10M08DAF256C8G - MAX 10 FPGA, 8K LE, 178 I/O, 256-LBGA | Altera
MPN: 10M08DAF256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.73 | $23.73 |
| 10 | $22.2 | $222.00 |
| 100 | $19.8 | $1,980.00 |
| 500 | $17.5 | $8,750.00 |
| 1,000 | $15.4 | $15,400.00 |
10M08DAF256C8G Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, optionally backed by non-volatile memory. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at volume) and microcontrollers (software-driven, lower throughput), offering hardware-level parallelism for glue logic, state machines, custom interfaces, and signal conditioning. MAX 10 specifically targets cost-sensitive, low-power applications where the instant-on and integrated analog features deliver ASIC-like integration at FPGA-like flexibility.
Key features of the 10M08DAF256C8G include integrated 12-bit ADC blocks (up to 2 channels on select variants), on-chip temperature sensing, hard DDR3/LPDDR2 memory controllers, and support for LVDS, LVTTL, and SSTL I/O standards. The 256-LBGA package offers a compact 17 mm x 17 mm footprint and supports densities from 8K up to 50K logic elements within the same pin-compatible logic-array layout, simplifying scalability across the family.
The architecture leverages the same LE structure used across Altera/Intel FPGA product lines, with adaptive logic modules (ALMs), embedded M9K memory blocks, and dedicated 18x18 multipliers for DSP workloads. Combined with the dual-boot flash configuration scheme, the device can fail-safe update firmware in the field and revert to a known-good image if a configuration error occurs - critical for remote, unattended, or safety-sensitive deployments.
Typical applications include industrial motor control, factory automation I/O expansion, automotive body electronics and infotainment bridging, portable medical device glue logic, IoT sensor aggregation nodes, and low-cost video/display bridging. The integrated ADC and temperature sensor also make MAX 10 useful for board-management controllers in larger systems.
When designing with this part, plan I/O bank assignments carefully because the 256-LBGA pinout is shared across the 10M08/10M16/10M25/10M40/10M50 density grades, allowing migration within the family without board rework. Use the Quartus Prime Lite or Standard edition for synthesis; the device is supported by both.
This page synthesizes distributor pricing, pin-compatible same-family variants, and practical design notes that go beyond the manufacturer datasheet to help engineers select and source the correct MAX 10 density for their target application.
Drop-in alternatives for 10M08DAF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M08DAF256C8G (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DAF256C7G
✅ Drop-In✓ In Stock
$7.95 / Unit
View Datasheet →10M08DAF256A7G
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →10M16DAF256C8G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M25DAF256C8G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$45.3 / Unit
View Datasheet →10M40DAF256C8G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$55.2 / Unit
View Datasheet →10M08DAF256C8G Maximum Ratings & Electrical Characteristics
| Product Line | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 |
| Embedded Memory Bits | 387,072 |
| User I/O Count | 178 |
| Package | 256-LBGA (F256) |
| Package Dimensions | 17 mm x 17 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial, suffix C8G) |
| Speed Grade | 8 |
| On-Chip Flash | Dual-configuration (instant-on) |
| Process Technology | 55 nm embedded NOR flash + CMOS |
| I/O Standards Supported | LVDS, LVTTL, SSTL, HSTL, PCI |
| Memory Controller | Hard DDR3 / LPDDR2 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 |
| Configuration Mode | Internal flash, dual-boot supported |
10M08DAF256C8G 17 mm x 17 mm Pin Configuration Guide
Pin configuration for 10M08DAF256C8G (17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DAF256C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M08DAF256C8G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Body Electronics, Portable Medical Device Glue Logic, IoT Sensor Aggregation Nodes, Display Bridging and Video Format Conversion.
Industrial Motor Control
The 10M08DAF256C8G fits industrial motor control because its 8K LE and 178 I/O can host encoder quadrature decoding, multi-channel PWM generation, and a closed-loop PI/DTC control state machine. The integrated 12-bit ADC (select variants) simplifies current and back-EMF sensing without an external analog front end. Compared with a discrete MCU, the FPGA fabric executes the control loop in parallel hardware with deterministic latency, which is critical for high-RPM field-oriented control. Hard DDR3 controller support also eases integration of external lookup-table memory. The commercial C8G temperature grade covers most cabinet-internal deployments.
Recommended
Factory Automation I/O Expansion
The 10M08DAF256C8G is ideal for factory-automation I/O expansion cards because the 178 user I/O can aggregate dozens of digital inputs, relay outputs, and encoder channels that a host PLC or industrial PC cannot service directly. Its MAX 10 architecture includes built-in support for RS-485, RS-232, and isolated 24V industrial signaling, allowing the FPGA to act as a programmable protocol bridge (Modbus RTU, Profibus, CANopen). Instant-on from internal flash eliminates boot delay on the production line. The 256-LBGA package's 17 mm x 17 mm footprint fits compact DIN-rail carrier boards.
