DSP56311VL150 - 150 MHz 24-bit Fixed-Point DSP | NXP | Audio
MPN: DSP56311VL150 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $30.1 | $3,010.00 |
| 500 | $26.8 | $13,400.00 |
| 1,000 | $23.4 | $23,400.00 |
DSP56311VL150 Overview
An audio-compression and effects DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-speed numerical computation on streaming data such as audio samples, using a Harvard architecture that separates program and data memory to sustain an instruction-execution rate far higher than general-purpose CPUs. The DSP56000 family sits in the broader hierarchy of audio DSP -> fixed-point DSP -> embedded DSP -> microcontroller -> semiconductor. Like SRAM-based controllers, it executes deterministic instruction cycles ideal for codec and effects pipelines, while differing from general-purpose MCUs through hardware MAC units, dedicated address-generation units, and zero-overhead looping.
Key features include a 24-bit x 24-bit multiplier-accumulator, an instruction cache, a six-channel DMA controller, an external address bus switch for memory expansion, and a programmable memory expansion area (program RAM plus cache, PM_EB). The device supports 150 MHz operation across industrial temperature grades and provides robust glue logic for connecting to external SRAM, SDRAM, and host processors. The filter coprocessor (EFCOP) offloads FIR/IIR convolution workloads so the main core can run control code concurrently.
Typical applications include multi-channel audio processing, voice-over-IP codecs, networking infrastructure (echo cancellers, modem pools, V.90/V.92), wireless baseband preprocessing, and professional audio effects units. Its object-code compatibility with the DSP56000 allows reuse of legacy audio libraries and codec binaries while delivering higher throughput.
When designing with this device, allocate PCB area for the 196-ball LBGA and provide adequate decoupling (at least 10 uF bulk plus 100 nF ceramic at each supply pin). The 1.8 V core and 3.3 V I/O rails should be sequenced core-first then I/O to prevent bus contention during power-up. Because the part is end-of-life and stocked only in legacy channels, plan for last-time-buy and qualification to a successor.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives in the same 196-LBGA footprint, and practical design notes not found in the manufacturer datasheet summary.
Drop-in alternatives for DSP56311VL150 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSP56311VL150 (same form factor and footprint) — differing in Core Architecture, Instruction Cache, Package, Mounting Type, Bootstrap ROM.
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Request AlternativesDSP56311VL150 Specifications
| Product Type | 24-bit Fixed-Point Digital Signal Processor |
| Core Architecture | DSP56000 (object-code compatible) |
| Clock Frequency | 150 MHz |
| Performance | Up to 150 MMACS (300 MMACS with EFCOP) |
| Multiplier | 24-bit x 24-bit MAC |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| DMA Controllers | Six channel DMA |
| Instruction Cache | Yes |
| Bootstrap ROM | Yes |
| External Bus Interface | Yes (with EABI and external address bus switch) |
| Program RAM | 24-bit x 24-bit Memory Expansion Area (PM_EB) |
| Package | 196-ball LBGA (15x15 mm) |
| Mounting Type | Surface Mount |
| Packing | Reel-Reel 13" Q1 DP |
| Min. Order Quantity | 750 |
| RoHS Status | Compliant (Pbfree per Mouser listing) |
DSP56311VL150 196-ball lbga (15x15 mm) Pin Configuration Guide
Pin configuration for DSP56311VL150 (196-ball lbga (15x15 mm) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for DSP56311VL150.
Refer to the datasheet for full pin configuration.
Typical Applications
DSP56311VL150 is suitable for 6 applications: Multi-Channel Audio Processing, Voice-over-IP and Acoustic Echo Cancellation, Wireless Baseband Preprocessing, Professional Audio Effects Units, Networking Infrastructure (Modem Pools, V.90/V.92 Modems), Industrial Control and Motor Drive Signal Processing.
