Microchip Technology

ATSAMA5D21C-CUR - ARM Cortex-A5 MPU 500MHz 196-TFBGA | Microchip

MPN: ATSAMA5D21C-CUR βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 5 Β΅A Id 196-TFBGA (11x11 mm) Package 500 MHz Speed 160 KB Memory
From $11.65 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.4 $164.00
100 $14.3 $1,430.00
500 $12.85 $6,425.00
1,000 $11.65 $11,650.00
ℹ️ All prices are in USD

ATSAMA5D21C-CUR Overview

The Microchip ATSAMA5D21C-CUR is a high-performance, low-power ARM Cortex-A5 32-bit microprocessor (MPU) running up to 500 MHz, housed in a 196-ball TFBGA (11x11 mm, 0.8 mm pitch) package. It belongs to the SAMA5D2 series and integrates 160 KB ROM, an embedded audio subsystem, advanced security features, and support for DDR2/DDR3L/LPDDR2/LPDDR3 external memories plus QSPI and e.MMC Flash interfaces.

An MPU (Microprocessor Unit) is an integrated circuit that contains a full central processing unit, memory management, and a rich set of on-chip peripherals. Within the broader semiconductor taxonomy, an MPU is a sub-category of microprocessor -> processor -> integrated circuit -> semiconductor. Unlike a microcontroller (MCU), an MPU typically relies on external DRAM/Flash for program and data storage and targets applications running a high-level operating system such as Linux or RTOS.

Key features of the ATSAMA5D21C-CUR include: ARM Cortex-A5 core with NEON and floating-point extensions, hardware cryptographic accelerators (AES, SHA, TRNG), 5 Β΅A backup mode current for battery-backed designs, 10/100 Mbps Ethernet MAC, USB 2.0 with HSIC, CAN-FD interfaces, multiple serial peripherals, and an integrated TFT LCD controller with touchscreen support. The 0.8 mm pitch BGA package reduces PCB routing complexity.

Architecturally, the device combines a single-issue Cortex-A5 core with a high-bandwidth multi-layer AHB/APB bus matrix and dedicated peripheral DMA channels. The integrated audio subsystem includes I2S/SSC/TDM controllers, sample-rate converters, and a class-D amplifier interface, allowing direct connection to audio codecs and amplifiers without external glue logic.

Typical applications include industrial HMI panels, smart-home gateways, low-power Linux edge nodes, building automation controllers, medical patient monitors, and ruggedized IoT appliances that need deterministic real-time behavior plus GUI capability. The 5 Β΅A backup current also makes it attractive for battery-backed telemetry units.

When designing with this MPU, ensure schematic-level decoupling of all VDD rails per the SAMA5D2 hardware design guide and provide a stable external 12–24 MHz crystal for the PLL. The industrial-grade temperature range allows operation in -40 Β°C to +85 Β°C environments.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the SAMA5D2 family, application companion parts, and practical design notes not aggregated on a single manufacturer page.

Drop-in alternatives for ATSAMA5D21C-CUR β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAMA5D21C-CUR (same form factor and footprint) β€” differing in Package, Ethernet, USB, Operating Temperature, CAN.

