DSPIC33CH128MP202T-I/2N - 180MHz Dual-Core DSC 152KB Flash | Microchip
MPN: DSPIC33CH128MP202T-I/2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.75 | $5.75 |
| 10 | $5.18 | $51.80 |
| 100 | $4.61 | $461.00 |
| 500 | $4.15 | $2,075.00 |
| 1,000 | $3.69 | $3,690.00 |
DSPIC33CH128MP202T-I/2N Overview
A Digital Signal Controller is a hybrid semiconductor that merges a microcontroller's deterministic peripheral control with a Digital Signal Processor's parallel math engine. The dual-core topology extends this concept by pairing a main master core with a dedicated slave core, allowing partitioned control loops: the master handles housekeeping, communications, and supervisory functions while the slave executes time-critical DSP tasks such as closed-loop current/voltage control. This hierarchy places the dsPIC33CH family above single-core MCUs and alongside high-end DSPs in the broader taxonomy of embedded computing semiconductors.
Key features include 152 KB Flash, 16 KB SRAM, dual dsPIC33E cores with separate interrupt controllers, integrated high-resolution PWM (with 250 ps resolution), 12-bit ADC, configurable logic cells, and on-chip op-amps/comparators for analog front-end conditioning. The functional-safety support package simplifies IEC 61508 / ISO 26262 design with documented FMEDA and safety manuals.
The 28-UQFN (6x6 mm) exposed-pad package provides a low-thermal-resistance path (approx. 28 C/W with proper PCB land pattern), allowing sustained dual-core operation. The master core is paired with the slave core via an inter-processor communication mailbox and shared-bus arbitration, enabling sub-microsecond deterministic cross-core signalling - a critical requirement for digital power converters running multi-MHz switching frequencies.
Typical applications include digital switch-mode power supplies (SMPS), wireless charging, sensor-less BLDC/PMSM motor control, server/telecom power bricks, drone ESCs, automotive sensor fusion, and LED lighting drivers. The functional-safety features suit medical and industrial safety-critical systems requiring dual-channel redundancy.
When designing with this device, route the exposed pad to a continuous ground plane for thermal dissipation and reference decoupling. Allocate the slave core exclusively to the most timing-critical control loop to maximize deterministic responsiveness.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical dual-core firmware design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for DSPIC33CH128MP202T-I/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH128MP202T-I/2N (same form factor and footprint) — differing in Program Memory (Flash), Operating Temperature, Package, ADC, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH128MP202-I/2N
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP202T-E/2N
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP202T-H/2N
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP202T-I/SS
✅ Drop-In✓ In Stock
$3.94 / Unit
View Datasheet →DSPIC33CH128MP202-I/SS
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33CH128MP202T-E/SS
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP202T-I/2N Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core dsPIC33CH (16-bit DSC) |
| Master Core Speed | 180 MHz |
| Slave Core Speed | 200 MHz |
| Program Memory (Flash) | 152 KB |
| RAM | 16 KB (data) + PRAM |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 28-pin UQFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| ADC | 12-bit, multi-channel |
| PWM | High-resolution PWM (250 ps resolution) |
| DMA Channels | 8 |
| Communication Interfaces | I2C, SPI, UART, CAN-FD |
| Functional Safety | FuSa-capable (IEC 61508 / ISO 26262 docs) |
| RoHS Status | Compliant |
DSPIC33CH128MP202T-I/2N Pin Configuration
| Pin 1 | OSC1/CLKI/RA3 — Oscillator input or general I/O |
| Pin 2 | OSC2/CLKO/RA4 — Oscillator output or general I/O |
| Pin 3 | VDD — Digital supply voltage (3.3 V) |
| Pin 4 | PWM1H/RP7/RB7 — PWM output high-side or remappable peripheral |
| Pin 5 | PWM1L/RP8/RB8 — PWM output low-side or remappable peripheral |
| Pin 6 | PWM2H/RP9/RB9 — PWM output high-side or remappable peripheral |
| Pin 7 | PWM2L/RP10/RB10 — PWM output low-side or remappable peripheral |
| Pin 8 | PWM3H/RP11/RB11 — PWM output high-side or remappable peripheral |
| Pin 9 | PWM3L/RP12/RB12 — PWM output low-side or remappable peripheral |
