Microchip Technology

ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip

MPN: ATSAMB11-XPRO βœ“ Active
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1x2 100-mil pin-header for MCU current shunt Id BLE peripheral / beacon prototyping Package 2.4 GHz ISM band Speed 256 KB Memory
From $36.14 USD / Unit
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Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $60.24 $60.24
10 $54.21 $542.10
100 $48.19 $4,819.00
500 $42.17 $21,085.00
1,000 $36.14 $36,140.00
ℹ️ All prices are in USD

ATSAMB11-XPRO Overview

The Microchip Technology ATSAMB11-XPRO is a Bluetooth Smart (BLE 4.1) evaluation kit built around the ATSAMB11-MR510CA Bluetooth Smart System-on-Chip (SoC) module, integrating an ARM Cortex-M0 MCU core, 2.4GHz transceiver, modem, MAC, PA, TR switch, and integrated Power Management Unit (PMU). The kit operates from a 32.768 kHz low-frequency clock and a 12 MHz primary CPU clock, and exposes 256 KB of embedded Flash for application code and BLE stack storage.

A Bluetooth Low Energy (BLE) Xplained Pro kit is a hardware prototyping platform that combines the Atmel/Microchip Xplained Pro extension header ecosystem with a fully certified BLE radio module. The Xplained Pro family follows a standardized 2x5 100-mil extension header and a 1x2 current-measurement header, so the ATSAMB11-XPRO can share daughter cards (XPRO extensions) with the SAM D/SAM4/SAMA5 development boards from Microchip, accelerating sensor, display, and connectivity prototyping.

Key features of this kit include the ATSAMB11G18A MCU evaluation board, on-board 32.768 kHz and 12 MHz clock sources, the standard Xplained Pro extension header for XPRO-compatible click-board and MikroElektronika shields, an integrated MCU current-measurement header for power profiling, full Bluetooth SIG 4.1 BLE certification inherited from the on-module SoC, and USB/power input for Atmel Studio / Microchip Studio debugging via the on-board EDBG interface. The kit supports Windows 7 / 8 / Vista / XP IDE toolchains.

The SAM B11 family integrates the radio, baseband, and application processor on a single die, eliminating external balun/matching components and reducing BOM. The PMU supports direct connection to a single 1.8-4.3V supply (typical coin-cell operation), and the ARM Cortex-M0 core delivers deterministic interrupt latency required for BLE link-layer timing, making the SoC well suited for beacon, health-device, and remote-control firmware.

Typical applications include BLE peripheral prototyping (heart-rate, proximity, environmental sensors), iBeacon / Eddystone beaconing, smart-home and lighting-control gateways, and low-power wireless sensor nodes. The Xplained Pro form factor also makes it a useful reference design for FCC/CE modular certification reuse.

When designing with this kit, place the included 2.4 GHz antenna in free space and avoid ground copper directly beneath the trace antenna; the on-board MCU current-measurement header allows accurate SoC power profiling across BLE advertising, scan, and connected states using a source-measure unit or shunt resistor.

Drop-in alternatives for ATSAMB11-XPRO β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAMB11-XPRO (same form factor and footprint) β€” differing in Debug Interface, Product Type.

Microchip Technology
Debug Interface: On-board SWD + Virtual COM port over USB
Product Type: RF Evaluation and Development Kit
Compare with ATSAMB11-XPRO β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

ATBTLC1000-XPRO

βœ… Drop-In
πŸ“¦ Xplained Pro Kit (2x5 100-mil extension header)
BTLC1000 BLE 5.0 SoC vs SAM B11 BLE 4.1; same Xplained Pro board form factor and EDBG debugger; firmware not binary-compatible

πŸ“‹ Reference alternative (not in catalog)

ATSAMW25-XPRO

βœ… Drop-In
πŸ“¦ Xplained Pro Kit (2x5 100-mil extension header)
SmartConnect W25 (SAMD21 host + WILC3000 Wi-Fi/BT combo) vs SAM B11 BLE-only; same Xplained Pro board form factor; adds Wi-Fi

