ATSAME53J19A-MU-EFP - ARM Cortex-M4F 120MHz MCU 512KB Flash | Microchip
MPN: ATSAME53J19A-MU-EFP ✓ פעילATSAME53J19A-MU-EFP סקירה
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including communication interfaces, analog blocks, and timers. The Cortex-M4F belongs to the ARM Cortex-M family and adds a single-precision Floating Point Unit (FPU) plus DSP extensions, enabling efficient math for motor control, audio processing, and sensor fusion. Within the broader taxonomy, this part is: microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M4F MCU -> semiconductor.
Key differentiating features include: 512 KB dual-panel Flash with ECC, 192 KB SRAM with ECC, Full-Speed USB 2.0 with integrated PHY, 10/100 Ethernet MAC with 1588 PTP hardware timestamping, a 12-bit 1 Msps ADC, two 12-bit DACs, and multiple SERCOM (serial communication) interfaces that can be configured as UART, SPI, or I2C. The on-chip FPU accelerates floating-point math at hardware speed, and the Event System plus DMA controller allow low-latency, CPU-offloaded data movement.
Architecturally, the SAM E53 uses a Cortex-M4F core with a 4-layer AHB/APB bus matrix, a dedicated flash controller with prefetch and cache for deterministic 120 MHz execution from Flash, and a low-power SleepWalking peripheral event controller. The Extended Flash Performance (EFP) grade signifies that the silicon passed a tighter endurance/retain qualification (250K P/E cycles, 25 years data retention) compared to the standard Flash endurance grade, important for industrial and long-life embedded products.
Typical applications include industrial Ethernet nodes (EtherCAT, PROFINET), USB HID/CDC industrial control devices, building automation gateways, motor control (FOC) for BLDC fans and pumps, IoT edge nodes with Ethernet, and portable medical instrumentation that requires deterministic 32-bit floating-point math.
Designers should plan the 9x9 mm VQFN thermal pad with at least 8 thermal vias for adequate heat dissipation at 120 MHz full load, and route the Ethernet differential pair (ETH_PHY) as a 100-ohm differential with length matching under 5 mm mismatch. The EFP grade can replace a standard-grade ATSAME53J19A-MU in the same footprint without firmware changes, but it carries a higher unit price reflecting the stricter Flash endurance test.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same SAM E53 family, and design notes not found in the standalone datasheet, giving engineers a one-stop reference for sourcing and designing with the ATSAME53J19A-MU-EFP.
חלופות תחליף ישיר עבור ATSAME53J19A-MU-EFP — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם ATSAME53J19A-MU-EFP (אותו גורם צורה וטביעת רגל) — שונים ב Package, ADC, USB, Ethernet, Core Architecture.
ATSAME53J19A-AU-EFP
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME53J19A-AUT-EFP
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME53J19A-AFT
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME53J18A-MU-EFP
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME51J19A-AU-EFP
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME53N19A-AU-EFP
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME53J19A-MU-EFP דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| תדר שעון מקסימלי | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB (ECC) |
| מארז | 64-pin VQFN (9x9 mm) with exposed pad |
| Operating Voltage Range | 1.71 V to 3.6 V |