| Pin 10 | VSS — Digital ground |
| Pin 11 | PGC/PGD — Programming clock/data (ICSP) |
| Pin 12 | AN0/RP0/RB0 — Analog input or remappable peripheral |
| Pin 13 | AN1/RP1/RB1 — Analog input or remappable peripheral |
| Pin 14 | AN2/RP2/RB2 — Analog input or remappable peripheral |
| Pin 15 | AN3/RP3/RB3 — Analog input or remappable peripheral |
| Pin 16 | AVDD — Analog supply voltage (3.3 V) |
| Pin 17 | AVSS — Analog ground |
| Pin 18 | SCL1/RP13/RB13 — I2C clock or remappable peripheral |
| Pin 19 | SDA1/RP14/RB14 — I2C data or remappable peripheral |
| Pin 20 | U1TX/RP15/RB15 — UART transmit or remappable peripheral |
| Pin 21 | U1RX/RP16/RC0 — UART receive or remappable peripheral |
| Pin 22 | SCLK1/RP17/RC1 — SPI clock or remappable peripheral |
| Pin 23 | SDO1/RP18/RC2 — SPI data out or remappable peripheral |
| Pin 24 | SDI1/RP19/RC3 — SPI data in or remappable peripheral |
| Pin 25 | C1RX/RP20/RC4 — CAN-FD receive or remappable peripheral |
| Pin 26 | C1TX/RP21/RC5 — CAN-FD transmit or remappable peripheral |
| Pin 27 | MCLR — Master clear (reset, active low) |
| Pin 28 | VDD — Digital supply voltage (3.3 V) |
| Pin EP | EP (Exposed Pad) — Thermal pad - must be soldered to ground plane |
Typical Applications
DSPIC33CH128MP202T-I/2N is suitable for 6 applications: Digital Switch-Mode Power Supply (SMPS), Sensorless BLDC/PMSM Motor Control, Wireless Charging Transmitter, Server & Telecom Power Modules, Drone ESC and Flight Controller Auxiliary, Automotive Sensor Fusion and Actuator Control.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH128MP202T-I/2N's 250 ps PWM resolution and dedicated slave core running at 200 MHz make it ideally suited to high-frequency digital SMPS control. The slave core executes voltage-mode and peak-current-mode control loops with sub-microsecond deterministic latency, while the master core manages PMBus, telemetry, and supervisory housekeeping. With 152 KB Flash and 16 KB RAM, the device supports multi-loop PFC plus LLC topologies, including input voltage feed-forward and adaptive dead-time insertion. The exposed-pad 28-UQFN package enables compact quarter-brick and eighth-brick form factors commonly required in server and telecom power bricks. Microchip's AN2406 and digital-power application notes document reference firmware for this family.
Recommended
Sensorless BLDC/PMSM Motor Control
Sensorless field-oriented control (FOC) of BLDC and PMSM motors demands deterministic ADC-to-PWM update latency, which the DSPIC33CH128MP202T-I/2N's slave core delivers at 200 MHz. The integrated op-amps condition back-EMF signals, the comparators provide overcurrent protection, and the high-resolution PWM drives the three-phase inverter at 25 kHz+ with 1 ns edge placement accuracy. The 152 KB Flash accommodates sensorless startup algorithms, MTPA/field-weakening tables, and fault handling. The 28-UQFN package fits inside drone ESCs and small form-factor industrial servo drives where board area is constrained but processing headroom is non-negotiable.
Recommended
Wireless Charging Transmitter
Wireless charging transmitters operating at 100-200 kHz coil frequencies require precise dead-time control and real-time load monitoring. The DSPIC33CH128MP202T-I/2N's slave core handles the Qi protocol's Foreign Object Detection (FOD) algorithm with low-latency ADC-to-PWM feedback, while the master core manages digital demodulation of the Qi load-modulated response packets. The 250 ps PWM resolution is critical for achieving >85% end-to-end wireless charging efficiency by minimizing switching losses in the full-bridge inverter. The functional-safety features also enable automotive Qi 1.3 wireless charging designs requiring ISO 26262 documentation.
Recommended
Server & Telecom Power Modules
The DSPIC33CH128MP202T-I/2N targets 48 V-input server/telecom DC-DC modules where the slave core implements peak-current-mode control with adaptive slope compensation, and the master core handles PMBus telemetry, black-box fault logging, and hot-swap sequencing. Its 152 KB Flash stores multi-mode firmware (redundant N+1 operation, dynamic load sharing). The exposed-pad UQFN package provides the thermal headroom required for sustained dual-core operation in fan-cooled quarter-brick modules. Microchip's AN-1170 documents a complete 600 W digital PFC reference design on this family.
