DSPIC30F2011T-20E/ML - 16-bit 20MIPS 12KB DSC | Microchip
MPN: DSPIC30F2011T-20E/ML β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.51 | $55.10 |
| 100 | $4.9 | $490.00 |
| 500 | $4.29 | $2,145.00 |
| 1,000 | $3.68 | $3,680.00 |
DSPIC30F2011T-20E/ML Overview
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP, providing single-cycle MAC (multiply-accumulate) instructions, DSP-grade math, and deterministic interrupt handling while retaining familiar MCU peripherals such as UART, SPI, and I2C. The dsPIC30F family is Microchip's first-generation 16-bit DSC line, with documented seamless migration paths to dsPIC33F, PIC24H, or PIC24F devices in similar packages.
Key features of this part include the 20 MIPS dsPIC core (40 MHz internal clock), 12KB self-programmable FLASH, 1KB RAM, and a rich analog front end: an 8-channel, 12-bit analog-to-digital converter supporting fast sampling for sensor signal chains. Serial connectivity covers I2C, SPI, and UART/USART, enabling straightforward integration with sensors, EEPROMs, displays, and host controllers.
Technically, the dsPIC30F core employs a modified Harvard architecture with a multiple internal bus structure and fixed-point DSP format, executing two instructions per clock cycle at up to 20 MIPS. CMOS flash technology supports in-circuit self-programming, and the extended temperature grade (suffix -20E, /ML QFN) targets industrial environments where ambient temperatures reach +125C.
Typical applications include industrial sensor conditioning and acquisition, closed-loop motor and servo control, and embedded instrumentation where 12-bit ADC accuracy and DSP math are needed at low cost. The 28-QFN 6x6 mm footprint suits compact, thermally demanding industrial boards.
Design consideration: this controller operates from a 2.5V to 5.5V supply (nominal 5.0V), so verify rail sequencing and decoupling on mixed-voltage boards.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC30F2011T-20E/ML β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F2011T-20E/ML (same form factor and footprint) β differing in Package, ADC, Core Architecture, Migration Path, Motor Control PWM.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC30F2011T-30I/ML
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC30F2011-20E/ML
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC30F2010T-20E/MM
β Drop-Inβ In Stock
$3.98 / Unit
View Datasheet βDSPIC30F2010T-30I/MM
β Drop-Inβ In Stock
$3.92 / Unit
View Datasheet βDSPIC30F2011T-20E/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC 16-bit |
| Program Memory Size | 12 KB (4K x 24) FLASH |
| RAM Size | 1 KB |
| Maximum Speed | 20 MIPS |
| Operating Supply Voltage | 2.5 V to 5.5 V (nominal 5.0 V) |
| ADC Resolution | 12-bit |
| ADC Channels | 8 channels |
| Communication Interfaces | I2C, SPI, UART/USART |
| Operating Temperature Range | -40C to +125C |
| Package | 28-QFN (6x6 mm) |
| Mounting Type | Surface Mount |
| Series | dsPIC 30F Sensor Family |
| Data Bus Width | 16-bit |
| Packaging Type | Tape & Reel (T suffix) |
| Technology | CMOS Flash |
| Programmability | In-Circuit Self-Programmable |
| RoHS Status | Lead-free / PB-free per manufacturer (Jotrin listing) |
DSPIC30F2011T-20E/ML 28-qfn (6x6 mm) Pin Configuration Guide
Pin configuration for DSPIC30F2011T-20E/ML (28-qfn (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC30F2011T-20E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC30F2011T-20E/ML is suitable for 6 applications: Industrial Sensor Conditioning and Acquisition, Servo and Motion Feedback Control, Embedded Instrumentation and Portable Test Gear, Automotive-Adjacent and High-Temperature Industrial Nodes, Motor Drive Sensing Rail (Current and Voltage Feedback), Building Automation and Smart Sensor Nodes.
Industrial Sensor Conditioning and Acquisition
As a member of Microchip's dsPIC30F Sensor Family, the DSPIC30F2011T-20E/ML is purpose-built for multi-channel analog sensing. Its 8-channel, 12-bit ADC can sequentially scan pressure, temperature, and position sensors, while the 20 MIPS DSP core applies digital filtering (single-cycle MAC, fixed-point math) to raw readings before transmission. The extended -40C to +125C operating range allows mounting directly inside industrial enclosures near motors and heaters without local thermal derating. UART, SPI, and I2C links forward conditioned data to PLC or host systems at 5V logic levels, eliminating level shifters. The main trade-off is 1KB of RAM, so long filter histories should use compact IIR rather than long FIR structures.
Recommended
Servo and Motion Feedback Control
In servo drives, the DSPIC30F2011T-20E/ML handles position-feedback acquisition: quadrature or analog sensor inputs feed the 12-bit ADC, and the 20 MIPS core executes PID loops with deterministic interrupt latency. Running at 5.0V from a 2.5V to 5.5V rail simplifies integration with industrial 5V encoders and optocouplers. The DSP multiply-accumulate capability accelerates notching and feedforward compensation terms that pure 8-bit MCUs compute too slowly. For the power stage PWM itself, pair it with the motor-control-family DSPIC30F2010T-30I/MM, which dedicates hardware pins to complementary PWM outputs and fault inputs - the two parts share the 28-QFN 6x6 package family, so firmware structures and layout practice transfer easily between the sensing and actuation controllers.
Recommended
Embedded Instrumentation and Portable Test Gear
Battery-powered and bench instruments benefit from the part's balance of 12-bit analog accuracy, DSP math, and serial connectivity. The 8-channel ADC digitizes multiple probe points, while I2C and SPI drive displays, front-panel keypads, and external data EEPROMs, and UART streams results to a PC. The 28-QFN 6x6 mm footprint keeps handheld and portable form factors compact, and the flash-based architecture supports field firmware updates through in-circuit self-programming. At 5V nominal operation, analog front ends built around 5V op-amps interface directly without translation. Budget carefully around the 1KB RAM: implement ring buffers for sampled data and offload logging to external serial memory rather than internal storage.