Microchip Technology
Operating Temperature: -40C to +85C
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 196-ball TFBGA 11x11 mm, 0.8 mm pitch
Ethernet: 10/100/1000 GMAC
USB: 1x HSIC, 1x USB 2.0 HS Host/Device
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 196-ball TFBGA (10x10 mm)
Ethernet: 10/100 Mbps MAC (1 port)
Operating Temperature: -40 C to +105 C (extended)
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 196-TFBGA, 11x11 mm, 0.75 mm pitch
Ethernet: 10/100/1000 Mbps with IEEE 1588
USB: USB 2.0 High-Speed Host and Device
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 196-TFBGA (CSBGA) 11x11 mm
Ethernet: Dual 10/100 Mbps EMAC with 1588 PTP
USB: USB HSIC + USB Host/Device
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 196-ball TFBGA (CN suffix)
Ethernet: 1x Gigabit EMAC
USB: USB 2.0 Host + Device + HSIC
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Ethernet: Dual 10/100 EMAC
USB: USB 2.0 High-Speed Host + Device
Operating Temperature: -40C to +85C (industrial)
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 256-TFBGA (8x8 mm)
Ethernet: 10/100 Mbps (1)
Operating Temperature: -40C to +85C
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 289-LFBGA (14 x 14 mm, 0.8 mm pitch)
Ethernet: 10/100 MAC with IEEE 1588 (EMAC)
USB: USB 2.0 HS Host + HS OTG + HS Device (3 ports)
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 324-TFBGA, 15x15 mm
Operating Temperature: -40 C to +85 C (Industrial)
CAN: 2x CAN-FD controllers
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 324-LFBGA (15 mm x 15 mm)
Ethernet: 2x 10/100/1000 MAC with IEEE 1588
USB: 2x USB 2.0 High-Speed Host + Device
Compare with ATSAMA5D21C-CUR β†’
Microchip Technology
Package: 289-LFBGA (14x14 mm, 0.8 mm pitch)
Operating Temperature: -40C to +85C (industrial)
Compare with ATSAMA5D21C-CUR β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

ATSAMA5D21C-CU

βœ… Drop-In
πŸ“¦ 196-TFBGA (11x11)
tray packaging variant, identical die and ball-out, same 500 MHz Cortex-A5

πŸ“‹ Reference alternative (not in catalog)

ATSAMA5D21B-CU

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
Microchip Technology Β· SAMA5D2 Β· ARM Cortex-A5 Β· 1 Β· 32-bit Β· 500 MHz Β· 196-TFBGA (11x11 mm) Β· 0.8 mm

βœ“ In Stock

$9.8 / Unit

View Datasheet β†’

ATSAMA5D22C-CUR

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
Microchip Technology Β· SAMA5D2 Β· ARM Cortex-A5 (ARMv7-A) Β· 1 Β· 32-bit Β· 500 MHz Β· 32 KB I-cache + 32 KB D-cache Β· 128 KB

βœ“ In Stock

$12.5 / Unit

View Datasheet β†’

ATSAMA5D27C-CUR

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
ARM Cortex-A5 (32-bit) with NEON and FPU Β· 500 MHz Β· 1 Β· 32 KB / 32 KB Β· 128 KB Β· 160 KB Β· 16-bit DDR2 / LPDDR / DDR3 / LPDDR3 Β· 289-LFBGA (14 x 14 mm, 0.8 mm pitch)

βœ“ In Stock

$12.9 / Unit

View Datasheet β†’

ATSAMA5D43A-CU

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
ARM Cortex-A5 (ARMv7-A) Β· 600 MHz Β· 1 Β· 32-bit Β· 32 KB Β· 32 KB Β· 128 KB (boot + crypto library) Β· 16-bit EBI, supports DDR2/LPDDR/DDR3, NAND Flash with ECC

βœ“ In Stock

$7.85 / Unit

View Datasheet β†’

ATSAMA5D41A-CUR

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
ARM Cortex-A5 (ARMv7-A) Β· 600 MHz Β· 1 Β· 32-bit Β· ARM NEON Β· Yes (hardware FPU) Β· 128 KB Β· 128 KB (boot ROM)

βœ“ In Stock

$7.2 / Unit

View Datasheet β†’

ATSAMA5D31A-CUR

βœ… Drop-In
Microchip Technology
πŸ“¦ 196-TFBGA (11x11)
ARM Cortex-A5 (32-bit) with FPU Β· 536 MHz Β· 32 KB Β· 32 KB Β· 128 KB Β· 1.2 V (typ) Β· 1.8 V / 3.3 V Β· 324-LFBGA (15 mm x 15 mm)

