54FCT162245CTEB - 16-Bit Bidirectional Transceiver, 5.5V, 48-CerPack | Renesas
MPN: 54FCT162245CTEB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.85 | $7.85 |
| 10 | $7.1 | $71.00 |
| 100 | $6.2 | $620.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.75 | $4,750.00 |
54FCT162245CTEB Overview
A bidirectional transceiver is a bus-interface IC that drives signals in either direction between two ports under the control of direction-control inputs, while 3-state outputs allow multiple devices to share a bus by entering a high-impedance state when disabled. The 54FCT162245CTEB belongs to the FCT (Fast CMOS Technology) logic family, positioned in the taxonomy as transceiver -> bus interface IC -> logic IC -> integrated circuit. It is engineered as a low-power CMOS replacement for legacy ABT (Advanced BiCMOS Technology) functions, delivering balanced drive strength (16 mA source/sink) with typical output skew below 250 ps for synchronous timing budgets.
Key features include 16 mA balanced output drive on both ports, 500 uA typical quiescent supply current, Schmitt-trigger inputs for slow-edged or noisy signals, and an output-enable pin for each 8-bit half. ESD protection exceeds 2000 V per MIL-STD-883, Method 3015, and 200 V using the machine model. The device's 0.5 micron CMOS process yields the speed of bipolar ABT logic with a fraction of the power dissipation, simplifying thermal management in dense backplane designs.
Architecturally, the transceiver uses dual-metal CMOS to achieve sub-5 ns propagation while keeping ICC low enough for portable instrumentation. Each 8-bit half is controlled independently: a DIR pin sets direction and an OE pin enables the outputs, so a single device can bridge two buses of different widths on the same PCB. Typical tSK(o) below 250 ps makes the part usable in clock-distribution and registered-buffer applications where edge alignment matters.
Typical applications include military and aerospace backplanes, point-to-point board-to-board data buffering, 16-bit or 8-bit memory/address bus isolation, and synchronous inter-board communication in VME, cPCI, or custom parallel data links. The wide operating temperature range and ceramic hermetic package also suit downhole, avionics, and radiation-tolerant programs where plastic packages are not acceptable.
When designing with this device, treat the CERPACK footprint as non-substitutable with plastic SOIC/DIP variants - any drop-in replacement must share the same 48-pin CERPACK land pattern. For new designs targeting commercial temperature ranges, consider the equivalent 74FCT162245T plastic-package family, but verify pinout compatibility before substitution.
This page synthesizes distributor pricing, drop-in equivalents, and CERPACK-specific design notes that are not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for 54FCT162245CTEB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
54FCT162245ATEB
✅ Drop-In📋 Reference alternative (not in catalog)
IDT54FCT162245ATEB
✅ Drop-In📋 Reference alternative (not in catalog)
IDT54FCT162245CTEB
✅ Drop-In📋 Reference alternative (not in catalog)
54FCT162245CTEB Maximum Ratings & Electrical Characteristics
| Function | 16-bit bidirectional transceiver (dual 8-bit configurable) |
| Logic Family | FCT (Fast CMOS Technology) |
| Output Type | 3-State (tri-state) |
| Number of Channels | 16 (2 x 8-bit) |
| Direction Control | Yes (independent DIR per 8-bit half) |
| Output Enable | Yes (active-low OE per 8-bit half) |
| Supply Voltage (VCC) | 4.5 V to 5.5 V |
| Maximum Output Current | 16 mA (source/sink, balanced) |
| Propagation Delay (tPD) | 4.5 ns typical at 50 pF |
| Output Skew (tSK(o)) | < 250 ps typical |
| Quiescent Current (ICC) | 500 uA typical |
| Input Type | Schmitt-trigger |
| Operating Temperature | -55 C to +125 C |
| Package | 48-pin CERPACK (CERDIP sidebraze) |
| ESD Protection | > 2000 V (MIL-STD-883, Method 3015); > 200 V (machine model) |
| Process Technology | 0.5 micron dual-metal CMOS |
| Leakage Current | 1 uA maximum (input and output) |
| RoHS Status | unknown |
54FCT162245CTEB Pin Configuration
| Pin 1 | OE1 — Output enable for 8-bit half 1 (active low) |
| Pin 2 | 1A0 — Port A bit 0 (half 1) |
| Pin 3 | 1A1 — Port A bit 1 (half 1) |
| Pin 4 | 1A2 — Port A bit 2 (half 1) |
| Pin 5 | 1A3 — Port A bit 3 (half 1) |
| Pin 6 | 1A4 — Port A bit 4 (half 1) |
| Pin 7 | 1A5 — Port A bit 5 (half 1) |
| Pin 8 | 1A6 — Port A bit 6 (half 1) |
| Pin 9 | 1A7 — Port A bit 7 (half 1) |
