Microchip Technology

DSPIC33CK32MP506-E/MR - 100MHz 16-bit DSC 64-QFN | Microchip

MPN: DSPIC33CK32MP506-E/MR ✓ Active
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3.0 V to 3.6 V Vdss 42.5 mA Id 64-QFN (9x9 mm), MR suffix Package 100 MHz (100 MIPS) Speed 32 KB (with ECC, dual-partition Live Update) Memory
From $3.55 USD / Unit
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Price updated: 2026-09-22
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Qty Unit Price Extended
1 $5.2 $5.20
10 $4.75 $47.50
100 $4.2 $420.00
500 $3.85 $1,925.00
1,000 $3.55 $3,550.00
ℹ️ All prices are in USD

DSPIC33CK32MP506-E/MR Overview

The Microchip Technology DSPIC33CK32MP506-E/MR is a 16-bit dsPIC33CK digital signal controller (DSC) running at 100 MHz (100 MIPS) with 32 KB of ECC-protected program Flash, 8 KB of data SRAM, and integrated CAN FD, housed in a 64-pin QFN (9x9 mm) package rated for -40C to +150C operation.

A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits alongside 32-bit MCUs and DSPs, targeting closed-loop control loops such as digital power conversion, motor control, and advanced sensing, where cycle-accurate PWM and fast ADC sampling dominate system performance.

Key features include the 100 MHz dsPIC33CK DSC core with DSP instruction extensions (dual 40-bit accumulators, single-cycle MAC), high-resolution PWM (HRPWM) with fine edge resolution, CAN Flexible Data (CAN FD) networking, three integrated operational amplifiers and three comparators that reduce external analog component count, and dual-partition Flash enabling Live Update firmware switching.

Technically, the dsPIC33CK32MP506 uses a Modified Harvard architecture with 24-bit instruction words, ECC on program Flash for functional-safety designs (the -E/MR variant is positioned for Functional Safety, FuSa), Memory Built-In Self-Test (MBIST) on SRAM, and a Peripheral Trigger Generator (PTG) for hardware-sequenced operation. Operating supply range is 3.0V to 3.6V per the dsPIC33CK family datasheet.

Typical applications include digital switch-mode power supplies (totem-pole PFC, LLC), brushless DC and PMSM motor drives, power-factor-correction stages, and automotive or industrial control nodes that must communicate over CAN FD. The 150C rated -E temperature option allows mounting close to heat-generating power stages.

Design consideration: at 100 MHz, keep the linear regulator feeding the 3.3V rail well decoupled and route the HRPWM outputs away from analog feedback lines; use the built-in op amps for current-sense amplification to shorten feedback loops.

This page synthesizes distributor availability, same-package drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for DSPIC33CK32MP506-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33CK32MP506-E/MR (same form factor and footprint) — differing in Operating Temperature, Package, Mounting Type, Core Architecture, Data SRAM.

Microchip Technology
Operating Temperature: -40C to +125C
Package: 64-QFN (9x9 mm), exposed pad
Core Architecture: 16-bit dsPIC DSC, Modified Harvard
Microchip Technology
Operating Temperature: -40 C to +125 C (E suffix, extended)
Package: VQFN-64 (9x9 mm) with exposed thermal pad
Mounting Type: Surface Mount (QFN)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33CK32MP506-I/MR

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
dsPIC33CK 16-bit DSC (modified Harvard) · 100 MHz (100 MIPS) · 32 KB · 8 KB · 3.0 V to 3.6 V · 3 · 3 · CAN FD

✓ In Stock

$3.1 / Unit

View Datasheet →

DSPIC33CK128MP506-E/MR

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
16-bit dsPIC DSC, Modified Harvard · DC to 100 MIPS (100 MHz core) · 128 KB (with ECC, dual-partition Live Update) · 16 KB · 3.0 V to 3.6 V · -40C to +125C · 2x CAN Flexible Data (CAN FD) · 3

✓ In Stock

$4.42 / Unit

View Datasheet →

DSPIC33CK32MP506T-E/MR

✅ Drop-In
📦 64-QFN (9x9 mm)
tape-and-reel packaging variant of the same die; tray vs reel supply only

📋 Reference alternative (not in catalog)

DSPIC33CK64MP506-I/MR

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 64-QFN (9x9 mm)
dsPIC33CK 16-bit DSC core · 100 MHz · 64 KB (64K x 8) · 8 KB · 3.0 V to 3.6 V · 12-bit · 3.5 Msps · 3

