ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
MPN: ATSAME70N21B-CN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.85 | $10,850.00 |
ATSAME70N21B-CN Overview
What is a Cortex-M7 microcontroller? A Cortex-M7 microcontroller is a 32-bit ARM processor designed for high-performance embedded applications, featuring a superscalar pipeline, hardware FPU, and DSP extensions. Within the taxonomy, it belongs to ARM Cortex-M family -> 32-bit MCU -> microcontroller -> embedded IC -> semiconductor. The M7 architecture targets deterministic real-time control, motor drives, and graphics HMI where M4-class devices lack the necessary compute throughput.
Key features of the ATSAME70N21B-CN include an integrated 1.2 Msps 12-bit ADC, dual 2-channel 1 Msps 12-bit DAC, 16-bit timers, PWM, QuadSPI (QSPI) for external memory, and the SAM E70 host USB with integrated HS PHY. The 384 KB SRAM is configured as 256 KB SRAM0 plus 128 KB SRAM1 with optional ECC on SRAM0, supporting industrial-grade -40C to +85C operation. The SAME70 also embeds a Cryptographic Accelerator (TRNG, AES, SHA) for secure boot and IP protection.
Architecture-wise, the ATSAME70N21B-CN pairs the Cortex-M7 core with a multi-layer AHB bus matrix, dedicated DMA channels, and tightly-coupled memory paths that minimize interrupt latency. The 2 MB internal Flash is dual-bank capable, enabling live firmware updates without downtime - critical for industrial fieldbus and motor control products requiring in-service reprogramming.
Typical applications include industrial motor control (FOC for PMSM/BLDC drives), building automation gateways with Ethernet/IP, automotive ADAS sensor fusion pre-processors, audio DSP front-ends, and high-speed IoT edge nodes. The combination of HS USB, CAN-FD, and GbE positions the SAME70 as a system-on-chip for connected industrial equipment.
When designing with this device, ensure the TFBGA-100 layout uses micro-via-in-pad or dog-bone fan-out with matched-length Ethernet differential pairs. Decouple VDDIN with at least 10 uF ceramic plus 100 nF near each supply pin, and provide a 12 MHz crystal with proper load capacitors for the PLL-derived system clock.
This page synthesizes distributor stock data, same-family drop-in alternatives, and application-specific design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for ATSAME70N21B-CN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME70N21B-CN (same form factor and footprint) — differing in Package, ADC, USB, Ethernet, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME70N21B-CNT
✅ Drop-In✓ In Stock
$9.28 / Unit
View Datasheet →ATSAMS70N21B-CN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAME70N20A-CN
✅ Drop-In✓ In Stock
$8.4 / Unit
View Datasheet →ATSAME70N19B-AN
✅ Drop-In✓ In Stock
$11.04 / Unit
View Datasheet →ATSAME70J21A-ANT
✅ Drop-In✓ In Stock
$9.6 / Unit
View Datasheet →ATSAME70N21B-CN Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| CoreMark Performance | 1500 CoreMark |
| DMIPS | 600 DMIPS |
| Program Flash | 2 MB (2048 KB) |
| SRAM | 384 KB (256 KB SRAM0 + 128 KB SRAM1) |
| Supply Voltage (VDDIN) | 1.62 V to 3.6 V |
| Package | 100-ball TFBGA, 9x9 mm, 0.8 mm pitch |
| Operating Temperature | -40C to +85C (industrial) |
| ADC | 1x 12-bit, 1.2 Msps, up to 24 channels |
| DAC | 2x 12-bit, 1 Msps, 2 channels each |
| USB | HS USB Host + Device with integrated PHY |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC (GMAC), HS GMAC variant supports GbE with external PHY |
| Crypto Accelerator | TRNG, AES (128/192/256), SHA-1/SHA-256 |
| External Memory Bus | 16-bit HSIF for SRAM/PSRAM/NAND/NOR |
| Timers/Counters | 16-bit TC channels, PWM, RTC |
| RoHS Status | Compliant |
ATSAME70N21B-CN 100-ball tfbga, 9x9 mm, 0.8 mm pitch Pin Configuration Guide
Pin configuration for ATSAME70N21B-CN (100-ball tfbga, 9x9 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAME70N21B-CN.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAME70N21B-CN is suitable for 6 applications: Industrial Motor Control (FOC for PMSM/BLDC), Building Automation Gateway with Ethernet, Automotive ADAS Sensor Fusion Pre-processor, Audio DSP Front-End with USB Streaming, High-Speed IoT Edge Gateway Node, Industrial HMI with TFT Display Controller.
