ATSAM4SD16CB-CNR - 120MHz Cortex-M4 MCU 1MB Flash TFBGA-100 | Microchip
MPN: ATSAM4SD16CB-CNR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.34 | $8.34 |
| 10 | $7.51 | $75.10 |
| 100 | $6.83 | $683.00 |
| 500 | $6.25 | $3,125.00 |
| 1,000 | $5.79 | $5,790.00 |
ATSAM4SD16CB-CNR Overview
An ARM Cortex-M4 MCU is a 32-bit RISC microcontroller that combines a high-efficiency processing pipeline with optional single-precision Floating-Point Unit, hardware MAC, and a tightly-coupled Nested Vectored Interrupt Controller. The Cortex-M4 architecture occupies a specific position in the broader MCU taxonomy: ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. SAM4S devices extend the M-class core with Microchip peripherals such as the High-Speed USB 2.0 Full-Speed device/host/OTG controller, CAN, EMAC, and an external bus interface, targeting industrial automation, smart energy, and Human-Machine Interface (HMI) applications.
Key features include 1 MB of dual-bank Flash (2x512 KB, supporting in-application programming), 160 KB SRAM, a flexible 16-channel 1 Msps ADC, two analog comparators, multiple timers, and a peripheral event system for hardware-triggered task chaining without CPU intervention. Cryptographic functions are accelerated by AES (256-bit) and True Random Number Generator hardware blocks. The high pin count and rich peripheral mix make this device well suited to gateway, data-logger, and motor-control applications that exceed the I/O budget of smaller Cortex-M0+ parts.
Typical applications include industrial PLC and HMI control, smart-meter concentrators with CAN/USB connectivity, factory-automation sensor hubs, USB-CDC bridge firmware for PC peripherals, and motor-control inverter boards. The 100-ball TFBGA footprint is favored where PCB space is at a premium and where the higher lead-count alternative (LQFP-100) cannot fit.
When designing with this part, allocate PCB real estate for both the TFBGA land pattern and the Xplained Pro board reference design; pay close attention to decoupling capacitor placement to keep VDDIO and VDDC noise under control at 120 MHz operation.
This page consolidates distributor pricing, drop-in alternative MPNs, and practical design notes beyond what is found in the manufacturer datasheet, making it easier to compare the ATSAM4SD16CB-CNR against alternatives and place orders with confidence.
Drop-in alternatives for ATSAM4SD16CB-CNR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD16CB-CNR (same form factor and footprint) — differing in ADC, Core Architecture, Package, Operating Temperature, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16CB-CFN
✅ Drop-In✓ In Stock
$8.85 / Unit
View Datasheet →ATSAM4SD16CB-ANR
✅ Drop-In✓ In Stock
$7.3 / Unit
View Datasheet →ATSAM4S8CB-CFNR
✅ Drop-In✓ In Stock
$6.85 / Unit
View Datasheet →ATSAM4SA16CB-ANR
✅ Drop-In✓ In Stock
$7.05 / Unit
View Datasheet →ATSAM4S4CB-ANR
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SD16CB-CNR Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 (32-bit RISC) |
| CPU Frequency (Max) | 120 MHz |
| Flash Memory | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Package | 100-ball TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| Silicon Revision | B (recommended for new designs) |
| Operating Temperature | -40C to +85C (extended temp grade) |
| ADC | 12-bit, up to 16 channels |
| USB | USB 2.0 Full-Speed device/host/OTG |
| Communication Interfaces | CAN, UART/USART, SPI, TWI (I2C), I2S, EMAC |
| Timers | Multiple 16-/32-bit TC channels |
| DMA Channels | 24 (PDC + DMA controller) |
| Cryptography | AES 256-bit + TRNG |
| Packing Quantity (T&R) | Tape & Reel (MRL B grade) |
| RoHS Status | Compliant |
| Lead-Free | Yes (Green compound) |
ATSAM4SD16CB-CNR 100-ball tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM4SD16CB-CNR (100-ball tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4SD16CB-CNR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4SD16CB-CNR is suitable for 6 applications: Industrial PLC and HMI Controller, Smart-Meter Concentrator with CAN/USB, Factory-Automation Sensor Hub, USB-CDC Bridge Firmware, Motor-Control Inverter Board, Portable Data Logger.
Industrial PLC and HMI Controller
The ATSAM4SD16CB-CNR fits industrial PLC and HMI controllers where deterministic 120 MHz Cortex-M4 performance is paired with 1 MB Flash for large ladder-logic and GUI assets and 160 KB SRAM for protocol stack headroom. Its CAN, USB, and UART channels map directly to PLC fieldbus, programming port, and HMI display links. The 100-ball TFBGA (9x9 mm) footprint keeps the controller area compact on a tightly populated backplane, while the extended -40C to +85C operating range tolerates cabinet temperatures. Revision B silicon is recommended by Microchip for all new industrial designs.
Recommended
Smart-Meter Concentrator with CAN/USB
The ATSAM4SD16CB-CNR serves as a smart-meter concentrator, aggregating data over CAN from household meters and forwarding it via USB to a maintenance tablet or backhaul modem. The 1 MB dual-bank Flash supports over-the-air firmware updates without service interruption, and the AES-256 hardware accelerator plus TRNG satisfy secure-boot and signed-firmware requirements. Operating from 1.62 V to 3.6 V, the device draws from the same battery-backed rail that powers the meter's RTC and metering SoC. The Revision B silicon corrects early errata for stable 24x7 operation.
