10M50SCE144A7G - MAX 10 FPGA 50KLE 144-LQFP | Intel
MPN: 10M50SCE144A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $20.73 | $20.73 |
| 10 | $18.95 | $189.50 |
| 100 | $16.4 | $1,640.00 |
| 500 | $14.2 | $7,100.00 |
| 1,000 | $12.85 | $12,850.00 |
Drop-in alternatives for 10M50SCE144A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40SCE144A7G
✅ Drop-In✓ In Stock
$57.21 / Unit
View Datasheet →10M50SAE144C8G
✅ Drop-In✓ In Stock
$47.9 / Unit
View Datasheet →10M25SCE144A7G
✅ Drop-In✓ In Stock
$47.21 / Unit
View Datasheet →10M16SCE144A7G
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →10M50SAE144C8G-Q
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M08SCE144A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50SCE144A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Total User Flash Bits | 1,677,312 bits |
| User I/O Count | 101 |
| Number of LABs/CLBs | 3,125 |
| Supply Voltage - Core | 1.2 V (internal) |
| Supply Voltage - I/O | 3.0 V / 3.3 V LVCMOS/LVTTL |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | 2 |
| Integrated ADC | 12-bit, 1 MSPS (analog inputs package-dependent) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Method | On-chip non-volatile flash (instant-on, no external boot PROM) |
| Process Technology | TSMC 55 nm NOR-flash + SRAM |
10M50SCE144A7G 144-lqfp exposed pad (eqfp-144) Pin Configuration Guide
Complete pinout information for 10M50SCE144A7G (144-lqfp exposed pad (eqfp-144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50SCE144A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50SCE144A7G is suitable for 6 applications: Industrial Motor Control & PLC I/O, Video Bridging & Image Aggregation, Factory Automation Protocol Bridges, Automotive Infotainment Auxiliary Displays, IoT Gateway & Edge Aggregation, Battery Management & Power Conversion.
Industrial Motor Control & PLC I/O
The 10M50SCE144A7G's 50KLE fabric and 12-bit 1 MSPS integrated ADC make it well suited to industrial motor control and PLC I/O expansion, where it can host multiple PWM generators, quadrature encoder interfaces, and a Nios II soft-core for field-oriented control loops. Operating across the full industrial -40C to +100C ambient range with on-chip non-volatile flash, the device eliminates external boot PROMs and survives factory-floor temperature swings. The 101 user I/O pins of the 144-LQFP-EP package provide sufficient headroom for multi-axis drives with current-sensor, encoder, and communication buses on a single chip. Designers typically place the FPGA between 24V-referenced gate drivers and an Ethernet/IP or EtherCAT master, reducing the BOM by 30-40% compared to microcontroller-plus-DSP architectures.
Recommended
Video Bridging & Image Aggregation
With 50KLE of programmable logic plus soft DDR3/LPDDR2 memory controller IP, the 10M50SCE144A7G is a strong fit for video bridging, image aggregation, and lightweight display processing applications such as industrial HMI panels and multi-camera surveillance recorders. Its 1,677,312 bits of user flash and 2.5 Mb embedded SRAM accommodate line buffers and frame-correction logic without external memory, while the 144-LQFP-EP package supports hand-reworkable prototypes that smaller BGAs cannot. Compared with discrete ASSP bridges, the 10M50 lets designers add proprietary overlays, watermarking, or protocol conversions in the same silicon. The integrated ADC also digitizes backlight or touch-panel analog signals.
Recommended
Factory Automation Protocol Bridges
The 10M50SCE144A7G excels as a factory automation protocol bridge, translating between legacy parallel buses (PC/104, ISA, parallel ADC) and modern Ethernet/IP, PROFINET, EtherCAT, or USB 3.0 interfaces. The 50KLE logic capacity can implement a Nios II soft-core running a real-time protocol stack in parallel with custom DMA engines, while the 101 user I/O pins of the 144-LQFP-EP footprint route legacy bus signals cleanly to internal registers. Its instant-on configuration from on-chip flash avoids external boot devices in sealed IP67 enclosures where service is impossible. Industrial temperature grading -40C to +100C and 12-bit ADC for sensor aggregation make it a single-chip solution for legacy-to-modern protocol conversion.
Recommended
Automotive Infotainment Auxiliary Displays
The 10M50SCE144A7G suits automotive infotainment auxiliary display applications such as rear-seat entertainment clusters, instrument-cluster repeaters, and HUD signal-conditioning, where it converts LVDS/eDP inputs to local LCD or OLED timing. Its on-chip flash and -40C to +100C ambient rating cover cabin and door-module thermal profiles, while 101 user I/O pins accommodate multi-touch and ambient-light-sensor aggregation. The 12-bit ADC digitizes backlight current and temperature signals directly, removing external monitoring ICs. Designers use the MAX 10's instant-on flash to wake displays within 100 ms of CAN bus activity - a key infotainment requirement.
