DRA745 - Dual Cortex-A15 1.2GHz Auto SoC | Texas Instruments
MPN: DRA745 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for DRA745 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DRA745BLGABCRQ1
β Drop-Inπ Reference alternative (not in catalog)
DRA745BLGABCQ1
β Drop-Inπ Reference alternative (not in catalog)
DRA744
β Drop-Inπ Reference alternative (not in catalog)
DRA755
β Drop-Inπ Reference alternative (not in catalog)
DRA752
β Drop-Inπ Reference alternative (not in catalog)
DRA745 Maximum Ratings & Electrical Characteristics
| Core Processor | Dual Arm Cortex-A15 |
| Core Frequency | 1.2 GHz |
| Coprocessor/DSP | C66x DSP, IVA-HD |
| Graphics Acceleration | 2D/3D graphics (SGX544) |
| Target Application | Automotive infotainment and cluster |
| Product Family | Jacinto 6 (DRA74x/DRA75x) |
| Silicon Revision | 2.0 |
| Package Type | FCBGA |
| Qualification | Q1 automotive grade (BLGABCRQ1 variants) |
| Core Architecture | ARM |
| Datasheet Pages | 443 |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage] |
| Memory Interfaces | [DATA_NEEDED: memory interface details] |
| Automotive Networks | [DATA_NEEDED: CAN/Ethernet peripheral list] |
| RoHS Status | [DATA_NEEDED: RoHS status] |
DRA745 Pin Configuration
| Pin Ball Map | FCBGA BLGABC β Full ball map (529-ball class) with power, ground, DDR, and I/O assignments is defined in the TI DRA75x/DRA74x Silicon Revision 2.0 datasheet - [DATA_NEEDED: exact ball count and pitch] |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
DRA745 is suitable for 6 applications: Automotive Head Unit, Digital Instrument Cluster, Telematics Gateway, Rear-Seat Entertainment, Audio Amplifier and Sound Processing Platform, ADAS Wrapper and Camera Viewer Applications.
Automotive Head Unit
The DRA745's dual 1.2 GHz Cortex-A15 cores provide the application processing power for navigation, media, and connectivity software in automotive head units, while the integrated SGX544-class 3D graphics engine renders fluid HMI animations without an external GPU. The C66x DSP offloads audio post-processing and multimedia decode, keeping the A15 cores free for the HMI stack. Running QNX or Android Automotive BSPs from TI's Jacinto 6 software ecosystem, the SoC consolidates display, camera, audio, and CAN/Ethernet connectivity into one chip, reducing BOM cost and board area versus multi-chip solutions. Its Q1 automotive-grade variants meet Tier-1 quality expectations for production vehicles.
Recommended
Digital Instrument Cluster
In digital clusters, the DRA745 renders gauge graphics via its integrated 3D graphics core while the dual Cortex-A15 cores at 1.2 GHz execute the cluster application and safety-monitoring software. The FCBGA package and Q1 automotive-grade variants address the reliability and quality flow-down required in front-of-driver displays. The C66x DSP handles chime and alert-tone synthesis without loading the main CPU. Display controllers drive high-resolution TFT panels directly, and the SoC's low-latency boot path supports the fast cluster power-up demanded by modern vehicles. Because cluster and infotainment can share one silicon platform, OEMs reuse software investments across both displays.
Recommended
Telematics Gateway
As a telematics and connectivity gateway, the DRA745 aggregates vehicle networks (CAN, Ethernet AVB) and bridges them to cellular and Wi-Fi modems through its high-speed peripheral interfaces. One Cortex-A15 core runs the gateway application while the second handles protocol translation and OTA update management, providing processing isolation that improves robustness. The C66x DSP can process audio for eCall voice paths. TI's Jacinto 6 software stack includes network stack support, and the FCBGA automotive-grade package supports under-hood-adjacent module environments. Gateway designs benefit from the same silicon platform as the head unit, enabling shared BSP and driver code across modules.
Recommended
Rear-Seat Entertainment
Rear-seat entertainment systems use the DRA745 to decode and display multiple video streams simultaneously: the IVA-HD multimedia accelerator and C66x DSP handle HD video decode for several independent screens while leaving Cortex-A15 headroom for UI and user-input handling. Integrated display controllers drive multiple panel outputs, eliminating external scalers. Camera inputs via the VIP subsystem support rear-cabin monitoring and conferencing use cases. Because the SoC shares software with front head units built on the same DRA74x platform, content and HMI frameworks port with minimal effort. Its automotive-grade ordering options satisfy the durability requirements of passenger-compartment electronics.