πŸ“‹ Reference alternative (not in catalog)

ATSAMB11ZR-XPRO

βœ… Drop-In
Microchip Technology
πŸ“¦ Xplained Pro Kit (2x5 100-mil extension header)
RF Evaluation and Development Kit Β· ATSAMB11-ZR210CA Β· Bluetooth Smart 4.x Low Energy (BLE) Β· 2.4 GHz ISM band Β· SmartConnect (ATSAMB11 Series) Β· SiP/Module (System-in-Package) Β· IEEE 802.15.1, Bluetooth 4.x Low Energy Β· ARM Cortex-M0

βœ“ In Stock

$45 / Unit

View Datasheet β†’

ATSAMB11-XPRO Specifications (manufacturer-published)

Product Type Bluetooth Smart Xplained Pro Evaluation Kit
Target MCU / Module ATSAMB11-MR510CA (ATSAMB11G18A SoC)
MCU Core ARM Cortex-M0 32-bit
Bluetooth Version BLE 4.1 (Bluetooth Smart)
Operating Frequency 2.4 GHz ISM band
Flash Memory 256 KB
Low-Frequency Clock 32.768 kHz
Primary CPU Clock 12 MHz
Form Factor Xplained Pro (Atmel/Microchip standard)
Extension Header 2x5 100-mil Xplained Pro header
Current Measurement 1x2 100-mil pin-header for MCU current shunt
Debug Interface On-board EDBG (USB to SWD/UART)
Supported OS Windows 7 / 8 / Vista / XP
Integrated Radio Transceiver, modem, MAC, PA, TR switch
Integrated Power Management Yes (on-module PMU)
Bluetooth Certification Bluetooth SIG 4.1 (module pre-certified)
Typical Use Case BLE peripheral / beacon prototyping

ATSAMB11-XPRO Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin J1-1 VCC β€” Xplained Pro extension header VCC (3.3 V)
Pin J1-2 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-3 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-4 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-5 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-6 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-7 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-8 GND β€” Xplained Pro extension header ground
Pin J1-9 GPIO β€” Xplained Pro extension header GPIO / signal pin
Pin J1-10 GND β€” Xplained Pro extension header ground

Typical Applications

ATSAMB11-XPRO is suitable for 6 applications: BLE Heart-Rate / Proximity Peripheral Prototype, iBeacon / Eddystone Beaconing Firmware Development, Smart Home Lighting / HVAC Wireless Node, Low-Power Wireless Sensor Node Reference Design, BLE Remote Control / HID Prototype, BLE Audio Streaming / Voice Remote Reference.

πŸ’Š

BLE Heart-Rate / Proximity Peripheral Prototype

The ATSAMB11-XPRO is well suited for prototyping Bluetooth Low Energy peripherals such as heart-rate, proximity, and environmental sensors because the integrated ATSAMB11G18A SoC combines a Cortex-M0 application processor with a fully certified BLE 4.1 radio. Its 256 KB Flash is enough to host the Microchip ASF/Wireless Framework BLE stack plus a custom GATT profile, and the integrated PMU allows direct connection of a CR2032 coin cell. The on-board 1x2 current-measurement header lets you quantify average SoC draw across advertising, scan, and connected intervals, which is essential when targeting sub-100 uA average current budgets for wearable medical peripherals.

🧩

iBeacon / Eddystone Beaconing Firmware Development

For iBeacon and Eddystone beacon designs, the ATSAMB11-XPRO exposes the SAM B11's low-power BLE advertising engine with deterministic Cortex-M0 timing required for precise advertising intervals. The integrated PA and TR switch deliver +4 dBm typical TX output and good RX sensitivity without external matching components, and the on-module PMU enables multi-year coin-cell battery life when the beacon advertises every 100-1000 ms. Engineers can use the Xplained Pro extension header to attach an external accelerometer and only wake the radio on motion, using the on-board 32.768 kHz crystal as the low-power timebase.

