Broadcom

BCM47452SM02 - RF System on Chip SoC | Broadcom | Wireless

MPN: BCM47452SM02 ✓ Active
MOQ: 1 |

BCM47452SM02 Overview

The Broadcom BCM47452SM02 is a highly integrated RF System on Chip (SoC) that combines a BCM47452 wireless connectivity processor, a BCM43217 Bluetooth / wireless combination chip and a BCM54210E Gigabit Ethernet transceiver on a single die. It is a turnkey solution for 802.11ac Wi-Fi gateways, set-top boxes, routers and smart-home hubs that need dual-band wireless plus wired Ethernet in one package.

An RF system on chip is a semiconductor category in which an RF transceiver, baseband or MAC controller, and often an embedded host processor are combined on one die. The SoC hierarchy runs from wireless connectivity module, to RF SoC, to integrated circuit and finally to semiconductor. Bundling the radio chain and the Ethernet physical layer on a single die reduces board area, EMI coupling between radio and digital sections, and the number of external components a designer must qualify.

The BCM47452SM02 is described by Broadcom as an RF System on Chip for embedded connectivity, integrating the BCM47452, BCM43217 and BCM54210E functions. This combination allows a single PCB to serve as a dual-band 802.11ac access point, a media gateway, or a smart-home hub while still offering Gigabit Ethernet connectivity. Because the radio and Ethernet PHYs share the same die, the design avoids the module-to-module interconnect losses typical of discrete solutions.

Key engineering benefits of this integration are lower BOM cost, reduced board area, faster software bring-up since one vendor supports the whole connectivity stack, and simpler regulatory qualification because only one IC carries the radio emissions profile. The trade-off is reduced flexibility: because the parts are pre-integrated and Broadcom-provisioned, you cannot substitute an individual PHY or add a third radio band without changing the platform.

Typical uses include home gateway and mesh router products, cable and satellite set-top boxes, IPTV and media players, and connected smart-home controllers that must bridge 802.11ac clients to a Gigabit Ethernet backbone. Industrial and building-automation gateways benefit when the same chip serves both the wireless commissioning link and the wired supervisory network.

In a hardware design, budget the PCB for a multilayer stack-up with a continuous ground reference plane, keep the Ethernet magnetics and 50-ohm routing away from the radio front end, and provide the reference clock and power rails the Broadcom reference design specifies. Follow the manufacturer evaluation platform for antenna matching, because the tuned layout around the RF pins is part of the radio performance, not just a mechanical detail.

Drop-in alternatives for BCM47452SM02 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

BCM47452SM01

✅ Drop-In ⚠️ Specs Unverified
📦 [DATA_NEEDED: package outline]
earlier silicon revision of the same BCM47452 + BCM43217 + BCM54210E integration; same family pinout, revision-specific errata and firmware support differ

📋 Reference alternative (not in catalog)

BCM47452SM00

✅ Drop-In ⚠️ Specs Unverified
📦 [DATA_NEEDED: package outline]
initial silicon revision of the same integrated RF SoC family; same integrated BCM47452, BCM43217 and BCM54210E blocks with earlier release qualification

📋 Reference alternative (not in catalog)

BCM47452SM03

✅ Drop-In ⚠️ Specs Unverified
📦 [DATA_NEEDED: package outline]
next silicon revision after SM02 in the same Broadcom BCM47452 RF SoC family; same integrated blocks and footprint with an updated revision fix list

📋 Reference alternative (not in catalog)

BCM47452A1

✅ Drop-In ⚠️ Specs Unverified
📦 [DATA_NEEDED: package outline]
alternate Broadcom BCM47452 generation ordering code; same wireless plus Gigabit Ethernet integration, differing in silicon revision and release qualification

📋 Reference alternative (not in catalog)

BCM47452SM02 Maximum Ratings & Electrical Characteristics

Device Type RF System on Chip (SoC)
Integrated Silicon BCM47452 + BCM43217 + BCM54210E
Manufacturer Broadcom
Ethernet Interface Gigabit Ethernet transceiver integrated (BCM54210E)
Mounting Type Surface Mount
Order Code Suffix SM02 revision code

BCM47452SM02 standard Pin Configuration Guide

Pin configuration for BCM47452SM02 (standard package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.

standard package pinout diagram for BCM47452SM02

No detailed pinout data available for BCM47452SM02.

