ATSAME70N20A-CN - ARM Cortex-M7 MCU 300MHz 1MB Flash 100-TFBGA
N.º de pieza: ATSAME70N20A-CN ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.45 | $114,50 |
| 100 | $10.1 | $1.010,00 |
| 500 | $8.85 | $4.425,00 |
| 1.000 | $7.75 | $7.750,00 |
ATSAME70N20A-CN Descripción general
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable peripherals. The SAM E70 family belongs to the Cortex-M7 class of microcontrollers, which sits in the hierarchy: ARM Cortex-M7 MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The Cortex-M7 core introduces a six-stage superscalar pipeline, double-precision FPU, and tightly-coupled memory (TCM) for deterministic sub-cycle interrupt response, enabling high-bandwidth signal processing on a single chip.
Key features of the ATSAME70N20A-CN include 16 Kbytes of I-cache and D-cache, an MPU for memory protection, and an Event System for inter-peripheral signalling without CPU intervention. It integrates a high-speed USB 2.0 High-Speed PHY, two HSMCI/eMMC interfaces, two CAN-FD controllers, an HSEM (Hardware Semaphore), and a Quad-SPI interface for XIP external Flash. The advanced analog includes a 12-bit AFEC, a temperature sensor, and configurable SERCOM channels for UART/SPI/I2C.
The device operates from a single 3.3V supply with an internal core LDO and supports industrial temperature grades (-40C to +85C). Its dual-AHB Bus Matrix enables simultaneous SRAM and peripheral access, and the integrated crypto engine provides AES, TRNG, and secure boot. The TFBGA-100 package has a thermal resistance suitable for fanless industrial enclosures when mounted on a multi-layer PCB with thermal vias under the exposed pad.
Typical applications include industrial motor drives (FOC for PMSM), solar inverters, audio amplification with DSP, point-of-sale terminals, and automotive body controllers. In each, the Cortex-M7's DSP extensions deliver >2x the signal-processing throughput of Cortex-M4 solutions at the same clock frequency.
When designing with this MCU, allocate the upper 128 Kbytes of SRAM as DTCM for zero-wait-state data access. Decouple VDDCORE and VDDIO supplies separately, and follow Microchip AN34002 PCB layout guidelines for TFBGA escape routing.
This page synthesizes distributor pricing, drop-in alternative candidates, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for evaluation and sourcing.
Alternativas directas para ATSAME70N20A-CN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAME70N20A-CN (mismo factor de forma y huella) — difiere en ADC, Package, Ethernet, SRAM, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAME70N21A-CN
✅ Sustitución directa✓ En stock
$22.73 / unidad
Ver hoja de datos →ATSAME70N20A-CFN
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAME70N20A-CNT
✅ Sustitución directa✓ En stock
$8.85 / unidad
Ver hoja de datos →ATSAME70N20B-AABT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAMS70N20A-CN
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAME70N20A-CN Valores máximos y características eléctricas
| Core | ARM Cortex-M7 with FPU |
| Frecuencia de reloj máxima | 300 MHz |
| Program Memory (Flash) | 1024 KB (1M x 8) |
| SRAM | 384 KB multi-port SRAM |
| Instruction Cache (I-cache) | 16 KB |
| Data Cache (D-cache) | 16 KB |
| Tensión de alimentación | 1.8V / 2.5V / 3.3V |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Encapsulado | 100-pin TFBGA (9x9 mm) |
| USB | USB 2.0 High-Speed PHY (integrated) |
| CAN | 2x CAN-FD controllers |
| HSMCI / eMMC | 2x HSMCI/eMMC interfaces |
| Quad-SPI / XIP | Yes |
| Crypto Engine | AES, TRNG, secure boot |
| ADC | 12-bit AFEC |
| Tipo de montaje | Surface Mount (TFBGA) |
| Estado RoHS | Compliant |
Guía de configuración de pines de ATSAME70N20A-CN 100-pin tfbga (9x9 mm)
Configuración de pines para ATSAME70N20A-CN (encapsulado 100-pin tfbga (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAME70N20A-CN.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAME70N20A-CN es adecuado para 6 aplicacións: Industrial Motor Drive (FOC for PMSM), Solar Inverter / Power Conversion, Audio Amplification with DSP, Point-of-Sale (POS) Terminal, Automotive Body Controller, Industrial IoT Gateway.
Industrial Motor Drive (FOC for PMSM)
The ATSAME70N20A-CN is purpose-built for industrial motor control thanks to its 300 MHz Cortex-M7 DSP extensions and double-precision FPU. Field-oriented control (FOC) loops for PMSM motors execute current-control and space-vector modulation in single-cycle MAC instructions, comfortably fitting 20 kHz switching loops while leaving headroom for speed/torque observers. The 12-bit AFEC samples phase currents synchronously to the PWM with <1 µs latency, and the 384 KB SRAM holds Clarke/Park transform buffers plus observer state without spilling to external memory.