✓ In Stock

$1.58 / Unit

View Datasheet →

DSPIC33CK16MP506-I/MR

✅ Drop-In ⚠️ 参数待验证
📦 64-QFN (9x9 mm)
16 KB Flash vs 32 KB Flash (half memory), otherwise pin-to-pin family member

📋 Reference alternative (not in catalog)

DSPIC33CK256MP506-I/MR

✅ Drop-In ⚠️ 参数待验证
📦 64-QFN (9x9 mm)
256 KB Flash vs 32 KB Flash (8x memory) with dual-partition Live Update, same footprint

📋 Reference alternative (not in catalog)

DSPIC33CK32MP506-E/MR Maximum Ratings & Electrical Characteristics

Core dsPIC33CK 16-bit DSC
Maximum CPU Speed 100 MHz (100 MIPS)
Program Flash 32 KB (with ECC, dual-partition Live Update)
Data SRAM 8 KB (with MBIST)
Supply Voltage 3.0 V to 3.6 V
Operating Temperature -40C to +150C (E grade)
Package 64-QFN (9x9 mm), MR suffix
CAN CAN Flexible Data (CAN FD)
Op Amps On-Chip 3
Comparators On-Chip 3
PWM High-Resolution PWM (HRPWM)
Peripheral Trigger Generator Yes (PTG)
Architecture Modified Harvard, 24-bit instruction word
Functional Safety FuSa capable (ECC Flash, MBIST)
Mounting Type Surface Mount
Maximum Supply Current 42.5 mA
RoHS Status Compliant

DSPIC33CK32MP506-E/MR 64-qfn (9x9 mm), mr suffix Pin Configuration Guide

Pin configuration for DSPIC33CK32MP506-E/MR (64-qfn (9x9 mm), mr suffix package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

64-qfn (9x9 mm), mr suffix package pinout diagram for DSPIC33CK32MP506-E/MR

No detailed pinout data available for DSPIC33CK32MP506-E/MR.

Refer to the datasheet for full pin configuration.

Typical Applications

DSPIC33CK32MP506-E/MR is suitable for 6 applications: Digital Switch-Mode Power Supplies, BLDC and PMSM Motor Control, CAN FD Industrial Networking Nodes, High-Temperature Automotive and Industrial Sensing, LED Lighting and Electronic Ballasts, Portable Instrumentation and Advanced Sensing.

Digital Switch-Mode Power Supplies

The DSPIC33CK32MP506-E/MR fits digital power conversion because its high-resolution PWM delivers fine duty-cycle and phase resolution needed by LLC, half-bridge, and totem-pole PFC topologies, while the 100 MHz DSP core closes voltage and current loops in well under one switching period. The three on-chip op amps amplify current-shunt signals without external ICs, and the comparators implement cycle-by-cycle overcurrent protection in hardware, independent of firmware latency. Placed as the controller between the feedback dividers and gate-driver inputs, the DSC replaces analog control chips and adds programmable compensation, telemetry, and CAN FD diagnostics; the trade-off is the need to budget firmware worst-case loop latency against the analog alternative's fixed response.

🏭

BLDC and PMSM Motor Control

For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK32MP506-E/MR executes field-oriented control at 100 MHz with single-cycle MAC DSP instructions, keeping the current-loop sample-to-PWM-update path deterministic. Its high-resolution PWM produces low-current-ripple phase voltages that reduce audible noise and torque ripple, while integrated op amps buffer low-side shunt currents and comparators provide hardware fault cutoff. In a typical servo or e-bike drive, the DSC reads resolver or encoder inputs, computes Park/Clarke transforms, and drives a three-phase inverter through external gate drivers; the 150C-rated E grade permits mounting inside sealed motor housings. The constraint is 32 KB Flash, which comfortably holds FOC plus CAN FD but limits room for extensive protocol stacks.

🌐

CAN FD Industrial Networking Nodes

The integrated CAN Flexible Data module makes the DSPIC33CK32MP506-E/MR a strong fit for industrial nodes that must exchange larger payloads than classical CAN allows, such as battery telemetry, predictive-maintenance sensor frames, or firmware-over-CAN updates. CAN FD's 64-byte data field and bit-rate switching preserve determinism on the arbitration phase while boosting throughput during data phases, and the 100 MHz core handles framing, CRC, and application logic without a separate communication co-processor. In a factory automation cell, one DSC can simultaneously run a local control loop (using HRPWM and op amps) and bridge measurements onto the plant CAN FD backbone; ECC Flash and MBIST support functional-safety documentation demands for such nodes.

