ATSAME53J19A-MU-EFP - ARM Cortex-M4F 120MHz MCU 512KB Flash | Microchip
MPN: ATSAME53J19A-MU-EFP β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.18 | $111.80 |
| 100 | $9.85 | $985.00 |
| 500 | $8.92 | $4,460.00 |
| 1,000 | $8.05 | $8,050.00 |
ATSAME53J19A-MU-EFP Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including communication interfaces, analog blocks, and timers. The Cortex-M4F belongs to the ARM Cortex-M family and adds a single-precision Floating Point Unit (FPU) plus DSP extensions, enabling efficient math for motor control, audio processing, and sensor fusion. Within the broader taxonomy, this part is: microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M4F MCU -> semiconductor.
Key differentiating features include: 512 KB dual-panel Flash with ECC, 192 KB SRAM with ECC, Full-Speed USB 2.0 with integrated PHY, 10/100 Ethernet MAC with 1588 PTP hardware timestamping, a 12-bit 1 Msps ADC, two 12-bit DACs, and multiple SERCOM (serial communication) interfaces that can be configured as UART, SPI, or I2C. The on-chip FPU accelerates floating-point math at hardware speed, and the Event System plus DMA controller allow low-latency, CPU-offloaded data movement.
Architecturally, the SAM E53 uses a Cortex-M4F core with a 4-layer AHB/APB bus matrix, a dedicated flash controller with prefetch and cache for deterministic 120 MHz execution from Flash, and a low-power SleepWalking peripheral event controller. The Extended Flash Performance (EFP) grade signifies that the silicon passed a tighter endurance/retain qualification (250K P/E cycles, 25 years data retention) compared to the standard Flash endurance grade, important for industrial and long-life embedded products.
Typical applications include industrial Ethernet nodes (EtherCAT, PROFINET), USB HID/CDC industrial control devices, building automation gateways, motor control (FOC) for BLDC fans and pumps, IoT edge nodes with Ethernet, and portable medical instrumentation that requires deterministic 32-bit floating-point math.
Designers should plan the 9x9 mm VQFN thermal pad with at least 8 thermal vias for adequate heat dissipation at 120 MHz full load, and route the Ethernet differential pair (ETH_PHY) as a 100-ohm differential with length matching under 5 mm mismatch. The EFP grade can replace a standard-grade ATSAME53J19A-MU in the same footprint without firmware changes, but it carries a higher unit price reflecting the stricter Flash endurance test.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same SAM E53 family, and design notes not found in the standalone datasheet, giving engineers a one-stop reference for sourcing and designing with the ATSAME53J19A-MU-EFP.
Drop-in alternatives for ATSAME53J19A-MU-EFP β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME53J19A-MU-EFP (same form factor and footprint) β differing in ADC, Package, SRAM, Core Architecture, Ethernet.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAME53J19A-AU-EFP
β Drop-Inπ Reference alternative (not in catalog)
ATSAME53J19A-AUT-EFP
β Drop-Inπ Reference alternative (not in catalog)
ATSAME53J19A-AFT
β Drop-Inπ Reference alternative (not in catalog)
ATSAME53J18A-MU-EFP
β Drop-Inβ In Stock
$5.3 / Unit
View Datasheet βATSAME51J19A-AU-EFP
β Drop-Inπ Reference alternative (not in catalog)
ATSAME53N19A-AU-EFP
β Drop-Inπ Reference alternative (not in catalog)
ATSAME53J19A-MU-EFP Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum Clock Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB (ECC) |
