DSPIC33CH256MP206-I/PT - Dual-Core 100MHz DSC, 256KB Flash | Microchip
MPN: DSPIC33CH256MP206-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.18 | $6.18 |
| 10 | $5.73 | $57.30 |
| 100 | $4.97 | $497.00 |
| 500 | $4.41 | $2,205.00 |
| 1,000 | $3.91 | $3,910.00 |
DSPIC33CH256MP206-I/PT Overview
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a digital signal processor (DSP). It combines deterministic interrupt-driven control loops (typical of MCUs) with deterministic DSP throughput (typical of DSPs), making it well suited to applications such as field-oriented motor control (FOC), digital power conversion, and audio processing where both real-time control and high-rate signal math are required. Within Microchip's portfolio, DSCs sit between PIC MCUs and standalone dsPIC DSPs and target high-performance embedded control.
Key features of the DSPIC33CH256MP206 include integrated functional-safety support for ISO 26262 and IEC 61508 designs, 8 KB shared PRAM between the two cores, up to 200 MHz PWM with high-resolution duty cycle and edge placement, dual 12-bit ADCs at up to 3.5 Msps with up to 24 channels, and high-speed comparators and op-amps for current sensing. The dual-core architecture enables partitioning of time-critical control (slave) from application and communication code (master), reducing jitter and easing firmware certification for safety-critical systems.
The dsPIC33CH architecture uses a 16-bit Harvard bus with DSP extensions, separate instruction and data paths, and a tightly coupled DSP engine. The slave core's 100 MIPS and the master core's 90 MIPS performance support 32 kHz to 50 MHz FOC loops and Class-D audio amplification at >100 kHz switching frequencies, while peripheral triggers and DMA minimize CPU overhead and provide deterministic ISR latency.
Typical applications include high-performance motor control (BLDC, PMSM, ACIM, SRM), digital power supplies (PFC, LLC, full-bridge), renewable-energy inverters, automotive sensor fusion, Class-D audio amplifiers, and functional-safety industrial drives. The integrated op-amps and comparators remove external analog front-end components.
When laying out the board, dedicate a low-impedance ground return for the analog and power sections, keep the VCAP pin within 1 cm of its decoupling capacitor, and follow the recommended PCB layout in the family reference manual to meet the ADC SNR and PWM timing margins.
This page synthesizes distributor pricing, dual-core drop-in alternatives, and practical dual-core design notes beyond what is found in the standalone dsPIC33CH family datasheet.
Drop-in alternatives for DSPIC33CH256MP206-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH256MP206-I/PT (same form factor and footprint) — differing in Package, ADC, Core Architecture, Slave Core Speed, High-Resolution PWM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH256MP206T-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH256MP206-E/PT
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →DSPIC33CH128MP206-I/PT
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →DSPIC33CH256MP205-I/PT
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →DSPIC33CH256MP205T-I/PT
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →DSPIC33CH256MP206-I/PT Maximum Ratings & Electrical Characteristics
| Product Family | dsPIC33CH |
| Core Architecture | Dual-Core 16-bit DSC (Harvard + DSP engine) |
| Main Core Speed | 90 MIPS (180 MHz) |
