PIC16F18855-I/SSVAO - 8-Bit 32MHz 14KB Flash XLP MCU | Microchip
MPN: PIC16F18855-I/SSVAO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.92 | $3.92 |
| 10 | $3.62 | $36.20 |
| 100 | $2.95 | $295.00 |
| 500 | $2.42 | $1,210.00 |
| 1,000 | $2.08 | $2,080.00 |
PIC16F18855-I/SSVAO Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals. The PIC16F18855 belongs to the PIC16F family of 8-bit Harvard-architecture microcontrollers, which sit within the broader category of microcontrollers -> embedded processors -> integrated circuits. Its XLP designation indicates optimized sleep currents in the nanoamp-to-microamp range, a critical differentiator versus standard MCUs for battery-powered or energy-harvesting designs.
Key features include a 32MHz internal oscillator, up to 14KB Flash, 1KB RAM, 256 bytes EEPROM, 25 digital I/O pins, a 10-bit ADC with computation, multiple UART/I2C/SPI interfaces, and CIPs such as CRC/SCAN, Hardware Limit Timer (HLT), and Complementary Waveform Generator. The AEC-Q100 automotive grade and Functional Safety support suit safety-critical automotive subsystems.
The device uses Microchip's enhanced mid-range 8-bit CPU core with a 14-bit instruction word, delivering predictable interrupt latency and deterministic execution. The XLP architecture combines multiple low-power modes (sleep, deep sleep, doze, idle) with peripheral activity tracking so unused peripherals can be clock-gated automatically. The integrated 10-bit ADC operates up to 100ksps and includes computation functions for averaging, oversampling, and threshold detection, reducing firmware burden.
Typical applications include automotive body electronics and sensor interfaces, industrial sensor nodes, low-power IoT edge devices, battery-powered instrumentation, and safety-related LED lighting control. The wide 1.8V-5.5V supply range supports 2.5V/3.3V/5V rails commonly found in automotive and industrial systems. As an automotive-grade FuSa MCU, the PIC16F18855-I/SSVAO is engineered for ISO 26262-style functional safety concepts including diagnostic libraries and windowed watchdog behavior.
When designing with this MCU, the SSVAO suffix designates the automotive-qualified, tape-and-reel variant. Designers should consult Microchip's MPLAB X IDE, MPLAB Code Configurator (MCC), and the Functional Safety diagnostic library to leverage the FuSa support, and verify that 28-pin SSOP PCB footprint constraints match the rest of the BOM.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical design notes not found on the manufacturer datasheet, helping engineers select, qualify, and source the PIC16F18855-I/SSVAO for next-generation automotive and industrial designs.
Drop-in alternatives for PIC16F18855-I/SSVAO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18855-I/SSVAO (same form factor and footprint) — differing in Package, Program Memory (Flash), ADC, Core Independent Peripherals, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18855-I/SS
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18855-E/SSVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18856-I/SSVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18854-I/SS
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18855-I/SSVAO Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Series | PIC® XLP™ 16F, Functional Safety (FuSa) |
| Core Processor | PIC 8-bit |
| Core Size | 8-Bit |
| Maximum CPU Speed | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| RAM | 1 KB |
| EEPROM | 256 B |
| Number of I/O Pins | 25 |
| Supply Voltage Range | 2.5V / 3.3V / 5V (1.8V - 5.5V broad range) |
| Operating Temperature Range | -40 C to +85 C (Industrial, 'I' grade) |
| Package | 28-SSOP (5.30 mm body, 1.0 mm pitch, SS suffix) |
| Mounting Type | Surface Mount |
| Automotive Grade | AEC-Q100 qualified (VAO suffix) |
| Functional Safety | FuSa-capable (diagnostic library available) |
| Low-Power Architecture | eXtreme Low Power (XLP) |
| ADC | 10-bit with computation, up to 100 ksps |
| Communication Interfaces | UART, I2C, SPI |
| Core Independent Peripherals | CRC/SCAN, HLT, CWG, NCO, PWM, CLC |
| MSL Level | 1 (unlimited floor life) |
| Lead-Free / RoHS | Yes / Compliant (per VAO automotive packaging designation) |
PIC16F18855-I/SSVAO Pin Configuration
| Pin 1 | RA5 — Bidirectional I/O / analog input / DAC output reference |
| Pin 2 | RA4 — Bidirectional I/O / analog input |
| Pin 3 | RA3 — Bidirectional I/O / analog input / MCLR (reset) |
| Pin 4 | RA2 — Bidirectional I/O / analog input |
| Pin 5 | RA1 — Bidirectional I/O / analog input / DAC output |
| Pin 6 | RA0 — Bidirectional I/O / analog input |
| Pin 7 | VSS — Ground reference |
| Pin 8 | VDD — Positive supply (1.8V - 5.5V) |
| Pin 9 | RA7 — Bidirectional I/O / analog input |
