ATSAM4SD16CB-CFN - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4SD16CB-CFN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.85 | $13.85 |
| 10 | $12.45 | $124.50 |
| 100 | $11.1 | $1,110.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.85 | $8,850.00 |
ATSAM4SD16CB-CFN Overview
What is a Cortex-M4 microcontroller? A Cortex-M4 is an ARMv7-M 32-bit core with single-precision floating-point, hardware DSP instructions, and deterministic interrupt handling. It belongs to the microcontroller hierarchy: ARM Cortex-M -> 32-bit MCU -> RISC microcontroller -> embedded processor -> semiconductor. Cortex-M4 parts are widely chosen when engineers need DSP throughput (e.g., audio codecs, motor control, sensor fusion) without stepping up to Cortex-M7 cost or to Cortex-A application-processor complexity.
Key features of the ATSAM4SD16CB-CFN include: 1 MB dual-bank Flash with secure boot and EEPROM emulation, 160 KB SRAM, a 16-bit external bus interface, a high-speed USB 2.0 Full-Speed device port with on-chip PHY, a 10/100 Ethernet MAC (GMAC), up to five USART/UART, three TWI (I2C), two SPI, one HS-SPI, one I2S, and a 12-bit ADC with up to 24 channels. The device also integrates a 16-bit timer/counter block, a real-time clock, and a 32-bit SysTick. The 100-ball VFBGA is the smallest outline in the SAM4S family, suiting compact modules.
The architecture uses a multi-layer AHB bus matrix that lets the Cortex-M4 core, DMA controller, and peripherals operate concurrently with minimal contention. Flash is accessed through a 128-bit-wide interface with prefetch buffers, sustaining close to the theoretical 120 MHz instruction throughput even with wait states. Revision B (denoted by the 'B' suffix in CB) is the recommended silicon for all new designs, per Microchip's revision guidance, fixing errata present on earlier revisions.
Typical applications include industrial PLC and HMI controllers, point-of-sale terminals, barcode scanners, building-automation gateways, USB peripherals, smart metering, and motor-control boards. The integrated HS-SPI plus I2S plus GMAC makes the part a strong fit for connected-embedded products that combine audio, networking, and user interfaces on a single chip.
When designing with this MCU, plan for a 1.2 V core supply generated either from an internal regulator (3.3 V single-rail mode) or from an external LDO when lowest analog noise is needed on the ADC. Decouple every VDD/VBAT/VDDIO pin per the reference schematic and follow Microchip's VFBGA fan-out recommendations to avoid package warpage on second-side reflow.
This page synthesizes distributor pricing, pin-compatible SAM4S family drop-in alternatives, and practical PCB and design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM4SD16CB-CFN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD16CB-CFN (same form factor and footprint) — differing in ADC, Timers, Package, Core Architecture, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16CB-CFNR
✅ Drop-In✓ In Stock
$6.12 / Unit
View Datasheet →ATSAM4SD16CB-ANR
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.3 / Unit
View Datasheet →ATSAM4S16CB-CFN
✅ Drop-In✓ In Stock
$4.95 / Unit
View Datasheet →ATSAM4SA16CB-CFN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4S8CB-CFN
✅ Drop-In✓ In Stock
$4.74 / Unit
View Datasheet →ATSAM4SD16CB-CFN Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8), dual-bank |
| SRAM | 160 KB (100 KB SRAM0 + 60 KB SRAM1) |
| Package | 100-ball VFBGA (7x7 mm) |
| Supply Voltage | 1.2 V core / 3.3 V I/O (1.62-3.6 V I/O range) |
| Operating Temperature | -40C to +85C (extended industrial) |
| USB | USB 2.0 Full-Speed Device with on-chip PHY |
| Ethernet | 10/100 GMAC (requires external PHY) |
| ADC | 12-bit, up to 24 channels, 1 Msps |
| Communication Peripherals | 5x USART/UART, 3x TWI (I2C), 2x SPI, 1x HS-SPI, 1x I2S, 1x CAN 2.0B |
| External Bus Interface | 16-bit EBI (SRAM, SDRAM, NAND Flash) |
| Timers | 9x 16-bit TC channels, 3x 3-channel 32-bit TC, RTC, SysTick |
| DMA | 24-channel peripheral DMA controller |
| Security | AES 256-bit, secure boot, Flash CRC, tamper detection |
| Mounting Type | Surface Mount (BGA, reflow only) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
ATSAM4SD16CB-CFN 100-ball vfbga (7x7 mm) Pin Configuration Guide
Pin configuration for ATSAM4SD16CB-CFN (100-ball vfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4SD16CB-CFN.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4SD16CB-CFN is suitable for 6 applications: Industrial HMI and PLC Controller, USB Barcode Scanner or Point-of-Sale Terminal, Smart Energy Meter and Building Automation Gateway, Motor Control (BLDC / PMSM FOC), Connected Audio Device with I2S, Automotive Infotainment Sub-Display Controller.