| Slave Core Speed | 100 MIPS (200 MHz) |
| Program Flash (Master) | 256 KB |
| Auxiliary Flash (Slave) | 32 KB |
| SRAM | 32 KB |
| Shared PRAM | 8 KB |
| Package | TQFP-64 (PT) 10x10 mm |
| Operating Temperature | -40C to +85C (Industrial, -I) |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| ADC | Dual 12-bit, up to 3.5 Msps, up to 24 channels |
| PWM | Up to 200 MHz, 16 channels, high-resolution |
| Functional Safety | ISO 26262 / IEC 61508 capable |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
DSPIC33CH256MP206-I/PT Pin Configuration
| Pin 1 | RP58/RB2 — Remappable I/O / AN2 |
| Pin 2 | RP59/RB3 — Remappable I/O / AN3 |
| Pin 3 | RP60/RB4 — Remappable I/O / AN4 |
| Pin 4 | RP61/RB5 — Remappable I/O / AN5 |
| Pin 5 | AVSS — Analog ground |
| Pin 6 | AVDD — Analog supply voltage |
| Pin 7 | RP54/RF0 — Remappable I/O |
| Pin 8 | RP55/RF1 — Remappable I/O |
| Pin 9 | RP32/RG6 — Remappable I/O |
| Pin 10 | RP33/RG7 — Remappable I/O |
| Pin 11 | RP34/RG8 — Remappable I/O |
| Pin 12 | RP35/RG9 — Remappable I/O |
| Pin 13 | VSS — Digital ground |
| Pin 14 | VDD — Digital supply voltage |
| Pin 15 | RP36/RG10 — Remappable I/O |
| Pin 16 | RP37/RG11 — Remappable I/O |
| Pin 17 | RP38/RG12 — Remappable I/O |
| Pin 18 | RP39/RG13 — Remappable I/O |
| Pin 19 | RP40/RG14 — Remappable I/O |
| Pin 20 | RP41/RG15 — Remappable I/O |
| Pin 21 | RP74/RC10 — Remappable I/O |
| Pin 22 | RP75/RC11 — Remappable I/O |
| Pin 23 | RP76/RC12 — Remappable I/O |
| Pin 24 | RP77/RC13 — Remappable I/O |
| Pin 25 | RP78/RC14 — Remappable I/O |
| Pin 26 | RP79/RC15 — Remappable I/O |
| Pin 27 | VSS — Digital ground |
| Pin 28 | VCAP — Internal regulator output - decouple to VSS with 10uF |
| Pin 29 | RP70/RD6 — Remappable I/O |
| Pin 30 | RP71/RD7 — Remappable I/O |
| Pin 31 | RP65/RD1 — Remappable I/O |
| Pin 32 | RP64/RD0 — Remappable I/O |
| Pin 33 | RP66/RD2 — Remappable I/O |
| Pin 34 | RP67/RD3 — Remappable I/O |
| Pin 35 | RP68/RD4 — Remappable I/O |
| Pin 36 | RP69/RD5 — Remappable I/O |
| Pin 37 | RP48/RE0 — Remappable I/O |
| Pin 38 | RP49/RE1 — Remappable I/O |
| Pin 39 | RP50/RE2 — Remappable I/O |
| Pin 40 | RP51/RE3 — Remappable I/O |
| Pin 41 | RP52/RE4 — Remappable I/O |
| Pin 42 | RP53/RE5 — Remappable I/O |
| Pin 43 | VSS — Digital ground |
| Pin 44 | VDD — Digital supply voltage |
| Pin 45 | RP56/RF2 — Remappable I/O |
| Pin 46 | RP57/RF3 — Remappable I/O |
| Pin 47 | RP42/RF5 — Remappable I/O |
| Pin 48 | RP43/RF6 — Remappable I/O |
| Pin 49 | RP44/RF7 — Remappable I/O |
| Pin 50 | RP45/RF8 — Remappable I/O |
| Pin 51 | RP46/RF9 — Remappable I/O |
| Pin 52 | RP47/RF10 — Remappable I/O |
| Pin 53 | RP62/RB6 — Remappable I/O |
| Pin 54 | RP63/RB7 — Remappable I/O |
| Pin 55 | RP72/RB8 — Remappable I/O |
| Pin 56 | RP73/RB9 — Remappable I/O |
| Pin 57 | RP80/RB10 — Remappable I/O |
| Pin 58 | RP81/RB11 — Remappable I/O |
| Pin 59 | RP30/RB12 — Remappable I/O |
| Pin 60 | RP31/RB13 — Remappable I/O |
| Pin 61 | RP82/RB14 — Remappable I/O |
| Pin 62 | RP83/RB15 — Remappable I/O |
| Pin 63 | OSCI — Crystal oscillator input |
| Pin 64 | MCLR — Master clear / reset input (active low) |
Typical Applications
DSPIC33CH256MP206-I/PT is suitable for 6 applications: Field-Oriented Control (FOC) of PMSM Motors, Digital Power Conversion (PFC + Full-Bridge LLC), Automotive Sensor Fusion and ADAS, Class-D Audio Amplifier, Renewable Energy Solar Inverters, Industrial Functional-Safety Drives (IEC 61508).
