10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel
MPN: 10M50SAE144C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $71.5 | $71.50 |
| 10 | $65.2 | $652.00 |
| 100 | $58.75 | $5,875.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.9 | $47,900.00 |
Drop-in alternatives for 10M50SAE144C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M50SAE144I7G
β Drop-Inπ Reference alternative (not in catalog)
10M50SCE144C8G
β Drop-Inπ Reference alternative (not in catalog)
10M50DAE144C8G
β Drop-Inπ Reference alternative (not in catalog)
10M40SAE144C8G
β Drop-Inβ In Stock
$195.85 / Unit
View Datasheet β10M25SAE144C8G
β Drop-Inβ In Stock
$32.4 / Unit
View Datasheet β10M50SAE144C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 50000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | 101 |
| Package | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch |
| Operating Temperature | 0C to +85C (Commercial, "C8" grade) |
| Process Technology | 55 nm embedded flash CMOS |
| Configuration | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | Up to 1.4 Mbit |
| ADC | 12-bit successive-approximation, up to 17 channels |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | Yes |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 3 |
10M50SAE144C8G Pin Configuration
| Pin 1 | I/O β General purpose user I/O (bank 8) |
| Pin 2 | I/O β General purpose user I/O (bank 8) |
| Pin 3 | GND β Ground |
| Pin 4 | I/O β General purpose user I/O (bank 8) |
| Pin 5 | I/O β General purpose user I/O (bank 8) |
| Pin 6 | I/O β General purpose user I/O (bank 8) |
| Pin 7 | VCCIO8 β I/O supply for bank 8 |
| Pin 8 | I/O β General purpose user I/O (bank 8) |
| Pin 9 | I/O β General purpose user I/O (bank 8) |
| Pin 10 | GND β Ground |
| Pin 11 | I/O β General purpose user I/O (bank 8) |
| Pin 12 | I/O β General purpose user I/O (bank 8) |
| Pin 13 | I/O β General purpose user I/O (bank 7) |
| Pin 14 | I/O β General purpose user I/O (bank 7) |
| Pin 15 | GND β Ground |
| Pin 16 | VCCIO7 β I/O supply for bank 7 |
| Pin 17 | I/O β General purpose user I/O (bank 7) |
| Pin 18 | I/O β General purpose user I/O (bank 7) |
| Pin 19 | I/O β General purpose user I/O (bank 7) |
| Pin 20 | I/O β General purpose user I/O (bank 7) |
| Pin 21 | I/O β General purpose user I/O (bank 7) |
| Pin 22 | I/O β General purpose user I/O (bank 7) |
| Pin 23 | I/O β General purpose user I/O (bank 7) |
| Pin 24 | GND β Ground |
| Pin 25 | I/O β General purpose user I/O (bank 7) |
| Pin 26 | I/O β General purpose user I/O (bank 7) |
| Pin 27 | I/O β General purpose user I/O (bank 6) |
| Pin 28 | I/O β General purpose user I/O (bank 6) |
| Pin 29 | VCCIO6 β I/O supply for bank 6 |
| Pin 30 | GND β Ground |
| Pin 31 | I/O β General purpose user I/O (bank 6) |
| Pin 32 | I/O β General purpose user I/O (bank 6) |
| Pin 33 | I/O β General purpose user I/O (bank 6) |
| Pin 34 | I/O β General purpose user I/O (bank 6) |
| Pin 35 | I/O β General purpose user I/O (bank 6) |
| Pin 36 | I/O β General purpose user I/O (bank 6) |
| Pin 37 | I/O β General purpose user I/O (bank 6) |
| Pin 38 | GND β Ground |
| Pin 39 | I/O β General purpose user I/O (bank 6) |
| Pin 40 | I/O β General purpose user I/O (bank 6) |
| Pin 41 | I/O β General purpose user I/O (bank 5) |
| Pin 42 | I/O β General purpose user I/O (bank 5) |
| Pin 43 | VCCIO5 β I/O supply for bank 5 |
| Pin 44 | GND β Ground |
| Pin 45 | I/O β General purpose user I/O (bank 5) |
| Pin 46 | I/O β General purpose user I/O (bank 5) |
| Pin 47 | I/O β General purpose user I/O (bank 5) |
| Pin 48 | I/O β General purpose user I/O (bank 5) |
| Pin 49 | I/O β General purpose user I/O (bank 5) |
| Pin 50 | I/O β General purpose user I/O (bank 5) |
| Pin 51 | I/O β General purpose user I/O (bank 5) |
| Pin 52 | GND β Ground |
| Pin 53 | I/O β General purpose user I/O (bank 5) |
| Pin 54 | I/O β General purpose user I/O (bank 5) |
| Pin 55 | I/O β General purpose user I/O (bank 4) |
| Pin 56 | I/O β General purpose user I/O (bank 4) |
| Pin 57 | VCCIO4 β I/O supply for bank 4 |
| Pin 58 | GND β Ground |
| Pin 59 | I/O β General purpose user I/O (bank 4) |
| Pin 60 | I/O β General purpose user I/O (bank 4) |
| Pin 61 | I/O β General purpose user I/O (bank 4) |
| Pin 62 | I/O β General purpose user I/O (bank 4) |
| Pin 63 | I/O β General purpose user I/O (bank 4) |
| Pin 64 | I/O β General purpose user I/O (bank 4) |
