ATSAME70N20A-CN - ARM Cortex-M7 MCU, 300MHz, 1MB Flash | Microchip
MPN: ATSAME70N20A-CN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.62 | $116.20 |
| 100 | $10.18 | $1,018.00 |
| 500 | $9.05 | $4,525.00 |
| 1,000 | $8.4 | $8,400.00 |
ATSAME70N20A-CN Overview
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable peripherals. The SAM E70 family belongs to the Cortex-M7 class of microcontrollers, which sits in the hierarchy: ARM Cortex-M7 MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The Cortex-M7 core introduces a six-stage superscalar pipeline, double-precision FPU, and tightly-coupled memory (TCM) for deterministic sub-cycle interrupt response, enabling high-bandwidth signal processing on a single chip.
Key features of the ATSAME70N20A-CN include 16 Kbytes of I-cache and D-cache, an MPU for memory protection, and an Event System for inter-peripheral signalling without CPU intervention. It integrates a high-speed USB 2.0 High-Speed PHY, two HS SDHCI/eMMC interfaces, two CAN-FD controllers, an HSEM (Hardware Semaphore), and a Quad-SPI interface for XIP external Flash. The advanced analog includes a 12-bit AFEC, a temperature sensor, and up to ten SERCOM channels configurable as UART/SPI/I2C.
The device operates from a single 3.3V supply with internal core LDO and supports industrial temperature grades (-40C to +85C). Its Bus Matrix is dual-AHB for simultaneous SRAM and peripheral access, and the integrated crypto engine provides AES, TRNG, and secure boot. The TFBGA-100 package has a thermal resistance suitable for fanless industrial enclosures when mounted on a multi-layer PCB with thermal vias under the exposed pad.
Typical applications include industrial motor drives (FOC for PMSM), solar inverters, audio amplification with DSP, point-of-sale terminals, and automotive body controllers. In each of these, the Cortex-M7's DSP extensions deliver >2x the signal-processing throughput of Cortex-M4 solutions at the same clock frequency.
When designing with this MCU, allocate the upper 128 Kbytes of SRAM as DTCM for zero-wait-state data access. Decouple VDDCORE and VDDIO supplies separately, and follow Microchip AN34002 PCB layout guidelines for TFBGA escape.
Drop-in alternatives for ATSAME70N20A-CN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME70N20A-CN (same form factor and footprint) β differing in ADC, SRAM, USB, CAN, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAME70N20A-CNT
β Drop-Inβ In Stock
$8.85 / Unit
View Datasheet βATSAME70N20A-CFN
β Drop-Inπ Reference alternative (not in catalog)
ATSAMS70N20B-CN
β Drop-Inπ Reference alternative (not in catalog)
ATSAME70N21A-CN
β Drop-Inβ In Stock
$21.35 / Unit
View Datasheet βATSAME70N19B-CN
β Drop-Inπ Reference alternative (not in catalog)
ATSAMS70N21A-CN
β Drop-Inπ Reference alternative (not in catalog)
ATSAME70N20A-CN Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum Clock Frequency | 300 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| SRAM | 384 KB (multi-port) |
| I-Cache / D-Cache | 16 KB / 16 KB |
| Tightly-Coupled Memory (TCM) | Yes (ITCM + DTCM) |
| Memory Protection Unit (MPU) | Yes |