Recommended
Factory-Automation Sensor Hub
The ATSAM4SD16CB-CNR anchors a factory-automation sensor hub by aggregating 4-20 mA, digital, and serial sensors onto Industrial Ethernet or CAN, then forwarding the data to the SCADA system. Its 12-bit 1 Msps ADC with up to 16 channels digitizes analog sensors directly, while the DMA controller streams ADC conversions without CPU intervention. The 160 KB SRAM buffers burst telemetry before forwarding, and the AES engine secures the link layer. The TFBGA-100 footprint supports dense PCB layouts where 100-pin LQFP parts cannot fit.
Recommended
USB-CDC Bridge Firmware
The ATSAM4SD16CB-CNR is well suited to USB-CDC bridge firmware that translates between a legacy RS-232/RS-485 field device and a modern PC USB port, presenting the device as a virtual COM port. The on-chip USB 2.0 Full-Speed OTG controller eliminates an external PHY, and the 120 MHz Cortex-M4 sustains the UART-USB throughput even under heavy buffering. The 1 MB Flash stores bootloader, CDC stack, and application; Revision B silicon improves USB suspend/resume behavior.
Recommended
Motor-Control Inverter Board
The ATSAM4SD16CB-CNR controls a small three-phase motor inverter by generating PWM with dead-time insertion via the TC channels, sampling phase currents with the 12-bit ADC, and running a sensorless FOC algorithm in real time. The 120 MHz Cortex-M4 executes the FOC loop within a few microseconds, while the AES-256 and TRNG enable firmware authentication for safety-critical motor applications. The 100-ball TFBGA keeps the MCU footprint compact on a high-density inverter PCB. Revision B silicon improves PWM timing accuracy.
Recommended
Portable Data Logger
The ATSAM4SD16CB-CNR acts as a portable data-logger MCU, sampling multiple analog and digital inputs, timestamping with the RTC, and storing batches to an external SD card or USB stick. The 160 KB SRAM buffers high-rate capture bursts, and the 1 MB Flash hosts filesystem and protocol stacks. Operating from 1.62 V to 3.6 V, the part runs directly from a Li-ion cell, extending battery runtime for field campaigns. The extended -40C to +85C range supports outdoor deployments.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD16CB-CNR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16CB-CFN | ATSAM4SD16CB-ANR | ATSAM4S8CB-CFNR | ATSAM4SA16CB-ANR | ATSAM4S4CB-ANR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA (9x9 mm) | 100-ball TFBGA (9x9 mm) - same | LQFP-100 (cross-footprint) | 100-ball TFBGA (9x9 mm) - same | LQFP-100 (cross-footprint) | LQFP-100 (cross-footprint) |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| Max CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (2 x 512 KB) | 1 MB (2 x 512 KB) | 1 MB (2 x 512 KB) | 512 KB | 1 MB | 256 KB |
| SRAM | 160 KB | 160 KB | 160 KB | 96 KB | 160 KB | 64 KB |
| Operating Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Silicon Revision | B | B | B | B | B | B |
| Ethernet MAC | Yes (EMAC) | Yes (EMAC) | Yes (EMAC) | Yes (EMAC) | Yes (EMAC enabled on SA) | Yes (EMAC) |
Key Differentiators
- Silicon Revision B with all known errata fixes (vs ATSAM4SD16CA-CUR (Revision A))
- 1 MB dual-bank Flash for in-application programming (vs ATSAM4S8CB-CFNR (512 KB Flash))
- 160 KB SRAM vs 64 KB on smaller SAM4S (vs ATSAM4S4CB-ANR (64 KB SRAM))
- Compact 100-ball TFBGA (9x9) for space-constrained designs (vs ATSAM4SD16CB-ANR (LQFP-100))
Design Notes
The ATSAM4SD16CB-CNR 100-ball TFBGA (9x9 mm) package requires a 4-layer PCB with a continuous ground plane directly under the BGA to provide a low-impedance return path for high-speed USB, EMAC, and SDRAM signals. Estimated: with a 0.8 mm ball pitch, route escape requires microvia or via-in-pad technology on the inner layers; allocate a 1.5 mm keep-out around the BGA for fan-out. Decoupling capacitors (100 nF X7R) must be placed within 2 mm of every VDDC and VDDIO ball, with bulk 4.7 uF tantalum or ceramic capacitors at the regulator outputs.
Supply the VDDC core from a dedicated 1.2 V LDO (or DC-DC if efficiency is needed) capable of at least 80 mA peak; the SAM4S datasheet reports core current up to ~70 mA at 120 MHz with all peripherals active. Estimated: at 3.3 V I/O rail with the CPU in Wait mode, total power is around 30 mW; in full run mode at 120 MHz it rises to approximately 200 mW. The VDDIO and VDDC rails must track within 0.3 V of each other to avoid parasitic current through the I/O cells.
Keep the USB DP/DM traces under 90 ohms differential impedance with length matching to within 150 mil; route over a continuous ground plane and avoid vias on the differential pair. Estimated: with the on-chip Full-Speed USB transceiver, no external PHY is required, but ESD protection (e.g. USBLC6-2SC6) at the connector is mandatory for industrial environments. Place the 48 MHz crystal within 5 mm of the XIN/XOUT pins and guard the traces with a ground ring to avoid radiated EMI.
Do not skip the JTAG/SWD header on prototype boards - debugging the Cortex-M4 lock-up states is otherwise very difficult. Ensure NRST is driven by a proper reset supervisor (e.g. MCP131) with a 10 kohm pull-up and 100 nF decoupling; floating NRST is a common cause of intermittent boot failures. The dual-bank Flash requires explicit configuration of the GPNVM bits before dual-bank operation is enabled; firmware must read the current GPNVM state before toggling, or the IAP routine can lock the device.
Compliance Information
RoHS compliant green compound (per Mouser listing 'Green'); lead-free per JLCPCB parts data. AEC-Q100 not applicable - this is an industrial-grade MCU, not an automotive-qualified part. Halogen-free status not explicitly stated in retrieved web data.
