TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
MPN: TMS320C6678ACYPA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $334.69 | $334.69 |
| 10 | $317.96 | $3,179.60 |
| 100 | $285.49 | $28,549.00 |
| 500 | $261.06 | $130,530.00 |
| 1,000 | $226.49 | $226,490.00 |
TMS320C6678ACYPA Overview
A digital signal processor is a specialized microprocessor optimized for real-time numerical computation such as filtering, FFT, and convolution. The C66x core combines fixed-point and floating-point execution, spanning the hierarchy from single-core DSPs up to multicore system-on-chips. Within the broader power/performance hierarchy, this DSP delivers real-time throughput above general-purpose processors while retaining full C-programmability, and it complements FPGAs in high-throughput signal chains.
Key features include eight C66x cores with 32-/64-bit architecture, 4 MB of on-chip L2 memory, 32 KB L1P and 32 KB L1D per core, and a 64-bit DDR3 external memory interface. Multicore navigation peripherals - Hyperlink, SRIO, and EMAC - enable efficient inter-processor communication and high-bandwidth I/O for data-intensive workloads.
Technically, the KeyStone architecture provides a high-bandwidth internal interconnect (TeraNet) so cores share data without bottlenecks. The C66x instruction set includes advanced FFT and Viterbi acceleration instructions, boosting throughput for communication physical-layer processing, radar pulse compression, and beamforming with high dynamic-range floating-point math.
Typical applications include radar and sonar processing, medical imaging (MRI, CT reconstruction), test and measurement instrumentation, industrial machine vision, and high-performance embedded computing. Floating-point capability suits algorithms demanding wide dynamic range, while the octo-core design scales performance by task distribution.
Design consideration: power dissipation is significant at 1.25 GHz operation. Provide dedicated heatsinking and airflow, sequence the core, I/O, and SerDes rails correctly, and use clean PLL supply filtering per TI datasheet (SPRS691) layout guidance.
This page synthesizes distributor pricing, drop-in speed-grade alternatives, design notes, and FAQ content not found together in the manufacturer datasheet.
Drop-in alternatives for TMS320C6678ACYPA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TMS320C6678ACYPA (same form factor and footprint) — differing in Package, Mounting Type, Core Architecture, External Memory Interface, Number of Cores.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TMS320C6678ACYP
✅ Drop-In📋 Reference alternative (not in catalog)
TMS320C6678ACYPA25
✅ Drop-In✓ In Stock
$410.42 / Unit
View Datasheet →TMS320C6678ACYP25
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6678CYPAM25
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6678ACYPA Specifications
| Core Type | C66x fixed/floating-point DSP |
| Number of Cores | 8 |
| Maximum Clock Frequency | 1.25 GHz |
| Aggregate Performance | up to 10 GHz (octo-core) |
| Architecture | KeyStone multicore SoC |
| On-Chip L2 Memory | 4 MB |
| L1 Memory per Core | 32 KB L1P + 32 KB L1D |
| External Memory Interface | 64-bit DDR3 |
| Peripherals | Hyperlink, SRIO, EMAC, EMIF16 |
| Operating Temperature | -40C to +100C |
| Package | 841-pin FCBGA (CYP), 24x24 mm |
| Mounting Type | Surface Mount |
| Speed Grade Code | ACY = 1.0 GHz to 1.25 GHz family |
TMS320C6678ACYPA 841-pin fcbga (cyp), 24x24 mm Pin Configuration Guide
Pin configuration for TMS320C6678ACYPA (841-pin fcbga (cyp), 24x24 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TMS320C6678ACYPA.
Refer to the datasheet for full pin configuration.
Typical Applications
TMS320C6678ACYPA is suitable for 6 applications: Radar and Sonar Processing, Medical Imaging (MRI/CT Reconstruction), Test and Measurement Instrumentation, Industrial Machine Vision, Telecom Baseband and Wireless Infrastructure, High-Performance Embedded Computing.
Radar and Sonar Processing
The TMS320C6678ACYPA fits radar and sonar processing because its eight C66x cores provide up to 10 GHz of aggregate throughput, hardware-accelerated FFT and Viterbi instructions, and wide-dynamic-range floating-point math essential for pulse compression, Doppler processing, and beamforming. Its 64-bit DDR3 interface sustains high sustained data rates from multi-channel receivers, while SRIO moves digitized samples to and from FPGAs at multi-gigabit rates. The part runs the full detection chain in C code, shortening development versus RTL designs, and its -40C to +100C rating suits rugged defense platforms.
Recommended
Medical Imaging (MRI/CT Reconstruction)
The TMS320C6678ACYPA suits medical imaging reconstruction because the C66x floating-point pipeline executes FFT-heavy k-space and filtered back-projection algorithms with the dynamic range diagnostic imaging demands. Eight cores allow k-space data to be partitioned across processors, and 4 MB of shared L2 plus the TeraNet interconnect keep intermediate datasets on-chip, reducing DDR3 bandwidth bottlenecks during reconstruction loops. The 64-bit DDR3 interface streams large volumetric datasets, and the industrial -40C to +100C operating range supports the thermally varied environment of imaging cabinets with forced airflow.