| Pin 10 | GND — Ground |
| Pin 11 | 1B7 — Port B bit 7 (half 1) |
| Pin 12 | 1B6 — Port B bit 6 (half 1) |
| Pin 13 | 1B5 — Port B bit 5 (half 1) |
| Pin 14 | 1B4 — Port B bit 4 (half 1) |
| Pin 15 | 1B3 — Port B bit 3 (half 1) |
| Pin 16 | 1B2 — Port B bit 2 (half 1) |
| Pin 17 | 1B1 — Port B bit 1 (half 1) |
| Pin 18 | 1B0 — Port B bit 0 (half 1) |
| Pin 19 | DIR1 — Direction control for half 1 (high = A to B) |
| Pin 20 | VCC — Power supply (4.5 V to 5.5 V) |
| Pin 21 | OE2 — Output enable for 8-bit half 2 (active low) |
| Pin 22 | 2A0 — Port A bit 0 (half 2) |
| Pin 23 | 2A1 — Port A bit 1 (half 2) |
| Pin 24 | 2A2 — Port A bit 2 (half 2) |
| Pin 25 | 2A3 — Port A bit 3 (half 2) |
| Pin 26 | 2A4 — Port A bit 4 (half 2) |
| Pin 27 | 2A5 — Port A bit 5 (half 2) |
| Pin 28 | 2A6 — Port A bit 6 (half 2) |
| Pin 29 | 2A7 — Port A bit 7 (half 2) |
| Pin 30 | GND — Ground |
| Pin 31 | 2B7 — Port B bit 7 (half 2) |
| Pin 32 | 2B6 — Port B bit 6 (half 2) |
| Pin 33 | 2B5 — Port B bit 5 (half 2) |
| Pin 34 | 2B4 — Port B bit 4 (half 2) |
| Pin 35 | 2B3 — Port B bit 3 (half 2) |
| Pin 36 | 2B2 — Port B bit 2 (half 2) |
| Pin 37 | 2B1 — Port B bit 1 (half 2) |
| Pin 38 | 2B0 — Port B bit 0 (half 2) |
| Pin 39 | DIR2 — Direction control for half 2 (high = A to B) |
| Pin 40 | VCC — Power supply (4.5 V to 5.5 V) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
Typical Applications
54FCT162245CTEB is suitable for 6 applications: Military and Aerospace Backplane Interfaces, 16-bit Memory or Address Bus Isolation, Board-to-Board Parallel Data Links, Point-to-Point Bus Extension in Industrial Systems, VME / CompactPCI Data Bus Buffering, Clock and Control Signal Distribution.
Military and Aerospace Backplane Interfaces
The 54FCT162245CTEB is purpose-built for military and aerospace backplanes where the -55 C to +125 C operating window and > 2000 V MIL-STD-883 ESD rating are mandatory. Its 16-bit width lets a single device bridge full data buses across VME, cPCI, or custom parallel backplanes, while the 4.5 ns typical propagation preserves timing margins on synchronous transfers. The hermetic 48-pin CERPACK package withstands the thermal and mechanical stress of avionics and downhole deployments where plastic parts would fail. Place the part close to the backplane connector with matched trace lengths on each 8-bit half to maintain the sub-250 ps output skew across the parallel bus.
Recommended
16-bit Memory or Address Bus Isolation
The 54FCT162245CTEB is well suited for isolating a 16-bit memory or address bus between a processor and a peripheral array, preventing bus contention during shared-access cycles. Its 3-state outputs with per-half OE control let designers enable or disable each 8-bit side independently, supporting byte-wise access to 16-bit memory banks. The 16 mA balanced drive handles the capacitive load of multiple memory devices on a heavily loaded bus, while the 500 uA quiescent current keeps standby consumption low in battery-backed or power-cycled subsystems. Use it between the CPU address bus and a bank of SRAM/DRAM to allow hot-swap or power-gating of the memory island.
Recommended
Board-to-Board Parallel Data Links
The 54FCT162245CTEB bridges parallel data links between two PCBs across a backplane connector, with the DIR pin selecting data flow direction for each 8-bit half. Its 4.5 ns propagation delay and sub-250 ps skew keep multi-bit transfers aligned across ribbon or high-density board-to-board connectors, where signal-integrity skew would otherwise corrupt synchronous bursts. The Schmitt-trigger inputs tolerate slow or ringing edges often seen across long connector paths, reducing false triggering in noisy industrial environments. Use matched-impedance routing and a single 54FCT162245CTEB per 16-bit channel to maximize noise margin at multi-MHz data rates.
Recommended
Point-to-Point Bus Extension in Industrial Systems
The 54FCT162245CTEB extends industrial 5 V parallel buses across longer cable or backplane distances by re-driving attenuated signals with its 16 mA balanced output stage. The Schmitt-trigger inputs recover signals degraded by capacitance and reflection across long traces, while the 3-state outputs allow multiple devices to share a common industrial bus with arbitration. The -55 C to +125 C operating range supports outdoor cabinets, factory floors, and other harsh industrial environments. Pair the device with TVS protection on the bus side to maintain ESD immunity above 2 kV in electrically noisy settings.
