ADC0820CC/D - 8-Bit 1.5us Half-Flash ADC Die | Maxim Integrated
부품 번호: ADC0820CC/D ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.8 | $980.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.1 | $7,100.00 |
ADC0820CC/D 개요
An ADC (analog-to-digital converter) is a data-acquisition component that converts continuous analog voltage signals into discrete digital codes, serving as the bridge between the analog physical world and digital signal processors, microcontrollers, or FPGAs. The half-flash (or sub-ranging) topology is a speed/cost compromise between successive-approximation (SAR) ADCs and full-flash ADCs, achieving sub-2-microsecond conversion at modest die area and low power. ADC ICs are categorized within the broader signal-chain hierarchy: sensor -> analog front end -> ADC -> DSP/MCU -> actuator/logic.
Key features of the ADC0820CC/D include an on-chip sample-and-hold (track/hold) front-end that eliminates the need for an external THA in many applications, single +5V supply operation, and a commercial temperature grade of 0C to +70C. The device supports both ratiometric and absolute-voltage conversions, with a typical input range of 0V to +5V when paired with a +5V reference. Its built-in track/hold function allows accurate digitization of fast-changing signals up to the converter's full-scale bandwidth.
From a technical-depth perspective, the half-flash architecture first performs a coarse 4-bit conversion, then subtracts the DAC residue and runs a fine 4-bit conversion on the remainder; the two 4-bit results are combined and error-corrected to yield the final 8-bit code. This dual-step method gives the ADC0820 a typical aperture time of 100 ns and a maximum conversion time of approximately 1.5 us, while limiting comparator count to 31 - far fewer than the 255 comparators required by a true single-step flash converter.
Typical applications include digital instrumentation, video digitizing, ultrasonic signal processing, high-speed data logging, and process-control front ends. The track/hold input also makes it suitable for multiplexing multiple channels into a single ADC at high switching rates without losing accuracy due to aperture jitter.
When designing with this part, treat the bare die as an ESD-sensitive component and use matched-impedance bond-wire layouts to preserve the 1.5 us timing budget. Decoupling the +5V supply with a 0.1 uF ceramic capacitor placed within 5 mm of each bond pad is recommended to keep digital ground bounce out of the analog sample-and-hold path.
This page combines Maxim Integrated datasheet values with distributor pricing and drop-in same-family alternatives to give design engineers a one-stop reference not found in any single source.
드롭인 대체품: ADC0820CC/D — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ADC0820CC/D (동일 폼 팩터 및 풋프린트) — 차이점: Architecture, Input Type, Package, Operating Temperature, Operating Temperature Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ADC0820CCN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ADC0820BCV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.9 / 개
데이터시트 보기 →ADC0820BCN
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ADC0820CCJ
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ADC0820BCJ
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ADC0820CC/D 최대 정격 & 전기적 특성
| 분해능 | 8 bit |
| Conversion Method | Half-Flash (sub-ranging, 2 x 4-bit) |
| Maximum Conversion Time | 1.5 us |
| Maximum Power Dissipation | 75 mW |
| 공급 전압 | +5 V (single supply) |
| Track/Hold Function | On-chip (built-in) |
| Number of Internal Comparators | 31 |
| Temperature Grade | Commercial |
| 동작 온도 범위 | 0C to +70C |
| Input Voltage Range (with +5V ref) | 0 V to +5 V |
| Number of Terminals | 20 (bare die bond pads) |
| Package / Form Factor | Bare Die (DIE package code) |
| Terminal Form | No-lead (bond-pad) |
| Package Shape | Rectangular |
| Conversion Mode | Ratiometric or absolute voltage reference |
ADC0820CC/D rectangular 핀 구성 가이드
ADC0820CC/D(rectangular 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ADC0820CC/D.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ADC0820CC/D 적합 용도: 6 애플리케이션s: Digital Instrumentation and Panel Meters, Video Signal Digitizing, Ultrasonic Signal Processing, High-Speed Data Logging, Process Control Front End, Multiplexed Analog Input Subsystems.
Digital Instrumentation and Panel Meters
The ADC0820CC/D's 1.5 us conversion time and 8-bit resolution deliver real-time updates for handheld digital multimeters and bench panel meters. Its on-chip track/hold lets a single ADC sample both DC and AC ranges without an external THA, while the +5 V single-supply operation simplifies battery-powered instrument design. The half-flash architecture samples at 666 kSPS, easily handling line-frequency measurement updates without aliasing.
추천
Video Signal Digitizing
At 1.5 us conversion time, the ADC0820CC/D can digitize standard-definition video bandwidth (up to ~6 MHz effective sampling) with 8-bit per-pixel resolution. The internal track/hold captures fast-changing chroma and luma transitions without external sample-and-hold circuitry, and the single +5 V supply keeps the analog front-end simple. Designers usually feed the ADC0820 from a video amplifier (such as the AD817) and buffer output to a frame-store FIFO.