Multi-Channel Audio Processing
The DSP56311VL150 is well matched to multi-channel audio effects and codec processing because its 150 MMACS throughput (300 MMACS with the EFCOP filter coprocessor) sustains real-time FIR and IIR convolution on 24-bit audio streams. Designers place the part between the ADC/DAC data converters and the audio CODEC bus, configuring the six-channel DMA to stream samples in and out of the on-chip program RAM while the core executes the audio graph. Compared with a general-purpose microcontroller, the dedicated MAC unit and zero-overhead looping deliver consistent low-jitter audio latency. The 196-LBGA package fits high-density pro-audio boards and supports fan-out to external SDRAM for long reverb impulse responses.
Recommended
Voice-over-IP and Acoustic Echo Cancellation
For VoIP gateways and conferencing systems the DSP56311VL150 provides the deterministic instruction cycles that acoustic echo cancellers require. Its 1.8 V core and 3.3 V I/O match the supply rails typically available in IP-phone hardware, and its 24-bit MAC preserves the dynamic range needed for line-echo cancellation tail lengths up to 128 ms. Engineers run the canceller algorithm on the main core while offloading the FIR filter weights to the EFCOP coprocessor, doubling effective throughput to 300 MMACS for the adaptive filter update. The six-channel DMA streams PCM samples between the SLIC interface and the algorithm memory without core intervention. This combination of low jitter and large on-chip memory made the DSP56311 family a standard VoIP platform before its transition to the DSP56321.
Recommended
Wireless Baseband Preprocessing
The DSP56311VL150 handles wireless baseband preprocessing tasks such as pulse shaping, equalization, and channel coding in pico-cell and micro-cell base stations. Its 1.8 V core reduces dynamic power versus the older 2.5 V designs while still supporting 150 MHz operation, and the six-channel DMA controller can service multiple antenna data streams in parallel. The EFCOP filter coprocessor accelerates the matched-filter convolutions used in demodulation, offloading 50% of MAC workload from the main core. The 196-LBGA ball grid provides low-inductance power and ground connections critical for RF-sensitive boards. Although NXP has obsoleted the DSP56311 family, it remains in active service in legacy wireless infrastructure where board respins are expensive.
Recommended
Professional Audio Effects Units
In rack-mount effects processors, guitar multi-effects pedals, and studio reverb units, the DSP56311VL150 provides enough headroom to run multiple parallel effect algorithms (chorus, delay, reverb, dynamics) simultaneously. The Memory Expansion Area supports long impulse responses without off-chip memory, and the EFCOP accelerates convolution reverb kernels at sample rates up to 96 kHz on 24-bit stereo. Object-code compatibility with the DSP56000 family means existing effect-algorithm libraries can be ported without rewrite. The 3.3 V I/O permits direct connection to common audio CODECs without level shifters. Per the manufacturer datasheet the DSP56311 was specifically designed for developers of multi-channel communication and audio systems.
Recommended
Networking Infrastructure (Modem Pools, V.90/V.92 Modems)
Modem pool and remote-access servers use the DSP56311VL150 to terminate large banks of analog modems over digital trunks. The 24-bit MAC handles DTMF detection, echo cancellation, and V.90/V.92 line equalization across hundreds of channels per card. Engineers typically pair the part with an external SDRAM bank to hold per-channel state, while the on-chip cache keeps inner loops in fast memory. The deterministic interrupt response and the DMA controller keep latency bounded for real-time PSTN signaling. Per the alldatasheet entry, the DSP56311 was specifically targeted at applications requiring a large amount of internal memory such as networking and wireless infrastructure.
Recommended
Industrial Control and Motor Drive Signal Processing
In servo drives, CNC controllers, and power-line communication modems, the DSP56311VL150 executes field-oriented control loops, FFT-based vibration analysis, and PLC PHY layer decoding. Its deterministic 150 MHz instruction timing provides the cycle-accurate control loop budgets needed for closed-loop motor control, and the 1.8 V core with 3.3 V I/O interfaces directly to standard industrial logic. The six-channel DMA streams encoder counters, ADC samples, and PWM update registers without CPU overhead. The 196-LBGA package supports industrial -40 to +105 C operation in the VL temperature grade variant. Per cross-reference data the DSP56311 family is still supported through authorized aftermarket channels such as Rochester Electronics.