Recommended
IoT Gateway & Edge Aggregation
In IoT gateway and edge-aggregation nodes, the 10M50SCE144A7G provides a flexible bridge between low-speed sensor buses (I2C, SPI, UART, 1-Wire, GPIO) and high-speed uplinks (Wi-Fi, Ethernet, LoRa, cellular modems). Its 50KLE fabric runs a RISC-V or Nios II soft-core aggregating data from dozens of sensors, while the integrated 12-bit ADC handles analog inputs directly. The 144-LQFP-EP package's hand-solder-friendly form factor benefits low-volume industrial gateway products, and the industrial temperature range -40C to +100C supports outdoor enclosures. On-chip user flash stores firmware updates and cryptographic keys securely.
Recommended
Battery Management & Power Conversion
The 10M50SCE144A7G's integrated 12-bit 1 MSPS ADC combined with 50KLE logic and 101 user I/O make it an excellent battery management system (BMS) controller for e-mobility, UPS, and energy-storage applications. The fabric implements cell-balancing algorithms, state-of-charge estimators, and CAN/Modbus communication stacks, while the ADC samples individual cell voltages and shunt currents directly. The 144-LQFP-EP exposed pad dissipates up to 1.5 W comfortably with proper via-array soldering, critical for sealed battery enclosures. Industrial -40C to +100C rating supports outdoor cabinet installations and under-hood automotive environments.
Recommended
Recommended Products Summary
Engineering reference data for 10M50SCE144A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40SCE144A7G | 10M50SAE144C8G | 10M25SCE144A7G | 10M16SCE144A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 50,000 | 40,000 (-20%) | 50,000 (same die) | 25,000 (-50%) | 16,000 (-68%) |
| User I/O | 101 | 101 (same) | 101 (same) | 101 (same) | 101 (same) |
| User Flash Bits | 1,677,312 | 1,255,680 (-25%) | 1,677,312 (same) | 819,200 (-51%) | 549,888 (-67%) |
| Speed Grade | -7 | -7 (same) | -8 (faster) | -7 (same) | -7 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial | Industrial | Industrial |
| Integrated ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) |
| Configuration Method | On-chip non-volatile flash | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) |
Key Differentiators
- Highest logic density in MAX 10 E144 footprint (vs 10M40SCE144A7G)
- 50KLE with industrial temperature rating (vs 10M50SAE144C8G)
- Instant-on from on-chip flash (vs 10M16SCE144A7G)
Design Notes
Estimated: The 144-LQFP-EP exposed pad must be soldered to a 4x4 thermal via array (0.3 mm via diameter, 0.5 mm pitch) connected to an inner ground or power plane to meet the datasheet theta-JA of approximately 12-15 C/W. Without the via array, junction temperature can exceed 100C at moderate loads (1.0-1.5 W dissipation), triggering thermal shutdown. Apply solder paste to the EP land pattern during stencil design; insufficient paste causes dry joints and thermal runaway under industrial-temperature load.
Place all MAX 10 decoupling capacitors within 3 mm of their respective supply pins: 0.1 uF X7R ceramic on each VCCIO/VCCINT bank plus a single 10 uF bulk capacitor on each rail. The configuration pins (nCONFIG, nSTATUS, CONF_DONE) require 4.7 kohm pull-ups to VCCIO. JTAG TMS and TCK must each have a 10 kohm pull-up to VCCIO to prevent spurious configuration entry during power-up. Route JTAG signals away from switching power and clock traces to avoid programming failures.
Do not leave the 10M50SCE144A7G's unused GPIO pins floating; configure them as outputs driving low or as inputs with internal weak pull-ups in your Quartus Prime pin assignment file. Floating pins can draw tens of milliamps through internal ESD structures and cause erratic behavior. Also, the dual-configuration flash region allows field updates, but you must implement the standard Altera remote-update IP block to safely switch images; manual bitstream swaps can brick the device in the field.
Route all differential pairs (LVDS, mini-LVDS) with 100 ohm differential impedance and length-matched within 150 mils (3.8 mm) to maintain signal integrity at the MAX 10's 304 Mbps LVDS rate. Keep PLL analog supply pins (VCCA_PLL) isolated with a ferrite bead and decoupled with 0.1 uF + 10 uF capacitors; switching noise on VCCA_PLL causes PLL jitter to exceed the datasheet 300 ps peak-to-peak spec, which corrupts DDR3 controller timing margins.
Compliance Information
RoHS and REACH compliance per Altera/Intel product declaration. Not AEC-Q100 qualified; for automotive applications consult Intel's MAX 10 automotive-grade variants. Halogen-free status not explicitly confirmed in available data - set to unknown.