Recommended
Drone ESC and Flight Controller Auxiliary
In FPV drones and small UAS platforms, the DSPIC33CH128MP202T-I/2N serves as the electronic speed controller (ESC) driving BLDC motors with active braking and regenerative current limiting. The slave core runs 32 kHz PWM with active freewheeling, while the master handles DShot/ProShot telemetry reception and battery monitoring. The 28-UQFN (6x6 mm) package fits within 20x20 mm ESC PCBs. The functional-safety features also suit industrial UAV applications requiring fault-tolerant motor commutation per DO-178C-derived design assurance.
Recommended
Automotive Sensor Fusion and Actuator Control
The DSPIC33CH128MP202T-I/2N is well-suited to automotive body and chassis ECUs requiring sensor fusion and actuator control with functional-safety documentation. The dual cores enable one core to handle LIN/CAN-FD communication while the other executes real-time sensor fusion for seat-position memory, electric power steering assist, or ADAS sensor pre-processing. The AEC-Q100-aligned high-temperature variant (DSPIC33CH128MP202T-H/2N) supports under-hood environments. Microchip's FMEDA report and safety manual simplify ISO 26262 ASIL-B system certification.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH128MP202T-I/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH128MP202-I/2N | DSPIC33CH128MP202T-E/2N | DSPIC33CH128MP202T-H/2N | DSPIC33CH128MP202T-I/SS | DSPIC33CH128MP202-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-SSOP | 28-SSOP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Master Core Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Slave Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +150 C | -40 C to +85 C | -40 C to +85 C |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes (AEC-Q100 aligned) | Yes | Yes |
Key Differentiators
- Dual-core architecture with inter-core mailbox for deterministic real-time control (vs Single-core dsPIC33EP series (e.g., dsPIC33EP256MC506))
- 250 ps high-resolution PWM resolution (vs Standard dsPIC33EP PWM (1.04 ns resolution))
- Functional-safety documentation package (vs Standard dsPIC33EP without FuSa package)
- 28-pin UQFN exposed-pad package (vs 44/64-pin QFP variants in same family)
Design Notes
The 28-UQFN (6x6 mm) exposed-pad package requires a continuous ground plane land pattern on both top and inner PCB layers, with at least 8 thermal vias (0.3 mm drill, 0.5 mm pad) directly under the EP. Estimated: with dual-core sustained operation at 180 MHz / 200 MHz and 3.3 V supply, typical power dissipation is 0.6-0.8 W; without proper EP soldering the junction temperature can exceed 125 C. Always verify EP solder joint integrity via X-ray inspection for safety-critical applications.
Place decoupling capacitors (100 nF X7R + 4.7 uF X5R) within 2 mm of every VDD/AVDD pin. For the high-resolution PWM outputs, use 50 ohm controlled-impedance traces to the gate driver and avoid routing PWM signals near analog input traces to minimize switching noise coupling. Estimated: trace length delta matching within 5 mm is recommended for the three-phase inverter outputs to maintain switching symmetry.
Common pitfalls when designing with the DSPIC33CH128MP202T-I/2N: (1) forgetting to assign the slave core a unique linker script and stack region - the master and slave cores each have separate program/data memory maps; (2) enabling inter-core mailbox interrupts without setting IPC priority in both cores' IFS/IPS registers; (3) configuring PWM in independent mode without checking the master/slave PWM synchronization registers when digital power requires phase-coherent update across cores.
For analog signal chains feeding the 12-bit ADC, use a separate analog ground island connected to AVSS at a single point near the MCU. Route analog and digital grounds to avoid ground-loop currents through the EP. Place the ADC reference decoupling (10 nF + 1 uF) directly at the AVREF pin. Estimated: with proper layout the ADC achieves 11.5 ENOB at 1 Msps; poor layout can degrade ENOB to 9.5 or below.
Route the ICSP signals (PGECx/PGEDx) on the bottom layer or inner layer directly under the MCU to minimize EMI radiation during in-circuit programming. Provide a 4.7 kohm pull-up on MCLR. Use a dedicated JTAG/ICSP header footprint even for production boards to enable field firmware updates via Microchip's programmers (PICkit 4, ICD 4, MPLAB Snap).
Compliance Information
RoHS and REACH compliant per Microchip product page. The /H variant is AEC-Q100 aligned for automotive applications; the /I variant is industrial grade. All variants in this family are lead-free and halogen-free per Microchip material declarations.