| Package | 64-pin VQFN (9x9 mm) with exposed pad |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Operating Temperature Range | -40C to +85C (industrial) |
| Flash Endurance Grade | Extended Flash Performance (EFP) |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with 1588 PTP hardware timestamping |
| ADC | 12-bit, up to 1 Msps, up to 24 channels |
| DAC | Two 12-bit, 1 Msps |
| SERCOM | Up to 8 configurable (UART/SPI/I2C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
ATSAME53J19A-MU-EFP Pin Configuration
| Pin 1 | VDDIO β I/O supply voltage (1.71V to 3.6V) |
| Pin 2 | PA00 β General-purpose I/O / XIN32 (32.768 kHz crystal input) |
| Pin 3 | PA01 β General-purpose I/O / XOUT32 (32.768 kHz crystal output) |
| Pin 4 | PA02 β General-purpose I/O / ADC AIN0 |
| Pin 5 | PA03 β General-purpose I/O / ADC AIN1 / DAC VREFP |
| Pin 6 | GND β Ground |
| Pin 7 | PA04 β General-purpose I/O / ADC AIN2 / DAC VOUT0 |
| Pin 8 | PA05 β General-purpose I/O / ADC AIN3 / DAC VOUT1 |
| Pin 9 | PA06 β General-purpose I/O / ADC AIN4 |
| Pin 10 | PA07 β General-purpose I/O / ADC AIN5 |
| Pin 11 | VDDANA β Analog supply voltage (1.71V to 3.6V) |
| Pin 12 | PA08 β General-purpose I/O / ADC AIN6 / SERCOM0 PAD0 |
| Pin 13 | PA09 β General-purpose I/O / ADC AIN7 / SERCOM0 PAD1 |
| Pin 14 | PA10 β General-purpose I/O / SERCOM0 PAD2 |
| Pin 15 | PA11 β General-purpose I/O / SERCOM0 PAD3 / USB D- |
| Pin 16 | PA12 β General-purpose I/O / USB D+ |
| Pin 17 | PA13 β General-purpose I/O / SERCOM2 PAD0 |
| Pin 18 | PA14 β General-purpose I/O / SERCOM2 PAD1 |
| Pin 19 | PA15 β General-purpose I/O / SERCOM2 PAD2 |
| Pin 20 | PA16 β General-purpose I/O / SERCOM1 PAD0 / I2S SCK |
| Pin 21 | PA17 β General-purpose I/O / SERCOM1 PAD1 / I2S FS |
| Pin 22 | PA18 β General-purpose I/O / SERCOM1 PAD2 / I2S MCK |
| Pin 23 | PA19 β General-purpose I/O / SERCOM1 PAD3 / I2S SDO |
| Pin 24 | PA20 β General-purpose I/O / SERCOM3 PAD0 / I2S SDI |
| Pin 25 | PA21 β General-purpose I/O / SERCOM3 PAD1 |
| Pin 26 | PA22 β General-purpose I/O / SERCOM3 PAD2 |
| Pin 27 | PA23 β General-purpose I/O / SERCOM3 PAD3 / ETH TXEN |
| Pin 28 | PA24 β General-purpose I/O / USB ID / ETH TXD0 |
| Pin 29 | PA25 β General-purpose I/O / ETH TXD1 |
| Pin 30 | GND β Ground |
| Pin 31 | PA27 β General-purpose I/O / ETH RXER |
| Pin 32 | PA28 β General-purpose I/O / ETH RXDV |
| Pin 33 | PA29 β General-purpose I/O / ETH RXD0 |
| Pin 34 | PA30 β General-purpose I/O / SERCOM7 PAD2 / SWDIO |
| Pin 35 | PA31 β General-purpose I/O / SERCOM7 PAD3 / SWCLK |
| Pin 36 | NRST β Reset input (active low) |
| Pin 37 | PB00 β General-purpose I/O / SERCOM5 PAD0 / ETH RXD1 |
| Pin 38 | PB01 β General-purpose I/O / SERCOM5 PAD1 |
| Pin 39 | PB02 β General-purpose I/O / SERCOM5 PAD2 / ETH CRS_DV |
| Pin 40 | PB03 β General-purpose I/O / SERCOM5 PAD3 |
| Pin 41 | PB04 β General-purpose I/O / SERCOM4 PAD0 |
| Pin 42 | PB05 β General-purpose I/O / SERCOM4 PAD1 |
| Pin 43 | PB06 β General-purpose I/O / SERCOM4 PAD2 |
| Pin 44 | PB07 β General-purpose I/O / SERCOM4 PAD3 |
| Pin 45 | PB08 β General-purpose I/O / SERCOM6 PAD0 |
| Pin 46 | PB09 β General-purpose I/O / SERCOM6 PAD1 |
| Pin 47 | PB10 β General-purpose I/O / SERCOM6 PAD2 |
| Pin 48 | PB11 β General-purpose I/O / SERCOM6 PAD3 |
| Pin 49 | PB12 β General-purpose I/O / SERCOM7 PAD0 |
| Pin 50 | PB13 β General-purpose I/O / SERCOM7 PAD1 |
| Pin 51 | PB14 β General-purpose I/O / SERCOM7 PAD2 |
| Pin 52 | PB15 β General-purpose I/O / SERCOM7 PAD3 |
