DSPIC33CH256MP206-E/MR - Dual-Core 200MHz DSC, 328KB Flash | Microchip
MPN: DSPIC33CH256MP206-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.95 | $89.50 |
| 100 | $8.2 | $820.00 |
| 500 | $7.45 | $3,725.00 |
| 1,000 | $6.9 | $6,900.00 |
DSPIC33CH256MP206-E/MR Overview
A Digital Signal Controller (DSC) is a class of microcontroller that fuses a microcontroller's deterministic I/O and interrupt handling with a digital signal processor's (DSP) single-cycle MAC, barrel shifter, and saturating arithmetic. The dsPIC33CH family extends the DSC concept with a true dual-core architecture where the slave core executes time-critical control loops while the main core handles communication, housekeeping, and application logic. This hierarchy—DSC under microcontroller, both under embedded processor—maps cleanly into the broader taxonomy of microcontrollers and DSPs.
Key features include 328 kB Flash, 64 kB RAM, dual dsPIC DSC cores running at 180 MHz (main) and 200 MHz (slave), 100 MIPS per core DSP throughput, a high-resolution PWM module suited to precision motor drives, and on-chip functional-safety diagnostics (FuSa). The 64-QFN exposed-pad package provides low thermal resistance and a compact 9x9 mm footprint ideal for space-constrained motor-control PCBs.
Typical applications include field-oriented control (FOC) of PMSM/BLDC motors, digital power conversion, automotive sensor-fusion, and functional-safety systems up to ASIL-B. The dual-core partitioning lets the slave handle the current-control loop at microsecond intervals while the main core services CAN-FD, run diagnostics, and updates the user interface.
When designing, allocate the slave-core's tightly bounded cycles for the torque loop, and keep the main core's bus bandwidth above 50 percent during housekeeping to avoid stalls. Note the -E suffix designates the -40C to +125C automotive temperature grade; the -I suffix variant is industrial -40C to +85C.
This page combines verified distributor pricing, package-level drop-in alternatives, and practical dual-core firmware notes that go beyond the manufacturer datasheet, giving procurement and engineering teams one place to evaluate the DSPIC33CH256MP206-E/MR.
Drop-in alternatives for DSPIC33CH256MP206-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH256MP206-E/MR (same form factor and footprint) — differing in Core Architecture, Package, Program Memory (Flash), ADC, Data RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH256MP206-I/MR
✅ Drop-In✓ In Stock
$3.7 / Unit
View Datasheet →DSPIC33CH256MP208-I/PT
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →DSPIC33CH128MP206-I/PT
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →DSPIC33CH256MP205-I/PT
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →DSPIC33CH128MP208T-I/PT
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →DSPIC33CH256MP206-E/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core dsPIC33 DSC (main + slave) |
| Main Core Frequency | 180 MHz (up to 100 MIPS) |
| Slave Core Frequency | 200 MHz (up to 100 MIPS) |
| Program Memory (Flash) | 328 kB (328k x 8) |
| Data RAM | 64 kB |
| Operating Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| Package | 64-pin QFN (9x9 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Temperature Grade (E suffix) | -40C to +125C (automotive / extended) |
| Safety Features | Functional Safety (FuSa) peripherals |
| PWM Resolution | High-resolution PWM (motor control) |
| Operating Temperature Range | -40C to +125C |
| RoHS Status | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