| Pin 65 | I/O β General purpose user I/O (bank 4) |
| Pin 66 | GND β Ground |
| Pin 67 | I/O β General purpose user I/O (bank 4) |
| Pin 68 | I/O β General purpose user I/O (bank 4) |
| Pin 69 | I/O β General purpose user I/O (bank 3) |
| Pin 70 | I/O β General purpose user I/O (bank 3) |
| Pin 71 | VCCIO3 β I/O supply for bank 3 |
| Pin 72 | GND β Ground |
| Pin 73 | I/O β General purpose user I/O (bank 3) |
| Pin 74 | I/O β General purpose user I/O (bank 3) |
| Pin 75 | I/O β General purpose user I/O (bank 3) |
| Pin 76 | I/O β General purpose user I/O (bank 3) |
| Pin 77 | I/O β General purpose user I/O (bank 3) |
| Pin 78 | I/O β General purpose user I/O (bank 3) |
| Pin 79 | I/O β General purpose user I/O (bank 3) |
| Pin 80 | GND β Ground |
| Pin 81 | I/O β General purpose user I/O (bank 3) |
| Pin 82 | I/O β General purpose user I/O (bank 3) |
| Pin 83 | I/O β General purpose user I/O (bank 2) |
| Pin 84 | I/O β General purpose user I/O (bank 2) |
| Pin 85 | VCCIO2 β I/O supply for bank 2 |
| Pin 86 | GND β Ground |
| Pin 87 | I/O β General purpose user I/O (bank 2) |
| Pin 88 | I/O β General purpose user I/O (bank 2) |
| Pin 89 | I/O β General purpose user I/O (bank 2) |
| Pin 90 | I/O β General purpose user I/O (bank 2) |
| Pin 91 | I/O β General purpose user I/O (bank 2) |
| Pin 92 | I/O β General purpose user I/O (bank 2) |
| Pin 93 | I/O β General purpose user I/O (bank 2) |
| Pin 94 | GND β Ground |
| Pin 95 | I/O β General purpose user I/O (bank 2) |
| Pin 96 | I/O β General purpose user I/O (bank 2) |
| Pin 97 | I/O β General purpose user I/O (bank 1) |
| Pin 98 | I/O β General purpose user I/O (bank 1) |
| Pin 99 | VCCIO1 β I/O supply for bank 1 |
| Pin 100 | GND β Ground |
| Pin 101 | I/O β General purpose user I/O (bank 1) |
| Pin 102 | I/O β General purpose user I/O (bank 1) |
| Pin 103 | I/O β General purpose user I/O (bank 1) |
| Pin 104 | I/O β General purpose user I/O (bank 1) |
| Pin 105 | I/O β General purpose user I/O (bank 1) |
| Pin 106 | I/O β General purpose user I/O (bank 1) |
| Pin 107 | I/O β General purpose user I/O (bank 1) |
| Pin 108 | GND β Ground |
| Pin 109 | I/O β General purpose user I/O (bank 1) |
| Pin 110 | I/O β General purpose user I/O (bank 1) |
| Pin 111 | TCK β JTAG test clock (dedicated) |
| Pin 112 | TMS β JTAG test mode select (dedicated) |
| Pin 113 | TDI β JTAG test data in (dedicated) |
| Pin 114 | TDO β JTAG test data out (dedicated) |
| Pin 115 | nCONFIG β Configuration start input (dedicated, active low) |
| Pin 116 | nSTATUS β Configuration status output (dedicated) |
| Pin 117 | CONFIG_DONE β Configuration complete output (dedicated) |
| Pin 118 | DCLK β Configuration clock (dedicated) |
| Pin 119 | DATA0 β Configuration data input (dedicated) |
| Pin 120 | CRC_ERROR β Configuration CRC error output (dedicated) |
| Pin 121 | DEV_OE β Device-wide output enable (dedicated) |
| Pin 122 | DEV_CLRn β Device-wide clear (dedicated, active low) |
| Pin 123 | VCCA1 β Analog supply for ADC/dedicated analog circuits |
| Pin 124 | VCCA2 β Analog supply for ADC/dedicated analog circuits |
| Pin 125 | ADCIN1 β ADC analog input channel 1 |
| Pin 126 | ADCIN2 β ADC analog input channel 2 |
| Pin 127 | ADCIN3 β ADC analog input channel 3 |
| Pin 128 | ADCIN4 β ADC analog input channel 4 |
| Pin 129 | GND β Ground |
| Pin 130 | VCC β Core supply voltage |
| Pin 131 | VCC β Core supply voltage |
| Pin 132 | GND β Ground |
| Pin 133 | NC β Not connected (per datasheet) |
| Pin 134 | NC β Not connected (per datasheet) |
| Pin 135 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 136 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 137 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 138 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 139 | VCCIO1B β I/O supply for bank 1B |
| Pin 140 | GND β Ground |
| Pin 141 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 142 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 143 | I/O β General purpose user I/O (bank 1B/2B) |
| Pin 144 | EPAD β Exposed thermal pad (must be soldered to ground) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50SAE144C8G is suitable for 6 applications: Industrial Control I/O Expansion, Portable Medical Device Signal Conditioning, Video Bridging and Image Aggregation, I/O Expansion for SoCs and Microcontrollers, Test & Measurement Instrumentation, Motor Control Pre-Processing.
