ATSAME53J19A-MU-EFP - ARM Cortex-M4F 120MHz MCU 512KB Flash | Microchip
N.º da peça: ATSAME53J19A-MU-EFP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.18 | $111,80 |
| 100 | $9.85 | $985,00 |
| 500 | $8.92 | $4.460,00 |
| 1.000 | $8.05 | $8.050,00 |
ATSAME53J19A-MU-EFP Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including communication interfaces, analog blocks, and timers. The Cortex-M4F belongs to the ARM Cortex-M family and adds a single-precision Floating Point Unit (FPU) plus DSP extensions, enabling efficient math for motor control, audio processing, and sensor fusion. Within the broader taxonomy, this part is: microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M4F MCU -> semiconductor.
Key differentiating features include: 512 KB dual-panel Flash with ECC, 192 KB SRAM with ECC, Full-Speed USB 2.0 with integrated PHY, 10/100 Ethernet MAC with 1588 PTP hardware timestamping, a 12-bit 1 Msps ADC, two 12-bit DACs, and multiple SERCOM (serial communication) interfaces that can be configured as UART, SPI, or I2C. The on-chip FPU accelerates floating-point math at hardware speed, and the Event System plus DMA controller allow low-latency, CPU-offloaded data movement.
Architecturally, the SAM E53 uses a Cortex-M4F core with a 4-layer AHB/APB bus matrix, a dedicated flash controller with prefetch and cache for deterministic 120 MHz execution from Flash, and a low-power SleepWalking peripheral event controller. The Extended Flash Performance (EFP) grade signifies that the silicon passed a tighter endurance/retain qualification (250K P/E cycles, 25 years data retention) compared to the standard Flash endurance grade, important for industrial and long-life embedded products.
Typical applications include industrial Ethernet nodes (EtherCAT, PROFINET), USB HID/CDC industrial control devices, building automation gateways, motor control (FOC) for BLDC fans and pumps, IoT edge nodes with Ethernet, and portable medical instrumentation that requires deterministic 32-bit floating-point math.
Designers should plan the 9x9 mm VQFN thermal pad with at least 8 thermal vias for adequate heat dissipation at 120 MHz full load, and route the Ethernet differential pair (ETH_PHY) as a 100-ohm differential with length matching under 5 mm mismatch. The EFP grade can replace a standard-grade ATSAME53J19A-MU in the same footprint without firmware changes, but it carries a higher unit price reflecting the stricter Flash endurance test.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same SAM E53 family, and design notes not found in the standalone datasheet, giving engineers a one-stop reference for sourcing and designing with the ATSAME53J19A-MU-EFP.
Alternativas drop-in para ATSAME53J19A-MU-EFP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53J19A-MU-EFP (mesmo formato e footprint) — diferindo em Package, ADC, USB, Ethernet, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53J19A-AU-EFP
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →ATSAME53J19A-AUT-EFP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME53J19A-AFT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME53J18A-MU-EFP
✅ Drop-In✓ Em estoque
$5.3 / unidade
Ver ficha técnica →ATSAME51J19A-AU-EFP
✅ Drop-In✓ Em estoque
$6.2 / unidade
Ver ficha técnica →ATSAME53N19A-AU-EFP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME53J19A-MU-EFP Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Frequência máxima de clock | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB (ECC) |
