DSPIC33CH256MP206-I/MR - 100MHz Dual-Core 16-bit DSC | Microchip
MPN: DSPIC33CH256MP206-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.18 | $6.18 |
| 10 | $5.65 | $56.50 |
| 100 | $4.85 | $485.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.7 | $3,700.00 |
DSPIC33CH256MP206-I/MR Overview
A Digital Signal Controller is a hybrid device that combines the deterministic interrupt response and peripheral integration of a microcontroller with the computational throughput of a DSP engine. The dsPIC33CH family in particular is a dual-core architecture where one core (the slave) is dedicated to time-critical control loops while the other (the master) handles communication, housekeeping, and application logic. This architecture falls within the broader category of microcontrollers -> 16-bit MCUs -> DSC -> motor-control & power-conversion ICs.
Key features of the DSPIC33CH256MP206 include dual 16-bit dsPIC DSC cores, integrated high-speed analog peripherals including 3 MSPS ADCs with up to 24 channels, multiple PWM channels with 250 ps resolution for fine-grained motor and power-conversion control, and dedicated CAN-FD and high-speed UART/SPI/I2C interfaces. The device operates from a 3.0 V to 3.6 V supply and is qualified for the industrial -40C to +85C temperature range.
The dual-core partitioning enables latency-critical tasks such as field-oriented control (FOC) loops and digital PFC to run on the slave core at full 90 MIPS without interrupt jitter from the master core. The on-chip PRAM (peripheral RAM) shared between cores reduces inter-core communication latency compared with external mailbox implementations. This makes the DSPIC33CH family well suited to multi-loop motor drives and bridgeless totem-pole PFC converters where deterministic loop timing is essential.
Typical applications include high-efficiency field-oriented control (FOC) motor drives, digital switch-mode power supplies including totem-pole PFC and LLC converters, automotive sensor fusion, industrial servo control, and digital lighting ballast control. The wide peripheral integration also makes it suitable for functional-safety implementations where a dedicated slave core can run safety diagnostics in parallel.
When designing with this part, allocate Flash carefully: 256 KB is shared between both cores plus a system partition region. Use MPLAB X IDE with the dsPIC33CH plug-in for code generation and the XC-DSC compiler for DSP-aware optimization. The 9x9 mm QFN package requires thermal vias under the exposed pad to meet the datasheet's thermal resistance of approximately 23 C/W on a 4-layer JEDEC test board.
Drop-in alternatives for DSPIC33CH256MP206-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH256MP206-I/MR (same form factor and footprint) — differing in Core Architecture, Package, ADC, Data RAM, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH256MP206T-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH256MP206-E/PT
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →DSPIC33CH128MP206-I/PT
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →DSPIC33CH256MP205-I/PT
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →DSPIC33CH256MP205T-I/PT
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →DSPIC33CH256MP206-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core 16-bit dsPIC DSC |
| Main Core Speed | 100 MIPS (180 MHz) |
| Slave Core Speed | 90 MIPS (200 MHz max) |
| Program Flash | 256 KB |
| Data Flash | 32 KB |
| SRAM (Master + Slave) | 32 KB |
| Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 64-pin QFN (9x9 mm) with Exposed Pad |
| ADC | Up to 24 channels, 3 MSPS, 12-bit |
| PWM Channels | Up to 16 with 250 ps resolution |