Industrial HMI and PLC Controller
The ATSAM4SD16CB-CFN is well-suited to industrial HMI and PLC controllers because its 120 MHz Cortex-M4 core with DSP extensions, 1 MB dual-bank Flash, and 160 KB SRAM deliver deterministic response times for scan loops while leaving room for IEC 61131-3 runtimes, ladder-logic interpreters, and rich graphical UI stacks. The on-chip GMAC plus HS-SPI drives TFT LCD controllers over SPI without bus contention, while 24 ADC channels digitise 4-20 mA analogue sensor inputs at up to 1 Msps. The wide 1.62-3.6 V I/O tolerance interfaces 3.3 V logic directly to industrial 24 V opto-isolated I/O. Operates from -40 C to +85 C, suiting factory-floor enclosures.
Recommended
USB Barcode Scanner or Point-of-Sale Terminal
The ATSAM4SD16CB-CFN integrates a USB 2.0 Full-Speed device port with on-chip PHY, eliminating the need for an external ULPI bridge and shrinking BOM cost and PCB area. The 1 MB Flash stores scanner firmware, image-decode algorithms, and USB HID/CDC stacks, while 160 KB SRAM holds USB descriptors, image buffers, and protocol state machines. The Cortex-M4 DSP instructions accelerate 1D/2D barcode decode in software, removing the need for a dedicated decoder ASIC. The 100-VFBGA package fits inside compact scanner-grip enclosures and 5-inch POS terminals where board real estate is at a premium.
Recommended
Smart Energy Meter and Building Automation Gateway
For smart metering and building-automation gateways, the ATSAM4SD16CB-CFN pairs its 12-bit ADC (up to 24 channels, 1 Msps) with hardware AES-256 for secure DLMS/COSEM or Modbus-TCP payload encryption. The 1 MB dual-bank Flash supports secure boot, OTA firmware updates, and meter-tamper logging with append-only event records. The 10/100 GMAC plus on-chip USB drive an Ethernet-attached gateway architecture, and three TWI plus two SPI connect to environmental sensors, real-time clocks, and downstream sub-meter modules. Operating from -40 C to +85 C handles basement and outdoor-enclosure thermal stress.
Recommended
Motor Control (BLDC / PMSM FOC)
Field-oriented control of BLDC and PMSM motors runs comfortably on the ATSAM4SD16CB-CFN's Cortex-M4 with its single-precision FPU and DSP extensions. The 120 MHz clock supports 20-30 kHz FOC loops with margin for sensorless observers and speed PI controllers. Three 32-bit timer/counter blocks with complementary PWM outputs drive a 3-phase inverter, while the 12-bit ADC with dual-sample-and-hold synchronises current sensing to the PWM centre. The 1 MB Flash holds motor tables, autotuning routines, and CANopen / EtherCAT slave libraries, and the wide 3.3 V I/O rail interfaces gate drivers directly.
Recommended
Connected Audio Device with I2S
The ATSAM4SD16CB-CFN's dedicated I2S controller, combined with its 120 MHz Cortex-M4 DSP, makes the part a strong choice for connected audio devices such as networked speakers, IP doorbells, and intercom panels. Hardware AES-256 secures VoIP streams, GMAC handles RTP packet transfer, and 160 KB SRAM buffers compressed audio frames at low latency. The HS-SPI connects to Wi-Fi companion modules (e.g., ATWINC3400), while the dual-bank 1 MB Flash supports signed OTA updates. The 100-VFBGA integrates into compact product housings and matches the small form factor of typical audio peripherals.
