ATSAMB11-XPRO vs ATSAMB11ZR-XPRO Comparison
Detailed side-by-side comparison of ATSAMB11-XPRO by Microchip Technology and ATSAMB11ZR-XPRO by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip
ATSAMB11-XPRO β ActiveMicrochip Technology
ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip
ATSAMB11ZR-XPRO β ActiveSpecification Comparison
| Parameter | ATSAMB11-XPRO | ATSAMB11ZR-XPRO |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | Development Boards | Wireless Modules |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $36.14 | $45.00 |
| Product Type | Bluetooth Smart Xplained Pro Evaluation Kit | RF Evaluation and Development Kit |
| Target MCU / Module | ATSAMB11-MR510CA (ATSAMB11G18A SoC) | β |
| MCU Core | ARM Cortex-M0 32-bit | β |
| Bluetooth Version | BLE 4.1 (Bluetooth Smart) | β |
| Operating Frequency | 2.4 GHz ISM band | 2.4 GHz ISM band |
| Flash Memory | 256 KB | β |
| Low-Frequency Clock | 32.768 kHz | β |
| Primary CPU Clock | 12 MHz | β |
| Form Factor | Xplained Pro (Atmel/Microchip standard) | β |
| Extension Header | 2x5 100-mil Xplained Pro header | β |
| Current Measurement | 1x2 100-mil pin-header for MCU current shunt | β |
| Debug Interface | On-board EDBG (USB to SWD/UART) | On-board SWD + Virtual COM port over USB |
| Supported OS | Windows 7 / 8 / Vista / XP | β |
| Integrated Radio | Transceiver, modem, MAC, PA, TR switch | β |
| Integrated Power Management | Yes (on-module PMU) | β |
| Bluetooth Certification | Bluetooth SIG 4.1 (module pre-certified) | β |
| Typical Use Case | BLE peripheral / beacon prototyping | β |
| Base Part Number | β | ATSAMB11-ZR210CA |
| RF Technology | β | Bluetooth Smart 4.x Low Energy (BLE) |
| Module Family | β | SmartConnect (ATSAMB11 Series) |
| Module Type | β | SiP/Module (System-in-Package) |
| Supported Standards | β | IEEE 802.15.1, Bluetooth 4.x Low Energy |
| Host Processor | β | ARM Cortex-M0 |
| Integrated Crystal | β | 32.768 kHz RTC + 16 MHz main |
| Power Supply | β | USB powered via on-board debugger |
| Extension Connectors | β | Xplained Pro header + mikroBUS socket |
| User Interface | β | 1x user pushbutton, 1x user LED, QT touch header |
| Operating Temperature | β | -40C to +85C |
| RoHS Status | β | Compliant |
| Country of Origin | β | RoHS-compliant Microchip packaging |