Recommended
Automotive-Adjacent and High-Temperature Industrial Nodes
The -20E suffix guarantees -40C to +125C operation, which suits under-hood-adjacent and high-temperature industrial nodes such as pump controllers, actuator feedback modules, and heat-treatment equipment monitoring. The 28-QFN ML package's exposed die-attach pad, when soldered to a solid ground plane, conducts heat away from the junction - essential at +125C ambient where allowable self-heating shrinks. Note that this part is not AEC-Q100 qualified, so use it in non-safety automotive-adjacent zones only. The 12-bit ADC tolerates sensor ratiometric schemes tied to VDD, and the 5V supply provides noise headroom in electrically harsh environments that 3.3V systems lack.
Recommended
Motor Drive Sensing Rail (Current and Voltage Feedback)
Every motor drive needs clean feedback of phase currents and DC-bus voltage, and the DSPIC30F2011T-20E/ML addresses exactly this sensing rail: shunt or hall-effect sensor outputs land on the 8-channel 12-bit ADC, and the DSP core scales, offsets-corrects, and filters them at 20 MIPS. The extended temperature grade survives drive-enclosure heat, and 5V ratiometric ADC operation matches common current-sense amplifier output ranges. For the inverter switching itself, delegate PWM generation to the DSPIC30F2010T-30I/MM motor-control DSC on the same board; the shared 28-QFN family package and common MPLAB XC16 toolchain let one firmware team maintain both controllers with unified coding standards and shared driver libraries.
Recommended
Building Automation and Smart Sensor Nodes
HVAC and building-automation nodes use the DSPIC30F2011T-20E/ML to aggregate temperature, humidity, and pressure sensors on its 8-channel ADC, apply compensation math in the DSP core, and report over UART or I2C to a gateway. The flash self-programming feature allows field firmware updates during building commissioning without device removal, and the -40C to +125C range covers rooftop and mechanical-room installations. At 5V nominal with a 2.5V floor, the controller tolerates long, lossy wiring-derived supply droop better than 3.3V-only devices. I2C also connects RTCs and serial EEPROMs for local scheduling and event logging, keeping the node functional through gateway outages.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F2011T-20E/ML β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F2011T-30I/ML | DSPIC30F2011-20E/ML | DSPIC30F2010T-20E/MM | DSPIC30F2010T-30I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same family footprint | 28-QFN (6x6 mm) - same family footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 20 MIPS | 30 MIPS | 20 MIPS | 20 MIPS | 30 MIPS |
| Program Flash | 12 KB (4K x 24) | 12 KB (4K x 24) | 12 KB (4K x 24) | 12 KB (4K x 24) | 12 KB (4K x 24) |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) - verify | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Family / Peripheral Emphasis | Sensor Family (8-ch 12-bit ADC) | Sensor Family | Sensor Family | Motor Control Family (motor PWM) | Motor Control Family (motor PWM) |
| Communication Interfaces | I2C, SPI, UART/USART | I2C, SPI, UART/USART | I2C, SPI, UART/USART | I2C, SPI, UART/USART | I2C, SPI, UART/USART |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tube / Tray (no T) | Tape & Reel (T) | Tape & Reel (T) |
Key Differentiators
- Extended -40C to +125C temperature grade (vs DSPIC30F2011T-30I/ML)
- Sensor Family analog emphasis (8-ch 12-bit ADC) (vs DSPIC30F2010T-20E/MM)
- 5V-native operation (2.5-5.5V) (vs dsPIC33F migration devices)
Design Notes
The DSPIC30F2011T-20E/ML runs from a 2.5V to 5.5V supply (nominal 5.0V). Decouple each VDD and AVDD pin with a 0.1uF ceramic capacitor placed within 3-5 mm of the pin, plus a bulk 4.7-10uF capacitor near the QFN. Keep AVDD on a quiet supply (ferrite bead or RC filter from the digital rail) to protect 12-bit ADC accuracy - ADC noise often traces to shared digital supply ripple rather than the converter itself.
Estimated: in a 28-QFN 6x6 package the exposed die-attach pad is the primary heat path. Solder it to a ground plane with an array of thermal vias (typical practice: 4-9 vias of 0.3 mm on a 1.0-1.2 mm pitch). At +125C ambient, allowable self-heating is minimal, so keep core-clock-dependent dissipation low and verify junction temperature with theta_JA from the manufacturer datasheet rather than assuming standard FR-4 figures.
Three frequent mistakes: (1) confusing temperature grades - only the -20E grade is rated to +125C; -20I parts fail above +85C. (2) Assuming pin-for-pin identity between Sensor Family (2011) and Motor Control Family (2010) 28-QFN parts - peripheral multiplexing on several pins differs, so check the datasheet pin-function tables. (3) Exceeding the 1KB RAM with large ADC sample buffers - size ring buffers explicitly in the linker map.
Place the oscillator and its load capacitors close to OSC1/OSC2 with short guarded traces, and route analog sensor traces away from PWM or UART lines. Keep the ADC reference (VREF+) path short and star-grounded to the analog ground island. For QFN assembly, specify a 2:1 solder-paste stencil aperture ratio on the center pad to avoid voiding, per standard QFN assembly practice.
Compliance Information
Listed as PB FREE (lead-free) by distributor Jotrin Electronics; RoHS compliance consistent with Microchip current production. REACH/halogen-free/conflict-minerals declarations not present in provided data - request official Microchip certificates.