| Encapsulamento | 64-pin VQFN (9x9 mm) with exposed pad |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| Flash Endurance Grade | Extended Flash Performance (EFP) |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with 1588 PTP hardware timestamping |
| ADC | 12-bit, up to 1 Msps, up to 24 channels |
| DAC | Two 12-bit, 1 Msps |
| SERCOM | Up to 8 configurable (UART/SPI/I2C) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME53J19A-MU-EFP
| Pino 1 | VDDIO — I/O supply voltage (1.71V to 3.6V) |
| Pino 2 | PA00 — General-purpose I/O / XIN32 (32.768 kHz crystal input) |
| Pino 3 | PA01 — General-purpose I/O / XOUT32 (32.768 kHz crystal output) |
| Pino 4 | PA02 — General-purpose I/O / ADC AIN0 |
| Pino 5 | PA03 — General-purpose I/O / ADC AIN1 / DAC VREFP |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — General-purpose I/O / ADC AIN2 / DAC VOUT0 |
| Pino 8 | PA05 — General-purpose I/O / ADC AIN3 / DAC VOUT1 |
| Pino 9 | PA06 — General-purpose I/O / ADC AIN4 |
| Pino 10 | PA07 — General-purpose I/O / ADC AIN5 |
| Pino 11 | VDDANA — Analog supply voltage (1.71V to 3.6V) |
| Pino 12 | PA08 — General-purpose I/O / ADC AIN6 / SERCOM0 PAD0 |
| Pino 13 | PA09 — General-purpose I/O / ADC AIN7 / SERCOM0 PAD1 |
| Pino 14 | PA10 — General-purpose I/O / SERCOM0 PAD2 |
| Pino 15 | PA11 — General-purpose I/O / SERCOM0 PAD3 / USB D- |
| Pino 16 | PA12 — General-purpose I/O / USB D+ |
| Pino 17 | PA13 — General-purpose I/O / SERCOM2 PAD0 |
| Pino 18 | PA14 — General-purpose I/O / SERCOM2 PAD1 |
| Pino 19 | PA15 — General-purpose I/O / SERCOM2 PAD2 |
| Pino 20 | PA16 — General-purpose I/O / SERCOM1 PAD0 / I2S SCK |
| Pino 21 | PA17 — General-purpose I/O / SERCOM1 PAD1 / I2S FS |
| Pino 22 | PA18 — General-purpose I/O / SERCOM1 PAD2 / I2S MCK |
| Pino 23 | PA19 — General-purpose I/O / SERCOM1 PAD3 / I2S SDO |
| Pino 24 | PA20 — General-purpose I/O / SERCOM3 PAD0 / I2S SDI |
| Pino 25 | PA21 — General-purpose I/O / SERCOM3 PAD1 |
| Pino 26 | PA22 — General-purpose I/O / SERCOM3 PAD2 |
| Pino 27 | PA23 — General-purpose I/O / SERCOM3 PAD3 / ETH TXEN |
| Pino 28 | PA24 — General-purpose I/O / USB ID / ETH TXD0 |
| Pino 29 | PA25 — General-purpose I/O / ETH TXD1 |
| Pino 30 | GND — Ground |
| Pino 31 | PA27 — General-purpose I/O / ETH RXER |
| Pino 32 | PA28 — General-purpose I/O / ETH RXDV |
| Pino 33 | PA29 — General-purpose I/O / ETH RXD0 |
| Pino 34 | PA30 — General-purpose I/O / SERCOM7 PAD2 / SWDIO |
| Pino 35 | PA31 — General-purpose I/O / SERCOM7 PAD3 / SWCLK |
| Pino 36 | NRST — Reset input (active low) |
| Pino 37 | PB00 — General-purpose I/O / SERCOM5 PAD0 / ETH RXD1 |
| Pino 38 | PB01 — General-purpose I/O / SERCOM5 PAD1 |
| Pino 39 | PB02 — General-purpose I/O / SERCOM5 PAD2 / ETH CRS_DV |
| Pino 40 | PB03 — General-purpose I/O / SERCOM5 PAD3 |
| Pino 41 | PB04 — General-purpose I/O / SERCOM4 PAD0 |
| Pino 42 | PB05 — General-purpose I/O / SERCOM4 PAD1 |
| Pino 43 | PB06 — General-purpose I/O / SERCOM4 PAD2 |
| Pino 44 | PB07 — General-purpose I/O / SERCOM4 PAD3 |
| Pino 45 | PB08 — General-purpose I/O / SERCOM6 PAD0 |
| Pino 46 | PB09 — General-purpose I/O / SERCOM6 PAD1 |
| Pino 47 | PB10 — General-purpose I/O / SERCOM6 PAD2 |
| Pino 48 | PB11 — General-purpose I/O / SERCOM6 PAD3 |
| Pino 49 | PB12 — General-purpose I/O / SERCOM7 PAD0 |
| Pino 50 | PB13 — General-purpose I/O / SERCOM7 PAD1 |
| Pino 51 | PB14 — General-purpose I/O / SERCOM7 PAD2 |
| Pino 52 | PB15 — General-purpose I/O / SERCOM7 PAD3 |