🚗

High-Temperature Automotive and Industrial Sensing

With a -40C to +150C operating rating, the E-grade DSPIC33CK32MP506-E/MR suits sensing and control modules located near engines, motor windings, power modules, or brake systems where conventional 85C parts cannot survive. The 32 KB ECC-protected Flash guards against bit corruption in high-radiation and high-vibration environments, and Memory Built-In Self-Test supports periodic diagnostics demanded by functional-safety assessments. A representative design uses the integrated op amps to condition thermocouple or shunt signals, the 12-bit ADC pipeline to sample them, and CAN FD to report results to the vehicle or machine ECU. Engineers should derate clock speed and verify AC timing parameters at the 150C extreme per the family datasheet electrical tables.

💡

LED Lighting and Electronic Ballasts

Digitally controlled LED drivers and HID ballasts benefit from the DSPIC33CK32MP506-E/MR's high-resolution PWM, which achieves the fine dimming granularity and phase management that 8-bit MCU PWM peripherals lack. The 100 MHz core runs power-factor-correction plus constant-current loops on one chip, the comparators protect against output shorts cycle-by-cycle in hardware, and the op amps sense LED current without external amplifiers. In a tunable industrial luminaire, the DSC can simultaneously regulate the boost-PFC front end and the buck LED stage, while CAN FD (or an added transceiver) accepts dimming scenes and reports fault status. The 150C E grade suits drivers sealed inside fixtures with limited airflow, where ambient temperatures regularly exceed 85C.

🔧

Portable Instrumentation and Advanced Sensing

The DSPIC33CK32MP506-E/MR serves battery-powered and bench instruments by combining a DSP-class 100 MHz core for FFT, filtering, and sensor-fusion math with low peripheral-count analog integration: three op amps and three comparators remove discrete front-end parts that inflate BOM cost in handheld designs. The Peripheral Trigger Generator sequences ADC conversions against PWM timing in hardware, reducing jitter in impedance-measurement or ultrasonic-sensing applications. Its 3.0V to 3.6V single-supply operation matches standard Li-ion and USB rails through a simple LDO, and 8 KB MBIST-backed SRAM provides reliable scratch memory for calibration data. Designers should note the 42.5 mA maximum supply current and size the power budget accordingly for battery-operated instruments.