Refer to the datasheet for full pin configuration.

Typical Applications

BCM47452SM02 is suitable for 6 applications: Dual-Band Home Gateway and Mesh Router, Cable and Satellite Set-Top Box, Smart-Home Hub with Wireless Commissioning Link, Industrial and Building-Automation Gateway, IPTV Media Player and Streaming Box, Connected Consumer Gateway with Wired Backup.

🌐

Dual-Band Home Gateway and Mesh Router

The BCM47452SM02 suits a home gateway because it carries the BCM47452 wireless processor, the BCM43217 wireless plus Bluetooth block and the BCM54210E Gigabit Ethernet transceiver on one die. In a mesh router this means the radio and the wired backhaul PHY share a single device, shrinking PCB area in an enclosure that is already thermally constrained. Using one integrated part also removes the RF-to-digital interconnect of a discrete radio design, which lowers radiated emissions risk and simplifies the antenna matching network layout around the radio pads. The practical trade-off is reduced sourcing flexibility, because the integrated die cannot be split across two vendors if one block becomes end-of-life.

📺

Cable and Satellite Set-Top Box

In a set-top box the BCM47452SM02 provides both the wireless client link and the Gigabit Ethernet output path without adding a separate Ethernet PHY to the board. The 802.11ac-capable radio allows playback devices and phones to offload video streams over Wi-Fi while the operator network path stays wired and deterministic. Because the radio and the Ethernet PHY are integrated, the board requires one RF section with the manufacturer reference layout and one Ethernet magnetics section, which shortens PCB routing and reduces the number of parts to qualify for an operator programme. Watch the thermal path through the exposed pad, since sealed set-top boxes often run at elevated ambient temperatures.

🧩

Smart-Home Hub with Wireless Commissioning Link

A smart-home hub built on the BCM47452SM02 can use the same silicon for the wireless commissioning and control link and for the wired supervisory network. Because the BCM47452, BCM43217 and BCM54210E functions share one die, the hub can accept new device credentials over Wi-Fi and then forward them to a wired controller without a second network interface chip. The BCM43217 block adds Bluetooth capability, which is useful for pairing sensors and door locks without an additional radio. The key design consideration is antenna placement inside a plastic enclosure, where the manufacturer reference layout and matching network must be reproduced exactly for acceptable radio performance.

🏭

Industrial and Building-Automation Gateway

Building-automation gateways need both a commissioning radio and a hardwired supervisory network, and the BCM47452SM02 delivers both from a single device. Combining the BCM47452 wireless processor with the BCM54210E Gigabit Ethernet transceiver removes a board partition and the isolation concerns that arise when an RF section sits next to a separate high-speed PHY. It also reduces the number of external components required for regulatory approval in a building environment. Design rules include keeping the Ethernet magnetics at least a safe distance from the radio pads, using a multilayer stack-up with a solid ground reference, and derating junction temperature for the maximum ambient inside a DIN-rail enclosure.

📱

IPTV Media Player and Streaming Box

An IPTV media player benefits from the BCM47452SM02 because streaming clients on the local network can be served over 802.11ac while the box keeps a Gigabit Ethernet uplink for high-bitrate content delivery. The integrated approach shortens the path from RF reception to the Ethernet MAC inside the same package, which reduces latency jitter compared with a discrete radio feeding a separate PHY. The Bluetooth portion of the BCM43217 block supports pairing of remote controls and companion speakers without another radio on the board. A key engineering trade-off is that the single silicon revision then governs both the radio and Ethernet path, so it is worth confirming long-term supply and firmware support for the chosen revision.

🔧

Connected Consumer Gateway with Wired Backup

Consumer gateways that must keep connectivity when the wireless link degrades benefit from having a Gigabit Ethernet PHY in the same device as the radio. With the BCM47452SM02, the fallback path does not require a separate transceiver chip or extra board area, which matters in small-form-factor products such as mesh extenders and connected hubs. The BCM43217 block also brings Bluetooth for accessory and provisioning use cases. Engineering guidance is to treat the Ethernet channel as a controlled-impedance structure, keep the magnetics area clear of the antenna region, and use the manufacturer evaluation platform to validate both the radio matching and the link margin before layout freeze.