| טווח טמפרטורת פעולה | -40C to +85C (industrial) |
| Flash Endurance Grade | Extended Flash Performance (EFP) |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with 1588 PTP hardware timestamping |
| ADC | 12-bit, up to 1 Msps, up to 24 channels |
| DAC | Two 12-bit, 1 Msps |
| SERCOM | Up to 8 configurable (UART/SPI/I2C) |
| סוג הרכבה | Surface Mount |
| סטטוס RoHS | Compliant |
תצורת פינים של ATSAME53J19A-MU-EFP
| פין 1 | VDDIO — I/O supply voltage (1.71V to 3.6V) |
| פין 2 | PA00 — General-purpose I/O / XIN32 (32.768 kHz crystal input) |
| פין 3 | PA01 — General-purpose I/O / XOUT32 (32.768 kHz crystal output) |
| פין 4 | PA02 — General-purpose I/O / ADC AIN0 |
| פין 5 | PA03 — General-purpose I/O / ADC AIN1 / DAC VREFP |
| פין 6 | GND — Ground |
| פין 7 | PA04 — General-purpose I/O / ADC AIN2 / DAC VOUT0 |
| פין 8 | PA05 — General-purpose I/O / ADC AIN3 / DAC VOUT1 |
| פין 9 | PA06 — General-purpose I/O / ADC AIN4 |
| פין 10 | PA07 — General-purpose I/O / ADC AIN5 |
| פין 11 | VDDANA — Analog supply voltage (1.71V to 3.6V) |
| פין 12 | PA08 — General-purpose I/O / ADC AIN6 / SERCOM0 PAD0 |
| פין 13 | PA09 — General-purpose I/O / ADC AIN7 / SERCOM0 PAD1 |
| פין 14 | PA10 — General-purpose I/O / SERCOM0 PAD2 |
| פין 15 | PA11 — General-purpose I/O / SERCOM0 PAD3 / USB D- |
| פין 16 | PA12 — General-purpose I/O / USB D+ |
| פין 17 | PA13 — General-purpose I/O / SERCOM2 PAD0 |
| פין 18 | PA14 — General-purpose I/O / SERCOM2 PAD1 |
| פין 19 | PA15 — General-purpose I/O / SERCOM2 PAD2 |
| פין 20 | PA16 — General-purpose I/O / SERCOM1 PAD0 / I2S SCK |
| פין 21 | PA17 — General-purpose I/O / SERCOM1 PAD1 / I2S FS |
| פין 22 | PA18 — General-purpose I/O / SERCOM1 PAD2 / I2S MCK |
| פין 23 | PA19 — General-purpose I/O / SERCOM1 PAD3 / I2S SDO |
| פין 24 | PA20 — General-purpose I/O / SERCOM3 PAD0 / I2S SDI |
| פין 25 | PA21 — General-purpose I/O / SERCOM3 PAD1 |
| פין 26 | PA22 — General-purpose I/O / SERCOM3 PAD2 |
| פין 27 | PA23 — General-purpose I/O / SERCOM3 PAD3 / ETH TXEN |
| פין 28 | PA24 — General-purpose I/O / USB ID / ETH TXD0 |
| פין 29 | PA25 — General-purpose I/O / ETH TXD1 |
| פין 30 | GND — Ground |
| פין 31 | PA27 — General-purpose I/O / ETH RXER |
| פין 32 | PA28 — General-purpose I/O / ETH RXDV |
| פין 33 | PA29 — General-purpose I/O / ETH RXD0 |
| פין 34 | PA30 — General-purpose I/O / SERCOM7 PAD2 / SWDIO |
| פין 35 | PA31 — General-purpose I/O / SERCOM7 PAD3 / SWCLK |
| פין 36 | NRST — Reset input (active low) |
| פין 37 | PB00 — General-purpose I/O / SERCOM5 PAD0 / ETH RXD1 |
| פין 38 | PB01 — General-purpose I/O / SERCOM5 PAD1 |
| פין 39 | PB02 — General-purpose I/O / SERCOM5 PAD2 / ETH CRS_DV |
| פין 40 | PB03 — General-purpose I/O / SERCOM5 PAD3 |
| פין 41 | PB04 — General-purpose I/O / SERCOM4 PAD0 |
| פין 42 | PB05 — General-purpose I/O / SERCOM4 PAD1 |
| פין 43 | PB06 — General-purpose I/O / SERCOM4 PAD2 |
| פין 44 | PB07 — General-purpose I/O / SERCOM4 PAD3 |
| פין 45 | PB08 — General-purpose I/O / SERCOM6 PAD0 |
| פין 46 | PB09 — General-purpose I/O / SERCOM6 PAD1 |
| פין 47 | PB10 — General-purpose I/O / SERCOM6 PAD2 |
| פין 48 | PB11 — General-purpose I/O / SERCOM6 PAD3 |
| פין 49 | PB12 — General-purpose I/O / SERCOM7 PAD0 |
| פין 50 | PB13 — General-purpose I/O / SERCOM7 PAD1 |
| פין 51 | PB14 — General-purpose I/O / SERCOM7 PAD2 |
| פין 52 | PB15 — General-purpose I/O / SERCOM7 PAD3 |
| פין 53 | PB16 — General-purpose I/O / SERCOM5 PAD0 |
