DSPIC33CK256MP308T-I/PT - 16-bit 100MIPS DSC 256KB | Microchip
MPN: DSPIC33CK256MP308T-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.99 | $1.99 |
| 10 | $1.89 | $18.90 |
| 100 | $1.79 | $179.00 |
| 500 | $1.69 | $845.00 |
| 1,000 | $1.59 | $1,590.00 |
DSPIC33CK256MP308T-I/PT Overview
A digital signal controller combines the computational capability of a digital signal processor with the peripheral integration and deterministic interrupt behavior of a microcontroller. Within the power-management hierarchy, the dsPIC33C family sits above general-purpose MCUs and below full DSPs, offering single-cycle MAC instructions, barrel shifting, and hardware divide that suit closed-loop control mathematics executed in firmware.
Key features of this device include the 100 MHz dsPIC33C core (100 MIPS), dual-panel Flash allowing live self-programming, integrated operational amplifiers for current-sense signal conditioning, 12-bit ADCs for high-resolution analog acquisition, and high-resolution PWM peripherals for switch-mode power conversion. Eight DMA channels offload data movement from the CPU. The part is also designated for Functional Safety (FuSa) support, aiding IEC 61508-style development workflows.
The MP308 device provides 69 general-purpose I/O, operates from a 3.0V to 3.6V single supply, and is rated for the industrial temperature range of -40C to +85C (the -I suffix). Rich peripheral sets, including multiple UART/SPI/I2C instances and analog comparators, reduce external component count in tightly integrated control boards.
Typical applications include digital power supplies, switch-mode converters, brushless and PMSM motor control, and advanced sensing systems where fast deterministic interrupt latency and hardware DSP math are essential. The integrated op amps make it especially attractive for current-loop control without external amplifiers.
For design, budget the 3.3V rail decoupling carefully and exploit dual-panel Flash to update code while the control loop runs.
This page synthesizes distributor pricing, drop-in alternatives within the dsPIC33CK family, and practical design guidance beyond the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK256MP308T-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK256MP308T-I/PT (same form factor and footprint) — differing in RAM, Supply Voltage.
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No drop-in alternatives available for this product.
Request AlternativesDSPIC33CK256MP308T-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33C RISC |
| Core Performance | 100 MIPS (100 MHz) |
| Flash Program Memory | 256 KB (256K x 8) |
| RAM | 64 KB (64K x 8) |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 80-TQFP (12x12 mm) |
| Mounting Type | Surface Mount |
| General-Purpose I/O | 69 |
| DMA Channels | 8 |
| ADC Resolution | 12-bit |
| Integrated Op Amps | Yes |
| PWM | High-resolution PWM |
| Functional Safety Designation | FuSa (Functional Safety) supported |
| Packaging | Tape & Reel (T suffix) |
| RoHS Status | ROHS3 Compliant |
| Number of Pins | 80 |
DSPIC33CK256MP308T-I/PT 80-tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK256MP308T-I/PT (80-tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP308T-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP308T-I/PT is suitable for 6 applications: Digital Power Supplies and PFC, Brushless DC and PMSM Motor Control, Solar Inverters and Energy Conversion, Battery Chargers and BMS, Industrial Automation and Sensing Nodes, Embedded Systems Development and Prototyping.
Digital Power Supplies and PFC
The DSPIC33CK256MP308T-I/PT fits digital switch-mode power conversion because its 100 MIPS core closes current loops fast enough for 100 kHz-plus power stages. The high-resolution PWM peripheral produces fine duty-cycle granularity (sub-ns effective resolution), reducing output ripple and improving transient response versus a fixed-resolution timer. Its 12-bit ADC can sample inductor current and output voltage with peripheral-triggered, deterministic latency, while 8 DMA channels stream results to RAM without CPU intervention. Use one op amp for current-sense amplification to remove an external amplifier stage. Dual-panel Flash lets firmware update the compensator coefficients in the second panel while the control loop keeps running from the first. Design the 3.3V rail with 0.1uF decoupling at each supply pin and route ADC references away from PWM switching noise to preserve conversion accuracy in the noisy power-stage environment.
Recommended
Brushless DC and PMSM Motor Control
Field-oriented control (FOC) of BLDC and PMSM motors demands both DSP math and precise PWM - exactly this DSC's strengths. The 16-bit core executes Clarke/Park transforms and PI current loops in single-digit microseconds at 100 MIPS, leaving headroom for speed loops and communication. Three integrated op amps condition low-side shunt currents directly, eliminating external current-sense amplifiers and their offset errors. The high-resolution PWM peripheral generates complementary outputs with dead-band insertion for the three-phase inverter bridge, while the 12-bit ADC samples phase currents synchronized to PWM center to avoid switching transients. Dual-panel Flash supports in-field firmware updates of the motion profile. For best results, size the 3.3V supply for the 69-GPIO pad switching and keep the analog reference plane separate from the gate-driver return path to prevent ADC offset errors during PWM edges.
Recommended
Solar Inverters and Energy Conversion
Grid-tied micro-inverters and solar optimizer products benefit from this controller's combination of DSP throughput and FuSa support. The 100 MIPS core runs MPPT algorithms plus grid-synchronization (PLL) and current-injection loops concurrently, while the high-resolution PWM drives interleaved boost and H-bridge stages with the sub-nanosecond resolution needed to meet low-THD grid requirements. The 12-bit ADC monitors DC bus, AC current, and temperature through multiple simultaneous channels with DMA-offloaded buffering. The Functional Safety (FuSa) designation and Microchip safety documentation support certification-oriented development for equipment touching the grid. Dual-panel Flash enables field firmware upgrades with rollback protection. Plan I/O allocation early: with 69 GPIO and rich PPS remapping, gate-drive, relay, and telemetry signals can be routed to minimize crossings, but confirm current-loop ADC channel assignments against the fixed analog pin map before layout freeze.