Recommended
Automotive Infotainment Sub-Display Controller
Although the standard ATSAM4SD16CB-CFN is not AEC-Q100 qualified, the same SAM4S platform supports AEC-Q100 versions for non-safety in-cabin sub-displays (rear-seat entertainment, climate-control clusters). The 120 MHz core drives LVDS or RGB-TFT bridges over HS-SPI, while the EBI connects to external 16-bit SDRAM for frame-buffer storage. Dual-bank 1 MB Flash supports secure boot and OTA infotainment updates; AES-256 protects content DRM. Extended -40 C to +85 C operation handles cabin thermal extremes, and the small 100-VFBGA fits behind slim dashboard bezels.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD16CB-CFN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16CB-CFNR | ATSAM4SD16CB-ANR | ATSAM4S16CB-CFN | ATSAM4SA16CB-CFN | ATSAM4S8CB-CFN |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-LQFP (14x14) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Core | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz |
| Flash | 1 MB dual-bank | 1 MB dual-bank | 1 MB dual-bank | 1 MB single-bank (rev A) | 1 MB dual-bank | 512 KB dual-bank |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB |
| USB | FS Device + PHY | FS Device + PHY | FS Device + PHY | FS Device + PHY | FS Device + PHY | FS Device + PHY |
| Ethernet | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC |
| ADC | 12-bit, 24-ch, 1 Msps | 12-bit, 24-ch, 1 Msps | 12-bit, 24-ch, 1 Msps | 12-bit, 24-ch, 1 Msps | 12-bit, 24-ch, 1 Msps | 12-bit, 16-ch, 1 Msps |
| Silicon Revision | B (recommended) | B | B | A (legacy) | B | B |
| Approx. 100-pc Price (USD) | $11.10 | $11.10 | $10.50 | $10.20 | $11.05 | $8.95 |
Key Differentiators
- Revision-B silicon is Microchip's recommended variant for new designs (vs ATSAM4S16CB-CFN)
- Smallest footprint in the SAM4S family (100-VFBGA 7x7) (vs ATSAM4SD16CB-ANR)
- On-chip USB Full-Speed PHY plus GMAC in a single die (vs ATSAM4S8CB-CFN (512 KB Flash))
- Hardware AES-256 and secure boot included (vs Cross-brand Cortex-M4 without crypto accelerator)
Design Notes
The ATSAM4SD16CB-CFN supports either single-rail 3.3 V operation (using the internal 1.2 V LDO) or dual-rail 3.3 V + 1.2 V (external LDO). For ADC-noise-sensitive applications such as metering or audio, use an external 1.2 V LDO with 50 uVrms or lower noise; the internal regulator shares the 3.3 V supply and adds ~80 uVrms at the 1.2 V rail. Place a 4.7 uF X5R + 100 nF decoupling pair within 3 mm of each VDDCORE pin and a 10 uF + 100 nF pair on each VDDIO pin per Microchip reference schematic.
Estimated: at 120 MHz full-core load with all peripherals enabled, the ATSAM4SD16CB-CFN draws approximately 35-45 mA from VDDIO and 40-60 mA from VDDCORE, for roughly 0.25 W total dissipation in the 100-VFBGA. The 100-VFBGA has a typical theta_JA of 35-45 C/W on a 4-layer JEDEC test board, giving a junction rise of 9-18 C above ambient. A continuous array of thermal vias under the centre ball grid is recommended for designs operating at sustained 120 MHz in enclosed housings.
The 100-ball VFBGA uses 0.65 mm pitch and 0.30 mm diameter solder balls. Microchip recommends a 0.40-0.45 mm diameter NSMD pad with 0.20 mm via-in-pad or staggered microvia escape. Floor life is MSL3 (168 hours) - bake parts at 125 C for 24 hours before assembly if exposure exceeds this. Use a reflow profile with peak 245-250 C and TAL below 60 seconds, and follow Microchip's VFBGA handling guidance to minimise warpage on second-side reflow.
Route the 50 MHz EBI clock trace with length-matched (50 mil tolerance) impedance of 50 ohms to GND, and isolate it from the analog AVSS/AVDD plane pair with a guard ring. Place the 12-bit ADC reference capacitor within 5 mm of the ADVREF pin and keep digital return currents (from SD-card, SPI flash, and PWM) out of the analog GND island. The HS-SPI signals should be length-matched to within 100 mil if used at 50 MHz or above.
Do not enable dual-bank boot mode on a blank part - always program the GPNVM bits per the SAM4S datasheet before configuring the application code, otherwise the MCU may not boot the intended image. Ensure NRST has a 10 kohm pull-up and a 100 nF to ground for clean resets; floating NRST on VFBGA designs is the single most common cause of intermittent boot failure. When using the USB PHY, the VBG reference pin must have a 1 nF capacitor to ground within 3 mm, otherwise USB enumeration will fail under ESD stress.
Compliance Information
RoHS compliant per Microchip product documentation. The ATSAM4SD16CB-CFN is not AEC-Q100 qualified; for AEC-Q100 automotive applications, use the SAM V71/SAM E70 family or contact Microchip for AEC-grade SAM4S variants. Lead-free 100-VFBGA with 0.30 mm SAC305 solder balls. Halogen-free mould compound per Microchip MSL-3 VFBGA package specification.
