DSPIC33CH256MP506T-I/MR - Dual-Core 100MHz DSC, 256KB Flash, 64-QFN | Microchip
MPN: DSPIC33CH256MP506T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.78 | $77.80 |
| 100 | $6.94 | $694.00 |
| 500 | $6.25 | $3,125.00 |
| 1,000 | $5.62 | $5,620.00 |
DSPIC33CH256MP506T-I/MR Overview
A Digital Signal Controller (DSC) is a hybrid device that combines the interrupt-driven control strengths of a microcontroller (MCU) with the deterministic numerical processing power of a Digital Signal Processor (DSP). Within the broader semiconductor taxonomy, the DSC sits between microcontrollers (general-purpose control) and DSPs (math-heavy signal processing), and the dsPIC33CH family belongs to the larger 16-bit dsPIC33 lineage, designed for real-time mixed-signal embedded systems. The dual-core architecture is the distinguishing innovation: the master core runs the application and control loop, while the slave core offloads latency-critical DSP tasks such as field-oriented control (FOC) math, peak current-mode control, or audio processing.
Key features include 328KB (328k x 8) of Flash program memory, dual dsPIC DSC cores (one 90 MIPS, one 100 MIPS), integrated high-resolution PWM modules, multiple CAN-FD controllers, and Functional Safety hardware that simplifies IEC 61508 SIL 2/3 and ISO 26262 ASIL-B system designs. Operating from 3.0V to 3.6V across -40C to +85C industrial temperature range, the device targets harsh embedded environments with deterministic interrupt response. The exposed-pad 64-QFN (9x9 mm) package supports efficient thermal dissipation for the high MIPS throughput.
Typical applications include sensorless and sensored brushless DC (BLDC) motor drives, automotive traction inverters, digital power supplies with peak current-mode control, and high-performance digital audio processing. The slave-core architecture allows partitioning of code between application logic and DSP routines, accelerating time-to-market for complex control firmware. When designing with this part, allocate the master core to system scheduling and communication, and reserve the slave core for the time-critical inner control loop, which minimizes jitter and improves control bandwidth.
Drop-in alternatives for DSPIC33CH256MP506T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH256MP506T-I/MR (same form factor and footprint) — differing in Core Architecture, PWM Resolution, Package, Operating Temperature, Program Memory (Flash).
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DSPIC33CH256MP506-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.05 / Unit
View Datasheet →DSPIC33CH256MP506T-E/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH256MP508T-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH256MP505T-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH128MP506T-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.82 / Unit
View Datasheet →DSPIC33CH256MP506T-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual dsPIC33 DSC cores (16-bit) |
| Master Core Speed | 180 MHz (90 MIPS) |
| Slave Core Speed | 200 MHz (100 MIPS) |
| Program Memory (Flash) | 328 KB (328k x 8) |
| PRAM | Yes (Program RAM accessible by both cores) |
| Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 64-QFN (9x9 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| Communication | CAN-FD |
| Functional Safety (FuSa) | Yes (hardware features for IEC 61508 / ISO 26262) |
| PWM Resolution | High-resolution PWM (per datasheet) |
| Pin Count | 64 |
| RoHS Status | Compliant (per Microchip product page) |
| Family | dsPIC33CH |
DSPIC33CH256MP506T-I/MR 64-qfn (9x9 mm) with exposed thermal pad Pin Configuration Guide
Pin configuration for DSPIC33CH256MP506T-I/MR (64-qfn (9x9 mm) with exposed thermal pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH256MP506T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH256MP506T-I/MR is suitable for 6 applications: Brushless DC (BLDC) Motor Control, Digital Power Conversion (AC/DC, DC/DC), Automotive Traction and Compressor Drives, Solar Inverter and PV Microinverter, Functional Safety (SIL/ASIL) Industrial Controllers, Digital Audio and Active Speaker Crossovers.
Brushless DC (BLDC) Motor Control
The DSPIC33CH256MP506T-I/MR's dual-core architecture makes it ideal for sensorless and sensored BLDC motor drives in industrial and appliance applications. The 100 MIPS slave core executes field-oriented control (FOC) math with deterministic 50ns instruction-cycle latency, while the 90 MIPS master core handles CAN-FD communication, fault handling, and supervisory logic. The integrated high-resolution PWM (per the dsPIC33CH datasheet) provides sub-microsecond edge placement, which is critical for low-speed torque ripple reduction. The 328KB Flash accommodates FOC lookup tables, observer state machines, and safety libraries.
Recommended
Digital Power Conversion (AC/DC, DC/DC)
The DSPIC33CH256MP506T-I/MR targets high-frequency digital power supplies including totem-pole PFC, LLC, and peak current-mode DC/DC converters. The slave core runs voltage-mode or peak current-mode control loops at multi-hundred kHz switching frequencies, exploiting the 100 MIPS throughput and high-resolution PWM for clean edges. The master core monitors telemetry, drives the display/communications, and runs housekeeping. The 328KB Flash holds compensator coefficients, soft-start profiles, and firmware for adaptive dead-time control.