| פין 54 | PB17 — General-purpose I/O / SERCOM5 PAD1 |
| פין 55 | PB18 — General-purpose I/O / SERCOM5 PAD2 |
| פין 56 | PB19 — General-purpose I/O / SERCOM5 PAD3 |
| פין 57 | PB20 — General-purpose I/O / SERCOM3 PAD0 |
| פין 58 | PB21 — General-purpose I/O / SERCOM3 PAD1 |
| פין 59 | PB22 — General-purpose I/O / SERCOM1 PAD2 |
| פין 60 | PB23 — General-purpose I/O / SERCOM1 PAD3 |
| פין 61 | PB24 — General-purpose I/O / SERCOM0 PAD0 |
| פין 62 | PB25 — General-purpose I/O / SERCOM0 PAD1 |
| פין 63 | VDDCORE — Core voltage supply (internal regulator output, decouple to GND) |
| פין 64 | GND — Ground / Exposed Pad (EP) - solder to PCB ground plane for thermal dissipation |
יישומים טיפוסיים
ATSAME53J19A-MU-EFP מתאים עבור 6 יישוםs: Industrial Ethernet Gateway, USB HID/CDC Industrial Device, Motor Control (FOC) for BLDC/PMSM, Building Automation Controller, IoT Edge Sensor Hub, Portable Medical Instrumentation.
Industrial Ethernet Gateway
The ATSAME53J19A-MU-EFP's integrated 10/100 Ethernet MAC with IEEE 1588 PTP hardware timestamping makes it ideal for industrial Ethernet nodes requiring sub-microsecond synchronization. Placed as the main MCU between a 10/100 PHY (e.g., KSZ8081) and the application logic, it runs TCP/IP stacks plus real-time industrial protocols while the Cortex-M4F core handles control loops. The 192 KB SRAM holds full LwIP or uIP stacks with room for application buffers, and the 512 KB ECC Flash stores firmware plus OTA staging area. Unlike parts requiring external Ethernet MACs, this integrated solution reduces BOM by 30-40%.
מומלץ
USB HID/CDC Industrial Device
The integrated USB 2.0 Full-Speed PHY with device/host capability makes the ATSAME53J19A-MU-EFP well-suited for USB HID, CDC, and MSC industrial devices including programming tools, test instruments, and human-machine interfaces. The on-chip PHY eliminates external USB transceivers, reducing BOM and PCB area. Firmware stacks like Microchip's ASF or Harmony 3 provide ready-made USB class drivers. The 120 MHz Cortex-M4F executes USB protocol handling plus real-time control with deterministic timing, and the 512 KB Flash stores full USB stacks plus application code.
מומלץ
Motor Control (FOC) for BLDC/PMSM
The ATSAME53J19A-MU-EFP's Cortex-M4F core with single-precision FPU executes Field-Oriented Control (FOC) algorithms for BLDC and PMSM motors at 120 MHz with deterministic timing. The integrated 12-bit 1 Msps ADC samples motor phase currents simultaneously via the ADC's hardware triggering and the Event System, while the dual 12-bit DACs generate reference waveforms for inverter control. The 192 KB SRAM holds control loops plus speed/position state, and the PWM timers with complementary outputs drive 3-phase bridges directly. This integration eliminates external DSP chips in motor drives up to several kW.
מומלץ
Building Automation Controller
For building automation gateways supporting BACnet, KNX, or Modbus, the ATSAME53J19A-MU-EFP combines Ethernet for IP backhaul, USB for commissioning, and up to 8 SERCOM interfaces for RS-485 sensor networks. The Cortex-M4F runs BACnet/IP stacks plus application logic, while the 192 KB SRAM holds concurrent protocol buffers. The Extended Flash Performance grade (250K P/E cycles, 25 years retention at 85C) qualifies the device for industrial building installations requiring 10-20 year service life. Operating temperature -40C to +85C covers unheated equipment rooms.