| Pin 10 | RA6 — Bidirectional I/O / analog input |
| Pin 11 | RC5 — Bidirectional I/O / CCP / PWM |
| Pin 12 | RC4 — Bidirectional I/O / SDA / data signal |
| Pin 13 | RC3 — Bidirectional I/O / SCL / clock signal |
| Pin 14 | RC2 — Bidirectional I/O / CCP / PWM |
| Pin 15 | RC1 — Bidirectional I/O / CCP / PWM |
| Pin 16 | RC0 — Bidirectional I/O |
| Pin 17 | OSC1 — External oscillator input / CLKIN |
| Pin 18 | OSC2 — External oscillator output / CLKOUT |
| Pin 19 | RB7 — Bidirectional I/O / ICSPCLK / ICDCLK |
| Pin 20 | RB6 — Bidirectional I/O / ICSPDAT / ICDDAT |
| Pin 21 | RB5 — Bidirectional I/O |
| Pin 22 | RB4 — Bidirectional I/O |
| Pin 23 | RB3 — Bidirectional I/O |
| Pin 24 | RB2 — Bidirectional I/O |
| Pin 25 | RB1 — Bidirectional I/O |
| Pin 26 | RB0 — Bidirectional I/O / interrupt-on-change |
| Pin 27 | RD7 — Bidirectional I/O (port-D expansion pins, see datasheet) |
| Pin 28 | RD6 — Bidirectional I/O (port-D expansion pin) |
Typical Applications
PIC16F18855-I/SSVAO is suitable for 6 applications: Automotive Body Electronics & Sensor Interfaces, Battery-Powered IoT Edge Sensor Nodes, Functional-Safety Lighting Control, Industrial Process Sensor Conditioning, HVAC & Climate Control Subsystems, Medical & Health Monitoring Wearables.
Automotive Body Electronics & Sensor Interfaces
The PIC16F18855-I/SSVAO fits automotive body and sensor ECUs because its AEC-Q100 qualification, 1.8V-5.5V supply (covering 12V automotive rails after regulation), 25 I/O pins, and 10-bit ADC with computation directly address the needs of body control modules, ambient light sensors, and HVAC position feedback. The 32MHz CPU executes closed-loop sensor-fusion algorithms within microseconds, while XLP sleep currents in the nanoamp range minimize quiescent drain when the vehicle is parked - a critical battery-life metric. CIPs like CRC/SCAN perform continuous memory-integrity checks mandated by ISO 26262 functional safety concepts. The 28-SSOP package handles the moderate thermal envelope of cabin-mounted ECUs and supports the wide -40C to +85C industrial temperature grade typical of body electronics. Drop-in companions include the same-die PIC16F18855-E/SSVAO for under-hood extended-temperature positions.
Recommended
Battery-Powered IoT Edge Sensor Nodes
The PIC16F18855-I/SSVAO is well suited for battery-operated IoT edge sensors because its XLP architecture delivers nanoamp sleep currents, enabling multi-year coin-cell or 2xAA battery life. The 14KB Flash holds an MQTT-SN or LoRaWAN application stack plus sensor drivers, and the 1KB RAM supports a network stack plus buffer. Hardware CIPs (HLT windowed watchdog, CRC/SCAN, CLC logic cell) offload safety and glue logic from the CPU, keeping wake-time short and active current minimal. The 1.8V-5.5V range accepts direct battery connection from single-cell Li-ion to 3xAA stacks. The 25 I/O pins accommodate I2C/SPI sensor clusters plus interrupt-driven wake inputs. Industrial -40C to +85C temperature grade suits outdoor enclosures.
Recommended
Functional-Safety Lighting Control
For safety-related LED lighting control - automotive tail lamps, emergency indicators, industrial machine status lights - the PIC16F18855-I/SSVAO provides FuSa-capable diagnostics, complementary waveform generator (CWG) with hardware dead-band, and Hardware Limit Timer (HLT) for windowed watchdog supervision. The CWG module drives LED strings with deterministic switching and built-in dead-band to prevent shoot-through in half-bridge FET drivers. CRC/SCAN continuously verifies Flash/EEPROM integrity as required by IEC 61508 / ISO 26262 functional safety standards. AEC-Q100 qualification and -40C to +85C industrial temperature support interior and exterior automotive lamp modules. The 14KB Flash fits lighting-pattern algorithms plus the FuSa diagnostic library without sacrificing feature richness.
Recommended
Industrial Process Sensor Conditioning
In industrial 4-20mA loop-powered transmitters and PLC analog input modules, the PIC16F18855-I/SSVAO brings the 10-bit ADC with computation (averaging, oversampling, threshold detection), 1.8V-5.5V supply for direct 24V bus operation after regulation, and 25 I/O pins for multi-channel sensor multiplexing. XLP sleep modes reduce loop-current consumption between conversion cycles, extending transmitter battery or harvested-power life. CIPs like the Numerically Controlled Oscillator (NCO) and CLC implement digital filtering and event sequencing in hardware, offloading the CPU and tightening response time. AEC-Q100 qualification provides headroom for industrial environments with extended thermal and vibration stress, supporting -40C to +85C operation. The 28-SSOP package survives conformal coating and wave-solder processes common in industrial PCBA.