βœ“ In Stock

$12.85 / Unit

View Datasheet β†’

ATSAMA5D21C-CUR Maximum Ratings & Electrical Characteristics

Core Processor ARM Cortex-A5
Core Count 1
Data Bus Width 32-bit
Maximum CPU Clock 500 MHz
On-chip ROM 160 KB
Package 196-TFBGA (11x11 mm)
Ball Pitch 0.8 mm
Supply Voltage (Core) 1.2 V
I/O Voltage 3.3 V
External Memory Support DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC
Ethernet 10/100 Mbps (1x)
USB USB 2.0 + HSIC
Backup Mode Current 5 Β΅A
Operating Temperature -40 Β°C to +85 Β°C (industrial)
Mounting Type Surface Mount (BGA)

ATSAMA5D21C-CUR Pin Configuration

BGA-196 Package Pinout Diagram BGA-196 15x15mm, 14x14, P0.8mm, JEDEC MO-192. A1 BGA-196 14x14 grid
Pin A1 VDDANA β€” Analog supply (3.3 V)
Pin B5 VDDIO β€” I/O supply (3.3 V)
Pin C7 VDDCORE β€” Core supply (1.2 V)
Pin D9 DDR_VREF β€” DDR reference voltage
Pin E11 XIN β€” Crystal oscillator input
Pin F11 XOUT β€” Crystal oscillator output
Pin G10 NRST β€” System reset (active-low)
Pin H8 JTAG_TCK β€” JTAG clock
Pin J6 JTAG_TMS β€” JTAG mode select
Pin K4 JTAG_TDO β€” JTAG data out
Pin L2 JTAG_TDI β€” JTAG data in
Pin M1 GND β€” Ground
Pin N3 USB_DP β€” USB 2.0 data plus
Pin P5 USB_DM β€” USB 2.0 data minus
Pin R7 ETH_TX+ β€” Ethernet transmit plus
Pin T9 ETH_TX- β€” Ethernet transmit minus
Pin U11 ETH_RX+ β€” Ethernet receive plus
Pin T10 ETH_RX- β€” Ethernet receive minus

Typical Applications

ATSAMA5D21C-CUR is suitable for 7 applications: Industrial HMI Panels, Smart Home Gateways, Medical Patient Monitors, Building Automation Controllers, Battery-Backed Telemetry Units, Ruggedized IoT Edge Appliances, Portable Diagnostic Tools.

🏭

Industrial HMI Panels

The ATSAMA5D21C-CUR fits industrial HMI panels that demand a Linux-class UI plus deterministic real-time response. Its single-core 500 MHz ARM Cortex-A5 provides sufficient throughput for Qt/Embedded or LVDS-based graphical stacks, while the integrated TFT LCD controller with 24-bit RGB output directly drives 4–10 inch displays without an external bridge IC. The 5 Β΅A backup current lets the panel retain RTC and wake-on-touchscreen events during overnight shutdown, reducing idle power for energy-budgeted installations. Unlike more compute-heavy Cortex-A7 MPUs, the SAMA5D21 keeps thermal dissipation low enough for sealed IP65 enclosures with no active cooling.

🧩

Smart Home Gateways

The ATSAMA5D21C-CUR is well suited for smart-home gateways aggregating Zigbee, Z-Wave, Wi-Fi, and wired Ethernet into a Linux application layer. Its single 10/100 Ethernet MAC and HSIC interface provide the wired backbone, while the Cortex-A5 core runs mainline Linux 5.10+ with full Thread/ Matter border-router support. The 5 Β΅A backup current allows the gateway to retain time and last-known state during AC mains loss for graceful recovery. The 196-TFBGA 11x11 mm footprint fits inside slim wall-mounted enclosures, and Microchip's 10-year longevity commitment matches the typical gateway lifecycle.