Recommended
Battery Chargers and BMS
Smart battery chargers use this DSC's analog and control resources to implement multi-stage CC/CV charging with precise termination. The 12-bit ADC measures battery voltage and shunt current with sufficient resolution for 0.5%-class charge regulation, and the integrated op amps buffer or amplify sense signals without external parts. High-resolution PWM controls buck/boost charging stages across wide input ranges, with cycle-by-cycle current limiting available in hardware. The 100 MIPS core simultaneously handles communication (SMBus-style I2C to a pack monitor), safety timers, and fault logging to the 256KB Flash file area. 8 DMA channels keep ADC sample streams flowing during communication bursts. Because charger boards combine hot power stages with precision sensing, place the controller's analog pins on the cool side of the PCB, use Kelvin connections to the shunt, and budget the -40C to +85C operating range against enclosure temperature rise.
Recommended
Industrial Automation and Sensing Nodes
Factory sensors and actuator interface modules exploit this DSC's DSP math for on-node FFT-based vibration analysis, sensor linearization, and protocol handling. The 100 MIPS core applies FIR/IIR filters and fixed-point transforms to 12-bit ADC streams buffered by DMA, extracting condition-monitoring features locally and sending only conclusions over UART/SPI/I2C. 69 GPIO drive relays, optocouplers, and local indication, while PPS remapping lets you match legacy connector pinouts without PCB respins. The industrial -40C to +85C rating and ROHS3-compliant 80-TQFP suit DIN-rail and panel-mounted electronics. FuSa documentation assists machinery-safety-adjacent designs. Use the 256KB Flash generously for parameter tables and multi-protocol stacks, and exploit dual-panel Flash for field updates without downtime. Keep analog front ends on a quiet ground island and use the internal op amps only for gains below 16x to preserve settling accuracy.
Recommended
Embedded Systems Development and Prototyping
As a development platform, the DSPIC33CK256MP308T-I/PT gives firmware teams a 100 MIPS, 256KB/64KB device with enough 69-GPIO breakout for rapid prototyping of peripherals. The 80-pin TQFP (12x12) is hand-solderable with hot air or a socket adapter, and ICSP programming needs only a few pins. Free MPLAB X IDE and XC16 compiler, plus the Microchip Code Configurator, generate peripheral setup code for PWM, ADC, op amps, and DMA in minutes. Dual-panel Flash supports bootloader-based iteration without external programmers on deployed boards. Choose the tray-packaged DSPIC33CK256MP308-I/PT for prototype batches and the T/R reel for production assembly lines. Stock both grades - I for lab and E for thermal chamber testing - since they are footprint-identical and code-compatible, letting one firmware image serve qualification and production hardware alike.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP308T-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP308-I/PT | DSPIC33CK256MP308T-E/PT | DSPIC33CK256MP308-E/PT | DSPIC33CK256MP608-I/PT | DSPIC33CK128MP308T-I/PT |
|---|---|---|---|---|---|---|
| Package | 80-TQFP (12x12) | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MHz dsPIC33C | 100 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C | -40C to +85C |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3.6 V max (per distributor listing) | 3 V to 3.6 V |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tray | Tape & Reel |
Key Differentiators
- Extended temperature option in the same footprint (vs DSPIC33CK256MP308T-E/PT)
- Double the Flash of the 128KB sibling (vs DSPIC33CK128MP308T-I/PT)
- Tape & Reel delivery for automated assembly (vs DSPIC33CK256MP308-I/PT)
Design Notes
Provide a clean 3.3V rail within the 3.0V-3.6V window. Place 0.1uF X7R ceramics at every VDD/VDDCORE pin pair within 2 mm, plus a 10uF bulk per supply domain. The 100 MHz core draws transient current on PWM edges; a shared rail with gate drivers will inject droop into the core supply. If the board uses a 5V input, use a dedicated low-noise LDO or buck module for the DSC rail, and sequence VDD before or together with the analog reference.
Treat the 80-TQFP (12x12) as a mixed-signal floor-plan problem: keep the 12-bit ADC inputs and integrated op amp pins on a quiet analog island with a single-point connection to the digital ground, and route PWM outputs away from AVDD/ADC traces. A solid ground plane with thermal relief on the exposed package leads gives best signal integrity. Avoid routing high-dv/dt gate-drive lines under the package; if unavoidable, add a local ground stitch via next to the ADC sense lines.
Confirm which temperature grade and order code you buy: -I (-40C to +85C) versus -E (-40C to +125C) share the identical die and footprint, so a BOM substitution of E for I is safe, but I for E is not in hot enclosures. Also distinguish the T (Tape & Reel) from tray versions when planning SMT feeders. Finally, dual-panel Flash self-programming consumes Flash sectors - reserve the configuration space and verify your bootloader protects the active panel before enabling live updates.
Compliance Information
Distributor data (ics-embedded) states ROHS3 Compliant. AEC-Q100 qualification is not stated in the provided data. REACH, halogen-free, and conflict-minerals status should be confirmed via Microchip compliance documentation.