BSC9131NXE7KHKB - 800 MHz e500 Processor SoC | NXP
MPN: BSC9131NXE7KHKB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $61.4926 | $61.49 |
| 10 | $61.4926 | $614.93 |
| 100 | $61.4926 | $6,149.26 |
| 500 | $61.4926 | $30,746.30 |
| 1,000 | $61.4926 | $61,492.60 |
BSC9131NXE7KHKB Overview
A system-on-chip is a semiconductor that integrates a processor core, specialized processing engines, memory interfaces, and supporting I/O into one package. In the device hierarchy, the BSC9131 is a microprocessor and SoC combining general-purpose embedded processing with digital signal processing. That combination lets one device handle control functions and communications or signal-processing workloads while reducing the number of external chips required.
Its principal verified features include one 32-bit PowerPC e500 core operating at 800 MHz, a StarCore SC3850 DSP operating at 1 GHz, MAPLE-B2F acceleration, DDR3 support, and SEC features. The exact voltage, I/O standards, memory-channel count, security-certification scope, clocking details, and electrical limits were not provided in the retrieved data and require consultation of the manufacturer documentation before schematic or PCB release.
The processor architecture combines scalar PowerPC execution with parallel-oriented DSP resources. This mixed approach is useful when control code, protocol handling, filtering, and other computation-intensive tasks must share one embedded platform. Software must be compiled and configured for the e500 and StarCore environments, so processor, cache, memory, accelerator, and security compatibility must be verified rather than inferred solely from similar package dimensions.
BSC9131NXE7KHKB targets small-cell base stations, enterprise VoIP, smart-grid control, military and defense equipment, and industrial systems. These applications benefit from integrating network-facing control, real-time processing, and specialized DSP acceleration while operating from -40°C to +105°C. The broad temperature range supports harsh deployed environments, although system-level thermal qualification remains necessary.
For new hardware, engineers should treat the end-of-life notice as a supply-risk warning and evaluate an NXP-recommended successor. Existing designs should preserve software, bootloader, memory-map, security, and board revisions. Because this is a complex 520-ball BGA device, escape routing, power integrity, thermal design, DDR3 layout, and manufacturing capability require careful review before substitution.
This page consolidates lifecycle status, distributor availability, package information, processor features, application context, and design cautions. It also distinguishes verified facts from missing parameters, helping procurement and engineering teams make a safer sourcing decision without treating a general cross-reference result as a guaranteed drop-in replacement.
Drop-in alternatives for BSC9131NXE7KHKB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesBSC9131NXE7KHKB Maximum Ratings & Electrical Characteristics
| Product Type | QorIQ Qonverge system-on-chip |
| General-Purpose CPU | PowerPC e500 |
| CPU Architecture | 32-bit |
| Core Count | 1 core |
| Processor Frequency | 800 MHz |
| DSP Core | StarCore SC3850 |
| DSP Frequency | 1 GHz |
| DSP Accelerator | MAPLE-B2F |
| External Memory Support | DDR3 |
| Security Feature | SEC |
| Package | 520-FCBGA |
| Package Dimensions | 21 x 21 mm |
| Ball Count | 520 balls |
| Operating Temperature Range | -40°C to +105°C |
| Target Applications | Small-cell base station, enterprise VoIP, smart-grid control, military and defense, industrial |
| Lifecycle Status | End of Life |
BSC9131NXE7KHKB 21 x 21 mm Pin Configuration Guide
Pin configuration for BSC9131NXE7KHKB (21 x 21 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for BSC9131NXE7KHKB.
Refer to the datasheet for full pin configuration.
Typical Applications
BSC9131NXE7KHKB is suitable for 6 applications: Small-Cell Base Stations, Enterprise VoIP Systems, Smart-Grid Control Equipment, Industrial Signal-Processing Equipment, Military and Defense Communications, Industrial Network Gateways.
Small-Cell Base Stations
The BSC9131NXE7KHKB fits small-cell base-station processing because it combines an 800 MHz 32-bit PowerPC e500 controller with a 1 GHz StarCore SC3850 DSP and MAPLE-B2F acceleration. These heterogeneous resources can support protocol, control, filtering, and communications workloads in one SoC while DDR3 provides external-memory capacity. The verified -40°C to +105°C range suits equipment expected to operate across extended temperature zones. Integration can simplify the board, but DDR3 routing, SEC configuration, boot software, and accelerator firmware must be validated. The 520-FCBGA also requires a manufacturing process capable of handling fine-pitch assembly.
Recommended
Enterprise VoIP Systems
For enterprise VoIP, the BSC9131NXE7KHKB combines general-purpose PowerPC execution with dedicated signal-processing resources. The 800 MHz e500 core can handle control-plane tasks, while the 1 GHz StarCore SC3850 DSP and MAPLE-B2F accelerator are positioned for demanding voice or media processing. DDR3 support allows working memory and program data to be placed externally rather than inside the processor package. Engineering validation must include codec interfaces, timing, network connectivity, boot media, and concurrency under sustained call load. Because the part is end of life, a successful design should also include a documented migration path.