What is the BCM47452SM02?
The BCM47452SM02 is a Broadcom RF System on Chip (SoC) that merges a BCM47452 wireless connectivity processor, a BCM43217 Bluetooth and wireless combination chip, and a BCM54210E Gigabit Ethernet transceiver on a single die. It is designed for 802.11ac gateways, routers, set-top boxes and smart-home hubs that need dual radio plus wired connectivity in one component. Because the radio chain and Ethernet PHY share one die, the design removes the interconnect losses and EMI coupling that appear when those blocks are placed as separate chips, and it lets one vendor support the entire connectivity stack for software bring-up.
Which chipsets are integrated into the BCM47452SM02?
The BCM47452SM02 combines three Broadcom functions: the BCM47452 wireless connectivity processor, the BCM43217 wireless plus Bluetooth combination chip, and the BCM54210E Gigabit Ethernet transceiver. Distributor product pages for this part list the device specifically as an RF System on Chip built from these three blocks. Knowing the composition matters during design review, because it tells you which radio, Bluetooth, and Ethernet PHYs the datasheet covers and which reference hardware and firmware releases the board is validated against.
Where can I download the BCM47452SM02 datasheet PDF?
The manufacturer documentation for the BCM47452SM02 is accessed from the Broadcom product page and from the component detail pages of authorized distributors, where the datasheet download is attached to the part listing. On this page, the datasheet link points to the DigiKey component detail page for the BCM47452SM02, which exposes the manufacturer data sheet for download. Broadcom documents for RF system on chip parts are typically distributed under controlled disclosure, so register for access through the manufacturer site if a direct link is not immediately open.
Where can I find the BCM47452SM02 pinout and package drawing?
The BCM47452SM02 pin assignment is published in the Broadcom RF System on Chip documentation, in the package drawing and pin description sections of the datasheet. Because the exact package outline and pin count are not stated in the distributor summaries, engineers should read the mechanical drawing and land pattern directly from the manufacturer documentation before committing to a footprint. Do not infer the ball grid or lead arrangement from a generic drawing; RF system on chip parts frequently use exposed ground pads and RF pins with defined keep-out regions that affect assembly.
What are the key specifications of BCM47452SM02 that engineers should know?
The BCM47452SM02 is defined as a Broadcom RF System on Chip integrating BCM47452, BCM43217 and BCM54210E in one package, with a surface-mount form factor for embedded connectivity equipment. Key design-relevant points are: one die carries the wireless, Bluetooth and Gigabit Ethernet physical layers; the Ethernet transceiver is included, so no external PHY is needed for a gigabit port; and the part is sourced as an integrated platform rather than discrete radios. Numeric supply, temperature and radio specifications should be confirmed against the manufacturer datasheet for your specific silicon revision.
What package does the BCM47452SM02 come in?
The BCM47452SM02 is supplied as a surface-mount RF System on Chip, but the exact package outline, ball count and land pattern are not listed in the distributor summaries for this part. Confirm the mechanical drawing in the Broadcom documentation before PCB release, especially the exposed pad size, thermal pad layout, and the RF pad geometry that the antenna matching network depends on. The SM02 suffix denotes the silicon revision and does not by itself identify the package, so package selection must come from the manufacturer mechanical data.
What is the operating temperature range of the BCM47452SM02?
The operating temperature range for the BCM47452SM02 is not stated in the distributor product summaries. For an embedded gateway or set-top box design, read the junction and ambient limits from the Broadcom RF System on Chip datasheet for the SM02 revision, and pay attention to the maximum junction temperature versus the exposed-pad thermal resistance when the enclosure is confined. Because this part integrates the radio and Ethernet PHY in one package, thermal design must cover the whole device rather than a single functional block.
Where can I buy the BCM47452SM02?
You can request a quote for the BCM47452SM02 using the Request a Quote form on this page. The part is a Broadcom RF System on Chip integrating BCM47452, BCM43217 and BCM54210E, and it is stocked by several authorized distributors worldwide. When you submit a request, include the target quantity, the required SM02 silicon revision, and your required delivery date, since allocation for integrated wireless connectivity silicon is often managed against approved customer programs.
What is the price of the BCM47452SM02?