DSPIC33CH256MP206-E/MR Pin Configuration
| Pin 1 | REFI — Reference input (varies by function) |
| Pin 2 | RP66 — Remappable peripheral pin / I/O |
| Pin 3 | RP67 — Remappable peripheral pin / I/O |
| Pin 4 | RP68 — Remappable peripheral pin / I/O |
| Pin 5 | RP69 — Remappable peripheral pin / I/O |
| Pin 6 | RP70 — Remappable peripheral pin / I/O |
| Pin 7 | RP72 — Remappable peripheral pin / I/O |
| Pin 8 | VSS — Ground |
| Pin 9 | RP73 — Remappable peripheral pin / I/O |
| Pin 10 | RP74 — Remappable peripheral pin / I/O |
| Pin 11 | RP75 — Remappable peripheral pin / I/O |
| Pin 12 | RP76 — Remappable peripheral pin / I/O |
| Pin 13 | RP77 — Remappable peripheral pin / I/O |
| Pin 14 | RP78 — Remappable peripheral pin / I/O |
| Pin 15 | RP79 — Remappable peripheral pin / I/O |
| Pin 16 | RP80 — Remappable peripheral pin / I/O |
| Pin 17 | RP81 — Remappable peripheral pin / I/O |
| Pin 18 | VDD — Digital supply 3.3V |
| Pin 19 | RP82 — Remappable peripheral pin / I/O |
| Pin 20 | RP83 — Remappable peripheral pin / I/O |
| Pin 21 | RP84 — Remappable peripheral pin / I/O |
| Pin 22 | RP85 — Remappable peripheral pin / I/O |
| Pin 23 | VSS — Ground |
| Pin 24 | RP87 — Remappable peripheral pin / I/O |
| Pin 25 | RP88 — Remappable peripheral pin / I/O |
| Pin 26 | RP89 — Remappable peripheral pin / I/O |
| Pin 27 | RP90 — Remappable peripheral pin / I/O |
| Pin 28 | RP91 — Remappable peripheral pin / I/O |
| Pin 29 | RP92 — Remappable peripheral pin / I/O |
| Pin 30 | VDD — Digital supply 3.3V |
| Pin 31 | RP93 — Remappable peripheral pin / I/O |
| Pin 32 | RP94 — Remappable peripheral pin / I/O |
| Pin 33 | RP95 — Remappable peripheral pin / I/O |
| Pin 34 | RP96 — Remappable peripheral pin / I/O |
| Pin 35 | OSCI — Crystal oscillator input |
| Pin 36 | OSCO — Crystal oscillator output |
| Pin 37 | VSS — Ground |
| Pin 38 | RP97 — Remappable peripheral pin / I/O |
| Pin 39 | RP98 — Remappable peripheral pin / I/O |
| Pin 40 | RP99 — Remappable peripheral pin / I/O |
| Pin 41 | RP100 — Remappable peripheral pin / I/O |
| Pin 42 | RP101 — Remappable peripheral pin / I/O |
| Pin 43 | RP102 — Remappable peripheral pin / I/O |
| Pin 44 | RP104 — Remappable peripheral pin / I/O |
| Pin 45 | RP105 — Remappable peripheral pin / I/O |
| Pin 46 | RP106 — Remappable peripheral pin / I/O |
| Pin 47 | RP107 — Remappable peripheral pin / I/O |
| Pin 48 | RP108 — Remappable peripheral pin / I/O |
| Pin 49 | RP109 — Remappable peripheral pin / I/O |
| Pin 50 | RP110 — Remappable peripheral pin / I/O |
| Pin 51 | VDD — Digital supply 3.3V |
| Pin 52 | RP111 — Remappable peripheral pin / I/O |
| Pin 53 | RP112 — Remappable peripheral pin / I/O |
| Pin 54 | RP113 — Remappable peripheral pin / I/O |
| Pin 55 | RP114 — Remappable peripheral pin / I/O |
| Pin 56 | RP115 — Remappable peripheral pin / I/O |
| Pin 57 | RP116 — Remappable peripheral pin / I/O |
| Pin 58 | RP117 — Remappable peripheral pin / I/O |
| Pin 59 | RP118 — Remappable peripheral pin / I/O |
| Pin 60 | RP119 — Remappable peripheral pin / I/O |
| Pin 61 | RP120 — Remappable peripheral pin / I/O |
| Pin 62 | RP121 — Remappable peripheral pin / I/O |
| Pin 63 | RP122 — Remappable peripheral pin / I/O |
| Pin 64 | VDD_CORE — Core voltage supply |
Typical Applications
DSPIC33CH256MP206-E/MR is suitable for 6 applications: Field-Oriented Control of PMSM/BLDC Motors, Automotive Functional Safety Motor Drive (ASIL-B), Digital Power Conversion (PFC + LLC), Industrial Servo and Robotics, Precision Sensor Signal Processing, Solar Inverter / Energy Storage Control.