🏭

Smart Home Lighting / HVAC Wireless Node

Smart-home lighting controllers, BLE thermostats, and HVAC wireless wall-modules benefit from the ATSAMB11-XPRO's integrated 2.4 GHz radio chain, Cortex-M0 MCU, and on-module PMU which together cut BOM cost and PCB area. The Xplained Pro 2x5 extension header accepts MikroElektronika click boards for adding relays, Triac drivers, or temperature/humidity sensors, allowing rapid iteration on ZigBee/BLE bridge prototypes. The kit's pre-certified BLE 4.1 radio also simplifies FCC/CE modular compliance for the end product, since the integrated antenna path is reused verbatim in the ATSAMB11-MR510CA module deployed in production.

🌐

Low-Power Wireless Sensor Node Reference Design

Industrial and agricultural wireless sensor nodes use the ATSAMB11-XPRO as a reference platform to validate sub-1 mA average BLE sensor nodes before committing to a custom PCB. The on-board EDBG debugger accelerates firmware iteration, while the 1x2 current-measurement header plus an external source-measure unit enables accurate SoC power profiling across duty-cycled BLE connections. Combined with the standard Xplained Pro extension header, designers can stack an environmental sensor click-board and reuse the same code on the production ATSAMB11-MR510CA SiP without re-certifying the radio.

πŸ“±

BLE Remote Control / HID Prototype

The ATSAMB11-XPRO is useful for prototyping Bluetooth Low Energy remote controls, presentation clickers, and HID peripherals because the SAM B11 SoC's BLE link layer can sustain low-latency connection intervals down to 7.5 ms while still running on coin-cell power. The Cortex-M0 core can scan a button matrix connected to the XPRO extension header and emit HID-over-GATT notifications with deterministic timing. The on-board 12 MHz primary crystal and 32.768 kHz RTC crystal together support both active-mode radio operation and low-power sleep modes typical of remote-control duty cycles.

🎧

BLE Audio Streaming / Voice Remote Reference

Audio-over-BLE prototypes, voice-remote controls, and hearing-aid accessory designs can use the ATSAMB11-XPRO as a software development platform for evaluating the SAM B11's BLE throughput, latency, and PDU scheduling. The kit's 256 KB Flash holds the ASF/Wireless Framework stack plus optional LC3/ADPCM codecs, and the Xplained Pro extension header accepts audio codec DAC click-boards for hardware-in-the-loop evaluation. Designers iterate using Microchip Studio on Windows and once the audio pipeline is validated, port the binary to the ATSAMB11-MR510CA SiP for the end-product PCB.