Recommended
Test and Measurement Instrumentation
The TMS320C6678ACYPA fits test and measurement instrumentation because its floating-point C66x cores perform real-time waveform analysis, filtering, and demodulation at sustained multi-gigaflop rates. Eight independent cores let one device run acquisition preprocessing, trigger detection, and analysis simultaneously, while SRIO and Hyperlink provide high-bandwidth links between the analog front end and the processing stage. The 1 GHz per core rating delivers deterministic real-time latency that general-purpose CPUs cannot match, and the industrial temperature rating supports bench and field instruments alike.
Recommended
Industrial Machine Vision
The TMS320C6678ACYPA is used in machine vision for real-time image preprocessing such as convolution, histogram analysis, and feature extraction at frame rates beyond what single-core processors achieve. Its octo-core architecture splits the image across cores for line-scan and area-scan pipelines, and floating-point capability preserves accuracy in lens correction and color conversion. The 64-bit DDR3 interface buffers multiple high-resolution frames, and EMAC ports connect directly to GigE Vision style networking. Its -40C to +100C rating allows fanless industrial enclosures at reduced clock rates.
Recommended
Telecom Baseband and Wireless Infrastructure
The TMS320C6678ACYPA was designed for wireless base station physical-layer processing: the C66x instruction set's FFT, Viterbi, and turbo-style acceleration instructions map directly onto LTE-style OFDM modulation, channel estimation, and decoding workloads. Eight cores scale by assigning per-carrier or per-user processing tasks, while Hyperlink enables multi-device baseband clustering with low protocol overhead. The 64-bit DDR3 interface handles control-plane buffering, and SRIO connects to standard baseband fronthaul fabrics. The commercial/industrial grades let system integrators match the ACYPA rating to outdoor cabinet requirements.
Recommended
High-Performance Embedded Computing
For high-performance embedded computing (HPEC) boards such as 3U/6U VPX processing cards, the TMS320C6678ACYPA delivers dense floating-point compute with predictable real-time behavior. Multiple C6678 devices are clustered over Hyperlink and SRIO on a single board to build scalable processing payloads for defense and aerospace computing. The 841-ball FCBGA package maximizes I/O density per board area, the TeraNet fabric keeps inter-core communication off external buses, and the -40C to +100C rating of the ACYPA grade supports conduction-cooled rugged enclosures common in HPEC deployments.
Recommended
Recommended Products Summary
Engineering reference data for TMS320C6678ACYPA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TMS320C6678ACYP | TMS320C6678ACYPA25 | TMS320C6678ACYP25 |
|---|---|---|---|---|
| Package | 841-pin FCBGA (CYP), 24x24 mm | 841-pin FCBGA (CYP) - same | 841-pin FCBGA (CYP) - same | 841-pin FCBGA (CYP) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Number of Cores | 8 (C66x) | 8 (C66x) | 8 (C66x) | 8 (C66x) |
| Operating Temperature | -40C to +100C | 0C to +85C (commercial) | -40C to +100C | 0C to +85C (commercial) |
| L2 Memory | 4 MB | 4 MB | 4 MB | 4 MB |
| External Memory Interface | 64-bit DDR3 | 64-bit DDR3 | 64-bit DDR3 | 64-bit DDR3 |
Key Differentiators
- Extended temperature range for rugged platforms (vs TMS320C6678ACYP)
- Cost-optimized speed grade (vs TMS320C6678ACYPA25)
- Floating-point throughput density (vs DSPB56720CAG)
Design Notes
The TMS320C6678ACYPA requires multiple supply rails (core, I/O, SerDes, PLL) with correct power sequencing per TI datasheet SPRS691. Use TI-recommended PMIC or point-of-load sequencing so the core rail comes up in the documented order relative to I/O to avoid latch-up or degraded reliability. Estimated: core current at 1.0-1.25 GHz depends heavily on utilization; use TI's Power Estimation Tool with your workload profile before selecting regulators, and allow at least 20% headroom on the core rail.
Power dissipation is significant at full clock rates on this 24x24 mm 841-ball FCBGA. Provide a dedicated heatsink with forced airflow over the lid, and verify the junction temperature stays below the datasheet maximum across your worst-case workload. Estimated: thermal resistance values depend on the exact CYP package specification in SPRS691; model board-level conduction through the BGA balls to the PCB as part of the thermal stack, not just the top-side heatsink path.
Route the 64-bit DDR3 interface with length-matched, tightly coupled trace pairs and follow the TI datasheet layout guidance on fly-by topology and reference planes. Filter each PLL supply pin with dedicated RC networks and keep PLL routing away from SerDes and DDR3 switching regions. Use TI reference designs (e.g., EVM schematics for the C6678) as the baseline for ball escapes, SerDes AC coupling, and JTAG/emulation header placement before customizing.
Do not substitute the commercial-grade ACYP into designs exposed below 0C or above +85C - the ACYPA's -40C to +100C rating is the reason to specify it. Also, boot configuration pins are strap-sampled at reset; incorrect pull resistor settings are the most common bring-up failure on C6678 boards. Verify boot mode, endian, and SerDes reference clock straps against the boot configuration table in SPRS691 before first power-on.
Compliance Information
Compliance data not present in the verified web data; consult TI's product page Quality & Environmental section for material declarations.