Industrial Control I/O Expansion
The 10M50SAE144C8G's 50,000 logic elements and 101 user I/Os make it well-suited as a deterministic I/O expansion coprocessor for industrial PLCs, IPCs, and microcontroller-based controllers. It can be paired with a host MCU over parallel or SPI bridge, offloading high-speed pulse counting, quadrature decoding, and multi-axis stepper pulse generation that exceed the host MCU's bandwidth. Its instant-on non-volatile flash configuration ensures deterministic boot within milliseconds, critical for fail-safe industrial startup. The integrated 12-bit ADC with up to 17 channels also eliminates an external ADC for slow analog monitoring of temperature, pressure, or supply rails. Recommended companion parts: 10M25SAE144C8G (lower-density option), host MCU such as a MAX 10 Cortex-M variant, and an isolated RS-485 transceiver.
Recommended
Portable Medical Device Signal Conditioning
The 10M50SAE144C8G fits portable medical monitoring designs because of its on-chip 12-bit ADC, low static power, and small 22 x 22 mm EQFP-144 footprint that fits handheld enclosures. The 50K-LE fabric can implement custom digital filters, ECG/EEG feature extraction, and packetization for Bluetooth/USB uplink to a host. On-chip flash and dual-boot remote-update support firmware upgrades in the field without requiring external boot memory. Combined with the integrated temperature-sensing diode, the FPGA can also supervise battery and PCB thermal conditions during long-term patient monitoring. Recommended companion parts: a low-noise analog front-end op-amp and a Bluetooth Low Energy module.
Recommended
Video Bridging and Image Aggregation
With 1.6 Mbit of embedded SRAM and 101 I/Os, the 10M50SAE144C8G can aggregate multiple image sensor streams (parallel CMOS, MIPI-CSI via serializer, or LVDS), perform pixel-level pre-processing (debayer, gamma, scaling) and forward the result over USB 3.0 or Ethernet to a host processor. The MAX 10 fabric is large enough for two simultaneous 720p60 streams with line buffering in M9K blocks. The instant-on flash configuration means the bridge is ready to forward the first frame within milliseconds of power-up, important for vision-based driver-assistance and machine-vision startup. Recommended companion parts: image sensor serializers and a USB 3.0 controller.
Recommended
I/O Expansion for SoCs and Microcontrollers
The 10M50SAE144C8G is frequently deployed as a flexible I/O expander alongside application processors in industrial gateways, where the SoC lacks enough GPIO, PWM channels, or special-purpose interfaces. The FPGA maps to the SoC over SPI or a parallel bus, exposing custom peripherals (PWM, quadrature encoder, custom UART, IrDA, LCD timing). Hot-socketing capability means the FPGA can be inserted onto a powered backplane without back-driving the system. Quartus IP libraries include UART, SPI, I2C, and PWM cores that can be stitched into a custom peripheral in days rather than months. Recommended companion parts: a Cortex-A industrial SoM and an SPI flash for SoC boot.
Recommended
Test & Measurement Instrumentation
Test and measurement front-ends benefit from the 10M50SAE144C8G's deterministic fabric, on-chip ADC, and 101 LVDS-capable I/Os. The device can implement custom trigger logic, pattern generation, and protocol-aware decoding for serial buses (I2C, SPI, UART, CAN, LVDS) without off-the-shelf logic analyzer ASICs. The 12-bit on-chip ADC is sufficient for slow analog measurements like supply-rail health and front-end temperature, while the 50K-LE fabric handles real-time state machines for sequencer control. Combined with the non-volatile flash, instrument designers can ship one board that supports multiple firmware personalities selected at boot. Recommended companion parts: high-speed ADCs and precision references.
