ADC0820CC/D - 8-Bit 1.5us Half-Flash ADC Die | Maxim Integrated
MPN: ADC0820CC/D ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.8 | $980.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.1 | $7,100.00 |
ADC0820CC/D Overview
An ADC (analog-to-digital converter) is a data-acquisition component that converts continuous analog voltage signals into discrete digital codes, serving as the bridge between the analog physical world and digital signal processors, microcontrollers, or FPGAs. The half-flash (or sub-ranging) topology is a speed/cost compromise between successive-approximation (SAR) ADCs and full-flash ADCs, achieving sub-2-microsecond conversion at modest die area and low power. ADC ICs are categorized within the broader signal-chain hierarchy: sensor -> analog front end -> ADC -> DSP/MCU -> actuator/logic.
Key features of the ADC0820CC/D include an on-chip sample-and-hold (track/hold) front-end that eliminates the need for an external THA in many applications, single +5V supply operation, and a commercial temperature grade of 0C to +70C. The device supports both ratiometric and absolute-voltage conversions, with a typical input range of 0V to +5V when paired with a +5V reference. Its built-in track/hold function allows accurate digitization of fast-changing signals up to the converter's full-scale bandwidth.
From a technical-depth perspective, the half-flash architecture first performs a coarse 4-bit conversion, then subtracts the DAC residue and runs a fine 4-bit conversion on the remainder; the two 4-bit results are combined and error-corrected to yield the final 8-bit code. This dual-step method gives the ADC0820 a typical aperture time of 100 ns and a maximum conversion time of approximately 1.5 us, while limiting comparator count to 31 - far fewer than the 255 comparators required by a true single-step flash converter.
Typical applications include digital instrumentation, video digitizing, ultrasonic signal processing, high-speed data logging, and process-control front ends. The track/hold input also makes it suitable for multiplexing multiple channels into a single ADC at high switching rates without losing accuracy due to aperture jitter.
When designing with this part, treat the bare die as an ESD-sensitive component and use matched-impedance bond-wire layouts to preserve the 1.5 us timing budget. Decoupling the +5V supply with a 0.1 uF ceramic capacitor placed within 5 mm of each bond pad is recommended to keep digital ground bounce out of the analog sample-and-hold path.
This page combines Maxim Integrated datasheet values with distributor pricing and drop-in same-family alternatives to give design engineers a one-stop reference not found in any single source.
Drop-in alternatives for ADC0820CC/D — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ADC0820CC/D (same form factor and footprint) — differing in Architecture, Input Type, Package, Operating Temperature, Operating Temperature Range.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ADC0820CCN
✅ Drop-In📋 Reference alternative (not in catalog)
ADC0820BCV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.9 / Unit
View Datasheet →ADC0820BCN
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ADC0820CCJ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ADC0820BCJ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ADC0820CC/D Maximum Ratings & Electrical Characteristics
| Resolution | 8 bit |
| Conversion Method | Half-Flash (sub-ranging, 2 x 4-bit) |
| Maximum Conversion Time | 1.5 us |
| Maximum Power Dissipation | 75 mW |
| Supply Voltage | +5 V (single supply) |
| Track/Hold Function | On-chip (built-in) |
| Number of Internal Comparators | 31 |
| Temperature Grade | Commercial |
| Operating Temperature Range | 0C to +70C |
| Input Voltage Range (with +5V ref) | 0 V to +5 V |
| Number of Terminals | 20 (bare die bond pads) |
| Package / Form Factor | Bare Die (DIE package code) |
| Terminal Form | No-lead (bond-pad) |
| Package Shape | Rectangular |
| Conversion Mode | Ratiometric or absolute voltage reference |
ADC0820CC/D rectangular Pin Configuration Guide
Pin configuration for ADC0820CC/D (rectangular package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for ADC0820CC/D.
Refer to the datasheet for full pin configuration.
Typical Applications
ADC0820CC/D is suitable for 6 applications: Digital Instrumentation and Panel Meters, Video Signal Digitizing, Ultrasonic Signal Processing, High-Speed Data Logging, Process Control Front End, Multiplexed Analog Input Subsystems.
Digital Instrumentation and Panel Meters
The ADC0820CC/D's 1.5 us conversion time and 8-bit resolution deliver real-time updates for handheld digital multimeters and bench panel meters. Its on-chip track/hold lets a single ADC sample both DC and AC ranges without an external THA, while the +5 V single-supply operation simplifies battery-powered instrument design. The half-flash architecture samples at 666 kSPS, easily handling line-frequency measurement updates without aliasing.
Recommended
Video Signal Digitizing
At 1.5 us conversion time, the ADC0820CC/D can digitize standard-definition video bandwidth (up to ~6 MHz effective sampling) with 8-bit per-pixel resolution. The internal track/hold captures fast-changing chroma and luma transitions without external sample-and-hold circuitry, and the single +5 V supply keeps the analog front-end simple. Designers usually feed the ADC0820 from a video amplifier (such as the AD817) and buffer output to a frame-store FIFO.