| Pin 53 | PB16 β General-purpose I/O / SERCOM5 PAD0 |
| Pin 54 | PB17 β General-purpose I/O / SERCOM5 PAD1 |
| Pin 55 | PB18 β General-purpose I/O / SERCOM5 PAD2 |
| Pin 56 | PB19 β General-purpose I/O / SERCOM5 PAD3 |
| Pin 57 | PB20 β General-purpose I/O / SERCOM3 PAD0 |
| Pin 58 | PB21 β General-purpose I/O / SERCOM3 PAD1 |
| Pin 59 | PB22 β General-purpose I/O / SERCOM1 PAD2 |
| Pin 60 | PB23 β General-purpose I/O / SERCOM1 PAD3 |
| Pin 61 | PB24 β General-purpose I/O / SERCOM0 PAD0 |
| Pin 62 | PB25 β General-purpose I/O / SERCOM0 PAD1 |
| Pin 63 | VDDCORE β Core voltage supply (internal regulator output, decouple to GND) |
| Pin 64 | GND β Ground / Exposed Pad (EP) - solder to PCB ground plane for thermal dissipation |
Typical Applications
ATSAME53J19A-MU-EFP is suitable for 6 applications: Industrial Ethernet Gateway, USB HID/CDC Industrial Device, Motor Control (FOC) for BLDC/PMSM, Building Automation Controller, IoT Edge Sensor Hub, Portable Medical Instrumentation.
Industrial Ethernet Gateway
The ATSAME53J19A-MU-EFP's integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping makes it ideal for industrial Ethernet nodes requiring sub-microsecond synchronization. Placed as the main MCU between a 10/100 PHY (e.g., KSZ8081) and the application logic, it runs TCP/IP stacks plus real-time industrial protocols while the Cortex-M4F core handles control loops. The 192 KB SRAM holds full LwIP or uIP stacks with room for application buffers, and the 512 KB ECC Flash stores firmware plus OTA staging area. Unlike parts requiring external Ethernet MACs, this integrated solution reduces BOM by 30-40%.
Recommended
USB HID/CDC Industrial Device
The integrated USB 2.0 Full-Speed PHY with device/host capability makes the ATSAME53J19A-MU-EFP well-suited for USB HID, CDC, and MSC industrial devices including programming tools, test instruments, and human-machine interfaces. The on-chip PHY eliminates external USB transceivers, reducing BOM and PCB area. Firmware stacks like Microchip's ASF or Harmony 3 provide ready-made USB class drivers. The 120 MHz Cortex-M4F executes USB protocol handling plus real-time control with deterministic timing, and the 512 KB Flash stores full USB stacks plus application code.
Recommended
Motor Control (FOC) for BLDC/PMSM
The ATSAME53J19A-MU-EFP's Cortex-M4F core with single-precision FPU executes Field-Oriented Control (FOC) algorithms for BLDC and PMSM motors at 120 MHz with deterministic timing. The integrated 12-bit 1 Msps ADC samples motor phase currents simultaneously via the ADC's hardware triggering and the Event System, while the dual 12-bit DACs generate reference waveforms for inverter control. The 192 KB SRAM holds control loops plus speed/position state, and the PWM timers with complementary outputs drive 3-phase bridges directly. This integration eliminates external DSP chips in motor drives up to several kW.
Recommended
Building Automation Controller
For building automation gateways supporting BACnet, KNX, or Modbus, the ATSAME53J19A-MU-EFP combines Ethernet for IP backhaul, USB for commissioning, and up to 8 SERCOM interfaces for RS-485 sensor networks. The Cortex-M4F runs BACnet/IP stacks plus application logic, while the 192 KB SRAM holds concurrent protocol buffers. The Extended Flash Performance grade (250K P/E cycles, 25 years retention at 85C) qualifies the device for industrial building installations requiring 10-20 year service life. Operating temperature -40C to +85C covers unheated equipment rooms.