What is the ATSAMB11-XPRO evaluation kit?
The ATSAMB11-XPRO is the Microchip Xplained Pro development kit for the ATSAMB11-MR510CA Bluetooth Smart (BLE 4.1) System-on-Chip module. It integrates an ARM Cortex-M0 core, 2.4 GHz radio chain (transceiver, modem, MAC, PA, TR switch), 256 KB Flash, and an on-module PMU on a single Xplained Pro board with a 1x2 MCU current-measurement header and standard XPRO extension header. According to the Atmel-42664 user guide, the kit ships with the EDBG debugger and is supported by Atmel Studio / Microchip Studio on Windows 7/8/Vista/XP.
What is the difference between ATSAMB11-XPRO and ATSAMW25-XPRO?
The ATSAMB11-XPRO is built around the SAM B11 BLE 4.1 SoC with ARM Cortex-M0 core and 256 KB Flash, targeting ultra-low-power Bluetooth Smart peripherals and beacons. The ATSAMW25-XPRO is built around the SmartConnect W25 SoC which adds an integrated SAMD21 Cortex-M0+ host MCU alongside the WILC3000 2.4 GHz Wi-Fi/BT combo, so it targets Wi-Fi plus Bluetooth rather than BLE-only. Both share the Xplained Pro form factor, but the ATSAMB11-XPRO is the simpler, lower-power BLE-only board.
How much does the ATSAMB11-XPRO cost?
The ATSAMB11-XPRO lists at approximately $60.24 per unit at qty-1 from authorized distributors such as LCSC, with stepped pricing down to roughly $36.14 at qty-1000 (as of 2026-09-21, per LCSC, DigiKey, Octopart aggregated distributor data). Pricing varies by reel/qty break, so quote-based volume pricing should be requested directly from Microchip authorized channels for OEM quantities.
Is the ATSAMB11-XPRO still in stock and active?
The ATSAMB11-XPRO is currently in active production and is listed as in stock at multiple authorized distributors including DigiKey (P/N 5549571) and LCSC, with same-day shipping as of 2026-09-21. The kit has not been marked NRND or EOL by Microchip Technology. For long-lead OEM programs, confirm supply through a Microchip franchised distributor before committing the design.
What is the lead time for ATSAMB11-XPRO?
Lead time for the ATSAMB11-XPRO from authorized distributors such as DigiKey is typically same-day to 2 weeks at qty-1, with 4-6 weeks typical for factory-direct orders of 1000+ units (as of 2026-09-21). Microchip franchised distributors can provide firm lead-time quotes; LCSC and Octopart also aggregate live stock from multiple vendors for faster small-volume sourcing.
What is the best drop-in alternative to ATSAMB11-XPRO?
There is no true drop-in PCB replacement for the ATSAMB11-XPRO because it is a complete Xplained Pro development board, not a bare SoC; functionally equivalent Xplained Pro BLE kits that share the same extension header and EDBG debugger include the Microchip ATBTLC1000-XPRO (BLE 5.0) and the RN-41-EK from Microchip/Roving Networks. For a kit swap without redesigning firmware porting effort, ATBTLC1000-XPRO is the closest same-form-factor Microchip upgrade path.
ATSAMB11-XPRO vs ATBTLC1000-XPRO - which is better for a new BLE design?
For a brand-new BLE design in 2026, the ATBTLC1000-XPRO is generally the better choice because the BTLC1000 SoC supports Bluetooth 5.0 (vs BLE 4.1 on SAM B11), giving longer range via LE Coded PHY and 2x raw throughput. However, the ATSAMB11-XPRO remains relevant for ultra-low-power coin-cell designs where the SAM B11's integrated PMU and proven BLE 4.1 stack minimize BOM and power budget; choose ATSAMB11-XPRO for proven lowest-power beacons, ATBTLC1000-XPRO for newer BLE 5.x features.
When should I choose ATSAMB11-XPRO over a bare BLE module?
Choose ATSAMB11-XPRO when you need a pre-certified, pre-tested Xplained Pro development platform with on-board EDBG debug, standardized XPRO extension headers for click-board shields, and an MCU current-measurement header for accurate power profiling across BLE states. A bare BLE module (e.g., a tiny pre-certified SiP) is better when you are building a high-volume end product where the evaluation board's bulk, cost, and USB/EDBG are unnecessary - migrate to the bare ATSAMB11-MR510CA module once the firmware is validated on the XPRO kit.
Can the ATSAMB11-MR510CA be used outside the kit?
Yes. The ATSAMB11-MR510CA Bluetooth Smart SiP module is sold separately by Microchip Technology and is pre-certified to Bluetooth SIG 4.1, so it can be soldered directly onto your production PCB without re-running the full radio regulatory certification. Designers typically prototype firmware on the ATSAMB11-XPRO and then drop the same MR510CA module onto their custom board, reusing the same Atmel/Microchip BLE stack binary.
Where can I download the ATSAMB11-XPRO datasheet and user guide?
The official ATSAMB11-XPRO Xplained Pro User Guide is published by Microchip as document Atmel-42664 and is downloadable from https://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42664-ATSAMB11-Xplained-Pro_UserGuide.pdf. The companion SAM B11 family datasheet is document 70005271C, also available from ww1.microchip.com. Both PDFs describe the kit schematic, extension header pinout, and EDBG debug interface.
Where can I find the ATSAMB11-XPRO pinout and extension header mapping?
The Xplained Pro extension header (2x5, 100-mil) and the 1x2 MCU current-measurement header are described in the Atmel-42664 user guide from Microchip Technology. Standard XPRO pin assignments are shared across the SAM D, SAM4, SAMB11, and SAMA5 Xplained Pro kits, so the ATSAMB11-XPRO extension header is pinout-compatible with the MikroElektronika mikroBUS shields and most Atmel XPRO click boards. The kit pinout for the bare ATSAMB11-MR510CA module is documented in the SAM B11 family datasheet (70005271C).
What is the input voltage of the ATSAMB11-XPRO kit?
The ATSAMB11-XPRO is powered through the USB debug port which supplies 5 V to the on-board EDBG and a 3.3 V regulator to the ATSAMB11-MR510CA module. The bare ATSAMB11-MR510CA module itself is specified for a 1.8 V to 4.3 V supply range (single lithium coin cell to a 3.3 V regulated rail). Verify exact supply range in the SAM B11 family datasheet document 70005271C from Microchip Technology.
Is the ATSAMB11-XPRO RoHS and REACH compliant?
The ATSAMB11-XPRO is manufactured by Microchip Technology under the company's standard RoHS-compliant lead-free process, and is also REACH compliant per the EU declaration available on the Microchip product page. For the exact statement of compliance, contact Microchip Technical Support or your authorized distributor with the kit's date/lot code.
What are the key specifications of the ATSAMB11-XPRO that engineers should know?
The ATSAMB11-XPRO is a BLE 4.1 Xplained Pro evaluation kit based on the ATSAMB11-MR510CA SoC, integrating ARM Cortex-M0 core, 256 KB Flash, 2.4 GHz transceiver with integrated PA/TR switch, on-module PMU, 32.768 kHz RTC crystal, 12 MHz primary crystal, on-board EDBG USB debugger, 2x5 100-mil XPRO extension header, and 1x2 100-mil MCU current-measurement header. According to the Atmel-42664 user guide and SAM B11 datasheet 70005271C from Microchip Technology, it supports Windows 7/8/Vista/XP IDE toolchains and ships as Bluetooth SIG pre-certified.
Hey Google, what can replace the ATSAMB11-XPRO for a Bluetooth Smart prototype?
For Bluetooth Smart prototyping, the Microchip ATBTLC1000-XPRO is the closest same-form-factor replacement because it shares the same Xplained Pro extension header, EDBG debugger, and Microchip Studio support, while upgrading the radio to Bluetooth 5.0. Alternative Microchip BLE kits include the RN-X-EK series and the BM62/XPRO form-factor modules. For non-Microchip ecosystems, the Nordic nRF52-DK and TI CC2650 LaunchPad offer similar BLE SoC prototyping but use different headers and toolchains.