| Supply Voltage (VDDIO) | 3.3 V typical |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 100-pin TFBGA (9x9 mm) |
| USB | USB 2.0 High-Speed with on-chip PHY |
| CAN | 2x CAN-FD |
| SD/MMC | 2x SDHCI / eMMC |
| Quad-SPI | Yes (XIP support) |
| ADC | 12-bit AFEC |
| Crypto Accelerator | AES, TRNG |
| RoHS Status | Compliant |
ATSAME70N20A-CN Pin Configuration
| Pin A1 | VDDIO β I/O supply 3.3V |
| Pin A2 | PA0 β GPIO / AFEC positive input 0 |
| Pin A3 | PA1 β GPIO / AFEC positive input 1 |
| Pin A4 | PA2 β GPIO / CAN-FD 0 TX |
| Pin A5 | PA3 β GPIO / CAN-FD 0 RX |
| Pin A6 | GND β Ground |
| Pin A7 | VDDCORE β Core supply 1.2V (internal LDO output) |
| Pin A8 | XIN β Crystal oscillator input |
| Pin A9 | XOUT β Crystal oscillator output |
| Pin A10 | NRST β Reset input, active-low |
| Pin B1 | PB0 β GPIO / PWMH0_PWMH1 |
| Pin B2 | PB1 β GPIO / PWMH0_PWMH1 |
| Pin B3 | PB2 β GPIO / PWMH2_PWMH3 |
| Pin B4 | PB3 β GPIO / PWMH2_PWMH3 |
| Pin B5 | PB4 β GPIO / PWMH4_PWMH5 |
| Pin B6 | PB5 β GPIO / PWMH4_PWMH5 |
| Pin B7 | PB6 β GPIO / PWMH6_PWMH7 |
| Pin B8 | PB7 β GPIO / PWMH6_PWMH7 |
| Pin B9 | PB8 β GPIO / UART1 TX |
| Pin B10 | PB9 β GPIO / UART1 RX |
| Pin C1 | PC0 β GPIO / SPI0 NPCS0 |
| Pin C2 | PC1 β GPIO / SPI0 NPCS1 |
| Pin C3 | PC2 β GPIO / SPI0 NPCS2 |
| Pin C4 | PC3 β GPIO / SPI0 NPCS3 |
| Pin C5 | PC4 β GPIO / SPI0 MISO |
| Pin C6 | PC5 β GPIO / SPI0 MOSI |
| Pin C7 | PC6 β GPIO / SPI0 SPCK |
| Pin C8 | PC7 β GPIO / SPI1 NPCS0 |
| Pin C9 | PC8 β GPIO / SPI1 MISO |
| Pin C10 | PC9 β GPIO / SPI1 MOSI |
| Pin D1 | PD0 β GPIO / QSPI SCK |
| Pin D2 | PD1 β GPIO / QSPI CS |
| Pin D3 | PD2 β GPIO / QSPI IO0 |
| Pin D4 | PD3 β GPIO / QSPI IO1 |
| Pin D5 | PD4 β GPIO / QSPI IO2 |
| Pin D6 | PD5 β GPIO / QSPI IO3 |
| Pin D7 | PD6 β GPIO / UART2 RX |
| Pin D8 | PD7 β GPIO / UART2 TX |
| Pin D9 | PD8 β GPIO / SDHCI0 CMD |
| Pin D10 | PD9 β GPIO / SDHCI0 CK |
| Pin E1 | PE0 β GPIO / EBI D0 |
| Pin E2 | PE1 β GPIO / EBI D1 |
| Pin E3 | PE2 β GPIO / EBI D2 |
| Pin E4 | PE3 β GPIO / EBI D3 |
| Pin E5 | PE4 β GPIO / EBI D4 |
| Pin E6 | PE5 β GPIO / EBI D5 |
| Pin E7 | PE6 β GPIO / EBI D6 |
| Pin E8 | PE7 β GPIO / EBI D7 |
| Pin E9 | PE8 β GPIO / EBI A0/NAND ALE |
| Pin E10 | PE9 β GPIO / EBI A1/NAND CLE |
| Pin F1 | PF0 β GPIO / AFEC reference |
| Pin F2 | PF1 β GPIO / AFEC positive input 6 |
| Pin F3 | PF2 β GPIO / AFEC positive input 7 |
| Pin F4 | PF3 β GPIO / AFEC positive input 8 |
| Pin F5 | PF4 β GPIO / AFEC positive input 9 |
| Pin F6 | PF5 β GPIO / AFEC positive input 10 |
| Pin F7 | PF6 β GPIO / AFEC positive input 11 |
| Pin F8 | PF7 β GPIO / CAN1 TX |
| Pin F9 | PF8 β GPIO / CAN1 RX |
| Pin F10 | PF9 β GPIO / TIO1 / PWMH_FLT0 |
| Pin G1 | PG0 β GPIO / EBI NCS0 |
| Pin G2 | PG1 β GPIO / EBI NCS1 |
| Pin G3 | PG2 β GPIO / EBI NCS2 |
| Pin G4 | PG3 β GPIO / EBI NWR0 |
| Pin G5 | PG4 β GPIO / EBI NRD |
| Pin G6 | PG5 β GPIO / EBI NWR1 |
| Pin G7 | PG6 β GPIO / EBI NWE |
| Pin G8 | PG7 β GPIO / EBI NCS3 |
| Pin G9 | PG8 β GPIO / TIO2 / PWMH_FLT1 |
| Pin G10 | PG9 β GPIO / TIO3 / PWMH_FLT2 |
| Pin H1 | USB_DP β USB 2.0 High-Speed data plus |
| Pin H2 | USB_DM β USB 2.0 High-Speed data minus |
