DSPIC33CH64MP503-I/M5 - Dual Core 16-bit DSC 64KB Flash | Microchip
MPN: DSPIC33CH64MP503-I/M5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.85 | $4.85 |
| 10 | $4.45 | $44.50 |
| 25 | $4.25 | $106.25 |
| 100 | $3.95 | $395.00 |
| 1,000 | $3.55 | $3,550.00 |
DSPIC33CH64MP503-I/M5 Overview
A digital signal controller combines the computational capability of a digital signal processor (DSP) with the control peripherals and deterministic behavior of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33CH family sits above single-core dsPIC33C devices and is specifically architected for digitally controlled power conversion, where one core runs the control loop while the second core manages housekeeping, communications, or user interface tasks.
Key features include the asymmetric dual-core architecture (a high-performance Master core plus a tightly coupled Slave core designed for fast, deterministic execution of control loops), integrated CAN FD for robust automotive and industrial networking, and high-resolution PWM outputs that enable fine duty-cycle granularity in switching converters. The device operates from a 3.3V supply over an industrial temperature range of -40C to +85C and integrates 16KB of RAM (20480 words of data memory as reported by Microchip USA).
Technical depth: the Slave core can run at higher frequencies than the Master core, allowing critical control algorithms such as peak current-mode control or digital LLC compensation to execute with minimal latency, while peripherals like the high-resolution PWM and ADC synchronize to the switching period.
Typical applications include wireless charging transmitters and receivers, server and telecom power supplies, drone motor control and battery management, and automotive sensors - all domains explicitly targeted by Microchip for this dual-core family.
Design consideration: as a dual-core device, code partitioning between Master and Slave cores must be planned early; the Slave core is typically programmed by the Master at reset or independently in production, which affects flash allocation and debugging strategy.
This page synthesizes distributor pricing, drop-in alternatives, pinout/package details, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CH64MP503-I/M5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH64MP503-I/M5 (same form factor and footprint) — differing in Operating Temperature, Package, RoHS Status, ADC, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH64MP503-E/M5
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP203-I/M5
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →DSPIC33CH128MP203-E/M5
✅ Drop-In✓ In Stock
$4.61 / Unit
View Datasheet →DSPIC33CH64MP503-I/M5 Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core 16-bit dsPIC33CH (asymmetric Master/Slave) |
| Max Core Frequency | 100 MHz (family rating, per Mouser listing) |
| Flash Program Memory | 64 KB |
| Program Memory Width | 24-bit |
| RAM | 16 KB (20480 words, per Microchip USA) |
| Supply Voltage | 3.3 V |
| CAN Interface | CAN FD (Flexible Data rate) |
| Special Peripherals | High-Resolution PWM |
| Operating Temperature | -40C to +85C |
| Package | 36-pin UQFN with exposed pad (PQCC36, M5) |
| Terminal Pitch | 0.40 mm |
| Mounting Type | Surface Mount |
| Packaging | Tube |
| Process Technology | CMOS |
| Programming Interface | ICSP (multiple PGECx/PGEDx pin pairs) |
| Qualification Family | AEC-Q100 qualified -E variant available in same package |
| RoHS Status | Compliant (per distributor listings) |
| Target Applications | Digital power, motor control, wireless power, server PSU, drones, automotive sensors |
DSPIC33CH64MP503-I/M5 36-pin uqfn with exposed pad (pqcc36, m5) Pin Configuration Guide
Pin configuration for DSPIC33CH64MP503-I/M5 (36-pin uqfn with exposed pad (pqcc36, m5) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH64MP503-I/M5.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH64MP503-I/M5 is suitable for 6 applications: Digital Power Supplies (Server/Telecom PSU), Wireless Power Transfer, Drone Motor Control and Flight Power, Automotive Sensors, Industrial Motor Drives, Battery Management and Charging Systems.
Digital Power Supplies (Server/Telecom PSU)
The DSPIC33CH64MP503-I/M5 fits digitally controlled server and telecom power supplies because its Slave core executes the voltage-loop compensation deterministically while the high-resolution PWM provides the fine duty-cycle resolution that resonant LLC and ZVS topologies require for tight regulation across load range. In a typical implementation the Slave core closes the current-mode loop at the switching frequency using the fast ADC, while the Master core manages PMBus/CAN FD telemetry, housekeeping, and fault handling. This partitioning removes interrupt-latency jitter from the control path - a quantifiable benefit in loop phase margin and transient response. Trade-off: dual-core firmware partitioning adds development overhead compared with a single-core DSC, but yields higher efficiency and cleaner loop behavior at high switching frequencies.
Recommended
Wireless Power Transfer
Wireless charging transmitters and receivers benefit directly from the MP503's asymmetric dual-core design: the Slave core runs the frequency/phase control of the resonant half-bridge at high switching frequencies with the high-resolution PWM, while the Master core implements foreign-object detection logic, CAN FD or UART communication with the system controller, and thermal derating algorithms. Microchip explicitly lists wireless power as a target application for this family. The 3.3V supply integrates cleanly with gate-driver and auxiliary rails, and the 64KB Flash accommodates full Qi-style control firmware with margin. Performance consideration: fine PWM resolution directly reduces frequency-stepping artifacts in the resonant tank, improving coupling efficiency and EMI margins versus coarse 8-bit PWM controllers.
Recommended
Drone Motor Control and Flight Power
Drones pair brushless motor drives with strict weight and efficiency budgets, and the DSPIC33CH64MP503-I/M5 addresses both: the Slave core executes field-oriented control (FOC) loops for multiple motors with minimal latency, while the Master core handles CAN FD links to flight controllers and battery-management telemetry. The high-resolution PWM enables low-torque-ripple sinusoidal drive, extending flight time - a measurable system benefit. Microchip names drones as a target market for the dsPIC33CH family. The -40C to +85C industrial rating covers typical drone ambient conditions, though designers pushing high current density should verify board-level thermals around the UQFN exposed pad. CAN FD also future-proofs the design for redundant safety channels in commercial UAV platforms.