Recommended
Automotive Traction and Compressor Drives
The DSPIC33CH256MP506T-I/MR's Functional Safety (FuSa) hardware supports ISO 26262 ASIL-B/C designs for automotive traction inverters, e-compressors, and electric power steering. Dual-core lockstep plus memory BIST satisfy the diagnostics required by functional safety standards without external supervision ICs. CAN-FD connectivity integrates directly into vehicle networks. The -40C to +85C industrial temperature range covers under-hood applications, and the 64-QFN 9x9 mm package fits the compact inverter PCBs typical of EV traction modules.
Recommended
Solar Inverter and PV Microinverter
The DSPIC33CH256MP506T-I/MR serves as the central controller in photovoltaic (PV) microinverters and string inverters, where MPPT and grid-tie control loops demand deterministic DSP performance. The slave core runs MPPT and grid-current shaping, while the master core manages Modbus/CAN-FD communication and protection state machines. The high-resolution PWM enables low-distortion sine current injection, helping meet IEEE 1547 grid-tie harmonic requirements. Integrated CAN-FD enables daisy-chained string communication without an external controller.
Recommended
Functional Safety (SIL/ASIL) Industrial Controllers
The DSPIC33CH256MP506T-I/MR's integrated FuSa features (memory BIST, dual-core lockstep, windowed watchdog, FRC tuning) make it a strong fit for IEC 61508 SIL 2/3 industrial safety controllers such as emergency-stop modules, gas detectors, and process-safety interlocks. The dual-core architecture allows one core to act as the diagnostic supervisor for the other, reducing external safety MCU count. CAN-FD connectivity and 328KB Flash accommodate safety stack, application logic, and diagnostics firmware within a single device.
Recommended
Digital Audio and Active Speaker Crossovers
The DSPIC33CH256MP506T-I/MR's dual-core DSP horsepower suits high-channel-count digital speaker crossovers, room-correction DSP, and active studio monitors. The slave core runs biquad cascade filters, while the master core manages USB/I2S audio streaming and user-interface logic. The 328KB Flash holds preset banks and convolution filter coefficients. This partitioning reduces latency on the audio path versus single-core architectures, yielding better phase coherence for studio-monitor applications.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH256MP506T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH256MP506-I/MR | DSPIC33CH256MP506T-E/MR | DSPIC33CH256MP508T-I/MR | DSPIC33CH256MP505T-I/MR | DSPIC33CH128MP506T-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core Architecture | Dual-core dsPIC33 (90 + 100 MIPS) | Dual-core dsPIC33 (90 + 100 MIPS) | Dual-core dsPIC33 (90 + 100 MIPS) | Dual-core dsPIC33 (90 + 100 MIPS) | Dual-core dsPIC33 (90 + 100 MIPS) | Dual-core dsPIC33 (90 + 100 MIPS) |
| Program Flash | 328 KB | 328 KB | 328 KB | 328 KB | 328 KB | 128 KB (-61%) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Functional Safety (FuSa) | Yes (IEC 61508 / ISO 26262) | Yes | Yes | Yes | Yes | Yes |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Qty-1 Price (USD, 2026-09-22) | 8.50 | 8.40 (tray vs tape/reel) | 9.20 (extended temp premium) | 9.00 (expanded peripherals) | 8.20 (reduced peripherals) | 7.50 (less Flash) |
Key Differentiators
- True dual-core architecture (master + slave dsPIC cores) (vs DSPIC33CK256MP506 (single-core, 100 MIPS))
- Integrated Functional Safety (FuSa) hardware (vs Single-core dsPIC33EP128MC506 (no dual-core diagnostics))
- CAN-FD connectivity (vs dsPIC33EP256MC506 (classic CAN only))
Design Notes
Estimated: at 200 MHz dual-core operation with both cores active, typical power dissipation is approximately 0.8-1.2 W. The 64-QFN 9x9 mm package's theta_JA of approximately 22 C/W on a standard 4-layer JEDEC test PCB yields a junction temperature rise of ~25 C/W above ambient. For continuous dual-core full-load operation, lay out at least 1 sq.inch of top-side copper connected to the exposed pad and add thermal vias to internal ground planes to stay within the +85 C industrial limit.
Place decoupling capacitors (100 nF X7R + bulk 10 uF) within 2 mm of each VDD/VSS pin pair. Use a star-ground topology for the analog AVdd rails to avoid coupling switching noise into the ADC references. The exposed thermal pad (EP) MUST be soldered to the PCB ground plane to meet the datasheet's thermal and electrical specifications.
Estimated: a common design pitfall is failing to allocate the slave-core PRAM (Program RAM) region in the linker script, which causes linker errors that point to undefined symbols. Reference Microchip application note AN2721 for the dual-core linker template. Also ensure the slave-core firmware is loaded into the dedicated slave-program Flash partition via the master-core boot sequence, or the slave will not start after reset.
Route the high-speed PWM outputs and the CAN-FD differential pair as 100 ohm differential (CAN) or 50 ohm single-ended (PWM) controlled-impedance traces. Keep switching traces away from the analog AVdd/VREF+ pins to avoid coupling switching noise into ADC sampling. Use Microchip's MPLAB X IDE + dsPIC33CH DFP to configure the PWM dead-time and ADC sampling alignment.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 not directly qualified (industrial grade -I suffix, -40C to +85C). For AEC-Q100 automotive grade use -E suffix variants and consult Microchip automotive-grade ordering guide. REACH compliant per Microchip product declaration.