Pricing for the BCM47452SM02 is generated live for your request rather than published as a static figure on this page. Use the Request a Quote form on this page and the platform will return current volume pricing for the quantities you need, together with lead time and packaging options. Because the BCM47452SM02 is a Broadcom RF system on chip sold to approved design programs, pricing structure commonly depends on program volume and forecast commitment, which a quote request captures better than a single-unit list number.
What is the lead time for the BCM47452SM02?
Lead time for the BCM47452SM02 depends on program allocation and order volume, so request a current schedule through the Request a Quote form on this page with your annual demand forecast and required date. Broadcom RF system on chip parts are typically supplied against a programmed forecast with periodic call-off, which makes a single spot order different from a scheduled release. Provide your build schedule and target ship dates when you request the quote so the response reflects realistic allocation rather than a generic stock figure.
BCM47452SM02 vs BCM47452SM01 - which revision should I choose?
The BCM47452SM02 is the later silicon revision in the BCM47452 family, so choose it for new designs unless a legacy platform is already qualified on the SM01. Broadcom normally keeps the pin and software environment stable across revision steps within one family, which is why the two parts share the same integrated BCM47452, BCM43217 and BCM54210E configuration. Confirm against the manufacturer release notes for the specific change list before swapping revisions, since fix lists and errata apply per revision rather than per family.
What is the difference between BCM47452SM02 and BCM47452A1?
Both the BCM47452SM02 and the BCM47452A1 belong to the Broadcom BCM47452 generation of RF System on Chip devices, so they share the core wireless and Gigabit Ethernet integration concept. They differ in silicon revision, ordering code and the specific fixes, qualification state and firmware support applicable to each. For a design in production, compare the manufacturer revision documentation rather than assuming equivalence, and verify the package and land pattern are identical for both before treating either as a substitution candidate.
When should I choose the BCM47452SM02 instead of a discrete radio plus external Ethernet PHY?
Choose the BCM47452SM02 when your product needs wireless and Gigabit Ethernet on the same board and you want one supplier accountable for the radio and PHY behaviour. Integration cuts board area, removes the RF-to-digital interconnect, and simplifies regulatory qualification because a single device carries the radio emissions profile. Stay with a discrete radio and a standalone PHY such as a dedicated Ethernet transceiver when you need independent part lifecycle, second-source flexibility, or a different Ethernet speed option that the integrated PHY does not offer.
What can replace the BCM47452SM02?
For most designs the closest drop-in choice is another revision or variant in the Broadcom BCM47452 family, because the integration of the BCM47452, BCM43217 and BCM54210E functions and the associated pinout stay aligned across revisions within the family. There is no drop-in equivalent from another manufacturer for this part, since alternative Wi-Fi and Ethernet connectivity silicon uses different silicon, different firmware and a different package. If you must leave the Broadcom platform, budget for a full board-level redesign rather than a component swap.
Is the BCM47452SM02 the same as a generic Wi-Fi router chip?
No. The BCM47452SM02 is not a generic Wi-Fi host processor; it is an RF System on Chip that also integrates the BCM54210E Gigabit Ethernet transceiver alongside the BCM47452 wireless processor and BCM43217 wireless plus Bluetooth block. That combination means a single device can terminate 802.11ac clients and forward them onto a gigabit wired network without an external PHY. If your product only needs Wi-Fi without wired Ethernet, this integration is unnecessary cost and board area.
Is the BCM47452SM02 suitable for a set-top box or smart-home hub design?
The BCM47452SM02 fits set-top boxes and smart-home hubs because it combines wireless connectivity with Gigabit Ethernet in one surface-mount device. For a set-top box, this supports Wi-Fi offload for playback devices while retaining a wired path to the home network. For a smart-home hub, the same silicon can run the local wireless mesh link and the supervisory Ethernet network. Design considerations are the broadband RF layout around the radio pins, thermal rise through the exposed pad, and a multi-layer stack-up with a continuous ground plane.
What are the key design considerations for a BCM47452SM02 PCB?
Three areas dominate a BCM47452SM02 board design. First, the RF section must follow the manufacturer reference layout, including the antenna matching network footprint and the keep-out around the radio pins, because a tuned layout is part of the certified radio performance. Second, the Ethernet magnetics and 50-ohm differential routing should be kept away from the radio front end to limit coupling. Third, provide a continuous ground plane and a multilayer stack-up, and derate the exposed-pad thermal path for the maximum ambient inside a sealed enclosure.