Recommended
Audio Amplifier and Sound Processing Platform
The DRA745's McASP audio serial ports and C66x DSP form a complete automotive audio processing platform: the DSP runs equalization, road-noise compensation, and surround virtualization while the A15 cores manage tuning and control UIs. I2S streams feed external Class-D amplifiers such as TI's TAS family, and the SoC's low-jitter audio clocks preserve signal quality. Because audio path latency directly affects lip-sync and noise-cancellation performance, offloading DSP work from the main CPU is a key advantage of the Jacinto 6 architecture. Designers pair the SoC with automotive amplifiers and audio codecs to build amplifier modules that share the head unit's software toolchain.
Recommended
ADAS Wrapper and Camera Viewer Applications
While the DRA745 is not a dedicated ADAS processor, its VIP (Video Input Port) camera interfaces and C66x DSP allow infotainment platforms to integrate surround-view parking, dashcam recording, and driver-assist preview functions alongside infotainment software. The DSP performs image preprocessing such as dewarping and lens correction, and the A15 cores run the application logic and network upload. This consolidates what would otherwise require a separate camera SoC, reducing system cost in mid-range vehicles. For safety-rated ADAS functions, TI directs designers to the TDA4/Jacinto 7 family, but the DRA745 remains an economical host for convenience-camera features within the cockpit domain.
Recommended
Recommended Products Summary
Engineering reference data for DRA745 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DRA745BLGABCRQ1 | DRA744 | DRA755 |
|---|---|---|---|---|
| Package | FCBGA | FCBGA - same | FCBGA - same | FCBGA - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| CPU Cores | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 |
| Core Frequency | 1.2 GHz | 1.2 GHz | [DATA_NEEDED] | [DATA_NEEDED] |
| DSP Subsystem | C66x DSP + IVA-HD | C66x DSP + IVA-HD | [DATA_NEEDED] | [DATA_NEEDED] |
| Graphics | 2D/3D graphics acceleration | 2D/3D graphics acceleration | [DATA_NEEDED] | [DATA_NEEDED] |
| Automotive Grade (Q1) | Q1 variants available | Yes (Q1) | Q1 variants available | Q1 variants available |
| Target Application | Infotainment and cluster | Infotainment and cluster | Infotainment | Infotainment (higher feature) |
Key Differentiators
- Dual Cortex-A15 at 1.2 GHz with integrated C66x DSP (vs DRA744)
- Q1 automotive-grade ordering variants on identical silicon (vs DRA745BLGABCQ1)
- Consolidated graphics, DSP, and connectivity on one SoC (vs Two-chip GPU + CPU alternatives)
Design Notes
The DRA745 requires a multi-rail power sequence typical of complex SoCs (core, GPU, DDR, I/O rails). Use a dedicated automotive PMIC such as the TPS659039-Q1 or a sequenced discrete solution and follow the power-up/power-down ordering tables in the TI DRA75x/DRA74x Silicon Revision 2.0 datasheet. Incorrect sequencing can latch up internal domains. Verify all rail voltage tolerances and sequencing delays against the datasheet before tape-out, and include soft-start control on the battery input rail.
The FCBGA package requires a controlled-impedance PCB with blind/buried via or HDI stackup for ball escape, plus tight length matching on DDR memory buses per the datasheet layout guidelines. Allocate solid ground planes under the die and provide adequate via stitching for the many ground balls. Follow TI's Jacinto 6 hardware design guide for stackup, fanout, and DDR3 routing topologies (fly-by vs T-topology) to ensure signal integrity at speed.
A dual 1.2 GHz Cortex-A15 plus GPU and DSP can dissipate several watts in automotive cabin environments up to +85C ambient. Provide a thermal path via the PCB (thermal vias to internal planes) and, in enclosed head units, a heatsink or chassis-coupled thermal interface. Run TI's thermal design calculator for your specific workload (GPU-heavy cluster vs CPU-heavy gateway) and confirm junction temperature stays below the datasheet maximum under worst-case conditions.
Compliance Information
Q1 automotive-grade ordering variants (DRA745BLGABCRQ1, DRA745BLGABCQ1) indicate automotive quality flow-down; exact AEC-Q100 temperature grade and RoHS/REACH status should be confirmed via TI quality documentation for the specific ordering part number.