Field-Oriented Control of PMSM/BLDC Motors
The DSPIC33CH256MP206-E/MR's dual-core architecture is purpose-built for FOC motor drives: the 200 MHz slave core runs the inner current-control torque loop at 10-20 kHz with deterministic sub-microsecond jitter, while the 180 MHz main core executes sensor-FOC transforms, handles CAN-FD communication, and runs diagnostics. The 328 kB Flash accommodates complex state machines and lookup tables for sensorless startup, while the 64 kB RAM holds real-time observation matrices. With high-resolution PWM, the controller achieves torque ripple below 1 percent and supports switching frequencies above 50 kHz for silent drive operation. The -40C to +125C grade suits under-hood and industrial inverter environments.
Recommended
Automotive Functional Safety Motor Drive (ASIL-B)
AEC-Q100 qualification and integrated Functional Safety peripherals make the DSPIC33CH256MP206-E/MR well suited to ISO 26262 ASIL-B motor drives such as electric power steering pumps, electric brake boosters, and active suspension actuators. The slave core isolates the safety-critical torque loop while the main core runs self-test diagnostics, dual-redundant sensor reads, and watchdog supervision. Hardware CRC on Flash, ECC on RAM, and the dual-core lockstep option provide the diagnostic coverage required for ASIL-B targets. The 64-QFN exposed-pad package keeps thermals low at continuous 30 A phase currents, and the -40C to +125C grade handles under-hood environments. This pairing meets functional safety without external safety MCU redundancy.
Recommended
Digital Power Conversion (PFC + LLC)
High-frequency digital power converters benefit from the DSPIC33CH256MP206-E/MR's dual-core partitioning: the slave core executes the current-mode control loop of a PFC or LLC stage at 100-500 kHz switching frequency with single-cycle ADC sampling and high-resolution PWM. The main core handles housekeeping, slow-loop voltage regulation, and PMBus telemetry. The 328 kB Flash is sufficient for full-state feedback observers and adaptive loop compensation tables, while 64 kB RAM supports interleaved PFC and resonant tank calculations without dropping samples. The exposed-pad QFN-64 keeps junction temperature low at full load, and AEC-Q100 grade suits industrial and telecom PSU environments.
Recommended
Industrial Servo and Robotics
Industrial servo amplifiers require deterministic multi-axis coordination that the DSPIC33CH256MP206-E/MR delivers through its 200 MHz slave core. The slave core handles the current loop at 16 kHz with sub-microsecond jitter, while the main core runs the position/speed loop, EtherCAT/CAN-FD communication, and motion trajectory planner. The 328 kB Flash fits multi-segment trajectory tables, while 64 kB RAM stores intermediate observer data without DMA stalls. With -40C to +125C rating and integrated FuSa diagnostics, this DSC also serves collaborative robot (cobot) joints requiring functional-safety monitoring. The 64-QFN package keeps PCB footprint under 9x9 mm for compact servo amplifier cards.
Recommended
Precision Sensor Signal Processing
Precision instrumentation applications benefit from the DSPIC33CH256MP206-E/MR's dual-core DSP throughput and integrated peripherals. The slave core runs a Kalman filter or other observer at 100 MIPS sustained throughput, processing high-speed ADC samples from precision sensors such as resolvers, encoders, or strain gauges. The main core handles higher-level logic, communication, and user interface. With 328 kB Flash, designers can implement adaptive filtering, temperature compensation, and calibration routines on-chip. The 64 kB RAM provides ample buffer for incoming sample streams, while the 64-QFN exposed-pad package ensures thermal stability for continuous high-MIPS operation in test and measurement equipment.