Recommended
Smart-Grid Control Equipment
The BSC9131NXE7KHKB is suitable for smart-grid controller platforms that combine supervisory logic with real-time signal analysis. Its PowerPC e500 core supports networking and control functions, while the 1 GHz StarCore DSP can handle computation-intensive measurement or waveform workloads. The verified -40°C to +105°C range is relevant to industrial edge equipment, and integrated SEC features may assist security implementation. Actual utility qualification requires testing EMC, surge withstand, environmental cycling, power-supply resilience, and functional safety assumptions at the complete-system level rather than assigning them automatically to the processor.
Recommended
Industrial Signal-Processing Equipment
The BSC9131NXE7KHKB can serve in industrial equipment that needs real-time digital processing alongside embedded control. The StarCore SC3850 DSP operates at 1 GHz, and MAPLE-B2F provides specialist acceleration, while the 800 MHz e500 processor manages supervisory tasks and communications. DDR3 enables external working memory for demanding data flows. Design teams must partition workloads between cores, confirm supported compiler and runtime environments, and benchmark accelerator data paths. Thermal management is particularly important because processor, DSP, accelerator, memory, and power-conversion heat are concentrated in a complex 520-FCBGA platform.
Recommended
Military and Defense Communications
The BSC9131NXE7KHKB targets military and defense communications and combines control, DSP, acceleration, and DDR3 connectivity in one processor platform. Its verified -40°C to +105°C operating range supports use across extended industrial environments, while SEC identifies an intended security capability. The processor itself does not establish program-level qualification; designers must verify radiation, shock, vibration, temperature, supply provenance, cybersecurity, and lifecycle requirements through system tests. Because NXP marks the exact MPN end of life, long-lived programs should evaluate obsolescence risk, secure inventory, software maintenance, and a controlled transition plan.
Recommended
Industrial Network Gateways
The BSC9131NXE7KHKB is suitable for industrial gateways that must mediate between real-time processing and network-facing control. Its 800 MHz e500 processor can execute operating-system and communications tasks, while the 1 GHz StarCore DSP and MAPLE-B2F accelerator add throughput for packet inspection, filtering, or other specialized operations. DDR3 supports external working memory. A robust implementation should include secure boot and update strategies, watchdog supervision, isolated power domains, industrial Ethernet interfaces, and thermal monitoring. The -40°C to +105°C range is suitable for many industrial environments, but enclosure temperature and airflow must be checked against measured processor dissipation.
Recommended
Recommended Products Summary
Engineering reference data for BSC9131NXE7KHKB — comparison, design guidance, and compliance information.
Selection Guide
Design Notes
Do not approve a replacement from CPU frequency, package size, or application claims alone. A BSC9131NXE7KHKB migration must verify every 520-FCBGA ball assignment, supply voltage and sequencing, DDR3 routing, clocks, resets, interrupts, security configuration, and peripheral interfaces. Software must also be rebuilt or certified for the replacement architecture. The supplied cross-reference search produced no verified same-package substitute, so any migration should begin as a controlled redesign rather than a presumed drop-in change.
The integrated e500 CPU, 1 GHz StarCore DSP, MAPLE-B2F accelerator, DDR3 interface, and supporting I/O can make system thermal performance workload-dependent. Place thermal sensors near the SoC, use thermal vias beneath the package according to the official land pattern, evaluate a spreader or heat spreader where required, and validate junction margin through worst-case ambient and traffic tests. Do not use the -40°C to +105°C device rating as proof that every board operating condition is safe.
A 520-FCBGA design requires controlled escape routing, short high-current power connections, multiple decoupling layers, and assembly capability for the exact ball pitch and pad geometry. Obtain the official package drawing and recommended land pattern before releasing PCB artwork. DDR3 requires a topology-specific layout with controlled impedance, matched routing, and via management, while analog or clock domains require separation from switching supplies and high-speed processor activity.
Engineer the power tree from the official processor electrical specification because core, I/O, and accelerator voltage domains were not included in the supplied data. Use the manufacturer-recommended capacitor values and sequencing rather than generic bulk-capacitor choices. Confirm steady-state and transient current for the selected 800 MHz CPU and 1 GHz DSP workloads, and verify that power sequencing remains valid during reset, sleep, and rapid enable transitions.
Because the exact MPN is end of life, avoid uncontrolled spot buys. Record distributor lot and date codes, request traceability and inspection records, purchase the quantity justified by lifecycle risk, and preserve documentation for every unit. For continuing production, freeze software branches, retain toolchain and library versions, validate stock through hardware testing, and maintain a written last-time-buy or transition plan approved by procurement and engineering.
Compliance Information
The supplied NXP and distributor results do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. No compliance claim has been inferred from the industrial or military target applications.
