TDA3MV - ADAS Vision SoC | Texas Instruments | Low Power
MPN: TDA3MV β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
Drop-in alternatives for TDA3MV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
TDA3MVRBFABFRQ1
β Drop-Inπ Reference alternative (not in catalog)
TDA3MVRBFABFQ1
β Drop-Inπ Reference alternative (not in catalog)
TDA3LX
β‘ Same Packageπ Reference alternative (not in catalog)
TDA3XE
β‘ Same Packageπ Reference alternative (not in catalog)
TDA3MA
β‘ Same Packageπ Reference alternative (not in catalog)
TDA3MV Maximum Ratings & Electrical Characteristics
| Product Type | ADAS SoC |
| Package | FCBGA 15mm (ABF) |
| Silicon Revision | 2.0 |
| Core Architecture | ARM Cortex-A15 + DSP |
| Vision Acceleration | Embedded Vision Engine (EVE) |
| Imaging Subsystem | ISP with multi-camera support |
| Operating Temperature | -40C to +125C |
| Power Consumption | Low power (exact value [DATA_NEEDED: TDP]) |
| Supply Voltage | [DATA_NEEDED: core voltage] |
| Security | Secure boot, hardware-enforced isolation |
| Functional Safety | Supports ASIL-B (per TI) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| AEC-Q100 | Qualified (Q1 variant) |
| Lead-Free | Yes |
TDA3MV Pin Configuration
| Pin A1 | VDD_CORE β Core power supply |
| Pin A2 | VSS β Ground |
| Pin B1 | VDD_IO β I/O power supply |
| Pin C1 | CLKIN β External clock input |
| Pin D1 | RESETN β Reset (active low) |
| Pin E1 | BOOTMODE0 β Boot mode select |
| Pin F1 | BOOTMODE1 β Boot mode select |
| Pin G1 | JTAG_TMS β JTAG test mode select |
| Pin H1 | JTAG_TCK β JTAG clock |
| Pin J1 | UART0_TX β UART transmit |
| Pin K1 | UART0_RX β UART receive |
| Pin L1 | CAN0_TX β CAN transmit |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TDA3MV is suitable for 6 applications: Front Camera Systems, Driver Monitoring Systems, Surround View Systems, Sensor Fusion Units, Battery-Operated Surveillance Cameras, Automotive Night Vision.
Front Camera Systems
The TDA3MV's low power and vision acceleration make it ideal for front camera ADAS. It processes real-time video for lane departure warning and forward collision warning. The integrated ISP handles multiple camera inputs, while the EVE accelerates object detection. Power efficiency reduces thermal load in the cabin, enabling compact designs. According to TI, the TDA3x family is optimized for leading ADAS applications.
Recommended
Driver Monitoring Systems
Driver monitoring requires continuous operation, making the TDA3MV's low power critical. The SoC processes infrared camera data to detect driver fatigue and distraction. Its vision accelerators handle facial recognition algorithms efficiently. The secure boot feature protects against tampering, essential for safety-critical systems. The 15mm package fits space-constrained camera modules.
Recommended
Surround View Systems
The TDA3MV supports multiple camera inputs for 360-degree surround view. Its imaging subsystem stitches camera feeds in real-time, while the DSP handles distortion correction. Low power consumption allows passive cooling, reducing system cost. The SoC's scalability enables different camera configurations. This application benefits from the TDA3MV's balanced performance and efficiency.
Recommended
Sensor Fusion Units
The TDA3MV fuses data from cameras, radar, and lidar for a unified environmental model. Its heterogeneous architecture processes different sensor streams in parallel. The vision accelerators handle camera data, while the DSP processes radar/lidar. Low power is crucial for continuous operation in electric vehicles. The secure boot ensures data integrity in safety-critical fusion algorithms.
Recommended
Battery-Operated Surveillance Cameras
The TDA3MV's low power makes it ideal for battery-operated AI surveillance cameras. It processes video locally for object detection, reducing cloud dependency. The vision accelerators enable efficient AI inference. Power management features extend battery life. According to TI, the TDA3MV is a low-power SoC with full-featured processing, suitable for this application.
Recommended
Automotive Night Vision
The TDA3MV processes thermal or low-light camera data for night vision systems. Its imaging subsystem enhances image quality in low-light conditions. The vision accelerators detect pedestrians and animals. Low power consumption is essential for continuous operation. The SoC's secure boot protects against cyber threats in connected vehicles.
Recommended
Recommended Products Summary
Engineering reference data for TDA3MV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TDA3MVRBFABFRQ1 | TDA3MVRBFABFQ1 | TDA3LX |
|---|---|---|---|---|
| Package | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Power Consumption | Low (exact [DATA_NEEDED]) | Low (same) | Low (same) | Higher |
| Automotive Grade | No (standard) | Yes (AEC-Q100) | Yes (AEC-Q100) | No (standard) |
| Vision Acceleration | Yes (EVE) | Yes (EVE) | Yes (EVE) | Yes (EVE) |
| Secure Boot | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Price (1pc) | $45.00 | $47.00 | $47.00 | $55.00 |
Key Differentiators
- Low power consumption (vs TDA3LX)
- Automotive-grade variant available (vs TDA3MVRBFABFRQ1)
- Full-featured vision acceleration (vs TDA3XE)
Design Notes
The TDA3MV requires multiple power rails (core, I/O, memory). Use a dedicated PMIC like the TPS6594-Q1 to sequence and regulate these rails. Ensure adequate decoupling with 100nF and 10uF capacitors close to each power pin. The low power design still demands clean supplies for reliable operation.
Although low power, the TDA3MV in a 15mm FCBGA can dissipate significant heat under load. Use a thermal pad and vias to connect the package to a ground plane. For automotive applications, ensure the junction temperature stays below 125C. Consider a heatsink if ambient temperatures exceed 85C.
Follow TI's layout guidelines for the FCBGA package. Route high-speed interfaces (MIPI CSI-2, DDR) with controlled impedance. Keep traces short and matched. Use ground planes under the SoC to reduce EMI. Reference TI's TDA3x EVM design for optimal layout.
Compliance Information
Standard TDA3MV is not AEC-Q100 qualified; use TDA3MVRBFABFRQ1 for automotive. RoHS compliant per TI.