Recommended
Solar Inverter / Energy Storage Control
Solar inverter and battery management controllers leverage the DSPIC33CH256MP206-E/MR's dual-core architecture to run MPPT/PFC and inverter control loops in parallel. The 200 MHz slave core executes the high-frequency inverter loop with single-cycle PWM updates, while the 180 MHz main core handles MPPT algorithm, grid monitoring, communication interfaces (RS-485, CAN), and system telemetry. The 328 kB Flash stores grid-tie code, parameter sets, and fault logs; the 64 kB RAM supports live waveform capture during grid-fault events. The -40C to +125C grade handles outdoor inverter cabinet environments, and AEC-Q100 qualification supports both stationary storage and emerging EV-charger applications.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH256MP206-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH256MP206-I/MR | DSPIC33CH256MP208-I/PT | DSPIC33CH128MP206-I/PT | DSPIC33CH256MP205-I/PT | DSPIC33CH128MP208T-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) with Exposed Pad | 64-QFN (9x9) - same | TQFP-80 (PT) - different | TQFP-64 (PT) - different | TQFP-64 (PT) - different | TQFP-80 (PT) - different |
| Flash Memory | 328 kB | 328 kB | 256 kB | 128 kB | 256 kB | 128 kB |
| RAM | 64 kB | 64 kB | 64 kB | 24 kB | 64 kB | 24 kB |
| Main Core Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Slave Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | -40C to +125C (Extended/Automotive) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| AEC-Q100 Qualified | Yes (Extended grade) | No (industrial grade) | No (industrial grade) | No (industrial grade) | No (industrial grade) | No (industrial grade) |
| Functional Safety (FuSa) | Yes (integrated peripherals) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Automotive temperature grade with AEC-Q100 qualification (vs DSPIC33CH256MP206-I/MR)
- Highest Flash density in 64-QFN package (vs DSPIC33CH128MP206-I/PT)
- Dual-core architecture with dedicated Functional Safety peripherals (vs DSPIC30F6015-30I/PT (single-core legacy))
Design Notes
The 64-QFN exposed-pad package dissipates thermal energy primarily through the bottom pad. Solder the exposed pad to a continuous copper pour of at least 1 square inch to keep junction temperature below 125C at full 200 MHz dual-core operation. Estimated: with theta_JA ~28 C/W on a 4-layer 2oz PCB and 1 sq inch copper pour, the device can dissipate roughly 1.5 W continuously. For motor-control applications with high peripheral activity, derate by 20 percent. Industrial -I grade variants should derate further for closed-enclosure designs without forced airflow.
Route the dual-core inter-core mailbox signals (typically shared RAM region) on inner PCB layers to minimize coupling with high-current motor PWM traces. Estimated: PWM transitions at 50 kHz with 1 ns rise times couple ~3-5 mV into adjacent signal traces; maintain at least 0.2 mm clearance between analog signals and PWM outputs. Place decoupling capacitors (100 nF ceramic + 4.7 uF bulk) within 3 mm of each VDD pin, with the exposed pad tied to a low-impedance ground plane stitched with 0.5 mm vias on a 2 mm grid.
Do not share the slave core's interrupt vector table with the main core unless you have explicitly configured the inter-core interrupt router. The slave core's vector table base address is independent, and a misconfigured shared base causes hard-to-diagnose jumps to undefined handlers. Always initialize both cores' stack pointers separately in the startup code. Estimated: a typical dual-core startup sequence reserves 1 kB of stack per core plus 256 B of inter-core mailbox buffer; allocate these regions in the linker file and verify with the MPLAB X simulator before deploying to hardware.
The slave core's high-resolution PWM output edge placement accuracy is +/- 250 ps at 200 MHz, but this assumes clean 3.3 V supply with peak ripple below 50 mV. Estimated: ripple above 100 mV on the VDD_CORE rail introduces measurable jitter on the high-resolution PWM edge. Use a dedicated LDO (such as the MCP1711) to isolate the analog and digital VDD rails. Place the LDO output capacitor within 2 mm of the VDD_CORE pin to minimize inductance and prevent ringing during 100 mA load transients.
Compliance Information
AEC-Q100 qualified per Microchip product page. RoHS compliant per distributor listings. -E temperature grade is the automotive/extended variant; -I grade is industrial.