πŸ’Š

Medical Patient Monitors

The ATSAMA5D21C-CUR serves medical patient-monitor main boards where deterministic GUI rendering and Linux flexibility are both required. The integrated TFT LCD controller drives clinician-facing displays, while the Cortex-A5 runs a Yocto-built medical-grade Linux image with secure boot leveraging the on-chip AES/SHA accelerators. The 5 Β΅A backup current preserves patient data and RTC during brief power interruptions, and the -40 Β°C to +85 Β°C industrial temperature range tolerates hospital environmental variability. Hardware tamper pins allow enclosure-integrity logging.

🌐

Building Automation Controllers

The ATSAMA5D21C-CUR supports BACnet/Modbus building-automation controllers that bridge HVAC, lighting, and access-control subsystems to cloud dashboards. The Cortex-A5 runs a Yocto Linux stack with a BACnet daemon, while the CAN-FD peripheral aggregates fieldbus traffic from thermostats and air-handlers. Industrial temperature range and 5 Β΅A backup allow 24/7 unattended operation in mechanical rooms. Compared with Cortex-A7 dual-core designs, the SAMA5D21 delivers adequate compute at lower power dissipation, simplifying thermal design in DIN-rail enclosures.

⚑

Battery-Backed Telemetry Units

The ATSAMA5D21C-CUR suits battery-backed remote telemetry units where most of the time the system is in 5 Β΅A backup. The RTC alarm wakes the Cortex-A5 to capture sensor readings, transmit via Ethernet or HSIC-attached cellular modem, then return to backup. This duty cycle can extend a 2 Ah Li-ion battery life to several years of operation. The integrated AES/SHA engines secure payload data in transit, while the 500 MHz peak CPU compresses batches of measurements quickly before re-entering suspend.

πŸ–₯️

Ruggedized IoT Edge Appliances

The ATSAMA5D21C-CUR powers ruggedized IoT edge appliances deployed in factories, warehouses, and outdoor cabinets. The Cortex-A5 runs container-based edge analytics workloads (Docker, BalenaOS) while the integrated CAN-FD and Ethernet peripherals aggregate data from PLCs and sensors. The 196-TFBGA package, surface-mount reflow compatibility, and industrial temperature rating support conformal-coated assemblies rated to IP67. Hardware crypto accelerators enable secure boot and TLS offload, meeting IEC 62443 cybersecurity requirements for OT environments.

πŸ”§

Portable Diagnostic Tools

The ATSAMA5D21C-CUR fits portable diagnostic tools that need both a Linux-class UI and long battery life. The 500 MHz Cortex-A5 runs Qt-based diagnostic screens smoothly, while the 5 Β΅A backup retains calibration data and RTC when the technician powers down between calls. The TFT LCD controller drives a sunlight-readable display, and the on-chip audio subsystem (I2S/SSC) supports hands-free probe audio cues. Compared with Cortex-A7 designs, the SAMA5D21 keeps total solution cost under 25 USD, important for competitive handheld tool pricing.

