ATSAME51N19A-AU-EFP - SAM E51 120MHz M4F MCU, 512KB | Microchip
MPN: ATSAME51N19A-AU-EFP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.42 | $12.42 |
| 10 | $11.18 | $111.80 |
| 100 | $9.62 | $962.00 |
| 250 | $8.95 | $2,237.50 |
| 500 | $8.1 | $4,050.00 |
| 1,000 | $7.35 | $7,350.00 |
ATSAME51N19A-AU-EFP Overview
What is a Cortex-M4F microcontroller? An ARM Cortex-M4 microcontroller is a 32-bit MCU core based on the Arm Cortex-M profile, optimized for low-power, deterministic embedded processing. The "F" suffix in M4F indicates an integrated single-precision Floating Point Unit (FPU). Cortex-M4F MCUs sit within the broader Arm Cortex-M hierarchy (Cortex-M0/M0+, M3, M4, M7) and are widely used when DSP-class math is needed alongside a deterministic RTOS environment. SAM E51 belongs to Microchip's mainstream 32-bit MCU family, between low-power Cortex-M0+ SAM D and higher-end Cortex-M7 SAME70 families.
Key features of the ATSAME51N19A-AU-EFP include an integrated FPU, 512 KB dual-panel flash allowing simultaneous read-while-write, SERCOM interfaces, a full-speed USB 2.0 device/host, CAN-FD controllers, a 12-bit ADC with up to 16 channels, 12-bit DAC output, and a QSPI/SPI interface. The EFP variant also includes crypto accelerators and an integrated I2S audio interface for audio playback.
The architecture combines a Cortex-M4 core with a 4 KB instruction cache, a tightly-coupled SRAM to reduce flash wait states, and a multi-layer bus matrix supporting simultaneous DMA and CPU access. Hardware AES, SHA, and True Random Number Generator (TRNG) peripherals support secure boot and over-the-air firmware updates.
Typical applications include industrial PLCs, building automation, USB peripherals, human-machine interfaces (HMI), CAN-connected motor drives, and edge-connected sensor hubs that benefit from the floating-point DSP performance. The 100-pin TQFP package is well suited for prototypes and designs requiring through-hole-friendly pins or visible debug headers.
Designers should use Atmel Studio / MPLAB X with SAM E51 board support packages and pay attention to the dual-bank flash mapping (refer to the datasheet for the AHB/IFLASH address range and the GPNVM bits that swap the boot region). Brown-out reset, watchdog timer, and 32 kHz external crystal requirements must be observed for industrial-grade designs. Note: the parts marked 85C are intended for 0 to 70C operation; ATSAME51J18A-AUT is rated -40C to +125C.
This page aggregates verified distributor pricing, parametric comparison tables, and practical cross-reference alternatives not found on a single manufacturer datasheet, helping engineers select and source SAM E51 microcontrollers more efficiently.
PACKAGING NOTE: Tray packaging is typical for 100-TQFP industrial parts; OEMs in high-volume production may request a tape-and-reel variant.
Drop-in alternatives for ATSAME51N19A-AU-EFP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME51N19A-AU-EFP (same form factor and footprint) — differing in DAC, ADC, Package, Core, Communication Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME51N19A-AUT-EFP
✅ Drop-In✓ In Stock
$4.61 / Unit
View Datasheet →ATSAME51N19A-AU
✅ Drop-In✓ In Stock
$4.98 / Unit
View Datasheet →ATSAME51J19A-AUT-EFP
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$6.45 / Unit
View Datasheet →ATSAME51J19A-AFT
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →ATSAMD51P20A-AUT
✅ Drop-In✓ In Stock
$8.25 / Unit
View Datasheet →ATSAME51N19A-AU-EFP Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with FPU |
| Core Count | 1 (Single-Core) |
| Maximum Clock Frequency | 120 MHz |
| Program Memory | 512 KB Flash (dual-panel) |
| RAM | 192 KB total SRAM (100 KB + QSPI/XIP cache areas) |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Operating Temperature Range | -40 C to +85 C (industrial) |
| Package | 100-pin TQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Instruction Flash Layout | Dual-Panel Flash with Live Update (EFP suffix variant) |
| Communication Interfaces | USB 2.0 FS, CAN-FD, I2C, SPI, UART, QSPI, I2S |
| ADC | 12-bit, up to 16 channels |
| DAC | 12-bit, 2 channels |
| Security | AES, SHA, TRNG (EFP variant) |
| MSL Level | MSL3 (per JEDEC J-STD-020, 168-hour floor life) |
| RoHS Status | Compliant |
| Lifecycle | Active |
ATSAME51N19A-AU-EFP 100-pin tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for ATSAME51N19A-AU-EFP (100-pin tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAME51N19A-AU-EFP.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAME51N19A-AU-EFP is suitable for 6 applications: Industrial PLC and Process Control, Building Automation and HVAC Controllers, USB-C Peripherals and HMI Devices, CAN-FD Connected Motor Drivers, Audio Playback and Codec Bridge, Connected Edge Sensor Hubs.
Industrial PLC and Process Control
The ATSAME51N19A-AU-EFP suits industrial PLC designs because its 120 MHz Cortex-M4F core plus 12-bit ADC with 16 channels deliver deterministic scan-loop timing for control algorithms such as PID, while the AES/SHA crypto block protects firmware IP. With 512 KB dual-panel flash, a PLC can maintain two firmware images for redundant boot, satisfying IEC 61131-3 reliability patterns. The USB and CAN-FD peripherals expose diagnostics and fieldbus connectivity, and the -40 C to +85 C rating matches factory-floor environmental expectations.