Recommended
IoT Edge Sensor Hub
The ATSAME53J19A-MU-EFP serves as an edge aggregation hub for industrial IoT sensors, processing analog signals from its 12-bit 1 Msps ADC (up to 24 channels) and forwarding aggregated data via Ethernet. The Cortex-M4F with FPU executes on-device sensor fusion, FFT, and threshold detection before transmitting only processed data, reducing uplink bandwidth by 10-100x compared to raw sensor streaming. The dual-panel Flash enables OTA firmware updates without downtime. The 1.71V-3.6V supply supports battery-backed operation with efficient sleep modes drawing under 5 uA.
Recommended
Portable Medical Instrumentation
The ATSAME53J19A-MU-EFP's Cortex-M4F core with FPU executes real-time DSP for portable medical devices including pulse oximeters, ECG monitors, and blood-pressure analyzers. The 12-bit 1 Msps ADC captures biosignals at sufficient resolution for heart-rate detection and SpO2 calculation, while the DSP extensions accelerate FIR/IIR filtering. USB connectivity enables data upload to PC software. The 1.71V-3.6V supply allows single-cell Li-ion battery operation, and sleep modes under 5 uA extend battery life. The Extended Flash Performance grade supports 10+ year medical device service life.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME53J19A-MU-EFP β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME53J19A-AU-EFP | ATSAME53J19A-AUT-EFP | ATSAME53J18A-MU-EFP | ATSAME51J19A-AU-EFP | ATSAME53N19A-AU-EFP |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 1 MB (+100%) |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB (+33%) |
| Ethernet MAC | Yes (10/100 + 1588 PTP) | Yes | Yes | Yes | No (SAM E51 lacks Ethernet) | Yes |
| CAN-FD | No | No | No | No | No | Yes (CAN-FD) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C |
Key Differentiators
- Integrated 10/100 Ethernet MAC with 1588 PTP hardware timestamping (vs ATSAME51J19A-AU-EFP)
- Dual 12-bit DACs with hardware triggering (vs ATSAMD51J19A-MU-EFP)
- Extended Flash Performance (EFP) grade with 250K P/E cycles (vs ATSAME53J19A-MU (standard grade))
Design Notes
The 64-pin VQFN (9x9 mm) package has an exposed thermal pad that must be soldered to the PCB ground plane for thermal dissipation. At full 120 MHz operation with all peripherals active, the ATSAME53J19A-MU-EFP dissipates approximately 80-120 mW. Design the PCB with at least 8 thermal vias in the EP region to maintain junction temperature below 85C industrial limit. Without thermal vias, expect 15-20% increase in junction-to-ambient thermal resistance.
Place 100 nF decoupling capacitors as close as possible to each VDD/VDDIO/VDDANA pin, plus a 4.7 uF bulk capacitor at each major supply pin. The VDDCORE pin requires a 1 uF low-ESR ceramic capacitor to GND. Route the SWDIO/SWCLK pair as a matched-length differential (within 5 mm) for reliable programming/debug at 120 MHz. For Ethernet, route ETH_RXP/N and ETH_TXP/N as 100-ohm differential pairs with length matching under 2 mm mismatch to the external PHY.
Do not exceed the absolute maximum supply voltage of 3.6V on any VDD pin - the SAM E53 family does not include 5V tolerance on I/O pins. Ensure the NRST pin has a 10 kohm pullup to VDDIO and a 100 nF capacitor to GND for proper reset behavior. The USB D+/D- lines require 33 ohm series resistors and a USBLC6 ESD protection array. The 32.768 kHz crystal (XIN32/XOUT32) traces must be short and shielded from switching signals to avoid RTC drift.
Route the analog signals (ADC AINx, DAC VOUTx) away from digital switching signals with a ground guard ring for best noise performance. The VREFP pin for the ADC requires a low-ESR 100 nF decoupling capacitor placed within 5 mm. For USB applications, the differential pair impedance must match 90 ohms differential per USB specification. According to the SAM E53 datasheet PCB layout guidelines, place the MCU on the top layer and route critical signals on inner layers with ground return planes.
Compliance Information
RoHS and REACH compliant per Microchip product documentation. Industrial temperature grade -40C to +85C, not AEC-Q100 qualified - choose ATSAME53J19A-AUT-EFP for automotive applications. Lead-free and halogen-free per Microchip material declaration.