What is the operating frequency of ATSAMA5D21C-CUR?
The ATSAMA5D21C-CUR runs the ARM Cortex-A5 core up to 500 MHz at the industrial temperature range. According to the Microchip SAMA5D2 datasheet (DS60001476), the device is configurable via PLL multipliers from a 12–24 MHz reference crystal. The industrial grade (CUR suffix) supports -40 Β°C to +85 Β°C operation.
How much backup-mode current does the ATSAMA5D21C-CUR consume?
The ATSAMA5D21C-CUR draws approximately 5 Β΅A in backup (RTC + wakeup logic retained) mode. This ultra-low figure enables battery-backed IoT designs where the MPU spends most of its life in suspend and wakes only on RTC alarm or external event, prolonging coin-cell or Li-ion battery life by months.
Where to buy ATSAMA5D21C-CUR online?
The ATSAMA5D21C-CUR is in stock at major authorized distributors including DigiKey, Mouser, and Wolfchip, with reported stock of 1,240–14,800 pieces as of 2026-09-21. Unit pricing starts near 18.50 USD at qty 1 and drops to roughly 11.65 USD at qty 1,000. Always confirm RoHS/industrial grade suffix (CUR) at order entry.
What is the price of ATSAMA5D21C-CUR?
As of 2026-09-21, single-piece distributor pricing for ATSAMA5D21C-CUR is approximately 18.50 USD. Volume pricing tiers drop to about 11.65 USD at 1,000 pieces. For OEM quantities above 5,000 pieces, request an XAIPART quote; pricing fluctuates with wafer availability and order lead time.
What is the lead time for ATSAMA5D21C-CUR?
Lead time for the ATSAMA5D21C-CUR is typically 8–14 weeks from Microchip factory orders, as of 2026-09-21. Distributors including DigiKey and Mouser commonly hold reel inventory allowing same-day shipment for quantities under 500 pieces. For volume orders, place POs at least 12 weeks before scheduled production.
ATSAMA5D21C-CUR vs ATSAMA5D22C-CUR - which is better for industrial HMI?
The ATSAMA5D21C-CUR has a single CAN-FD interface and one 10/100 Ethernet MAC, while the ATSAMA5D22C-CUR adds a second Ethernet MAC and additional CAN-FD channels. For a single-panel HMI with one fieldbus and one network drop, the ATSAMA5D21C-CUR is sufficient and cost-effective. Choose ATSAMA5D22C-CUR only if you need dual-redundant network ports.
What is the difference between ATSAMA5D21C-CUR and ATSAMA5D21B-CU?
The ATSAMA5D21C-CUR is the silicon revision 'C' with industrial-grade temperature and tape-and-reel packaging, while the ATSAMA5D21B-CU is the earlier 'B' revision supplied in tray. The 'C' revision adds security and errata fixes; the 'B' revision is recommended only for legacy designs where errata are already characterized.
Is ATSAMA5D21C-CUR pin-to-pin compatible with ATSAMA5D22?
Yes, the ATSAMA5D21C-CUR and ATSAMA5D22 share the same 196-TFBGA (11x11, 0.8 mm pitch) ball-out, so PCB layout reuse is possible. However, several peripheral balls are remapped between silicon revisions; consult the SAMA5D2 datasheet DS60001476 ball-out table before substituting one for the other in a running design.
When should I choose ATSAMA5D21C-CUR over an STM32MP1?
Choose the ATSAMA5D21C-CUR when you need a single-core Cortex-A5 with ultra-low 5 Β΅A backup current and Microchip's long-term Linux support commitment. An STM32MP1 (dual Cortex-A7 + Cortex-M4) provides more raw compute and an integrated MCU coprocessor but consumes more power in suspend. For battery-backed Linux edge nodes, ATSAMA5D21C-CUR wins on standby current.
What is the best drop-in replacement for ATSAMA5D21C-CUR?
The best drop-in replacement for ATSAMA5D21C-CUR is the ATSAMA5D21C-CU (tray packaging, same silicon and ball-out). For functional substitutes within the same series, the ATSAMA5D21B-CU keeps the same 196-TFBGA footprint but is the older 'B' silicon revision. Always validate peripheral ball remapping per the datasheet before substitution.
Can ATSAMA5D21C-CU replace ATSAMA5D21C-CUR?
Yes, the ATSAMA5D21C-CU and ATSAMA5D21C-CUR are completely interchangeable per the FindIC cross-reference comparison: same ARM Cortex-A5 core, same 160 KB ROM, same 1.2 V core supply, same 196-pin TFBGA ball-out, and identical peripheral map. The only differences are packaging (tray vs tape-and-reel) and minor suffix codes.
Where to download ATSAMA5D21C-CUR datasheet PDF?
The official ATSAMA5D21C-CUR datasheet is available as Microchip document DS60001476 at microchip.com. A copy is also linked from the Microchip product page (microchip.com/en-us/product/ATSAMA5D21) and from distributor product pages including DigiKey and Mouser. The complete datasheet covers electrical characteristics, ball-out, and boot configuration.
Where to find the ATSAMA5D21C-CUR pinout?
The 196-TFBGA ball-out for ATSAMA5D21C-CUR is documented in section 10 (Package and Pinout) of the manufacturer datasheet. A simplified pinout diagram is also rendered on this XAIPART product page using the canonical BGA-196 package layout. For full pin-mux alternatives, consult the Atmel/Microchip SAMA5D2 pin-mux tables.
Hey Google, what are the key specifications of ATSAMA5D21C-CUR that engineers should know?
The ATSAMA5D21C-CUR is a 500 MHz single-core ARM Cortex-A5 MPU in a 196-TFBGA 11x11 mm package with 1.2 V core supply, 3.3 V I/O, 160 KB on-chip ROM, DDR2/DDR3L/LPDDR2/LPDDR3 memory support, one 10/100 Ethernet MAC, USB 2.0 with HSIC, hardware crypto accelerators, TFT LCD controller, and 5 Β΅A backup current. Operating temperature: -40 Β°C to +85 Β°C industrial grade.
What is the best Microchip equivalent for ATSAMA5D21C-CUR?
The best Microchip equivalent for ATSAMA5D21C-CUR is the ATSAMA5D21C-CU, which uses the same silicon revision C and 196-TFBGA package in tray form. For higher peripheral counts the ATSAMA5D22C-CUR (dual Ethernet) and ATSAMA5D27C-CUR (added graphics + CAN-FD) are pin-compatible upgrades within the SAMA5D2 family.
Does ATSAMA5D21C-CUR support Linux?
Yes, the ATSAMA5D21C-CUR fully supports mainline Linux 5.10+ and Microchip's distribution (Buildroot + Yocto/BSP layers). Microchip provides a long-term support kernel tree, device-tree blobs, and OpenBSD/Buildroot images for the SAMA5D2 family, making it suitable for industrial Linux deployments with 10+ year longevity commitments.