מומלץ
IoT Edge Sensor Hub
The ATSAME53J19A-MU-EFP serves as an edge aggregation hub for industrial IoT sensors, processing analog signals from its 12-bit 1 Msps ADC (up to 24 channels) and forwarding aggregated data via Ethernet. The Cortex-M4F with FPU executes on-device sensor fusion, FFT, and threshold detection before transmitting only processed data, reducing uplink bandwidth by 10-100x compared to raw sensor streaming. The dual-panel Flash enables OTA firmware updates without downtime. The 1.71V-3.6V supply supports battery-backed operation with efficient sleep modes drawing under 5 uA.
מומלץ
Portable Medical Instrumentation
The ATSAME53J19A-MU-EFP's Cortex-M4F core with FPU executes real-time DSP for portable medical devices including pulse oximeters, ECG monitors, and blood-pressure analyzers. The 12-bit 1 Msps ADC captures biosignals at sufficient resolution for heart-rate detection and SpO2 calculation, while the DSP extensions accelerate FIR/IIR filtering. USB connectivity enables data upload to PC software. The 1.71V-3.6V supply allows single-cell Li-ion battery operation, and sleep modes under 5 uA extend battery life. The Extended Flash Performance grade supports 10+ year medical device service life.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור ATSAME53J19A-MU-EFP — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | ATSAME53J19A-AU-EFP | ATSAME53J19A-AUT-EFP | ATSAME53J18A-MU-EFP | ATSAME51J19A-AU-EFP | ATSAME53N19A-AU-EFP |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 1 MB (+100%) |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB (+33%) |
| Ethernet MAC | Yes (10/100 + 1588 PTP) | Yes | Yes | Yes | No (SAM E51 lacks Ethernet) | Yes |
| CAN-FD | No | No | No | No | No | Yes (CAN-FD) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C |
מבדילים עיקריים
- Integrated 10/100 Ethernet MAC with 1588 PTP hardware timestamping (לעומתATSAME51J19A-AU-EFP)
- Dual 12-bit DACs with hardware triggering (לעומתATSAMD51J19A-MU-EFP)
- Extended Flash Performance (EFP) grade with 250K P/E cycles (לעומתATSAME53J19A-MU (standard grade))
הערות תכנון
The 64-pin VQFN (9x9 mm) package has an exposed thermal pad that must be soldered to the PCB ground plane for thermal dissipation. At full 120 MHz operation with all peripherals active, the ATSAME53J19A-MU-EFP dissipates approximately 80-120 mW. Design the PCB with at least 8 thermal vias in the EP region to maintain junction temperature below 85C industrial limit. Without thermal vias, expect 15-20% increase in junction-to-ambient thermal resistance.
Place 100 nF decoupling capacitors as close as possible to each VDD/VDDIO/VDDANA pin, plus a 4.7 uF bulk capacitor at each major supply pin. The VDDCORE pin requires a 1 uF low-ESR ceramic capacitor to GND. Route the SWDIO/SWCLK pair as a matched-length differential (within 5 mm) for reliable programming/debug at 120 MHz. For Ethernet, route ETH_RXP/N and ETH_TXP/N as 100-ohm differential pairs with length matching under 2 mm mismatch to the external PHY.
Do not exceed the absolute maximum supply voltage of 3.6V on any VDD pin - the SAM E53 family does not include 5V tolerance on I/O pins. Ensure the NRST pin has a 10 kohm pullup to VDDIO and a 100 nF capacitor to GND for proper reset behavior. The USB D+/D- lines require 33 ohm series resistors and a USBLC6 ESD protection array. The 32.768 kHz crystal (XIN32/XOUT32) traces must be short and shielded from switching signals to avoid RTC drift.
Route the analog signals (ADC AINx, DAC VOUTx) away from digital switching signals with a ground guard ring for best noise performance. The VREFP pin for the ADC requires a low-ESR 100 nF decoupling capacitor placed within 5 mm. For USB applications, the differential pair impedance must match 90 ohms differential per USB specification. According to the SAM E53 datasheet PCB layout guidelines, place the MCU on the top layer and route critical signals on inner layers with ground return planes.
מידע על תאימות
RoHS and REACH compliant per Microchip product documentation. Industrial temperature grade -40C to +85C, not AEC-Q100 qualified - choose ATSAME53J19A-AUT-EFP for automotive applications. Lead-free and halogen-free per Microchip material declaration.
