DSPIC30F1010-30I/MM - 16-bit 30MIPS SMPS DSC 28-QFN | Microchip
MPN: DSPIC30F1010-30I/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.1 | $5.10 |
| 10 | $4.59 | $45.90 |
| 100 | $4.08 | $408.00 |
| 500 | $3.66 | $1,830.00 |
| 1,000 | $3.25 | $3,250.00 |
DSPIC30F1010-30I/MM Overview
A Digital Signal Controller combines the compute throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes the control loops of switch-mode power supplies in real time while integrating PWM, ADC, and communications peripherals on a single die. The dsPIC30F family from Microchip pioneered this category for digital power applications.
Key features of the dsPIC30F1010 include a 16-bit modified Harvard architecture CPU operating at up to 30 MIPS from a minimum supply of 3V, a 24-bit wide program memory word optimized for dense control code, and dedicated SMPS support features such as high-resolution PWM outputs and fast ADC sampling for multi-loop converter control. Low-power modes reduce consumption in standby, an important consideration for always-on auxiliary supplies.
Architecturally, the dsPIC30F1010 belongs to Microchip's dsPIC30F1010/202X SMPS family, documented in the dsPIC30F1010/202X Family Data Sheet (DS70178B) alongside the pin-compatible dsPIC30F2020 and dsPIC30F2023 SMPS devices. CMOS process technology keeps dynamic power low while supporting the deterministic interrupt latency required by peak-current-mode and voltage-mode control loops.
Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction stages, and multi-loop digital switch-mode power supplies where replacing analog control ICs with firmware-based control improves flexibility and reduces bill-of-materials complexity.
A key design consideration: the QFN package exposes a thermal pad that must be soldered to a grounded copper pour for both heat dissipation and signal integrity of the PWM outputs.
This page synthesizes distributor pricing, drop-in alternatives within the same 28-QFN footprint, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC30F1010-30I/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F1010-30I/MM (same form factor and footprint) — differing in Core Architecture, Package, Data RAM, Program Memory (Flash), ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC30F1010-30E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC30F2020-30I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.65 / Unit
View Datasheet →DSPIC30F2020-30E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC30F1010-30I/MM Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC30F (modified Harvard) |
| Maximum CPU Speed | 30 MIPS |
| Internal Clock Speed | 15 MHz (up to 20 MIPS at minimum 3V per device overview) |
| Program Memory (Flash) | 6 KB (2K x 24-bit words) |
| Program Memory Width | 24-bit |
| Data RAM | 256 bytes |
| I/O Pins | 21 |
| Package | 28-pin QFN-S (6x6 mm), JESD-30: S-PQCC-N28 |
| Mounting Type | Surface Mount |
| Process Technology | CMOS |
| Minimum Operating Voltage | 3 V |
| Temperature Grade | I (Industrial) |
| Low-Power Modes | Yes |
| Application Segment | SMPS and Digital Power Conversion |
DSPIC30F1010-30I/MM 28-pin qfn-s (6x6 mm), jesd-30: s-pqcc-n28 Pin Configuration Guide
Pin configuration for DSPIC30F1010-30I/MM (28-pin qfn-s (6x6 mm), jesd-30: s-pqcc-n28 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC30F1010-30I/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC30F1010-30I/MM is suitable for 6 applications: AC-to-DC Converter Control, DC-to-DC Converter Digital Control, Power Factor Correction (PFC), Multi-Loop SMPS Power Supplies, Industrial Power Conversion Systems, Prototyping and Development of Digital Power Supplies.
AC-to-DC Converter Control
The dsPIC30F1010-30I/MM implements the digital control law for AC-to-DC converters, replacing analog control ICs with firmware-executed loops. Its 30 MIPS 16-bit DSP core executes voltage and current loop compensation at switching frequencies typical of offline converters, while the SMPS-dedicated PWM peripherals generate precisely timed gate drive signals. Per Microchip's family data sheet, this device was explicitly architected for AC-to-DC power conversion. Placed as the sole controller in an offline front end, the 6KB (2K x 24) Flash is sufficient for PFC plus output regulation firmware, and the 21 I/O pins interface directly to the power stage, feedback dividers, and protection circuits. Digital control enables adaptive compensation that analog ICs cannot match.
Recommended
DC-to-DC Converter Digital Control
For isolated and non-isolated DC-to-DC converters, the dsPIC30F1010-30I/MM runs deterministic control loops from its 16-bit DSP core at up to 30 MIPS, sampling feedback with fast ADC conversions and updating high-resolution PWM duty cycles within a single switching period. The 3V minimum supply and CMOS process keep controller power draw negligible relative to converter output. Its 256 bytes of RAM store loop states and compensation coefficients without external memory. Because the control parameters live in firmware, output trim, soft-start profiles, and fault thresholds can be tuned across product variants without hardware changes, shortening time-to-market for multi-output point-of-load and telecom brick designs.