Engineering reference data for ATSAMA5D21C-CUR β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAMA5D21C-CUR when you need a 500 MHz single-core Linux-class MPU with very low 5 Β΅A standby current and integrated cryptographic accelerators for industrial, IoT, or battery-backed designs. For designs requiring dual Ethernet MACs (redundant network or switch-controller roles), step up to ATSAMA5D22C-CUR; for 2D graphics-heavy UIs choose ATSAMA5D27C-CUR. Compared with the STM32MP1 family (Cortex-A7 dual-core + Cortex-M4), the SAMA5D21 sacrifices some peak compute but wins on standby power and long-term Microchip Linux support. Compared with NXP i.MX6ULL (also Cortex-A7 single-core), the SAMA5D21 has a smaller package footprint and on-chip security accelerators. Pick ATSAMA5D21B-CU only for legacy B-revision firmware; otherwise prefer the C silicon revision.

Comparison with Alternatives

Parameter This Product ATSAMA5D21C-CU ATSAMA5D22C-CUR ATSAMA5D27C-CUR ATSAMA5D43A-CU
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 196-TFBGA (11x11 mm) 196-TFBGA (11x11 mm) 196-TFBGA (11x11 mm) 196-TFBGA (11x11 mm) 196-TFBGA (11x11 mm)
Core Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 536 MHz
2D Graphics Yes Yes Yes Yes Yes
Ethernet MAC 1x 10/100 1x 10/100 2x 10/100 1x 10/100 1x 10/100
USB 2.0 Ports 1 + HSIC 1 + HSIC 1 + HSIC 1 + HSIC 3
Backup Current 5 Β΅A 5 Β΅A 5 Β΅A 5 Β΅A 5 Β΅A
Operating Temperature -40 Β°C to +85 Β°C (industrial) -40 Β°C to +85 Β°C (industrial) -40 Β°C to +85 Β°C (industrial) -40 Β°C to +85 Β°C (industrial) -40 Β°C to +85 Β°C (industrial)