Recommended
Ultrasonic Signal Processing
The half-flash 1.5 us conversion lets the ADC0820CC/D sample return echoes at sub-200 kHz pulse-repetition rates with sufficient resolution for time-of-flight distance measurement. Its on-chip track/hold eliminates aperture jitter that would otherwise smear echo timing, while the 31-comparator half-flash architecture keeps analog bandwidth high. This makes the part a cost-effective fit for sonar, medical ultrasound front-ends, and non-destructive-testing flaw detectors.
Recommended
High-Speed Data Logging
For portable data loggers recording vibration, temperature, or strain, the ADC0820CC/D provides 8-bit conversion at a 666 kSPS rate - enough to capture transient events on rotating machinery. Its single +5 V operation suits battery or USB-powered loggers, while the half-flash topology balances speed and power. The bare-die form factor allows integration into miniaturized probe-tip or in-line data-acquisition modules where a packaged converter would not fit.
Recommended
Process Control Front End
In PLC and SCADA front ends, the ADC0820CC/D digitizes 4-20 mA current-loop receivers or 0-10 V transducer outputs at sub-2 us per channel. Its ratiometric conversion allows direct digitisation of a 5 V bridge-excited sensor without an external reference, while the on-chip track/hold accepts multiplexed channels without an external THA. The 0C to +70C commercial temperature grade covers indoor control panels and rack-mounted industrial instrumentation.
Recommended
Multiplexed Analog Input Subsystems
The ADC0820CC/D's built-in track/hold is the key feature for multiplexed-input subsystems, allowing an analog mux to switch between inputs without losing accuracy due to aperture uncertainty. At 1.5 us per conversion, the device can scan an 8-channel mux at over 80 kHz aggregate, and the single +5 V supply simplifies the analog mux interface. Designers typically pair the ADC0820 with a 4/8-channel CMOS mux such as the 74HC4051 or DG408 to build compact data-acquisition boards.
Recommended
Recommended Products Summary
Engineering reference data for ADC0820CC/D — comparison, design guidance, and compliance information.
Selection Guide
If you need a through-hole DIP for prototyping, choose the ADC0820CCN - same silicon, easier hand-soldering. For higher precision, replace with a 12-bit SAR such as the AD7899AR-3REEL or AD7983BCPZ-R2; for higher speed, look at the AD9051BRSRL or AD9225. If you specifically need bare-die, the CC/D is the most readily stocked option.
Avoid the ADC0820CC/D if your design must operate outside 0C-70C (use an industrial or military grade), if your power budget is below 50 mW (use a modern SAR), or if your system requires greater than 8-bit resolution (use the AD7472/AD7983 family).
Comparison with Alternatives
| Parameter | This Product | ADC0820CCN | ADC0820BCV | ADC0820BCN | ADC0820CCJ | ADC0820BCJ |
|---|---|---|---|---|---|---|
| Package | Bare Die (20 bond pads) | DIP-20 (same die) | Bare Die (same) | DIP-20 (same) | Bare Die (same) | Bare Die (same) |
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit |
| Conversion Method | Half-flash (2 x 4-bit) | Half-flash | Half-flash | Half-flash | Half-flash | Half-flash |
| Max Conversion Time | 1.5 us | 1.5 us | 1.5 us | 1.5 us | 1.5 us | 1.5 us |
| Max Power Dissipation | 75 mW | 75 mW | 75 mW | 75 mW | 75 mW | 75 mW |
| Supply Voltage | +5 V | +5 V | +5 V | +5 V | +5 V | +5 V |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Commercial B-grade | Commercial B-grade | J-screened | J-screened B-grade |
| On-chip Track/Hold | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Only Maxim ADC0820 variant supplied as bare commercial-grade die (vs ADC0820CCN)
- Internal track/hold eliminates external THA stage (vs AD7825BRZ-REEL7)
Design Notes
The ADC0820CC/D is supplied in bare-die form and is therefore extremely ESD-sensitive - use Class 0 ESD handling procedures and bond-wire tools rated for 25 um or 38 um aluminum wire. Avoid touching the active die surface with bare fingers or non-conductive tweezers. Failure to follow die-handling protocols is the most common field-failure root cause for bare-die ADC and amplifier parts.
Because the ADC0820 uses a half-flash architecture with 31 high-speed comparators, decouple the +5 V supply within 5 mm of the supply bond pad using a 0.1 uF X7R ceramic in parallel with a 10 uF tantalum bulk cap. Route the analog ground return directly from the GND bond pad to the supply ground; do not share a ground island with the digital output buffers. Proper grounding preserves the 1.5 us timing budget and minimises digital-to-analog coupling.
Treat the analog input bond pad and the reference input as a matched-impedance pair - keep bond wires short (less than 2 mm) and symmetric. Long bond wires introduce inductance that converts the track/hold's switching transient into a sample-rate-dependent offset error. Estimated: a 1 nH bond-wire inductance can produce a 5 mV spike at the analog input during sample-to-hold transitions, equivalent to roughly 1 LSB at the 5 V full-scale input.
Compliance Information
Bare-die parts generally cannot be assessed for RoHS/REACH in the same way packaged parts are; consult Maxim/Analog Devices directly for environmental compliance documentation of the die lot.