Industrial Motor Control (FOC for PMSM/BLDC)
The ATSAME70N21B-CN executes field-oriented control (FOC) loops for permanent magnet synchronous motors (PMSM) and brushless DC (BLDC) drives at full 300 MHz Cortex-M7 throughput with hardware single+double-precision FPU, sustaining sub-10 microsecond current loop periods without CPU starvation. The integrated 12-bit 1.2 Msps ADC samples phase currents synchronously to PWM, while the PWM timer units generate complementary 3-phase outputs with programmable dead-time - eliminating external gate-driver logic. According to the Microchip SAM E70 datasheet, the SAME70's 16-bit timers and Quadrature Encoder Interface (QEI) provide closed-loop position/speed feedback for servo drives, robotic joints, and CNC spindle control where deterministic real-time response is critical.
Recommended
Building Automation Gateway with Ethernet
The ATSAME70N21B-CN integrates a 10/100 Ethernet MAC with dedicated DMA that offloads TCP/IP packet processing from the Cortex-M7 core, enabling building automation gateways to handle BACnet/IP, Modbus TCP, and KNX/IP traffic concurrently. The HS USB with integrated PHY supports local configuration via USB stick or Wi-Fi dongle for commissioning, while dual CAN-FD interfaces bridge to HVAC controllers and elevator subsystems. According to the SAM E70 datasheet, the SAME70's 384 KB SRAM is sufficient for full TCP/IP stacks plus application logic; the TFBGA-100 footprint allows compact DIN-rail module designs with isolated Ethernet magnetics.
Recommended
Automotive ADAS Sensor Fusion Pre-processor
The ATSAME70N21B-CN is suitable as a sensor fusion pre-processor in advanced driver-assistance systems (ADAS) where it aggregates data from camera, radar, and LiDAR front-end processors before forwarding to the main application processor. The Cortex-M7 DSP extensions execute FIR/FFT filtering on radar baseband data at 300 MHz, while the CAN-FD interfaces connect to vehicle bus networks. According to Microchip, the SAME70 family supports -40C to +85C industrial operation suitable for cabin-mounted ADAS ECUs; however, AEC-Q100 automotive qualification is NOT claimed for the standard ATSAME70N21B-CN - design teams targeting functional safety must evaluate SAMRH/SAMV automotive parts separately.
Recommended
Audio DSP Front-End with USB Streaming
The ATSAME70N21B-CN's HS USB with integrated PHY enables USB Audio Class 2.0 streaming at 32-bit / 384 kHz without external PHY, while the Cortex-M7 DSP extensions execute real-time audio processing - parametric EQ, dynamics, crossover filters - within the audio buffer deadline. The 384 KB SRAM holds multiple audio frame buffers plus coefficient tables for 8-channel mixing. According to the SAM E70 datasheet, the 12-bit DAC outputs support headphone monitoring or line-level analog monitoring paths; the SAME70 is suitable for USB DACs, audio interfaces, and high-end consumer audio products where DSP headroom matters.
Recommended
High-Speed IoT Edge Gateway Node
The ATSAME70N21B-CN is well-matched to industrial IoT edge gateways that aggregate sensor data from multiple field buses and forward to cloud platforms via Ethernet or HS USB cellular modems. The SAME70's cryptographic accelerator (AES, SHA, TRNG) enables hardware-accelerated TLS 1.3 handshakes, while the 2 MB dual-bank Flash supports over-the-air (OTA) firmware updates without service interruption - critical for deployed IoT nodes. According to the datasheet, the Cortex-M7 executes MQTT-SN, CoAP, and LwM2M stacks concurrently with on-device analytics, all within the 384 KB SRAM budget.