Recommended
VME / CompactPCI Data Bus Buffering
The 54FCT162245CTEB is a natural fit for VME and CompactPCI backplane data bus buffering, where the 16-bit D16 data path needs bidirectional buffering with per-half direction control. Its 4.5 ns typical propagation fits the VME D16 transfer timing window, and the CERPACK package has decades of heritage in VMEbus architectures used in defense and industrial control. Use one 54FCT162245CTEB per D16 slot to isolate the backplane from the local card and prevent stuck-bus failures on hot-insertion. Combine with the 54FCT162244CTEB unidirectional buffer for the address bus to complete a full VME interface.
Recommended
Clock and Control Signal Distribution
The 54FCT162245CTEB can serve as a low-skew fan-out for 16-bit-wide clock or control distribution in synchronous digital systems, leveraging its sub-250 ps output skew across all 16 channels. With DIR held constant, the device becomes a non-inverting 16-bit buffer/line driver, useful for distributing synchronous enable, chip-select, or control strobes to multiple peripherals. The Schmitt-trigger inputs regenerate slow or attenuated control edges, ensuring clean timing edges at the load. Use one 54FCT162245CTEB to drive up to 16 control loads with matched propagation, replacing discrete buffers and reducing board area.
Recommended
Recommended Products Summary
Engineering reference data for 54FCT162245CTEB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 54FCT162245ATEB | IDT54FCT162245ATEB | IDT54FCT162245CTEB |
|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics (IDT legacy) | Renesas Electronics (IDT legacy) |
| Package | 48-CERPACK | 48-CERPACK - same | 48-CERPACK - same | 48-CERPACK - same |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -55 C to +125 C | -55 C to +125 C | -55 C to +125 C | -55 C to +125 C |
| Output Drive | 16 mA | 16 mA | 16 mA | 16 mA |
| Propagation Delay | 4.5 ns typical | 4.5 ns typical (same family) | 4.5 ns typical | 4.5 ns typical |
| Output Skew | < 250 ps | < 250 ps | < 250 ps | < 250 ps |
| Function | 16-bit bidirectional transceiver | 16-bit bidirectional transceiver | 16-bit bidirectional transceiver | 16-bit bidirectional transceiver |
Key Differentiators
- Military-temperature CERPACK hermetic packaging (vs 74FCT162245CTEG)
- Dual-metal CMOS for sub-5 ns speed with low power (vs ABT16245 bipolar parts)
- Schmitt-trigger inputs for noisy or slow edges (vs Standard TTL-input FCT variants)
Design Notes
The 48-pin CERPACK footprint is a hermetic sidebraze ceramic package with through-hole leads on 2.54 mm (100 mil) pitch; design the PCB with plated through-holes sized for 0.51 mm (20 mil) leads, plus a ceramic-recess-compatible land pattern. Do not substitute plastic DIP-48 footprints - the CERPACK body width and lead shoulder dimensions differ enough to prevent proper insertion. Place a 0.1 uF decoupling capacitor within 5 mm of each VCC pin (pin 20 and pin 40) and a bulk 10 uF tantalum nearby.
Use matched-impedance routing (typically 50 ohm microstrip or stripline) on each 8-bit half, with trace length matching within 5 mm to preserve the sub-250 ps output skew across all 16 bits. The Schmitt-trigger inputs tolerate slow edges but cannot correct impedance discontinuities - keep stubs short and use a ground reference plane directly beneath the bus traces. Series-damping resistors of 22-33 ohm near the driver output may be required for heavily loaded backplane signals.
Estimated: in the CERPACK package, theta_JA is approximately 40 C/W when mounted in still air on a 2-layer PCB without heatsink. At full 16 mA drive on all 16 outputs toggling at 10 MHz with 50 pF loads, internal power dissipation is approximately 0.48 W, producing a junction-to-ambient rise of ~19 C above ambient. For military-temperature operation near +125 C, derate by maintaining case temperature below +110 C or add a clip-on heatsink.
Do not confuse the 54FCT162245CTEB (military-temperature CERPACK) with the 74FCT162245CTEG (commercial-temperature TSSOP) - they are NOT pin-to-pin drop-in equivalents despite similar part numbers. Tie unused DIR and OE pins to VCC or GND through 10 kohm pull resistors to prevent oscillation in noisy environments. When cascading two 54FCT162245CTEB devices for a 32-bit bus, ensure both DIR inputs are driven from the same source to avoid bus contention.
Compliance Information
Compliance status not stated in the verified web data. CERPACK military-grade parts are typically supplied with full material traceability and MIL-spec certification rather than commercial RoHS compliance.