Recommended
Recommended Products Summary
Engineering reference data for DSP56311VL150 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSP56311VF150 | DSP56311VL150R2 | DSP56321VL200 | DSP56321VL220 | DSP56321VL240 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15x15) | 196-LBGA (15x15) - same | 196-LBGA (15x15) - same | 196-MAPBGA - same | 196-MAPBGA - same | 196-MAPBGA - same |
| Clock Frequency | 150 MHz | 150 MHz | 150 MHz | 200 MHz | 220 MHz | 240 MHz |
| Core Architecture | DSP56000 | DSP56000 | DSP56000 | DSP56000 (DSP56321 generation) | DSP56000 (DSP56321 generation) | DSP56000 (DSP56321 generation) |
| Performance | 150 MMACS (300 with EFCOP) | 150 MMACS (300 with EFCOP) | 150 MMACS (300 with EFCOP) | 200 MMACS | 220 MMACS | 240 MMACS |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Active (per cross-reference) | Active (per cross-reference) | Active (per cross-reference) |
| Memory Expansion Area | Program RAM + Cache (PM_EB) | Program RAM + Cache (PM_EB) | Program RAM + Cache (PM_EB) | Refreshed Memory Expansion Area | Refreshed Memory Expansion Area | Refreshed Memory Expansion Area |
Key Differentiators
- EFCOP filter coprocessor doubles effective throughput (vs DSP56321VL200)
- 100% compatible with DSP56000 object code libraries (vs DSP56321VL240)
- Last-time-buy availability through authorized aftermarket channels (vs DSP56321VL220)
Design Notes
Sequence the 1.8 V core and 3.3 V I/O rails core-first then I/O to prevent bus contention during power-up. Use a power-supply sequencer such as the LTC2923 or a simple RC delay on the I/O rail enable. Add 10 uF bulk plus 100 nF X7R ceramic decoupling on every VDD/VSS pair adjacent to the BGA balls; the high switching currents of the DMA engine demand low-impedance return paths. Per the manufacturer datasheet the part draws significant current during DMA bursts, so place bulk capacitors within 5 mm of the package.
Although the DSP56311VL150 is a CMOS digital IC, its 196-ball LBGA package dissipates 2-3 W typical at 150 MHz with all peripherals active. Provide at least 4 thermal vias under the center BGA ball grid tied to an internal ground plane to spread heat. If operating inside an enclosed chassis, derate the ambient by 10 C above 70 C and validate the junction temperature with a thermal couple during worst-case DMA + EFCOP workloads.
Use a 4 or 6-layer PCB with matched 50 ohm controlled impedance for the external address and data bus signals. Per the manufacturer reference design, route all bus signals over a continuous ground plane, length-match within 1 cm, and place series damping resistors near the driver. The 196-BGA requires 0.8 mm pitch fan-out with microvia stackups (laser-drilled 0.1 mm vias) - confirm your PCB vendor supports BGA fan-out before committing the layout.
Do not omit the bootstrap ROM configuration strap resistors on the MODE pins - the DSP will fail to boot or boot into the wrong mode. Do not reuse DSP56000 object code without checking the DSP56311 errata for peripheral register changes; some timer registers were relocated. Because the part is obsolete, source only from authorized aftermarket partners (Rochester Electronics, Heisener) to avoid counterfeit units - verify lot date codes and traceability.
Compliance Information
Per Mouser listing the DSP56311VL150 is marked Pbfree (lead-free) and RoHS compliant. REACH, halogen-free, and conflict-minerals status not explicitly stated in distributor data; treat as unknown.