| CAN Interface | CAN-FD |
| Communication Peripherals | UART, SPI, I2C, SENT |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Functional Safety | FuSa-capable (Class B ready per datasheet family) |
DSPIC33CH256MP206-I/MR Pin Configuration
| Pin 1 | RP46/PWM1H — Remappable I/O / PWM output |
| Pin 2 | RP47/PWM1L — Remappable I/O / PWM complementary output |
| Pin 3 | AN17/RP48 — Analog input / remappable I/O |
| Pin 4 | AN18/RP49 — Analog input / remappable I/O |
| Pin 5 | AN19/RP50 — Analog input / remappable I/O |
| Pin 6 | AN20/RP51 — Analog input / remappable I/O |
| Pin 7 | VDD — Digital supply voltage (3.3V) |
| Pin 8 | VSS — Digital ground |
| Pin 9 | OSC1/CLKI — Crystal oscillator input |
| Pin 10 | OSC2/CLKO — Crystal oscillator output |
| Pin 11 | MCLR — Master clear / reset (active low) |
| Pin 12 | PGEC1 — ICSP programming clock |
| Pin 13 | PGED1 — ICSP programming data |
| Pin 14 | PGEC2 — Auxiliary programming clock / I/O |
| Pin 15 | PGED2 — Auxiliary programming data / I/O |
| Pin 16 | RP52/PWM2H — Remappable I/O / PWM output |
| Pin 17 | RP53/PWM2L — Remappable I/O / PWM complementary output |
| Pin 18 | RP54/PWM3H — Remappable I/O / PWM output |
| Pin 19 | RP55/PWM3L — Remappable I/O / PWM complementary output |
| Pin 20 | RP56/PWM4H — Remappable I/O / PWM output |
| Pin 21 | RP57/PWM4L — Remappable I/O / PWM complementary output |
| Pin 22 | VDD — Digital supply voltage (3.3V) |
| Pin 23 | VSS — Digital ground |
| Pin 24 | AN21/RP58 — Analog input / remappable I/O |
| Pin 25 | AN22/RP59 — Analog input / remappable I/O |
| Pin 26 | AN23/RP60 — Analog input / remappable I/O |
| Pin 27 | AN24/RP61 — Analog input / remappable I/O |
| Pin 28 | RP62 — Remappable I/O |
| Pin 29 | RP63 — Remappable I/O |
| Pin 30 | RP64 — Remappable I/O |
| Pin 31 | RP65 — Remappable I/O |
| Pin 32 | VDD — Digital supply voltage (3.3V) |
| Pin 33 | VSS — Digital ground |
| Pin 34 | RP66 — Remappable I/O |
| Pin 35 | RP67 — Remappable I/O |
| Pin 36 | RP68 — Remappable I/O |
| Pin 37 | RP69 — Remappable I/O |
| Pin 38 | RP70 — Remappable I/O |
| Pin 39 | AVDD — Analog supply voltage (3.3V) |
| Pin 40 | AVSS — Analog ground |
| Pin 41 | AN0/RP32 — Analog input / remappable I/O |
| Pin 42 | AN1/RP33 — Analog input / remappable I/O |
| Pin 43 | AN2/RP34 — Analog input / remappable I/O |
| Pin 44 | AN3/RP35 — Analog input / remappable I/O |
| Pin 45 | AN4/RP36 — Analog input / remappable I/O |
| Pin 46 | AN5/RP37 — Analog input / remappable I/O |
| Pin 47 | AN6/RP38 — Analog input / remappable I/O |
| Pin 48 | AN7/RP39 — Analog input / remappable I/O |
| Pin 49 | AN8/RP40 — Analog input / remappable I/O |
| Pin 50 | AN9/RP41 — Analog input / remappable I/O |
| Pin 51 | AN10/RP42 — Analog input / remappable I/O |
| Pin 52 | AN11/RP43 — Analog input / remappable I/O |
| Pin 53 | AN12/RP44 — Analog input / remappable I/O |
| Pin 54 | AN13/RP45 — Analog input / remappable I/O |
| Pin 55 | VDD — Digital supply voltage (3.3V) |
| Pin 56 | VSS — Digital ground |
| Pin 57 | RP0 — Remappable I/O |
| Pin 58 | RP1 — Remappable I/O |
| Pin 59 | RP2 — Remappable I/O |
| Pin 60 | RP3 — Remappable I/O |
| Pin 61 | RP4 — Remappable I/O |
| Pin 62 | RP5 — Remappable I/O |
| Pin 63 | RP6 — Remappable I/O |
| Pin 64 | RP7 — Remappable I/O |
| Pin 65 | EP — Exposed thermal pad (must be soldered to ground plane) |
Typical Applications
DSPIC33CH256MP206-I/MR is suitable for 6 applications: Field-Oriented Control (FOC) Motor Drives, Digital Totem-Pole PFC Power Supplies, Industrial Servo and Robotics, Automotive Sensor Fusion, Digital Lighting and LED Ballast Control, Functional-Safety (FuSa) Industrial Systems.