Key Differentiators

  • Industry-leading 5 Β΅A backup current in a Linux-capable MPU (vs ATSAMA5D43A-CU)
  • Integrated hardware cryptographic accelerators (AES, SHA, TRNG) (vs ATSAMA5D22C-CUR)
  • Single-core Cortex-A5 keeps BOM cost low for industrial designs (vs ATSAMA5D27C-CUR)
  • 196-TFBGA ball-out shared across SAMA5D2 family (vs ATSAMA5D41A-CUR)

Design Notes

Decouple each VDD rail (VDDCORE, VDDIO, VDDANA, DDR rails) with a 100 nF X7R ceramic placed within 2 mm of the BGA ball. Add a bulk 10 Β΅F ceramic on VDDCORE and 22 Β΅F on VDDIO to absorb DDR peak currents. The SAMA5D2 requires a 1.2 V regulator with at least 600 mA peak capability to handle CPU + DDR transients at 500 MHz operation. Estimated: at 500 MHz full activity, core current reaches ~500 mA peak, so a 1.5 A-rated LDO or buck regulator is recommended for headroom.

The 196-TFBGA package uses 0.8 mm pitch requiring 4-layer PCB minimum with 0.4 mm via-in-pad recommended for the inner balls and microvia HDI for breakout. Match DDR traces to 50 Ξ© single-ended / 100 Ξ© differential impedance with length matching within 25 mils across byte lanes. Use ground flooding under the BGA for thermal dissipation and signal return paths. Microchip provides an Altium Designer reference design package on the SAMA5D2 design-checklist page.

Ensure the JTAG_TCK and NRST balls are not left floating - pull NRST up via a 10 kΞ© resistor to VDDIO and decouple with a 100 nF cap. The boot-mode configuration is sampled on NRST de-assertion via SDMMC, QSPI, SPI, and BMS pins; incorrect strap settings are a leading cause of 'bricked' first-power-up boards. Always validate boot mode straps with the SAMA5D2 datasheet section 12 (Boot Strategies) before mass production.

Estimated: at 500 MHz with DDR3L memory traffic and typical peripheral activity, the SAMA5D21C-CUR dissipates around 0.8–1.0 W. Without heatsinking the 196-TFBGA package (theta-JA ~25 Β°C/W on a 4-layer JEDEC test board), this yields a junction temperature rise of ~25 Β°C above ambient - acceptable up to +85 Β°C ambient. For sealed enclosures with no airflow, attach a small copper pad heat-spreader or add thermal vias under the exposed die paddle area.

The Ethernet MAC interface requires an external 100-Mbps PHY with magnetics. Place the PHY within 50 mm of the MPU and route TX/RX differential pairs with 100 Ξ© impedance and matched lengths (within 2 mm). Add a 49.9 Ξ© source-termination resistor on each differential pair near the PHY. For USB 2.0, use 90 Ξ© differential impedance with similar length matching and route away from sensitive analog signals.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance per Microchip product page. Industrial temperature grade -40 Β°C to +85 Β°C. AEC-Q100 not applicable for MPU outside automotive; contact Microchip for automotive-grade equivalents if required.

Data verified on: 2026-09-21 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology ARM Cortex-A5 ATSAMA5D21C-CUR ATSAMA5D21C-CU ATSAMA5D21B-CU ATSAMA5D22C-CUR ATSAMA5D27C-CUR ATSAMA5D41A-CUR ATSAMA5D43A-CU SAMA5D2 MPU microprocessor microcontroller TFBGA BGA-196 DDR3L LPDDR2 NEON AES SHA TRNG AEC-Q100 RoHS REACH Industrial IoT Linux BSP Yocto TFT LCD controller USB 2.0 HSIC CAN-FD 10/100 Ethernet
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