Recommended
Motor Control Pre-Processing
The 10M50SAE144C8G is well-suited to offload real-time motor-control pre-processing from the main MCU: it can implement up to 6-channel PWM generation with dead-time insertion, quadrature encoder decoding, and field-oriented control (FOC) math in logic using the embedded multipliers. The on-chip ADC simultaneously samples phase currents and bus voltage, reducing component count and improving loop determinism. Closed-loop control loop latency is bounded by FPGA fabric delays rather than software interrupts, enabling higher PWM frequencies and quieter operation. The exposed thermal pad supports the elevated power dissipation typical when the device is fully populated with logic. Recommended companion parts: gate drivers and current-sense amplifiers.
Recommended
Recommended Products Summary
Engineering reference data for 10M50SAE144C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50SAE144I7G | 10M50SCE144C8G | 10M50DAE144C8G | 10M40SAE144C8G | 10M25SAE144C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Logic Elements | 50000 | 50000 | 50000 | 50000 | 40000 | 25000 |
| Embedded Memory | 1677312 bits | 1677312 bits | 1677312 bits | 1677312 bits | 1290240 bits | 806400 bits |
| Max User I/Os | 101 | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | 0C to +85C (Commercial, C8) | -40C to +100C (Industrial, I7) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) |
| Configuration Flash | Dual-image (S-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) | Single-image (D-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) |
| ADC | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels |
| Approx. 100-pc Price (USD) | 58.75 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile instant-on with on-chip 12-bit ADC (vs 10M40SAE144C8G (40K LE variant))
- Dual-image flash for remote system upgrade (vs 10M50DAE144C8G (single-image flash))
- 50K LE in EQFP-144 with commercial temp grade (vs 10M25SAE144C8G (25K LE variant))
Design Notes
Solder the exposed thermal pad (EPAD, pin 144) to a continuous ground copper pour of at least 1 square inch on the top layer with multiple thermal vias stitching the pad to internal ground planes. The EQFP-144 thermal performance depends entirely on this pad; without adequate copper the junction temperature can exceed the 125C limit at elevated ambient. Estimated: at 1 W dissipation in still air with 1 sq-in copper pour, junction temperature rises approximately 25-30C above ambient. Keep high-power external components away from the pad area to avoid thermal coupling.
Decouple every VCC and VCCIO bank pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the pin, and add a single 10 uF bulk capacitor near each bank. The MAX 10 has separate VCC (core) and VCCIO1 through VCCIO8 (per-bank I/O) supplies, plus VCCA1/VCCA2 for the ADC analog circuits. Analog supplies should be filtered with a ferrite bead and have their own 10 uF + 0.1 uF local decoupling to minimise ADC crosstalk. Power-up sequencing should follow Intel's MAX 10 Hardware Design Guidelines; in particular VCCA must ramp with or after VCC to avoid latch-up.
Bank I/O voltages (VCCIO1-VCCIO8) can be set independently to support mixed-voltage interfaces (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. When routing differential pairs (LVDS), keep the P/N traces length-matched within 50 mils and maintain 100-ohm differential impedance with 50-ohm single-ended reference to ground. JTAG chain pins (TCK, TMS, TDI, TDO) should be pulled to known logic levels through 10 kohm resistors if unused, to avoid floating inputs that can corrupt boundary-scan tests.
Do not leave configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) floating; if not used in the application, tie nCONFIG through 10 kohm to VCC, leave nSTATUS and CONFIG_DONE as outputs, and route DCLK and DATA0 to a JTAG header for in-field reprogramming. Note that the S-suffix part supports dual-boot remote system upgrade, while the D-suffix uses single-image flash and frees more user flash at the cost of field-upgrade safety. Choose density carefully: 10M40/10M25 variants are pin-compatible drop-ins only when your design fits the smaller LE count.
The MAX 10 LVDS I/O can operate at up to 800 Mbps per channel. Maintain 100-ohm differential impedance and keep ground reference continuous under the pair; route over an unbroken reference plane to avoid return-path discontinuities that cause common-mode noise. For ADC inputs, use a 0.1 uF X7R bypass close to the ADCIN pin and a 10 kohm anti-aliasing RC network on each input. Quartus Prime's Pin Planner reports per-pin signal integrity advisories; always run Fitter and Timing Analyzer before tape-out.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product page (https://www.altera.com/products/fpga/max/10/10m50-e144/10M50SAE144C8G). Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive. Halogen-free status not explicitly stated in the verified data.