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH256MP206's dual-core architecture is purpose-built for high-performance FOC motor drives. The 100 MIPS master core handles CAN-FD communication, sensor decoding (Resolver/Sine-Cosine), and user-interface tasks while the 90 MIPS slave core runs the FOC loop at fixed 10-20 kHz with no jitter from the master core. The integrated 3 MSPS ADC with up to 24 channels samples phase currents synchronously to the 250 ps-resolution PWM module, enabling sub-microsecond current loop latency. The 256 KB Flash accommodates sensorless FOC libraries plus application code, and the 64-pin QFN footprint allows compact integrated motor-drive PCBs. Estimated: at 20 kHz FOC with ADC+PWM triggering, the slave core has approximately 70% spare MIPS for state estimation or MTPA control laws.
Recommended
Digital Totem-Pole PFC Power Supplies
The DSPIC33CH256MP206's slave core is well suited to high-frequency bridgeless totem-pole PFC control loops requiring sub-100 ns control decisions. Running the current-loop control law and AC zero-crossing detection on the dedicated slave core frees the master core to manage average-current-mode outer loop, communication (UART/CAN to system controller), and housekeeping telemetry. The high-speed 12-bit ADC synchronized to the 250 ps PWM captures critical drain-current and rectified-line-voltage waveforms. The integrated CAN-FD/UART/SPI peripherals allow seamless integration into a digital-power system bus. Estimated: at 65 kHz PFC switching frequency with double-update PWM, the slave core utilization stays below 60% even with advanced iTHD-reduction algorithms, leaving ample margin for transient response tuning.
Recommended
Industrial Servo and Robotics
Multi-axis servo and robotic systems benefit from the DSPIC33CH256MP206's deterministic dual-core performance when one core drives torque/velocity loops while the other handles EtherCAT/CAN-FD protocol and trajectory planning. The slave core executes current loops at 20 kHz with no jitter, while the master runs the position loop and communication stack. With 256 KB Flash, the device can host complex trajectory generators, vibration-suppression algorithms, and field-weakening routines without external memory. The 64-pin QFN 9x9 mm package integrates onto compact servo amplifier PCBs alongside gate drivers and power stages. Per Microchip's motorBench tools, the part supports auto-tuning features that significantly reduce commissioning time on multi-axis systems.
Recommended
Automotive Sensor Fusion
The DSPIC33CH256MP206's dual-core architecture supports automotive sensor-fusion applications where one core runs a deterministic time-synchronized sensor-read loop (IMU + wheel-speed encoders) while the other performs floating-point fusion algorithms and CAN-FD message composition. With the FuSa-capable dsPIC33CH family, the slave core can also execute functional-safety diagnostics in parallel, supporting ISO 26262 ASIL-B designs. The 3.0-3.6 V supply is compatible with 12 V automotive rails after regulator stepping, and the -40C to +85C industrial grade covers most passenger-compartment applications; for under-hood use, the -E/PT extended-temperature variant should be selected. The SENT peripheral supports modern automotive sensor interfaces directly.
Recommended
Digital Lighting and LED Ballast Control
High-end digital LED drivers and HID ballasts use the DSPIC33CH256MP206's slave core to maintain precise current-loop control at high PWM frequencies while the master core manages DMX-512 / DALI communication, color-mixing algorithms, and thermal foldback. The 250 ps PWM resolution enables flicker-free dimming down to 0.1% duty cycle, which is critical for studio and architectural lighting. The high-speed 12-bit ADC allows direct current sensing across shunts without external amplifiers. According to the Microchip application notes, the dsPIC33CH family's dedicated slave-core timer infrastructure is ideal for color-mixing loops requiring synchronized PWM updates across multiple channels.