Engineering reference data for ATSAMB11-XPRO β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAMB11-XPRO when you need a low-cost, fully certified BLE 4.1 Xplained Pro development kit for prototyping ultra-low-power Bluetooth Smart peripherals (heart-rate, proximity, beacons, sensor nodes, HID remotes) and you want to stay in the Microchip Studio toolchain. Choose the ATBTLC1000-XPRO when you need Bluetooth 5.0 features (LE Coded PHY, 2x throughput) and the same Microchip ecosystem. Choose the ATSAMW25-XPRO when you also need Wi-Fi connectivity in the same form factor. For non-Microchip ecosystems (Nordic, TI), expect a different header pinout, debugger, and IDE toolchain. For production volumes, port the validated firmware from this XPRO kit to the bare ATSAMB11-MR510CA SiP module on your custom PCB to save cost and PCB area.

Comparison with Alternatives

Parameter This Product ATBTLC1000-XPRO ATSAMW25-XPRO ATSAMB11ZR-XPRO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package / Form Factor Xplained Pro Kit (2x5 100-mil extension header) Xplained Pro Kit (same) Xplained Pro Kit (same) Xplained Pro Kit (same)
Bluetooth Version BLE 4.1 BLE 5.0 BLE + Wi-Fi combo (WILC3000) BLE 4.1
Target SoC ATSAMB11G18A (Cortex-M0 + 2.4 GHz radio) ATBTLC1000 (Cortex-M0 + BLE 5.0) ATSAMW25 (SAMD21 host + WILC3000 combo) ATSAMB11ZR SiP module
Flash Memory 256 KB 128 KB 256 KB (SAMD21 host) 256 KB
Integrated PMU Yes (on-module) Yes (on-module) External LDO recommended Yes (on-module)
Wi-Fi No No Yes (WILC3000) No
Debug Interface On-board EDBG (USB-SWD/UART) On-board EDBG On-board EDBG On-board EDBG
MCU Current-Measurement Header 1x2 100-mil (included) 1x2 100-mil (included) 1x2 100-mil (included) 1x2 100-mil (included)

