DSPIC33CH128MP202T-I/SS - 16-bit Dual-Core 200MHz DSC | Microchip
MPN: DSPIC33CH128MP202T-I/SS β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.58 | $55.80 |
| 100 | $4.97 | $497.00 |
| 500 | $4.45 | $2,225.00 |
| 1,000 | $3.94 | $3,940.00 |
DSPIC33CH128MP202T-I/SS Overview
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic interrupt response and peripheral set of a microcontroller with the high-throughput math capabilities of a DSP. In the system hierarchy, the dsPIC33CH family sits above general-purpose 16-bit MCUs and below 32-bit Cortex-M microcontrollers, fitting applications that need both real-time control loops (motor control, power conversion) and signal-processing throughput (audio, sensor fusion, digital filtering).
The DSPIC33CH128MP202T-I/SS supports a 3V to 3.6V supply, -40C to +85C industrial temperature range, and Functional Safety (FuSa) features targeting applications needing fault detection. Programmable gain amplifiers and high-resolution PWM simplify closed-loop power and motor designs.
Typical applications include high-performance digital power conversion (wireless charging, server PSUs, telecom rectifiers), motor control (BLDC, PMSM, FOC drives), drones, automotive sensors, and digital lighting ballasts. The slave core can run dedicated housekeeping or safety firmware independently of the master core.
When designing with the DSPIC33CH128MP202T-I/SS, observe decoupling guidelines and follow the dual-core inter-processor mailbox structure documented in the Microchip datasheet. The 28-pin SSOP package is suitable for moderate thermal dissipation in compact industrial modules.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes compiled across multiple sources not found in any single manufacturer document.
Drop-in alternatives for DSPIC33CH128MP202T-I/SS β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH128MP202T-I/SS (same form factor and footprint) β differing in Package, Core Architecture, Operating Temperature, Program Memory (Flash), Data RAM.
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DSPIC33CH128MP202-I/SS
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$4.1 / Unit
View Datasheet βDSPIC33CH128MP202T-E/SS
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DSPIC33CH128MP202T-I/MM
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33CH128MP202T-I/SS Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC33CH 16-bit Dual-Core (master + slave) |
| Master Core Frequency | 200 MHz |
| Slave Core Frequency | 180 MHz |
| Program Memory (Flash) | 152 KB (152K x 8) |
| Data RAM | 20 KB total (16 KB + 4 KB split between cores) |
| I/O Pins | 21 general-purpose I/O |
| ADC | 23-channel, 12-bit |
| DAC | 4 x 12-bit |
| DMA Channels | 8 |
| Serial I/O Ports | 3 |
| Timers | 2 (16-bit) |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial - I grade) |
| Package | 28-pin SSOP |
| Mounting Type | Surface Mount |
| Functional Safety | FuSa-capable |
| RoHS Status | Compliant |
DSPIC33CH128MP202T-I/SS 28-pin ssop Pin Configuration Guide
Pin configuration for DSPIC33CH128MP202T-I/SS (28-pin ssop package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH128MP202T-I/SS.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH128MP202T-I/SS is suitable for 6 applications: High-Performance Digital Power Conversion, BLDC / PMSM Motor Control (Field-Oriented Control), Drones and UAV Flight Controllers, Automotive Sensors and Functional Safety Modules, Digital Lighting and LED Ballasts, Server and Telecom Power Supply Units.
High-Performance Digital Power Conversion
The DSPIC33CH128MP202T-I/SS fits digital power conversion designs such as wireless charging, telecom and server PSUs, where the 200MHz master core executes the control loop and the 180MHz slave core runs housekeeping or telemetry in parallel. With 23-channel 12-bit ADC, 4-channel 12-bit DAC, and high-resolution PWM, the device achieves sub-microsecond feedback latency. Compared to a single-core MCU approach, the dual-core design simplifies partitioning between fast control and slow system management firmware, and the FuSa-capable architecture supports fault detection required in modern server and telecom rectifiers.
Recommended
BLDC / PMSM Motor Control (Field-Oriented Control)
The DSPIC33CH128MP202T-I/SS is suited to BLDC and PMSM motor drives using field-oriented control (FOC), with the master core computing the FOC loop at 200MHz and the slave core handling sensor-fusion or position estimation. The 23-channel 12-bit ADC samples phase currents, while high-resolution PWM outputs drive the gate stage. The dual-core split reduces interrupt latency on the control loop and simplifies safety integration per ISO 26262. Compared with single-core dsPIC33EP, the CH variant removes contention between current-loop and housekeeping tasks in drone and robotics motor drives.