Recommended
Power Factor Correction (PFC)
The dsPIC30F1010-30I/MM suits boost-type power factor correction stages where average-current-mode control must be executed at line frequency with per-cycle current limiting. Its DSP MAC-class instructions compute the current loop quickly enough to maintain high power factor across load ranges, while SMPS-specific peripherals provide the PWM resolution needed for low input-current distortion. Microchip lists PFC-class conversion among the target applications for the dsPIC30F1010/202X family. In a typical design the controller samples rectified line voltage and inductor current, updates PWM each switching cycle, and manages brown-out and over-current protection in firmware, consolidating functions previously spread across several analog ICs into one 28-QFN device.
Recommended
Multi-Loop SMPS Power Supplies
The dsPIC30F1010-30I/MM is specifically targeted at multi-loop digital switch-mode power supplies, per Microchip's product description. A single device can close the voltage loop, current loop, and auxiliary regulation loops using its ADC channels and multiple PWM outputs, executing all compensators at up to 30 MIPS. The 21 available I/O pins accommodate multiple feedback paths, enable signals, and fault flags without external glue logic. Digital implementation allows loop interactions that are problematic in analog multi-loop designs to be handled in software with decoupling and scheduling. The industrial temperature grade and low-power modes make it appropriate for always-on server and industrial supplies requiring continuous multi-rail supervision.
Recommended
Industrial Power Conversion Systems
In industrial environments, the DSPIC30F1010-30I/MM's industrial temperature grade, CMOS construction, and surface-mount 28-QFN-S package fit motor-drive auxiliary supplies, battery chargers, and power conversion subassemblies on automated production lines. The 16-bit architecture provides the arithmetic precision needed for stable regulation over temperature and component tolerances, while firmware-based control enables field updates and fault logging that analog solutions cannot offer. Designers should ground the QFN exposed pad to the PCB pour with thermal vias to survive elevated ambient temperatures typical of industrial enclosures. The device's deterministic interrupt behavior ensures consistent loop timing even with housekeeping tasks running concurrently.
Recommended
Prototyping and Development of Digital Power Supplies
Although this page features the /MM QFN variant, the dsPIC30F1010 family includes through-hole packaging options such as the DSPIC30F1010-30I/SP in 28-pin SPDIP, which is ideal for breadboard and socket-based prototyping of digital power control firmware. Control code developed against the /SP device runs unmodified on the DSPIC30F1010-30I/MM because the die, peripherals, and memory map are identical - only the package changes. Teams can therefore validate SMPS control algorithms on the through-hole part, then transfer the verified firmware to the QFN production variant, eliminating one full firmware regression cycle from the development schedule.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F1010-30I/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F1010-30E/MM | DSPIC30F2020-30I/MM | DSPIC30F2020-30E/MM |
|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 30 MIPS | 30 MIPS | 30 MIPS | 30 MIPS |
| Program Memory | 6 KB (2K x 24) | 6 KB (2K x 24) | 12 KB | 12 KB |
| I/O Pins | 21 | 21 | 21 | 21 |
| Temperature Grade | Industrial (I) | Extended (E) | Industrial (I) | Extended (E) |
| Application Focus | SMPS / digital power conversion | SMPS / digital power conversion | SMPS / digital power conversion | SMPS / digital power conversion |
Key Differentiators
- Lowest-cost entry point in the SMPS DSC family (vs DSPIC30F2020-30I/MM)
- SMPS-optimized architecture, not a general-purpose MCU (vs DSPIC30F1010-30E/MM)
- Exposed-pad QFN thermal/ground performance (vs DSPIC30F1010-30I/SP)
Design Notes
The 28-QFN-S (6x6 mm) package requires an exposed-pad land pattern with a grounded copper pour and an array of thermal vias beneath the pad. This pad is the main heat path and the controller ground return; a poor solder joint here shows up as ground bounce on PWM outputs and elevated junction temperature. Follow IPC-recommended QFN land pattern dimensions and inspect the pad coverage on first-article X-ray or cross-section builds before releasing production.
Keep the SMPS PWM output traces as short as possible between the dsPIC30F1010-30I/MM and the gate driver or power stage. Route them over a continuous ground plane, away from ADC feedback lines, and series-damp if gate-drive ringing is observed. Place the ADC feedback divider close to the pin and add local 0.1uF decoupling at the supply pins to keep the ADC reference quiet during PWM transitions, which otherwise injects sampling noise into the control loop.
Do not assume package interchangeability within the family: the /MM suffix is the 28-QFN-S footprint, while /SP (SPDIP) and /SO (SOIC) variants of the dsPIC30F1010 use different land patterns and cannot be dropped onto a QFN PCB. Also verify supply headroom against the [3V minimum operating point] in your design margin analysis - brown-out behavior during converter startup must be characterized, since the DSC must remain out of reset until the loop can regulate.
Compliance Information
Compliance status not stated in the provided web data. Verify RoHS/REACH status on the Microchip product page or with the distributor before ordering.
