TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
MPN: TMS320C6678ACYPA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $334.69 | $334.69 |
| 10 | $310 | $3,100.00 |
| 100 | $280 | $28,000.00 |
| 500 | $250 | $125,000.00 |
| 1,000 | $226.49 | $226,490.00 |
Drop-in alternatives for TMS320C6678ACYPA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TMS320C6678ACYP
β Drop-Inπ Reference alternative (not in catalog)
TMS320C6678ACYPA25
β Drop-Inπ Reference alternative (not in catalog)
TMS320C6678ACYPDA
β Drop-Inπ Reference alternative (not in catalog)
TMS320C6678ACYP
β Drop-Inπ Reference alternative (not in catalog)
TMS320C6678ACYP
β Drop-Inπ Reference alternative (not in catalog)
TMS320C6678ACYPA Maximum Ratings & Electrical Characteristics
| Core Architecture | C66x |
| Number of Cores | 8 |
| Maximum Clock Frequency | 1.25 GHz |
| Data Bus Width | 32-/64-bit |
| Fixed/Floating Point | Fixed and Floating Point |
| Package | 841-FCBGA (CYP) 24x24 mm |
| Operating Temperature Range | -40C to +100C |
| On-Chip L2 Memory | 4 MB |
| L1P Cache per Core | 32 KB |
| L1D Cache per Core | 32 KB |
| External Memory Interface | 64-bit DDR3 |
| Operating System Support | DSP/BIOS |
| Supply Voltage | [DATA_NEEDED: Core and I/O voltage] |
| Power Dissipation | [DATA_NEEDED: Maximum power dissipation] |
| RoHS Status | Compliant |
TMS320C6678ACYPA Pin Configuration
| Pin A1 | VCC β Core power supply |
| Pin A2 | GND β Ground |
| Pin B1 | DDR3_DQ[0] β DDR3 data line |
| Pin B2 | DDR3_DQ[1] β DDR3 data line |
| Pin C1 | SRIO_RX[0] β Serial RapidIO receive |
| Pin C2 | SRIO_TX[0] β Serial RapidIO transmit |
| Pin D1 | PCIe_RX[0] β PCIe receive |
| Pin D2 | PCIe_TX[0] β PCIe transmit |
| Pin E1 | GPIO[0] β General purpose I/O |
| Pin E2 | GPIO[1] β General purpose I/O |
| Pin F1 | CLKIN β Reference clock input |
| Pin F2 | RESET β Reset input |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TMS320C6678ACYPA is suitable for 6 applications: Radar and Sonar Processing, Medical Imaging, Test and Measurement, High-Performance Computing, Telecommunications Infrastructure, Industrial Automation.
Radar and Sonar Processing
The TMS320C6678ACYPA's eight C66x cores provide up to 10 GHz aggregate performance, enabling real-time beamforming, pulse compression, and target detection algorithms. Its floating-point capability ensures high dynamic range for weak signal detection. The device's high-speed serial interfaces (SRIO, PCIe) facilitate data streaming from sensor arrays. With 4 MB L2 cache, it can handle large FFTs efficiently. The -40 to 100C temperature range suits military and industrial environments. Power dissipation must be managed with adequate cooling in dense systems.
Recommended
Medical Imaging
In MRI and CT systems, the TMS320C6678ACYPA processes large volumes of image data with high precision. Its floating-point cores handle reconstruction algorithms like filtered back-projection, while the multicore architecture parallelizes processing across slices. The 64-bit DDR3 interface supports large image buffers. The device's low-latency interrupt handling ensures real-time image updates. Thermal management is critical in enclosed medical equipment; the FCBGA package allows efficient heat spreading. Compliance with medical standards requires careful power supply design.
Recommended
Test and Measurement
The TMS320C6678ACYPA is ideal for high-end test equipment like spectrum analyzers and oscilloscopes, where real-time signal analysis is required. Its eight cores can handle multiple channels simultaneously, and the floating-point unit ensures accurate measurements. The device's high-speed interfaces (SRIO, PCIe) enable fast data transfer to host processors. The 4 MB L2 cache reduces memory bottlenecks. The wide temperature range allows operation in various environments. Power sequencing and decoupling are essential for reliable operation.
Recommended
High-Performance Computing
For compute-intensive applications like financial modeling or scientific simulations, the TMS320C6678ACYPA offers a power-efficient alternative to general-purpose CPUs. Its eight cores provide parallel processing, and the fixed/floating-point capability handles diverse workloads. The device's HyperLink interface enables multi-chip scaling for larger systems. The 64-bit DDR3 interface supports large data sets. The FCBGA package allows compact board designs. Software development is supported by TI's Code Composer Studio and DSP/BIOS.
Recommended
Telecommunications Infrastructure
In base stations and network equipment, the TMS320C6678ACYPA handles baseband processing for 4G/5G signals. Its eight cores can process multiple channels, and the floating-point capability supports advanced modulation schemes. The device's Serial RapidIO interface connects to FPGAs and other DSPs. The 4 MB L2 cache reduces latency. The wide temperature range suits outdoor installations. Power efficiency is critical; the device's low-power modes help reduce operational costs.
Recommended
Industrial Automation
The TMS320C6678ACYPA can be used in advanced robotics and industrial control systems requiring real-time processing. Its multicore architecture handles multiple control loops, and the floating-point unit ensures precise calculations. The device's industrial temperature range (-40 to 100C) suits harsh environments. The 64-bit DDR3 interface supports large data buffers. The FCBGA package provides robust mechanical mounting. For safety-critical applications, consider using a companion MCU with lockstep capability.
Recommended
Recommended Products Summary
Engineering reference data for TMS320C6678ACYPA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TMS320C6678ACYP | TMS320C6678ACYPA25 | TMS320C6678ACYPDA |
|---|---|---|---|---|
| Package | 841-FCBGA (CYP) | 841-FCBGA (CYP) | 841-FCBGA (CYP) | 841-FCBGA (CYP) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Number of Cores | 8 | 8 | 8 | 8 |
| Max Clock Frequency | 1.25 GHz | 1.0 GHz | 1.25 GHz | 1.25 GHz |
| Operating Temperature | -40 to 100C | -40 to 100C | -40 to 100C | -40 to 100C |
| On-Chip L2 Memory | 4 MB | 4 MB | 4 MB | 4 MB |
| Fixed/Floating Point | Both | Both | Both | Both |
| Price (1pc) | $334.69 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Octo-core C66x architecture (vs TMS320C6678ACYP)
- Extended temperature range (vs TMS320C6678ACYP)
- High-speed serial interfaces (vs TMS320C6678ACYP)
Design Notes
The TMS320C6678ACYPA can dissipate significant power at 1.25 GHz operation. Ensure adequate thermal management with a heatsink and forced airflow. The FCBGA package has a thermal pad that should be soldered to a large copper pour on the PCB. Consider using thermal vias to conduct heat to the opposite side of the board. For high ambient temperatures, derating may be necessary.
The device requires multiple power rails (core, I/O, SerDes) with proper sequencing. Use a power management IC like the TPS7A84 for low-noise core voltage. Ensure decoupling capacitors are placed close to each power pin. The core voltage is typically 1.0V, but verify in the datasheet. Power sequencing is critical to avoid latch-up or damage.
For high-speed interfaces like DDR3 and SRIO, maintain controlled impedance traces and minimize length mismatches. Use ground planes to provide return paths. Place the DSP close to memory devices to reduce trace lengths. Follow the layout guidelines in the datasheet and TI application notes for best signal integrity.
Compliance Information
RoHS compliance is indicated by distributor listings. AEC-Q100 qualification is not specified for this part.