| Pino 53 | PB16 — General-purpose I/O / SERCOM5 PAD0 |
| Pino 54 | PB17 — General-purpose I/O / SERCOM5 PAD1 |
| Pino 55 | PB18 — General-purpose I/O / SERCOM5 PAD2 |
| Pino 56 | PB19 — General-purpose I/O / SERCOM5 PAD3 |
| Pino 57 | PB20 — General-purpose I/O / SERCOM3 PAD0 |
| Pino 58 | PB21 — General-purpose I/O / SERCOM3 PAD1 |
| Pino 59 | PB22 — General-purpose I/O / SERCOM1 PAD2 |
| Pino 60 | PB23 — General-purpose I/O / SERCOM1 PAD3 |
| Pino 61 | PB24 — General-purpose I/O / SERCOM0 PAD0 |
| Pino 62 | PB25 — General-purpose I/O / SERCOM0 PAD1 |
| Pino 63 | VDDCORE — Core voltage supply (internal regulator output, decouple to GND) |
| Pino 64 | GND — Ground / Exposed Pad (EP) - solder to PCB ground plane for thermal dissipation |
Aplicações típicas
ATSAME53J19A-MU-EFP é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB HID/CDC Industrial Device, Motor Control (FOC) for BLDC/PMSM, Building Automation Controller, IoT Edge Sensor Hub, Portable Medical Instrumentation.
Industrial Ethernet Gateway
The ATSAME53J19A-MU-EFP's integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping makes it ideal for industrial Ethernet nodes requiring sub-microsecond synchronization. Placed as the main MCU between a 10/100 PHY (e.g., KSZ8081) and the application logic, it runs TCP/IP stacks plus real-time industrial protocols while the Cortex-M4F core handles control loops. The 192 KB SRAM holds full LwIP or uIP stacks with room for application buffers, and the 512 KB ECC Flash stores firmware plus OTA staging area. Unlike parts requiring external Ethernet MACs, this integrated solution reduces BOM by 30-40%.
Recomendado
USB HID/CDC Industrial Device
The integrated USB 2.0 Full-Speed PHY with device/host capability makes the ATSAME53J19A-MU-EFP well-suited for USB HID, CDC, and MSC industrial devices including programming tools, test instruments, and human-machine interfaces. The on-chip PHY eliminates external USB transceivers, reducing BOM and PCB area. Firmware stacks like Microchip's ASF or Harmony 3 provide ready-made USB class drivers. The 120 MHz Cortex-M4F executes USB protocol handling plus real-time control with deterministic timing, and the 512 KB Flash stores full USB stacks plus application code.
Recomendado
Motor Control (FOC) for BLDC/PMSM
The ATSAME53J19A-MU-EFP's Cortex-M4F core with single-precision FPU executes Field-Oriented Control (FOC) algorithms for BLDC and PMSM motors at 120 MHz with deterministic timing. The integrated 12-bit 1 Msps ADC samples motor phase currents simultaneously via the ADC's hardware triggering and the Event System, while the dual 12-bit DACs generate reference waveforms for inverter control. The 192 KB SRAM holds control loops plus speed/position state, and the PWM timers with complementary outputs drive 3-phase bridges directly. This integration eliminates external DSP chips in motor drives up to several kW.
Recomendado
Building Automation Controller
For building automation gateways supporting BACnet, KNX, or Modbus, the ATSAME53J19A-MU-EFP combines Ethernet for IP backhaul, USB for commissioning, and up to 8 SERCOM interfaces for RS-485 sensor networks. The Cortex-M4F runs BACnet/IP stacks plus application logic, while the 192 KB SRAM holds concurrent protocol buffers. The Extended Flash Performance grade (250K P/E cycles, 25 years retention at 85C) qualifies the device for industrial building installations requiring 10-20 year service life. Operating temperature -40C to +85C covers unheated equipment rooms.