Recommended
Drones and UAV Flight Controllers
The DSPIC33CH128MP202T-I/SS supports drone flight-controller designs that require parallel execution of motor FOC loops and sensor fusion on the same chip. The master core at 200MHz runs four motor FOC loops, while the slave core handles IMU sensor fusion and communication. With 23 ADC channels, the device samples current sensors across all four ESC channels plus battery monitoring. Compared with Cortex-M4 flight controllers, the dsPIC33CH provides tighter PWM control for high-payload industrial drones, though programming requires MPLAB X IDE rather than the Arduino/STM32 toolchain.
Recommended
Automotive Sensors and Functional Safety Modules
The DSPIC33CH128MP202T-I/SS Functional Safety (FuSa) capability and dual-core architecture suit automotive sensor modules where one core runs the primary measurement loop and the other executes safety diagnostics in parallel. With -40C to +85C industrial temperature range, the I-grade variant fits under-hood and chassis electronics. The -40C to +125C E-grade variant (DSPIC33CH128MP202T-E/SS) is preferred for under-hood or transmission-mounted modules. Compared with single-core automotive MCUs, the CH family simplifies ASIL decomposition and reduces software complexity for redundant fault detection.
Recommended
Digital Lighting and LED Ballasts
The DSPIC33CH128MP202T-I/SS drives high-end digital lighting ballasts and tunable white LED drivers where the master core computes current-loop control and the slave core manages DMX or DALI protocol stacks in parallel. With 4-channel 12-bit DAC, the device can drive multiple LED channels with high dimming resolution. The 200MHz computational headroom enables predictive thermal management algorithms that adjust current based on measured junction temperature. Compared with traditional 8-bit ballast controllers, the CH variant delivers smoother dimming curves and supports IoT-connected lighting control.
Recommended
Server and Telecom Power Supply Units
The DSPIC33CH128MP202T-I/SS fits server and telecom PSU primary-side and secondary-side control loops where the master core executes the digital feedback loop at 200MHz and the slave core runs PMBus, telemetry, and fault logging concurrently. With high-resolution PWM and 23-channel ADC, the device supports totem-pole PFC, LLC, and full-bridge topologies used in 80+ Titanium-rated PSUs. The FuSa-capable architecture supports fault detection mandated by datacenter reliability standards. Compared with analog UCC25640 controllers, the dsPIC33CH variant enables adaptive digital control and firmware-upgradeable platforms.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH128MP202T-I/SS β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH128MP202-I/SS | DSPIC33CH128MP202T-E/SS | DSPIC33CH128MP202T-I/MM |
|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-uQFN - same pin count, different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Slave Core Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB |
| Data RAM | 20 KB (16 KB + 4 KB) | 20 KB | 20 KB | 20 KB |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) |
| ADC Channels | 23 x 12-bit | 23 x 12-bit | 23 x 12-bit | 23 x 12-bit |
| DAC Outputs | 4 x 12-bit | 4 x 12-bit | 4 x 12-bit | 4 x 12-bit |
| GPIO Pins | 21 | 21 | 21 | 21 |
Key Differentiators
- True dual-core architecture with inter-processor mailbox (vs Single-core dsPIC33EP variants)
- Highest flash density at the SSOP-28 pin count (vs Smaller dsPIC33CH MP102 variants)
- Functional Safety (FuSa) capable dual-core partition (vs Single-core dsPIC33CK/CV devices)
Design Notes
The DSPIC33CH128MP202T-I/SS operates from a single 3.0V to 3.6V supply. Place a 10uF bulk decoupling capacitor and a 0.1uF ceramic decoupling capacitor as close to each VDD/VSS pair as possible. The dual-core architecture draws higher peak current than single-core dsPIC33EP devices, so a low-impedance 3.3V rail (LT3042 or similar LDO with <2mV ripple) is recommended to prevent core brown-out during ADC sampling events.
Route the 200MHz master-core traces as 50-ohm microstrip on the top layer over a continuous ground plane. Keep analog ADC traces short and away from PWM switching signals to minimize crosstalk into current-sense measurements. The exposed pad (if present on the SSOP-28 variant) should be soldered to a grounded copper pour of at least 0.5 square inch to keep junction temperature rise within industrial limits. Estimated: at 200MHz, 80% peripheral utilization, expect ~150mA active current.
Do not assume the master and slave cores share a single binary image; each core has its own firmware partition loaded into separate flash regions, and the inter-processor mailbox requires explicit initialization. Programming the device requires MPLAB X IDE with a PICkit 4, MPLAB ICD 4, or MPLAB Snap debugger - older PICkit 3 supports basic programming but not real-time dual-core debug. Also note: firmware for the I-grade variant cannot be used on the E-grade without re-verifying thermal derating in your enclosure design.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 not qualified in the I grade; the E grade variant (DSPIC33CH128MP202T-E/SS) extends to automotive temperature range but is not formally AEC-Q100 qualified per public documentation.