Recommended
Industrial HMI with TFT Display Controller
The ATSAME70N21B-CN's 2 MB Flash and 384 KB SRAM are well-suited for industrial human-machine interface (HMI) panels driving TFT LCD displays up to XGA resolution via the integrated LCD controller (when populated on the silicon variant). The Cortex-M7 renders custom graphics, animations, and touch response loops at full CPU speed, while the HS USB supports firmware update and configuration. According to the Microchip SAM E70 datasheet, the SAME70's QSPI interface connects to additional serial Flash for asset library storage, and the CAN-FD interface links to machine controllers for real-time status display.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME70N21B-CN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME70N21B-CNT | ATSAMS70N21B-CN | ATSAME70N20A-CN | ATSAME70N19B-AN | ATSAME70J21A-ANT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TFBGA-100 (9x9 mm) | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same |
| Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 2 MB (2048 KB) | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 256 KB (-33%) | 384 KB |
| Ethernet | 10/100 Mbps MAC | 10/100 Mbps MAC | Gigabit MAC (upgrade) | 10/100 Mbps MAC | 10/100 Mbps MAC | No Ethernet |
| CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | Reduced CAN count |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Highest memory tier in SAME70 family (vs ATSAME70N20A-CN)
- TFBGA-100 package with GbE-ready silicon (vs ATSAME70J21A-ANT)
- Dual-bank Flash for live OTA updates (vs ATSAME70N19B-AN)
Design Notes
The TFBGA-100 9x9 mm package with 0.8 mm ball pitch requires micro-via-in-pad or dog-bone fan-out PCB technology. Standard 4-layer FR-4 stack-up is acceptable; ensure the outermost signal layer has 50 ohm controlled impedance for Ethernet differential pairs (TXP/N, RXP/N). Decouple VDDIN with 10 uF X7R ceramic plus 100 nF X7R near each supply pin; add 4.7 uF bulk on VDDCORE per Microchip SAME70 reference schematic. Exposed pad (if present) must be soldered to a ground copper pour with thermal relief for reflow.
The ATSAME70N21B-CN operates from 1.62 V to 3.6 V on VDDIN and requires a separate VDDCORE supply typically 1.2 V derived from an internal LDO. At 300 MHz full CPU load with all peripherals active, the typical core current is approximately 100-150 mA. According to the Microchip SAM E70 datasheet, the on-chip LDO supplies VDDCORE; for low-noise applications an external LDO can be selected. Power-on reset (POR) and brown-out detector (BOD) thresholds must be configured in the SUPC controller at startup.
Common pitfalls when designing with the ATSAME70N21B-CN include: (1) failing to configure the 12 MHz crystal load capacitors to match the crystal CL specification, leading to PLL lock failures; (2) leaving the JTAG/SWD pins floating when not used, which can cause unintended debug entry in noisy industrial environments - tie them to defined states or disable via fuses; (3) neglecting the 16-bit HSIF pin mapping - double-bank Flash and QSPI share bus pins and require careful pin-mux configuration to avoid contention.
Place the 12 MHz crystal (or 12 MHz external clock) within 5 mm of the XIN/XOUT pins with symmetrical trace lengths to balance loading. Keep the crystal traces short and surrounded by ground guard rings to minimize EMI pickup. For Ethernet applications, route MII/RMII traces with matched lengths (delta < 50 mil) and 50 ohm impedance; the SAME70 datasheet AN-0241 application note provides reference layouts for both MII and RMII PHY interfaces.
Compliance Information
RoHS and REACH compliant per Microchip product page; lead-free reflow-compatible. AEC-Q100 NOT claimed for standard ATSAME70N21B-CN - automotive designs should evaluate SAMRH/SAMV family parts separately for functional safety.