추천
Ultrasonic Signal Processing
The half-flash 1.5 us conversion lets the ADC0820CC/D sample return echoes at sub-200 kHz pulse-repetition rates with sufficient resolution for time-of-flight distance measurement. Its on-chip track/hold eliminates aperture jitter that would otherwise smear echo timing, while the 31-comparator half-flash architecture keeps analog bandwidth high. This makes the part a cost-effective fit for sonar, medical ultrasound front-ends, and non-destructive-testing flaw detectors.
추천
High-Speed Data Logging
For portable data loggers recording vibration, temperature, or strain, the ADC0820CC/D provides 8-bit conversion at a 666 kSPS rate - enough to capture transient events on rotating machinery. Its single +5 V operation suits battery or USB-powered loggers, while the half-flash topology balances speed and power. The bare-die form factor allows integration into miniaturized probe-tip or in-line data-acquisition modules where a packaged converter would not fit.
추천
Process Control Front End
In PLC and SCADA front ends, the ADC0820CC/D digitizes 4-20 mA current-loop receivers or 0-10 V transducer outputs at sub-2 us per channel. Its ratiometric conversion allows direct digitisation of a 5 V bridge-excited sensor without an external reference, while the on-chip track/hold accepts multiplexed channels without an external THA. The 0C to +70C commercial temperature grade covers indoor control panels and rack-mounted industrial instrumentation.
추천
Multiplexed Analog Input Subsystems
The ADC0820CC/D's built-in track/hold is the key feature for multiplexed-input subsystems, allowing an analog mux to switch between inputs without losing accuracy due to aperture uncertainty. At 1.5 us per conversion, the device can scan an 8-channel mux at over 80 kHz aggregate, and the single +5 V supply simplifies the analog mux interface. Designers typically pair the ADC0820 with a 4/8-channel CMOS mux such as the 74HC4051 or DG408 to build compact data-acquisition boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: ADC0820CC/D — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
If you need a through-hole DIP for prototyping, choose the ADC0820CCN - same silicon, easier hand-soldering. For higher precision, replace with a 12-bit SAR such as the AD7899AR-3REEL or AD7983BCPZ-R2; for higher speed, look at the AD9051BRSRL or AD9225. If you specifically need bare-die, the CC/D is the most readily stocked option.
Avoid the ADC0820CC/D if your design must operate outside 0C-70C (use an industrial or military grade), if your power budget is below 50 mW (use a modern SAR), or if your system requires greater than 8-bit resolution (use the AD7472/AD7983 family).
대체품과의 비교
| 파라미터 | 이 제품 | ADC0820CCN | ADC0820BCV | ADC0820BCN | ADC0820CCJ | ADC0820BCJ |
|---|---|---|---|---|---|---|
| Package | Bare Die (20 bond pads) | DIP-20 (same die) | Bare Die (same) | DIP-20 (same) | Bare Die (same) | Bare Die (same) |
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit |
| Conversion Method | Half-flash (2 x 4-bit) | Half-flash | Half-flash | Half-flash | Half-flash | Half-flash |
| Max Conversion Time | 1.5 us | 1.5 us | 1.5 us | 1.5 us | 1.5 us | 1.5 us |
| Max Power Dissipation | 75 mW | 75 mW | 75 mW | 75 mW | 75 mW | 75 mW |
| Supply Voltage | +5 V | +5 V | +5 V | +5 V | +5 V | +5 V |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Commercial B-grade | Commercial B-grade | J-screened | J-screened B-grade |
| On-chip Track/Hold | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Only Maxim ADC0820 variant supplied as bare commercial-grade die (vs ADC0820CCN)
- Internal track/hold eliminates external THA stage (vs AD7825BRZ-REEL7)
설계 노트
The ADC0820CC/D is supplied in bare-die form and is therefore extremely ESD-sensitive - use Class 0 ESD handling procedures and bond-wire tools rated for 25 um or 38 um aluminum wire. Avoid touching the active die surface with bare fingers or non-conductive tweezers. Failure to follow die-handling protocols is the most common field-failure root cause for bare-die ADC and amplifier parts.
Because the ADC0820 uses a half-flash architecture with 31 high-speed comparators, decouple the +5 V supply within 5 mm of the supply bond pad using a 0.1 uF X7R ceramic in parallel with a 10 uF tantalum bulk cap. Route the analog ground return directly from the GND bond pad to the supply ground; do not share a ground island with the digital output buffers. Proper grounding preserves the 1.5 us timing budget and minimises digital-to-analog coupling.
Treat the analog input bond pad and the reference input as a matched-impedance pair - keep bond wires short (less than 2 mm) and symmetric. Long bond wires introduce inductance that converts the track/hold's switching transient into a sample-rate-dependent offset error. Estimated: a 1 nH bond-wire inductance can produce a 5 mV spike at the analog input during sample-to-hold transitions, equivalent to roughly 1 LSB at the 5 V full-scale input.
규정 준수 정보
Bare-die parts generally cannot be assessed for RoHS/REACH in the same way packaged parts are; consult Maxim/Analog Devices directly for environmental compliance documentation of the die lot.