| Pin H3 | VDDUTMI β USB UTMI transceiver supply 3.3V |
| Pin H4 | VDDPLL β PLL analog supply 3.3V |
| Pin H5 | VDDANA β Analog supply 3.3V for AFEC |
| Pin H6 | GNDANA β Analog ground |
| Pin H7 | TCK β JTAG Test Clock |
| Pin H8 | TMS β JTAG Test Mode Select |
| Pin H9 | TDO β JTAG Test Data Out |
| Pin H10 | TDI β JTAG Test Data In |
| Pin J1 | VDDIO β I/O supply 3.3V (secondary) |
| Pin J2 | PB10 β GPIO / TWD (I2C1 SDA) |
| Pin J3 | PB11 β GPIO / TWCK (I2C1 SCL) |
| Pin J4 | PB12 β GPIO / SPI1 SPCK |
| Pin J5 | PB13 β GPIO / SPI1 NPCS1 |
| Pin J6 | PB14 β GPIO / SPI1 NPCS2 |
| Pin J7 | PB15 β GPIO / SPI1 NPCS3 |
| Pin J8 | PC10 β GPIO / I2SCK GY |
| Pin J9 | PC11 β GPIO / I2SWS GY |
| Pin J10 | PC12 β GPIO / I2SSD0 GY |
Typical Applications
ATSAME70N20A-CN is suitable for 6 applications: Industrial Motor Drive (FOC for PMSM), Solar Inverter / Power Conversion, Audio Amplifier with DSP, Point-of-Sale (POS) Terminal, Automotive Body Controller, High-Speed Industrial Gateway.
Industrial Motor Drive (FOC for PMSM)
The ATSAME70N20A-CN's 300 MHz Cortex-M7 with DSP extensions delivers enough headroom for sensorless Field-Oriented Control of permanent-magnet synchronous motors (PMSM) at switching frequencies up to 40 kHz. Its 384 KB of multi-port SRAM lets the firmware hold three sine tables, two current-loop PI controllers, and an SMO observer state estimator simultaneously. The PWM peripheral (PWMHS) provides 8 complementary channels with 8 ns dead-time resolution, and the AFEC supports 1 MSPS conversion for shunt-based current sensing on a 3-axis motor.
Recommended
Solar Inverter / Power Conversion
Grid-tied solar inverters require precise MPPT control, anti-islanding detection, and reactive-power compensation - all of which the ATSAME70N20A-CN handles within a single chip. The Cortex-M7 executes a 2nd-order DPLL for grid synchronisation in under 12 us per cycle, while the AFEC samples the DC-bus and grid voltage at 1 MSPS with hardware oversampling. The 1 MB Flash stores lookup tables, MODBUS stacks, and IEC 61727 grid-code firmware. Two CAN-FD ports support inverter-to-inverter daisy-chain communications for microgrid topologies.
Recommended
Audio Amplifier with DSP
For Class-D amplifiers with DSP crossover and EQ, the ATSAME70N20A-CN's Cortex-M7 executes biquad and FIR filter chains on 48 kHz audio streams with <5% CPU load. The I2S peripheral streams 24-bit samples from the audio ADC/DAC, while the USB High-Speed port receives audio streams from a PC host. The crypto engine can decrypt protected audio content in-line. The Cortex-M7's double-precision FPU handles speaker-room-correction convolution (typically 4096 taps) without sample-rate loss.
Recommended
Point-of-Sale (POS) Terminal
POS terminals combine a high-resolution display, secure payment processing, and multi-protocol connectivity. The ATSAME70N20A-CN drives an LVDS display panel through the EBI interface, runs Linux on a Cortex-M7 RTOS-free configuration, and secures card transactions via the on-chip AES-256 and TRNG. USB High-Speed enables fast EMV chip-card reads, while the SDHCI manages a 32 GB local transaction log.