Key Differentiators

  • Fully integrated BLE 4.1 radio + Cortex-M0 SoC + PMU in a single pre-certified module (vs ATBTLC1000-XPRO)
  • BLE-only design (no Wi-Fi cost/overhead) vs Wi-Fi+BT combo (vs ATSAMW25-XPRO)
  • Same Xplained Pro form factor, EDBG debugger, and Microchip Studio tooling as the rest of the SAM XPRO family (vs Generic BLE dongle / Nordic nRF51-DK)

Design Notes

The ATSAMB11-XPRO hosts the ATSAMB11-MR510CA SiP whose integrated 2.4 GHz trace antenna requires a keep-out area beneath and around the antenna in any production PCB derived from the kit. Reuse the ATSAMB11-MR510CA reference layout from the SAM B11 family datasheet (70005271C) verbatim, including antenna dimensions, GND plane clearance, and via stitching pattern, to preserve the Bluetooth SIG pre-certification. Estimated: ground keep-out minimum 5 mm beyond antenna trace on all layers.

For coin-cell designs (CR2032, CR2477), drive the ATSAMB11-MR510CA module from a single 1.8-4.3 V rail through its integrated PMU; do not add a separate LDO in front of it. Place a 10 uF X5R/X7R ceramic bulk capacitor as close as possible to the module's VDD pin to suppress BLE TX inrush current (estimated peak ~25 mA per TX burst at 0 dBm). Add a 100 nF decoupling cap in parallel for high-frequency noise bypass, and verify peak burst current is within the coin cell's pulse rating.

Do not assume BLE 5.0 features (LE Coded PHY, 2 Mbps PHY, periodic advertising, advertising sets) are available on the SAM B11 SoC; this kit supports BLE 4.1 only, and the Microchip BLE stack on this SoC does not expose the BLE 5.x feature set. For BLE 5.0 designs, migrate to ATBTLC1000-XPRO or to a Nordic nRF52/TI CC26xx platform. Also verify the XPRO extension header pinout against the SAM B11 datasheet before connecting third-party shields - the SAM B11 SoC does not expose every XPRO standard signal (no analog comparator pins, no DAC pins).

Use the on-board MCU current-measurement header (1x2 100-mil pin-header) on the ATSAMB11-XPRO with a source-measure unit or a 10-100 ohm shunt resistor to capture SoC current across BLE advertising, scanning, connection, and sleep states. This is the only reliable way to estimate battery life for coin-cell designs, and the kit's dedicated shunt point is preferred over measuring at the USB input (which adds EDBG/regulator quiescent current). Recommended: sample at >= 1 kSa/s with a 1 ms moving average to capture TX burst peaks.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS/REACH compliance per Microchip Technology product page. The on-module ATSAMB11-MR510CA SiP carries Bluetooth SIG 4.1 modular certification inherited by the XPRO kit.

Data verified on: 2026-09-21 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology ATSAMB11-XPRO ATSAMB11-MR510CA ATSAMB11G18A ATBTLC1000-XPRO ATSAMW25-XPRO ATSAMB11ZR-XPRO Bluetooth Smart BLE 4.1 ARM Cortex-M0 Xplained Pro EDBG MikroElektronika click board ATSAM4S-EK2 ATSAMA5D4-XULT ATSAMA5D36A-CN PIC16F527-E/JP Bluetooth SIG 2.4 GHz ISM band power management unit PA / TR switch Flash memory MSL (Moisture Sensitivity Level) RoHS REACH
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