Recommended
Automotive Sensors
Automotive sensor modules - position, pressure, and current sensing nodes - require a robust network interface plus deterministic local signal processing, which the MP503 provides through its CAN FD peripheral and dual-core partitioning. The Master core manages CAN FD framing, diagnostic services (such as UDS-style messaging), and sensor linearization, while the Slave core runs high-rate sampling and DSP filtering on the fast ADC path. Microchip lists automotive sensors among the family's target applications, and the -E temperature-grade sibling (-40C to +125C, AEC-Q100 qualified) offers a same-footprint path to qualified production. Design note: choose the -E variant from the start for automotive programs to avoid requalification when migrating from the -I industrial grade.
Recommended
Industrial Motor Drives
Industrial drives and automation nodes use the DSPIC33CH64MP503-I/M5 to run FOC or sensorless-observer control on the Slave core while the Master core handles industrial fieldbus duties (CAN FD/CANopen-style messaging), safety interlocks, and human-interface I/O. The high-resolution PWM supports dead-time trimming at fine granularity, reducing switching losses in three-phase inverters - a directly quantifiable efficiency gain. The -40C to +85C rating covers cabinet-mounted industrial environments, and the 36-pin UQFN with exposed pad keeps board area small for compact drive boards. Trade-off: designers needing more parallel I/O for encoders and hall sensors should step up to the 48/64/80-pin dsPIC33CH family members in the same core architecture.
Recommended
Battery Management and Charging Systems
Advanced battery chargers and management units combine switching-converter control with pack telemetry, a workload profile that maps naturally onto the MP503's dual cores: the Slave core closes the charging-converter control loop (buck, boost, or LLC stage) using high-resolution PWM and fast ADC sampling of current and voltage, while the Master core runs state-of-charge estimation, cell-balancing coordination, and CAN FD communication with the vehicle or system host. The 64KB Flash holds both control and communication firmware comfortably, and 16KB RAM supports filtering and estimation state variables. Drone and wireless-charging battery systems - both family target markets - are common adopters of this partitioning strategy.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH64MP503-I/M5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH64MP503-E/M5 | DSPIC33CH128MP203-I/M5 | DSPIC33CH128MP203-E/M5 |
|---|---|---|---|---|
| Package | 36-pin UQFN EP (M5, PQCC36, 0.40 mm pitch) | 36-pin UQFN EP (M5) - same | 36-pin UQFN EP (M5) - same | 36-pin UQFN EP (M5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 64 KB | 128 KB | 128 KB |
| Core | Dual-core 16-bit dsPIC33CH, 100 MHz family rating | Dual-core 16-bit dsPIC33CH, 100 MHz | Dual-core 16-bit dsPIC33CH, 100 MHz | Dual-core 16-bit dsPIC33CH, 100 MHz |
| CAN Interface | CAN FD | CAN FD | CAN FD | CAN FD |
| High-Resolution PWM | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended, AEC-Q100) | -40C to +85C (industrial) | -40C to +125C (extended, AEC-Q100) |
| Automotive Qualification | No (-I industrial grade) | Yes (AEC-Q100) | No (-I industrial grade) | Yes (AEC-Q100) |
| Primary Selection Reason | Baseline 64KB industrial-grade option | Same memory, automotive temp/qualification | 2x Flash for larger firmware | 2x Flash + automotive temp/qualification |
Key Differentiators
- Industrial temperature grade at baseline cost (vs DSPIC33CH64MP503-E/M5)
- Dual-core asymmetric architecture (vs Single-core dsPIC33C parts)
- Memory headroom upgrade path without PCB change (vs DSPIC33CH128MP203-I/M5)
Design Notes
The M5 package is a 36-pin UQFN with an exposed pad on 0.40 mm terminal pitch. The exposed pad must be connected to a solid ground pour through an array of thermal vias - it is both the primary thermal path and the ground return for the DSC. With 0.40 mm pitch, specify a solder stencil with reduced aperture area (approximately 70-80%) on the fine-pitch lands to prevent bridging, and use NSMD pad geometry. Follow Microchip's surface-mount layout guidelines for PQCC/UQFN packages during reflow profiling.
Decouple the 3.3V rail with at least one 0.1 uF ceramic capacitor placed within 2 mm of each VDD pin pair, plus a bulk 4.7-10 uF capacitor near the device. The dual-core architecture means both cores can switch simultaneously; the internal regulator output capacitor specified in the datasheet must not be omitted or the Slave core may brown out during clock transitions. Verify the datasheet's specified VDD operating window around 3.3V before finalizing the power tree, and confirm brown-out detector settings match your supply ramp.
ICSP programming requires PGECx/PGEDx pairs to be used together - per the northernsoftware.com dsPIC33CH64MP503 development notes, if PGEC2 carries ICSPCLK then PGED2 must carry ICSPDAT. Do not route the chosen pair through connectors or series resistors that add excessive capacitance. Also plan the Master/Slave core flash partitioning before layout: the Slave core image may be stored in Master flash and loaded at boot, affecting your memory map. Keeping unused PGED/PGEC pins as dedicated programming pads simplifies production programming.
Compliance Information
RoHS compliant per onlinecomponents.com and FindIC distributor listings. The -I/M5 variant is the industrial grade; the AEC-Q100 qualified variant is the -E/M5 (-40C to +125C) per Microchip USA. REACH, halogen-free, and conflict-minerals statuses require Microchip official compliance documentation.