Recomendado
Solar Inverter / Power Conversion
In solar inverter designs, the ATSAME70N20A-CN executes MPPT, grid-synchronization PLL, and inverter control simultaneously. Its Cortex-M7 DSP at 300 MHz performs FFT-based harmonic analysis and SOGI-FLL grid locking inside the control period. The integrated USB 2.0 High-Speed PHY streams telemetry to monitoring systems at 480 Mbps, and the HSMCI/eMMC port logs energy yield on removable storage. Industrial -40C to +85C rating covers outdoor inverter enclosures without derating.
Recomendado
Audio Amplification with DSP
The ATSAME70N20A-CN delivers >2x signal-processing throughput versus Cortex-M4 devices, making it well matched to Class-D audio amplifiers with on-chip DSP. Crossover filters, room correction, and dynamic compression run on the FPU at 300 MHz while I2S feeds an external DAC. The 16 KB D-cache keeps sample buffers in zero-wait-state memory, and the 1 MB Flash stores coefficient tables and presets. Two HSMCI ports support SD-card playback for installed audio content.
Recomendado
Point-of-Sale (POS) Terminal
POS terminals benefit from the ATSAME70N20A-CN's Cortex-M7 performance combined with hardware crypto and high-speed connectivity. The integrated AES/TRNG engine secures PCI-PTS transactions, while USB 2.0 High-Speed PHY connects to printers or scanners. The TFT LCD controller drives WVGA displays without external graphics RAM, and the HSMCI/eMMC port hosts the Linux-style root filesystem on managed NAND. The Quad-SPI XIP interface boots instantly from encrypted external Flash.
Recomendado
Automotive Body Controller
Although not AEC-Q100 qualified, the ATSAME70N20A-CN is widely used in non-safety automotive body applications (interior lighting, HVAC, mirror control) where its CAN-FD controllers and Cortex-M7 DSP simplify multi-protocol gatewaying. Dual CAN-FD buses bridge classic CAN and modern vehicle networks. The integrated crypto engine secures diagnostic UDS sessions, and the Event System routes sensor inputs without CPU wake-up, reducing quiescent current for parked-vehicle standby.
Recomendado
Industrial IoT Gateway
The ATSAME70N20A-CN is well suited for industrial IoT edge gateways aggregating fieldbus (CAN-FD, RS-485, I2C sensor arrays) and pushing telemetry over Ethernet or Wi-Fi. The Cortex-M7 handles protocol translation, on-device analytics, and secure TLS sessions using its hardware AES acceleration. The 384 KB SRAM buffers MQTT payloads and the HSMCI port logs data to industrial SD cards. Industrial temperature range covers factory-floor cabinets and outdoor cabinets.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAME70N20A-CN — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAME70N21A-CN | ATSAME70N20A-CFN | ATSAME70N20A-CNT | ATSAME70N20B-AABT | ATSAMS70N20A-CN |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU (rev B) | ARM Cortex-M7 + FPU |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 1 MB | 2 MB (+100%) | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Silicon Revision | A | A | A | A | B (enhanced) | A |
| Packaging Format | Tray | Tray | No-tray | Tape and Reel | Tray | Tray |
Diferenciadores clave
- Same-die variants offering Flash and packaging options in identical footprint (frente a ATSAME70N20A-CFN / ATSAME70N20A-CNT)
- Double the Flash capacity with full backward compatibility (frente a ATSAME70N21A-CN)
- Silicon revision B with enhanced ESD and bug fixes (frente a ATSAME70N20B-AABT)
Notas de diseño
TFBGA-100 (9x9 mm, 0.8 mm pitch) requires fan-out via escape routing on inner PCB layers. Use micro-via-in-pad (0.2 mm drill) on at least 4 layers for clean signal egress. Place thermal vias (0.3 mm drill, 1 mm pitch array) directly under the exposed pad to keep theta-JA below 25 C/W. Follow Microchip AN34002 PCB layout guidelines for TFBGA escape and refer to the SAM E70 design files package for reference Gerbers.
Decouple VDDCORE and VDDIO separately. Place a 4.7 µF + 100 nF X7R pair within 2 mm of each VDDCORE ball, and a separate 1 µF + 100 nF pair on VDDIO. The internal core LDO can source up to ~200 mA; avoid drawing MCU I/O current through VDDCORE balls. Tie unused VDDBU to VDDIO through a ferrite bead if RTC is unused, or directly to VDDIO if RTC backup is disabled.
Allocate the upper 128 KB of SRAM as DTCM (Data Tightly-Coupled Memory) for zero-wait-state access by configuring the bus matrix at startup. This dramatically accelerates DSP loops and ADC double-buffer ping-pong patterns. Route HS USB differential pair (DP/DN) with 90-ohm differential impedance and length matching within 150 mil. Keep HSMCI/Quad-SPI traces length-matched within 500 mil to avoid setup/hold violations at 100 MHz.
Do not skip the NRST reset circuit: a 10 kΩ pull-up to VDDIO with a 1 nF to 10 nF capacitor to ground is required for clean power-on reset. Failing to configure the PLLs before enabling peripherals results in bus hang - always initialize the PMC (Power Management Controller) before peripheral clocks. Note that the HS USB PHY requires a 12 MHz reference clock; the internal 12 MHz RC is insufficient for USB compliance.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade only - not AEC-Q100 qualified. For automotive safety applications, consider SAM V71 family with AEC-Q100 grade 1 variants.