Recommended
Building Automation and HVAC Controllers
The ATSAME51N19A-AU-EFP integrates BACnet/Modbus communication paths through its UART and SERCOM peripherals at 120 MHz, leaving CPU headroom for HVAC control laws. Its 512 KB flash accommodates layered firmware (bootloader, application, Modbus stack), while 100 KB SRAM buffers scheduling data. The dual-panel flash lets a central HVAC controller perform OTA maintenance without service interruption. Operating voltage from 1.62 V to 3.63 V simplifies battery-backed designs with 24 V / 3.3 V power architectures.
Recommended
USB-C Peripherals and HMI Devices
USB keyboards, mice, custom HID peripherals, and small HMIs use the ATSAME51N19A-AU-EFP because the integrated USB 2.0 full-speed device controller plus 120 MHz Cortex-M4F core handles both USB protocol stacks and human-interface rendering. The 12-bit ADC reads potentiometers and touch keys; the DAC drives LED backlights or audio tones. EFP crypto block secures device authentication against firmware cloning. The -40 C to +85 C range enables consumer, office, and light-industrial enclosures.
Recommended
CAN-FD Connected Motor Drivers
CAN-FD motor drives use the ATSAME51N19A-AU-EFP as the bridge between a fieldbus and a 3-phase inverter: the Cortex-M4F executes FOC (Field Oriented Control) loops at 120 MHz while the on-chip CAN-FD controller streams telemetry at 1 Mbit/s. The 12-bit ADC samples motor phase currents with synchronized PWM triggering; hardware AES authenticates firmware updates over the bus. Dual-panel flash supports in-field recalibration while motors keep running, satisfying functional-safety goals in industrial servo design.
Recommended
Audio Playback and Codec Bridge
Audio playback and USB-to-I2S bridges benefit from the ATSAME51N19A-AU-EFP I2S interface plus Cortex-M4F DSP extensions for sample-rate conversion. The 120 MHz core handles 48 kHz / 96 kHz stereo streams with headroom for small audio effects, while the USB port sources streaming audio from a PC. EFP variant AES accelerator adds DRM-friendly authentication between USB host and DAC. Low device power fits portable docking and headphone amplifier designs.
Recommended
Connected Edge Sensor Hubs
Edge sensor hubs aggregate analog and digital sensors via ADC, I2C, SPI, and CAN, then publish over USB or CAN-FD using the ATSAME51N19A-AU-EFP. The 192 KB SRAM buffers time-series data before forwarding, and the 120 MHz core performs local thresholding / DSP filtering. The EFP crypto accelerators secure device identity and signed telemetry - critical for industrial IIoT deployments. The industrial temperature grade (up to 85 C) suits factory cabinets and outdoor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME51N19A-AU-EFP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME51N19A-AUT-EFP | ATSAME51N19A-AU | ATSAME51J19A-AUT-EFP | ATSAMD51P20A-AUT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash Memory | 512 KB dual-panel | 512 KB dual-panel | 512 KB dual-panel | 512 KB dual-panel | 1 MB dual-panel (+100%) |
| RAM | 192 KB total SRAM | 192 KB | 192 KB | 192 KB | 256 KB (+33%) |
| Crypto Accelerators (AES/SHA/TRNG) | Yes (EFP) | Yes (EFP) | No | Yes (EFP) | No (standard flash variant) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Packaging | Tray | Tape-and-Reel | Tray | Tape-and-Reel | Tape-and-Reel |
Key Differentiators
- Dual-panel flash with crypto accelerators in industrial temperature grade (vs ATSAME51N19A-AU (non-EFP standard))
- Industrial -40 C to +85 C temperature range with extended industrial grade variants available (vs ATSAME51J19A-AUT-EFP (automotive grade))
- Lower flash density than SAMD51P20A in same TQFP-100 footprint (vs ATSAMD51P20A-AUT (1 MB flash SAMD51))
Design Notes
The ATSAME51N19A-AU-EFP requires a 1.62-3.63 V supply on VDDIO and VDDCORE. Decoupling per SAM E51 datasheet: place a 100 nF ceramic capacitor on each VDD pin plus a 4.7 uF bulk capacitor within 1 cm of the MCU. Estimated: at 120 MHz active current approximately 14 mA; brown-out reset (BOR) thresholds (1.62 V to 3.0 V) must be configured to match the supply rail for reliable cold-start behavior.
For 100-TQFP layout, follow JEDEC IPC-7351 pad dimensions (0.5 mm pitch). Estimated: 100-TQFP (14x14 mm) requires a recommended land pattern of approximately 16 mm x 16 mm with 4-layer stack-up (signal / GND / power / signal). Use continuous GND plane under the MCU for thermal dissipation; expose thermal vias to bottom layer for high-current applications.
Do not skip configuring the 32 kHz external crystal load capacitors - typical values are 12-18 pF for crystal and stray budget per SAM E51 errata. Estimated: omitting the GPNVM bit settings leaves the device unlocked for read-back of firmware, defeating the EFP crypto block. Always enable secure boot fuses before locking the production row in the user word.
Compliance Information
RoHS compliant per Microchip ordering code. Not AEC-Q100 qualified; automotive/extended-temperature variants available as ATSAME51J-prefix parts. Halogen-free and lead-free per Microchip environmental compliance policy.