Field-Oriented Control (FOC) of PMSM Motors
The DSPIC33CH256MP206 is purpose-built for PMSM and BLDC field-oriented control. The dedicated 100 MIPS slave core executes the Clarke-Park transform, SVPWM, and current PI loops with deterministic sub-microsecond jitter, while the 90 MIPS master core handles CAN FD communication, torque command arbitration, and housekeeping. With high-resolution 200 MHz PWM offering 250 ps edge placement, current loop bandwidth above 5 kHz is achievable. Dual 12-bit ADCs at 3.5 Msps sample phase currents synchronously to PWM, and integrated op-amps and comparators remove external current-sense amplifiers, reducing BOM cost and PCB area in EV traction and servo-drive designs.
Recommended
Digital Power Conversion (PFC + Full-Bridge LLC)
For AC-DC and DC-DC power supplies with active PFC and LLC resonant stages, the DSPIC33CH256MP206 drives the high-resolution 200 MHz PWM in complementary mode with programmable dead time. The slave core runs the average-current-mode PFC at 50 kHz to 100 kHz switching frequency with full DSP MAC acceleration, while the master monitors input voltage, manages PMBus telemetry, and updates the GUI. The 12-bit 3.5 Msps ADC samples the inductor current precisely in the middle of the PWM pulse, and ECC-protected Flash prevents corrupted firmware in long-life industrial power supplies. The integrated op-amps simplify the current-shunt amplifier path.
Recommended
Automotive Sensor Fusion and ADAS
The dsPIC33CH256MP206 family is qualified for ISO 26262 functional-safety applications, making it suitable for sensor fusion nodes, electric power steering (EPS) torque control, and braking-system ECUs. The dual-core lockstep configuration allows the slave to verify the master and trigger a windowed watchdog if divergence is detected. Dual 12-bit ADCs fuse wheel-speed, steering-angle, and yaw-rate signals, while CAN FD peripherals handle 2 Mbps communication with other vehicle ECUs. The industrial -I variant operates from -40C to +85C and is suitable for cabin-mounted ECUs; the -E variant (DSPIC33CH256MP206-E/PT) extends to +125C under-hood environments.
Recommended
Class-D Audio Amplifier
For high-efficiency Class-D audio amplifiers, the DSPIC33CH256MP206 delivers >100 kHz PWM switching with extremely low output noise thanks to its 250 ps high-resolution edge placement. The slave core runs the audio DSP pipeline (sample-rate conversion, biquad EQ, limiter) while the master handles I2S input from the codec and volume control via SPI potentiometer. The dual 12-bit ADCs monitor supply rails for adaptive voltage rails and DC-offset protection. Hardware short-circuit protection via the analog comparators and PWM fault shutdown prevents speaker damage under output-stage failure.
Recommended
Renewable Energy Solar Inverters
In residential and commercial photovoltaic inverters, the DSPIC33CH256MP206 coordinates MPPT, grid-tie synchronization, and anti-islanding on its dual cores. The slave core tracks the MPPT algorithm at 30 kHz to 50 kHz to maximize energy harvest, while the master handles grid-current control, PLL, and Modbus/RENESOL communication. The high-resolution 200 MHz PWM produces clean 50 Hz or 60 Hz sine current into the grid with low THD below 3%, meeting IEEE 1547 requirements. Functional-safety certification support simplifies compliance with UL 1741 and IEC 62116 anti-islanding tests.
