DSPIC33CH64MP502T-I/2N - Dual-Core 16-bit DSC, CAN FD | Microchip
MPN: DSPIC33CH64MP502T-I/2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.91 | $49.10 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.55 | $3,550.00 |
DSPIC33CH64MP502T-I/2N Overview
A Digital Signal Controller merges the compute power of a DSP with the peripheral integration and control peripherals of a microcontroller, sitting between a general-purpose MCU and a dedicated DSP in the embedded hierarchy. The dsPIC33CH family is Microchip's dual-core DSC line: one core is designed as a master core for general supervision and communication, while the second slave core is optimized for high-speed control loops, enabling sophisticated algorithms without core contention.
Key features include dual-core operation with independent clocking, CAN Flexible Data (CAN FD) support for automotive and industrial networking, high-resolution PWM outputs targeted at digital power conversion, and Functional Safety (FuSa) documentation support. Per Microchip product literature, the dsPIC33CH64MP502 family operates from a 3V to 3.6V supply across -40C to +125C.
The dsPIC33CH architecture dedicates the master core to housekeeping tasks - communications, user interface, and system supervision - while the slave core executes deterministic, cycle-accurate control loops. Inter-core communication uses PRAM with mailbox-style messaging, allowing both cores to share data with low latency. The high-resolution PWM peripheral supports duty-cycle and frequency resolution well beyond conventional PWM blocks, which is critical for topologies such as LLC resonant converters and totem-pole PFC.
Typical applications include high-performance digital power supplies, wireless charging transmitters and receivers, server power supplies, drone motor control, and automotive sensors, per Microchip's product page.
Design-wise, budget the slave-core clock for worst-case loop latency, and plan a pull-up on the slave-core programming pin for ICSP access during development.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CH64MP502T-I/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH64MP502T-I/2N (same form factor and footprint) — differing in Core Architecture, Package, Functional Safety, Operating Temperature, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH64MP202T-I/2N
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →DSPIC33CH64MP202-I/2N
✅ Drop-In✓ In Stock
$3.31 / Unit
View Datasheet →DSPIC33CH64MP502T-E/2N
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH64MP502-I/2N
✅ Drop-In✓ In Stock
$3.4 / Unit
View Datasheet →DSPIC33CH64MP502T-I/2N Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dual-core (dsPIC33CH) |
| Core Clock | 180 MHz, 200 MHz (per DigiKey listing; Mouser cites 100 MHz dual core) |
| Program Memory Size | 88KB (88K x 8) FLASH + PRAM |
| Flash Nominal Capacity | 64KB (family designation per Mouser/Microchip) |
| Core Type | dsPIC DSC with DSP engine (master + slave core) |
| Supply Voltage Range | 3 V to 3.6 V |
| Operating Temperature | -40C to +125C (I grade) |
| Package | 28-UQFN (6x6 mm) |
| Mounting Type | Surface Mount |
| Data Bus Width | 16 bit |
| Communications Interfaces | CAN FD, UART, SPI, I2C |
| PWM Feature | High-Resolution PWM |
| Functional Safety | FuSa supported (per DigiKey listing) |
| Packaging | Tape & Reel (T suffix) |
| RoHS Status | Compliant |
DSPIC33CH64MP502T-I/2N 28-uqfn (6x6 mm) Pin Configuration Guide
Pin configuration for DSPIC33CH64MP502T-I/2N (28-uqfn (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH64MP502T-I/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH64MP502T-I/2N is suitable for 6 applications: Digital Power Supplies, Wireless Power Transfer, Drone Motor Control, Automotive Sensors, Server Power Supplies, Industrial Motor Control.
Digital Power Supplies
The DSPIC33CH64MP502T-I/2N fits high-performance digital power conversion because its dual-core architecture separates slow housekeeping (telemetry, CAN FD messaging, fault logging on the master core) from the fast voltage/current control loops executed deterministically on the slave core. The high-resolution PWM peripheral delivers the fine duty-cycle and frequency resolution that LLC resonant converters and totem-pole PFC stages need to hit tight regulation and efficiency targets at 3.0V-3.6V logic and -40C to +125C ambient. Placed as the single controller for a server PSU or telecom rectifier stage, the 88KB FLASH holds the compensator, soft-start, and protection firmware without external memory, while PRAM mailboxing keeps inter-core latency low so protection actions trip within microseconds of a transient.
Recommended
Wireless Power Transfer
Wireless charging transmitters require precise, rapidly adjusted PWM drive and closed-loop control of coil current and frequency tracking - exactly what the dsPIC33CH64MP502 provides with its high-resolution PWM and slave-core control loop. The master core manages foreign-object detection algorithms, communication with the receiver, and system supervision, while the slave core runs the resonant-converter control at high rate, keeping the operating point locked on the resonance frequency for maximum transfer efficiency. Operating from 3V to 3.6V over -40C to +125C, the 28-UQFN 6x6 mm package suits compact transmitter coils assemblies where PCB area is limited and thermal margin matters during high-power transfer sessions.
Recommended
Drone Motor Control
Drone electronic speed controllers benefit directly from the DSPIC33CH64MP502T-I/2N's split architecture: the slave core executes field-oriented control for BLDC motors at high loop rates, while the master core receives throttle commands, monitors battery state, and handles safety supervision concurrently. Microchip explicitly lists drones among the target applications for the dsPIC33CH dual-core family. The 16-bit DSP engine with hardware multiply-accumulate accelerates Clarke/Park transforms, and the high-resolution PWM yields smooth commutation with low acoustic noise. Weighing on a compact 28-UQFN 6x6 footprint with CAN FD available for multi-node airframe buses, one DSC can control a motor phase stage while remaining network-connected.