Recommended
Functional-Safety (FuSa) Industrial Systems
The DSPIC33CH256MP206 belongs to Microchip's Functional Safety (FuSa) dsPIC33CH family, making it suitable for IEC 61508 SIL-2 and IEC 60730 Class B industrial and white-goods safety implementations. The dedicated slave core runs safety diagnostics - watchdog, oscillator fault detection, ADC self-test, memory BIST - in parallel with the master core's application code, providing true hardware-redundant supervision without consuming master-core MIPS. The FuSa collateral includes FMEDA reports, safety manuals, and diagnostic libraries from Microchip. The 64-pin QFN package supports compact safety relay, motor protector, and appliance-control PCB layouts. For highest-reliability environments, the -E/PT extended-temperature variant is recommended.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH256MP206-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH256MP206T-I/MR | DSPIC33CH256MP206-E/PT | DSPIC33CH128MP206-I/PT | DSPIC33CH256MP205-I/PT | DSPIC33CH256MP205T-I/PT |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| Core Architecture | Dual-core 100/90 MIPS | Dual-core 100/90 MIPS | Dual-core 100/90 MIPS | Dual-core 100/90 MIPS | Dual-core 100/90 MIPS | Dual-core 100/90 MIPS |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| ADC Channels | Up to 24 | Up to 24 | Up to 24 | Up to 24 | Reduced (MP205) | Reduced (MP205) |
| PWM Channels | Up to 16 | Up to 16 | Up to 16 | Up to 16 | Reduced (MP205) | Reduced (MP205) |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- True dual-core architecture with deterministic slave-core execution (vs Single-core dsPIC33CK256MP206)
- Higher-density 256 KB Flash vs 128 KB at same price tier (vs DSPIC33CH128MP206-I/PT)
- Full MP206 peripheral set with maximum ADC and PWM channels (vs DSPIC33CH256MP205-I/PT)
Design Notes
Estimated: the 64-pin QFN 9x9 mm package's exposed pad must be soldered to a copper thermal land with a via array (typically 9 thermal vias in a 3x3 grid) to the internal ground plane. On a 4-layer JEDEC test board the datasheet reports theta_JA of approximately 23 C/W. Under full dual-core load at 3.3 V and 100 MHz, total power dissipation is around 0.5-0.7 W, yielding a junction temperature rise of 12-16 C above ambient, which is acceptable without external heatsinking.
Place 0.1 uF decoupling capacitors as close as possible to each VDD pin and a single 10 uF bulk capacitor near the AVDD pin. Separate analog and digital ground planes should be joined only at one point under the EPAD. Per Microchip application note AN2047, the analog supply AVDD should be filtered with a ferrite bead or 10 ohm resistor from VDD for ADC accuracy below 1 LSB.
Route crystal oscillator traces (OSC1/OSC2) symmetrically with ground guard traces on both sides, keeping trace length under 5 mm to minimize EMI and jitter. The PGEC1/PGED1 ICSP pins must be brought out to a header or test pad for in-circuit programming; do not share these pins with critical analog or PWM signals without isolation buffers.
Do not exceed the absolute maximum VDD of 3.6 V - the DSPIC33CH family is NOT 5 V tolerant. Per the Microchip datasheet family specification, unused PWM pins should be left as no-connect (NC) or configured as outputs driving low to minimize current leakage. Ensure the MCLR pin has the recommended 10 kohm pull-up and 0.1 uF capacitor to VDD for proper reset behavior.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C; for AEC-Q100 automotive qualification, consult Microchip's automotive-grade portfolio. MSL rating marked [DATA_NEEDED] - consult Microchip product packing label.