Engineering reference data for BCM47452SM02 — comparison, design guidance, and compliance information.

Selection Guide

Choose the BCM47452SM02 when your product is a Wi-Fi plus wired gateway, set-top box, mesh node or smart-home hub that needs dual-band wireless and Gigabit Ethernet in a small, RF-constrained enclosure, and you prefer one vendor to own the radio and Ethernet behaviour. Integration reduces board area, removes the RF-to-PHY interconnect, and simplifies emissions qualification. Pick an earlier BCM47452 family revision such as the SM01 only when a legacy platform is already qualified on it and supply continuity demands it. Choose a discrete radio plus a standalone Ethernet transceiver when you need independent part lifecycle, second-source flexibility across vendors, or an Ethernet speed or interface set the integrated PHY does not support. Note that no third-party manufacturer offers a pin-compatible drop-in for this part, so leaving the Broadcom platform means a full board redesign rather than a component swap.

Comparison with Alternatives

Parameter This Product BCM47452SM01 BCM47452SM00 BCM47452SM03 BCM47452A1
Brand Broadcom Broadcom Broadcom Broadcom Broadcom
Device Type RF System on Chip (SoC) RF System on Chip (SoC) RF System on Chip (SoC) RF System on Chip (SoC) RF System on Chip (SoC)
Integrated Silicon BCM47452 + BCM43217 + BCM54210E BCM47452 + BCM43217 + BCM54210E BCM47452 + BCM43217 + BCM54210E BCM47452 + BCM43217 + BCM54210E BCM47452 family generation
Silicon Revision SM02 SM01 SM00 SM03 A1

Key Differentiators

  • Radio, Bluetooth and Gigabit Ethernet PHY integrated on one die (vs Discrete radio plus external Ethernet PHY architecture)
  • Newer silicon revision for fresh qualification cycles (vs BCM47452SM01)
  • Single-vendor accountability for the whole connectivity stack (vs BCM47083SL01)

Design Notes

Treat the radio section of the BCM47452SM02 board as a tuned RF layout, not a generic routing job. Reproduce the manufacturer reference land pattern for the antenna matching network, keep the RF pads and their routed traces free of ground pour on the opposite layers where the reference design specifies, and observe the keep-out around the radio pins. Changing trace length or impedance inside the matching network shifts the antenna resonance, which shows up as reduced link margin and poor regulatory margin rather than as an obvious schematic error.

Separate the Ethernet channel from the radio front end. Place the isolation transformer and the differential 100-ohm pairs at a distance from the antenna feed and matching components, keep the Ethernet differential pair impedance controlled and matched to the magnetics, and avoid running Ethernet traces beneath the radio area or across the reference plane cutouts created by antenna routing. The BCM54210E Gigabit Ethernet transceiver shares this die with the radio, so intra-package coupling is already minimized; board-level separation is what keeps the design clean.

Estimated: with the BCM47452SM02 exposed pad on a 4-layer board with a solid ground pour, the junction-to-ambient rise depends on the copper area available for heat spreading, so calculate the worst case at the maximum enclosure ambient. Determine the actual thermal pad area, copper keep-out and via count from the manufacturer mechanical drawing, then apply the resulting junction temperature limit from the datasheet. Because the radio, Bluetooth and Ethernet PHY are all active in the same package, derate for the aggregate dissipation rather than for a single block.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

No RoHS, REACH, halogen-free or conflict-minerals statements appear in the distributor product summaries for the BCM47452SM02. Confirm compliance from the Broadcom product page and the material declaration for the specific silicon revision before release. The part is an embedded consumer and industrial connectivity device, so automotive AEC-Q100 qualification is treated as not applicable.

Data verified on: 2026-11-04 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Broadcom BCM47452SM02 BCM47452 BCM43217 BCM54210E BCM47452SM01 BCM47083SL01 RF System on Chip RF SoC system on chip wireless connectivity SoC integrated circuit semiconductor 802.11ac Wi-Fi Bluetooth Gigabit Ethernet transceiver Ethernet PHY set-top box home gateway mesh router smart-home hub RoHS REACH
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