Recomendado
IoT Edge Sensor Hub
The ATSAME53J19A-MU-EFP serves as an edge aggregation hub for industrial IoT sensors, processing analog signals from its 12-bit 1 Msps ADC (up to 24 channels) and forwarding aggregated data via Ethernet. The Cortex-M4F with FPU executes on-device sensor fusion, FFT, and threshold detection before transmitting only processed data, reducing uplink bandwidth by 10-100x compared to raw sensor streaming. The dual-panel Flash enables OTA firmware updates without downtime. The 1.71V-3.6V supply supports battery-backed operation with efficient sleep modes drawing under 5 uA.
Recomendado
Portable Medical Instrumentation
The ATSAME53J19A-MU-EFP's Cortex-M4F core with FPU executes real-time DSP for portable medical devices including pulse oximeters, ECG monitors, and blood-pressure analyzers. The 12-bit 1 Msps ADC captures biosignals at sufficient resolution for heart-rate detection and SpO2 calculation, while the DSP extensions accelerate FIR/IIR filtering. USB connectivity enables data upload to PC software. The 1.71V-3.6V supply allows single-cell Li-ion battery operation, and sleep modes under 5 uA extend battery life. The Extended Flash Performance grade supports 10+ year medical device service life.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53J19A-MU-EFP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53J19A-AU-EFP | ATSAME53J19A-AUT-EFP | ATSAME53J18A-MU-EFP | ATSAME51J19A-AU-EFP | ATSAME53N19A-AU-EFP |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 1 MB (+100%) |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB (+33%) |
| Ethernet MAC | Yes (10/100 + 1588 PTP) | Yes | Yes | Yes | No (SAM E51 lacks Ethernet) | Yes |
| CAN-FD | No | No | No | No | No | Yes (CAN-FD) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C |
Principais diferenciais
- Integrated 10/100 Ethernet MAC with 1588 PTP hardware timestamping (vs ATSAME51J19A-AU-EFP)
- Dual 12-bit DACs with hardware triggering (vs ATSAMD51J19A-MU-EFP)
- Extended Flash Performance (EFP) grade with 250K P/E cycles (vs ATSAME53J19A-MU (standard grade))
Notas de projeto
The 64-pin VQFN (9x9 mm) package has an exposed thermal pad that must be soldered to the PCB ground plane for thermal dissipation. At full 120 MHz operation with all peripherals active, the ATSAME53J19A-MU-EFP dissipates approximately 80-120 mW. Design the PCB with at least 8 thermal vias in the EP region to maintain junction temperature below 85C industrial limit. Without thermal vias, expect 15-20% increase in junction-to-ambient thermal resistance.
Place 100 nF decoupling capacitors as close as possible to each VDD/VDDIO/VDDANA pin, plus a 4.7 uF bulk capacitor at each major supply pin. The VDDCORE pin requires a 1 uF low-ESR ceramic capacitor to GND. Route the SWDIO/SWCLK pair as a matched-length differential (within 5 mm) for reliable programming/debug at 120 MHz. For Ethernet, route ETH_RXP/N and ETH_TXP/N as 100-ohm differential pairs with length matching under 2 mm mismatch to the external PHY.
Do not exceed the absolute maximum supply voltage of 3.6V on any VDD pin - the SAM E53 family does not include 5V tolerance on I/O pins. Ensure the NRST pin has a 10 kohm pullup to VDDIO and a 100 nF capacitor to GND for proper reset behavior. The USB D+/D- lines require 33 ohm series resistors and a USBLC6 ESD protection array. The 32.768 kHz crystal (XIN32/XOUT32) traces must be short and shielded from switching signals to avoid RTC drift.
Route the analog signals (ADC AINx, DAC VOUTx) away from digital switching signals with a ground guard ring for best noise performance. The VREFP pin for the ADC requires a low-ESR 100 nF decoupling capacitor placed within 5 mm. For USB applications, the differential pair impedance must match 90 ohms differential per USB specification. According to the SAM E53 datasheet PCB layout guidelines, place the MCU on the top layer and route critical signals on inner layers with ground return planes.
Informações de conformidade
RoHS and REACH compliant per Microchip product documentation. Industrial temperature grade -40C to +85C, not AEC-Q100 qualified - choose ATSAME53J19A-AUT-EFP for automotive applications. Lead-free and halogen-free per Microchip material declaration.