Recommended
HVAC & Climate Control Subsystems
HVAC damper actuators, variable-speed fan controllers, and thermostat modules benefit from the PIC16F18855-I/SSVAO's CIP-driven PWM channels, integrated 10-bit ADC for temperature/humidity sensing, and XLP sleep behavior for battery-backed thermostats. The CWG generates complementary PWM signals with programmable dead-band for half-bridge fan motor drivers, while the HLT enforces windowed watchdog supervision mandated by safety standards. The 14KB Flash stores PID control firmware, look-up tables, and an optional BLE/Zigbee bridge stack. Industrial -40C to +85C temperature grade supports plenum and outdoor HVAC locations. AEC-Q100 qualification is useful where the same firmware base supports both automotive climate seats and stationary HVAC product lines.
Recommended
Medical & Health Monitoring Wearables
Wearable health monitors - pulse oximeters, single-lead ECG patches, continuous glucose monitor (CGM) transmitters - leverage the PIC16F18855-I/SSVAO XLP sleep currents to extend coin-cell battery life past 30 days, while the 32MHz CPU executes signal-processing algorithms for heart-rate detection and motion artifact rejection. The 14KB Flash stores firmware plus small lookup tables, and 1KB RAM buffers sensor windows between wakes. Hardware CRC/SCAN provides patient-data integrity checking required by IEC 62304 / FDA cybersecurity guidance. The 28-SSOP package is suitable for miniaturized wearable PCBs and supports the -40C to +85C industrial temperature range covering body-worn applications. The 10-bit ADC with computation performs oversampling for high-resolution vital-sign measurement at low active current.
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Recommended Products Summary
Engineering reference data for PIC16F18855-I/SSVAO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18855-I/SS | PIC16F18855-E/SSVAO | PIC16F18856-I/SSVAO | PIC16F18854-I/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP | 28-SSOP (same) | 28-SSOP (same) | 28-SSOP (same) | 28-SSOP (same) |
| Flash Memory | 14 KB | 14 KB | 14 KB | 28 KB | 7 KB |
| RAM | 1 KB | 1 KB | 1 KB | 2 KB | 512 B |
| Maximum CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| AEC-Q100 Automotive Grade | Yes (VAO) | No (industrial only) | Yes (VAO) | Yes (VAO) | No (industrial only) |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C |
| Functional Safety (FuSa) | Yes (diagnostic library) | Yes | Yes | Yes | Yes |
Key Differentiators
- AEC-Q100 automotive qualification with PPAP release (vs PIC16F18855-I/SS)
- Extended temperature range for under-hood applications (vs PIC16F18855-I/SSVAO)
- Doubled Flash and RAM in same footprint for OTA-capable designs (vs PIC16F18854-I/SS)
Design Notes
Estimated: at VDD=5V, CPU=32MHz, peripherals active, IDD is typically in the low single-digit mA range; XLP sleep current drops to nanoamp levels. For battery-powered designs, leverage the Doze, Idle, and Sleep modes with peripheral clock-gating controlled by the PMD registers. Always place a 100 nF decoupling capacitor within 5 mm of the VDD pin and a bulk 1-10 uF tantalum or ceramic capacitor at the supply rail entry to suppress transient loads from PWM outputs.
The VAO suffix is AEC-Q100 qualified and requires PPAP - substituting a non-VAO part in a certified automotive ECU is a quality escape and invalidates PPAP/PSO documentation. When migrating firmware from PIC16F18854 to PIC16F18855, verify CIP interrupt vector mapping because the additional peripherals shift vector addresses; recompile the entire project with the updated device pack in MPLAB X IDE.
Route the ICSPDAT and ICSPCLK pins (RB6/RB7) directly to an in-circuit debugger header without series resistors to preserve in-system programming reliability. Keep the MCLR/RA3 pin trace short and surround it with a guard ring to reduce ESD susceptibility; add a 10 kohm pull-up and a 100 nF decoupling capacitor per the programming specification. For mixed-signal designs, separate the analog VDD/VSS pins from digital supply traces with a ferrite bead or star-ground topology to minimize ADC noise injection.
Estimated: at 32 MHz CPU clock, harmonic content extends into the 100-200 MHz band; place the MCU close to its crystal or use the internal HFINTOSC to minimize radiated emissions. For automotive designs requiring CISPR 25 Class 5 compliance, add a series ferrite bead on the VDD supply rail and ensure the SSOP exposed pad (if used) is soldered to a contiguous ground plane for thermal dissipation and EMI suppression.
Compliance Information
AEC-Q100 qualified per VAO suffix designation. RoHS compliance inferred from Microchip VAO packaging designation - verify against the manufacturer certificate of compliance for production documentation. Halogen-free status not explicitly stated in the verified web data.