Recommended
Automotive Sensors
Automotive sensor modules - position, pressure, and current sensing nodes - need deterministic signal processing plus a robust network interface. The dsPIC33CH64MP502T-I/2N provides CAN FD on-chip for the vehicle bus, a -40C to +125C industrial-grade temperature rating, and Functional Safety (FuSa) support documentation per the DigiKey listing, which eases safety-relevant development. The slave core can run sensor compensation and DSP filtering continuously while the master core services the CAN FD stack and diagnostics, so neither task misses deadlines. Its 28-UQFN 6x6 package fits tight sensor housings, and the 3.0V-3.6V supply integrates with standard automotive 3.3V sensor rails after transient protection.
Recommended
Server Power Supplies
Server and data-center PSUs are a flagship application for the dsPIC33CH family per Microchip's product page. The DSPIC33CH64MP502T-I/2N supports the hot-swap digital control, power-good sequencing, and PMBus-style telemetry expected in server power stages; its dual-core design lets the slave core close the fast feedback loops on LLC or PFC stages while the master core manages digital communication, fault reporting, and firmware-upgradable housekeeping. The 88KB program FLASH accommodates full control plus communication stacks, and CAN FD interconnects redundant PSUs in parallel-operation schemes. High-resolution PWM improves light-load efficiency by enabling phase shedding and frequency dithering with fine granularity.
Recommended
Industrial Motor Control
For industrial drives and factory automation nodes, the DSPIC33CH64MP502T-I/2N offers the peripherals that modern motor control demands: high-resolution PWM for low-torque-ripple commutation, a DSP engine for FOC mathematics, and CAN FD for integration into industrial fieldbus networks. The master/slave split lets one chip run the motor control loop and simultaneously manage protocol handling, encoder interface supervision, and safety monitoring without software contention. Rated -40C to +125C in a surface-mount 28-UQFN 6x6 package, it suits compact drive add-on boards and smart actuator controllers where efficiency targets and EMI limits both benefit from the fine PWM resolution.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH64MP502T-I/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH64MP202T-I/2N | DSPIC33CH64MP202-I/2N | DSPIC33CH64MP502T-E/2N | DSPIC33CH64MP502-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | 16-bit dual-core | 16-bit dual-core | 16-bit dual-core | 16-bit dual-core | 16-bit dual-core |
| Program FLASH | 88KB (64KB-class family designation) | 88KB (64KB-class) | 88KB (64KB-class) | 88KB (64KB-class) | 88KB (64KB-class) |
| Temperature Range | -40C to +125C (I grade) | -40C to +125C (I grade) | -40C to +125C (I grade) | Extended (E grade) | -40C to +125C (I grade) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tube/Tray |
Key Differentiators
- CAN FD integrated on-chip (vs DSPIC33CH64MP202T-I/2N)
- Dedicated slave control core (vs DSPIC33EP64MC502)
- Extended-temperature migration path (vs DSPIC33CH64MP502T-E/2N)
- Trade-off: tape-and-reel suffix only in this MPN (vs DSPIC33CH64MP502-I/2N)
Design Notes
Supply the DSPIC33CH64MP502T-I/2N from a regulated 3.3V rail within the specified 3.0V-3.6V window. Estimated: with both cores clocked near maximum, active current is in the tens-of-mA class (exact value: consult the manufacturer datasheet electrical characteristics), so size the regulator and decoupling network for transient load steps when cores wake. Place 0.1uF ceramic capacitors at each VDD/VSS pair as close to the pins as possible, plus 4.7uF-10uF bulk per rail. Use a solid VDD/VSS plane pair under the UQFN to minimize supply bounce during dual-core operation.
Dual-core debugging is a frequent stumbling block: per Microchip developer documentation, the slave core uses alternative S1MCLRx pins for debugging, and it may be necessary to add a pull-up to the S1MCLRx pin to successfully access the slave core via ICSP. Plan these programming access points in the PCB layout from day one - retrofitting test points on a 28-UQFN 6x6 mm footprint is impractical. Also verify peripheral allocation (CAN FD, PWM channels) against the exact MP502 variant before committing to firmware that assumes the full peripheral set.
Estimated: the 28-UQFN 6x6 package relies on the exposed thermal pad and PCB copper for heat spreading. At moderate controller-level dissipation (well under 0.5W in typical DSC service), a 4x4 array of thermal vias from the exposed pad to a ground plane is sufficient to keep junction temperature well below the +125C rating at +85C ambient. For dense digital-power boards where neighboring converters heat the PCB, verify junction temperature with a thermal model rather than assuming ambient - the -40C to +125C rating applies to the die, not the local PCB microclimate.
For high-resolution PWM outputs driving power stages, route PWM traces short and away from analog sensing lines to prevent crosstalk into ADC inputs; use ground guard traces around feedback dividers. Keep the crystal/oscillator loop compact with local ground. CAN FD bus routing should use controlled impedance (typically 120-ohm differential) with a stub length under 3 cm from transceiver to controller pins. These practices preserve the deterministic timing the slave-core control loops depend on.
Compliance Information
RoHS compliance per standard Microchip production flow for current UQFN offerings; REACH, halogen-free, and conflict-minerals statements should be confirmed via Microchip's official environmental documentation for this exact MPN.