Recommended
Automotive Body Electronics
The 10M08DAF256C8G supports automotive body-electronics modules such as body controllers, gateway ECUs, and infotainment bridging. The 8K LE is sufficient for CAN/LIN message routing, LED matrix control, and mirror/lighting state machines. The F256 package is pin-compatible with the higher-density 10M16/10M25 parts, allowing OEM platforms to scale without PCB rework across vehicle trim levels. The -40C to +125C automotive variant (10M08DAF256A7G) is required for under-hood or cabin deployments where commercial temperature is insufficient.
Recommended
Portable Medical Device Glue Logic
In portable medical devices such as handheld ultrasound probes, patient monitors, and point-of-care diagnostics, the 10M08DAF256C8G provides the glue logic between sensor front ends, display drivers, and the main application processor. Its instant-on from internal flash eliminates patient-visible boot delay on wake-up. The low static power of the MAX 10 family (compared with SRAM-based FPGAs) extends battery life in sleep mode. Hard DSP blocks handle sensor-fusion math, while the LVDS I/O supports high-speed display links to compact LCD panels.
Recommended
IoT Sensor Aggregation Nodes
The 10M08DAF256C8G serves as the aggregation hub in IoT sensor nodes, combining I2C/SPI/UART sensor data, performing local edge pre-processing, and forwarding packets via Ethernet or wireless MPU. Its 178 I/O easily handles 20-30 sensor channels plus a host bus interface. The on-chip dual-configuration flash supports secure OTA firmware updates with golden-image fallback - critical for unattended field deployments. Compared with a microcontroller, the FPGA parallelizes simultaneous sensor sampling without jitter, improving measurement consistency across the node.
Recommended
Display Bridging and Video Format Conversion
The 10M08DAF256C8G handles display bridging tasks - converting between parallel RGB, LVDS, MIPI-DSI, and HDMI - at resolutions up to 1080p60. Its LVDS I/O banks directly interface with industrial LCD panels without external serializer chips. The hard memory controller and embedded SRAM (387 Kbits) provide line buffers for scaling and color-space conversion. Compared with ASSP bridges, the FPGA gives designers a single BOM line that supports multiple input/output combinations across product variants.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAF256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF256C7G | 10M08DAF256A7G | 10M16DAF256C8G | 10M25DAF256C8G | 10M40DAF256C8G |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 16,000 LE | 25,000 LE | 40,000 LE |
| User I/O | 178 | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 8 | 7 | 7 | 8 | 8 | 8 |
| On-Chip Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
Key Differentiators
- Instant-on from on-chip dual-configuration flash (vs Lattice ECP5 (LFE5U-12F))
- Hard DDR3 memory controller in silicon (vs Lattice iCE40 (iCE40HX8K))
- Pin-compatible family migration within F256 footprint (vs Xilinx Spartan-6 XC6SLX9)
Design Notes
The 256-LBGA package uses a 1.0 mm ball pitch and requires 4+ layer PCB construction with microvia or via-in-pad for reliable assembly. Per JEDEC J-STD-020, MSL3 floor life is 168 hours at <=30C/60% RH - bake the device before assembly if the seal is broken. Decoupling: place 0.1 uF X7R capacitors within 2 mm of every VCCIO/VCCINT ball; add 10 uF bulk caps at each bank supply. Exposed pads (if any) MUST be soldered to the ground plane for thermal dissipation.
Estimated: at 100 MHz fabric clock with 50% toggle rate, total VCCINT current for 8K LE is roughly 200-400 mA depending on routing density. Add 50 mA per active LVDS channel and 30 mA per active M9K block for budgeting. Use a linear LDO (e.g., TPS7A4701) or DC-DC with ferrite bead filtering for VCCINT to minimize jitter. Ramp-up sequencing: VCCINT must precede VCCIO by at least 0.2 ms; consult the MAX 10 handbook for the exact sequence to avoid I/O latch-up.
Differential pair length matching for LVDS: route P and N with <50 mil length mismatch within a pair and <100 ps skew between pairs in the same channel. Keep 3x trace spacing from non-related signals to maintain 90 ohm differential impedance. JTAG chain: place the 10-pin header or fly-wire access at the board edge for factory programming; include TCK pull-down, TMS pull-up, and TDI pull-up per the Altera JTAG guidelines. Reserve a dedicated CONF_DONE LED on a free GPIO.
Do not program the bitstream from a 3.3 V MCU using a level-translated JTAG - MAX 10 JTAG expects 2.5V/3.3V tolerant buffers; 5V signals will damage the device. Avoid leaving unused I/O balls floating - configure them as tri-stated inputs with weak pull-ups in Quartus to prevent spurious current. When migrating to a higher-density 10M16/10M25/10M40 part, recompile the design in Quartus; bitstreams are not interchangeable across densities.
Compliance Information
RoHS compliant per Altera product page. The C8G suffix denotes commercial temperature; for AEC-Q100 automotive qualification, choose the 10M08DAF256A7G variant. Halogen-free status not explicitly stated in distributor data - marked unknown.