Recommended
Industrial Functional-Safety Drives (IEC 61508)
In SIL-2/SIL-3 industrial drives such as robotics, CNC servos, and process-control valves, the DSPIC33CH256MP206 dual-core lockstep configuration satisfies IEC 61508 requirements for diagnostics and fault tolerance. The slave core monitors the master and executes safety-related logic (safe-torque-off, overcurrent, overspeed detection), while the master runs the application. ECC on Flash and SRAM prevents silent data corruption, and the windowed watchdog forces a safe shutdown on firmware faults. The 64-pin TQFP package exposes the full peripheral set needed for multi-axis drives in a single chip.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH256MP206-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH256MP206T-I/PT | DSPIC33CH256MP206-E/PT | DSPIC33CH128MP206-I/PT | DSPIC33CH256MP205-I/PT | DSPIC33CH256MP205T-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-64 (PT) | TQFP-64 (PT) - same | TQFP-64 (PT) - same | TQFP-64 (PT) - same | TQFP-48 - different | TQFP-48 - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Speed | 90 MIPS (180 MHz) | 90 MIPS | 90 MIPS | 90 MIPS | 90 MIPS | 90 MIPS |
| Slave Core Speed | 100 MIPS (200 MHz) | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Flash (Master) | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Pin Count | 64 | 64 | 64 | 64 | 48 | 48 |
| Functional Safety | ISO 26262 / IEC 61508 capable | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Dual-core DSC architecture with 100 MIPS slave core (vs Single-core dsPIC33CK256MP506)
- Same-package automotive temperature upgrade path (vs DSPIC33CH256MP206-E/PT)
- Cost-down path in same 64-pin TQFP footprint (vs DSPIC33CH128MP206-I/PT)
Design Notes
Place the VCAP pin (pin 28) within 1 cm of its 10 uF decoupling capacitor; do not share its ground return with high-current PWM outputs. Use separate analog (AVDD/AVSS) and digital (VDD/VSS) planes, joined at a single point under the IC, to keep ADC SNR within datasheet limits. A ferrite bead on the digital VDD supply is recommended for motor-control designs where PWM ground bounce would otherwise inject noise into ADC sampling.
Route PWM outputs first with the shortest possible traces to the gate driver; the high-resolution 200 MHz PWM has 250 ps edge placement, so even 50 mm of trace introduces ~0.5 ns of propagation delay that matters for dead-time accuracy. Place the crystal oscillator traces symmetrically around OSCI/OSCO with a guarded ground on both sides, and keep ADC inputs well away from PWM traces to avoid coupling.
Do not assume the slave and master cores share the same Flash: the master has 256 KB but the slave has its own 32 KB auxiliary Flash for safety isolation. Programming both requires separate linker scripts in MPLAB X. The -I grade variant is rated -40C to +85C only - for under-hood automotive, order the -E variant (DSPIC33CH256MP206-E/PT) which is rated +125C. AEC-Q100 qualification status should be confirmed with the latest Microchip product page before use in automotive safety-relevant designs.
The TQFP-64 (PT) 10x10 mm package dissipates up to ~1.0 W in industrial motor-control loops at full dual-core load. Estimated: at 90+100 MIPS dual-core utilization and 3.3 V supply, the die power is roughly 0.6 W, and with a theta_JA of ~55 C/W on a 4-layer JEDEC test board the junction temperature rises 33 C above ambient. No external heatsink is needed for typical motor-control duty, but at elevated ambient (>70 C) additional copper pours beneath the EP pad region are recommended.
Compliance Information
RoHS compliant per Microchip product page. -I grade is industrial temperature; -E grade is automotive extended. Functional-safety support for ISO 26262 and IEC 61508 is provided via the dsPIC33CH family, but AEC-Q100 qualification status varies by package and grade - confirm with Microchip product page before automotive design-in.