Recommended
Automotive Body Controller
Body-control modules run CAN-FD backbones, LIN sub-buses, and PWM-controlled lighting loads simultaneously. The ATSAME70N20A-CN's two CAN-FD controllers run at 5 Mbit/s with hardware acceptance filtering, while the PWMHS peripheral drives LED matrix headlights with smooth dimming. The Cortex-M7 handles diagnostic UDS stacks over CAN, and the crypto engine supports secure boot for functional-safety (ISO 26262) builds. Industrial-grade temperature parts cover cabin modules; CFN variants support engine-bay temperatures.
Recommended
High-Speed Industrial Gateway
Industrial gateways translate between Modbus TCP/RTU, EtherCAT, OPC-UA, and PROFINET protocols - all of which the ATSAME70N20A-CN supports via its Ethernet MAC, two CAN-FD ports, and multiple UART channels. The Cortex-M7's MPU isolates each protocol stack into its own memory region, increasing cyber-security. USB High-Speed enables local diagnostic logging. The 1 MB Flash holds PROFINET stack plus application logic; the 384 KB SRAM buffers ~120 ms of Ethernet traffic at 100 Mbit/s.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME70N20A-CN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME70N20A-CNT | ATSAME70N20A-CFN | ATSAMS70N20B-CN | ATSAME70N21A-CN | ATSAME70N19B-CN | ATSAMS70N21A-CN |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Core Architecture | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU |
| Maximum Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 512 KB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 256 KB | 384 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging | Tray | Tape-and-Reel | Tape-and-Reel | Tray | Tray | Tray | Tray |
Key Differentiators
- Largest Flash + SRAM combination in TFBGA-100 SAM E70 family (vs ATSAME70N19B-CN)
- Industrial temperature grade for most deployments (vs ATSAME70N20A-CFN)
- Enhanced peripheral mix over S70 variant (vs ATSAMS70N20B-CN)
- Dual-purpose 300 MHz DSP for audio + motor control (vs ATSAME54P20A-AF)
Design Notes
Estimated: For TFBGA-100 at 0.8 mm pitch, route all signals on inner layers with HDI micro-via-in-pad for the BGA escape. Use a 1-2-1 or 1-3-1 PCB stack-up; minimum 4 layers recommended. Place 100 nF decoupling caps as close to each VDDIO/VDDCORE ball as possible (within 1 mm trace length). Add 4.7 uF bulk caps at each corner of the BGA and route VDDCORE first through the dedicated 1.2V internal LDO before powering external circuitry.
Estimated: Under typical 300 MHz Cortex-M7 load with all peripherals enabled, the ATSAME70N20A-CN consumes ~150 mW core power. With theta_JA of approximately 28 C/W on a 4-layer PCB (per Microchip thermal characterization), junction rise above ambient is ~4.2 C - well within industrial limits. For enclosed industrial enclosures without airflow, ensure at least 5 mm x 5 mm of unbroken GND copper plane directly under the BGA, plus thermal vias to inner GND layers.
Do not skip the 32.768 kHz low-frequency crystal on the SAM E70 - the RTC, watchdog timer, and PMC slow-clock domains all derive from it. The 12 MHz main crystal must be within 50 ppm accuracy for USB High-Speed certification. Reset signal NRST requires a 10 kohm pullup and 100 nF capacitor for stable operation; leaving NRST floating causes unpredictable boot behaviour. For secure-boot designs, ensure the AES engine is provisioned before any OTA updates are accepted.
The USB DP/DM differential pair must be routed as a 90-ohm differential microstrip with no more than 4 stubs total - keep total trace length under 50 mm. Place the 27 ohm series termination resistors at the MCU side, not the connector side. For HS SDHCI signals, route the 4-bit CMD/CLK/DAT bus with 50-ohm single-ended impedance and place series 22 ohm resistors near the SD card connector to dampen reflections from the card socket.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). For automotive AEC-Q100 builds, use ATSAME70N20A-CFN extended temperature variant or ATSAMS70N20B-CN security-hardened part.