What are the key specifications of DSPIC33CK32MP506-E/MR?
The DSPIC33CK32MP506-E/MR is a 16-bit dsPIC33CK digital signal controller with a 100 MHz core (100 MIPS), 32 KB of ECC-protected program Flash, and 8 KB of SRAM. It integrates CAN FD, three op amps, three comparators, high-resolution PWM, and a Peripheral Trigger Generator, and comes in a 64-pin QFN (9x9 mm) package rated -40C to +150C on a 3.0V to 3.6V supply. Specifications are per the Microchip dsPIC33CK32MP506 family datasheet and DigiKey product listing.
What is the operating temperature range of DSPIC33CK32MP506-E/MR?
The DSPIC33CK32MP506-E/MR operates from -40C to +150C. The E temperature suffix indicates the extended 150C junction-capable grade, compared with the standard I grade (-40C to +85C) or the 125C H grade. This makes the -E/MR suitable for mounting near power-conversion stages such as PFC and LLC converters where ambient temperatures exceed standard industrial ratings, according to the Microchip dsPIC33CK family datasheet.
Where to buy DSPIC33CK32MP506-E/MR online?
The DSPIC33CK32MP506-E/MR is listed at DigiKey (ships same day), Mouser, Avnet, Octopart-compared distributors, and specialty brokers such as Fusion Worldwide and Xecor. On XAIPART, request a quote for the part with tiered quantity pricing; as of 2026-09-23, indicative unit pricing is around USD 5.20 at qty 1, dropping near USD 3.55 at qty 1000. Always verify stock and lead time with the distributor before design release.
What is the price of DSPIC33CK32MP506-E/MR?
Indicative pricing for the DSPIC33CK32MP506-E/MR as of 2026-09-23 is approximately USD 5.20 for 1 unit, USD 4.75 at 10, USD 4.20 at 100, USD 3.85 at 500, and USD 3.55 at 1000 pieces. Volume pricing varies by distributor and market conditions; extended -E temperature grade parts typically carry a price premium over the standard -I/MR grade. Check DigiKey, Mouser, or XAIPART for a live quote.
Is DSPIC33CK32MP506-E/MR in stock and what is the lead time?
DigiKey's listing states 'Buy now, ships today' for the DSPIC33CK32MP506-E/MR, indicating same-day shipment from distributor stock as of the 2026-09-23 data capture. Mouser and Avnet also list the part for ordering. Lead times can vary with demand in the digital-power and motor-control markets, so confirm real-time inventory on the distributor page or via XAIPART before committing to production schedules.
What is the difference between DSPIC33CK32MP506-E/MR and DSPIC33CK32MP506-I/MR?
The only difference is the temperature grade: the -E/MR is rated -40C to +150C for extended-temperature use, while the -I/MR is rated -40C to +85C industrial. Both are pin-to-pin compatible in the same 64-QFN (9x9 mm) package with identical 100 MHz core, 32 KB Flash, 8 KB RAM, CAN FD, and analog peripherals, so they are true drop-in replacements. Source: Microchip dsPIC33CK32MP506 family datasheet and distributor listings.
What is the difference between DSPIC33CK32MP506 and DSPIC33CK128MP506?
The primary difference is program Flash size: the MP506 (32KB part) carries 32 KB while the 128MP506 carries 128 KB of ECC Flash. Both share the same 100 MHz dsPIC33CK core, 64-QFN MR package option, CAN FD, three op amps, three comparators, and HRPWM. The pinout for the same package and pin-count options is family-consistent, so the 128KB part in the MR package can serve as a higher-memory upgrade path. Source: Microchip dsPIC33CK family product page.
Can DSPIC33CK128MP506-E/MR replace DSPIC33CK32MP506-E/MR?
Yes, in most cases. The DSPIC33CK128MP506-E/MR offers the same 64-QFN (9x9 mm) MR footprint, 100 MHz core, 8 KB SRAM class peripheral set, and CAN FD, but with 128 KB Flash instead of 32 KB, so code written for the 32KB device fits with room to spare. Verify that your Flash programming algorithms and linker settings match the 128 KB memory map before swapping. This makes it a practical drop-in upgrade, not a downgrade.
When should I choose DSPIC33CK32MP506-E/MR over DSPIC33CK32MP502-I/SS?
Choose the DSPIC33CK32MP506-E/MR when you need the 64-pin package for maximum peripheral pin-out, the 150C extended temperature range, and full CAN FD networking - typical for digital power and motor-control boards. Choose the DSPIC33CK32MP502-I/SS when the design is cost-sensitive, needs fewer I/O pins in a smaller SSOP package, and operates within standard industrial temperatures. Both share the same core and Flash size, so the decision is driven by pin count, temperature, and footprint.
Is DSPIC33CK32MP506-E/MR suitable for digital power and motor control?
Yes. The dsPIC33CK family is explicitly targeted at digital power, motor control, advanced sensing and control applications per Microchip's product page. The DSPIC33CK32MP506-E/MR provides high-resolution PWM for fine duty-cycle control in LLC and totem-pole PFC stages, integrated op amps for current sensing, comparators for cycle-by-cycle current limiting, and a 100 MHz DSP core for fast control loops such as field-oriented motor control.
What is the best drop-in replacement for DSPIC33CK32MP506-E/MR?
The closest drop-in replacement is the DSPIC33CK32MP506-I/MR: identical 64-QFN (9x9 mm) package, identical memory and peripherals, differing only in maximum operating temperature (-40C to +85C industrial versus -40C to +150C extended). If your thermal analysis shows junction temperatures stay below 85C, the -I/MR is a cost-saving, pin-to-pin substitute. For higher memory in the same footprint, use DSPIC33CK128MP506-E/MR. Source: Microchip family datasheet.
Where to download the DSPIC33CK32MP506 datasheet PDF?
The official DSPIC33CK32MP506 datasheet is available from the Microchip product page at microchip.com/en-us/product/dsPIC33CK32MP506; it is a 640-page document covering the 28/36/48/64/80-pin 16-bit digital signal controllers with High-Resolution PWM and CAN FD. Mirror copies are indexed on alldatasheet.com and datasheet4u.com, but always prefer the latest revision from Microchip's official site to ensure you have current electrical specifications and errata.
Is DSPIC33CK32MP506-E/MR the same as DSPIC33CK32MP506T-E/MR?
Functionally they are the same die and the same 64-QFN (9x9 mm) package; the T suffix denotes tape-and-reel packaging for high-volume automated assembly, while the non-T part ships in trays. Both are rated -40C to +150C, 100 MHz, 32 KB Flash with ECC, and CAN FD. Choose the T variant if your contract manufacturer feeds reels directly into pick-and-place equipment. Source: Microchip part-numbering convention and distributor listings.
Does DSPIC33CK32MP506-E/MR support CAN FD and what is it used for?
Yes, the DSPIC33CK32MP506-E/MR integrates CAN Flexible Data (CAN FD), the 2015 extension to classical CAN that raises the payload to 64 bytes per frame and allows a faster arbitration-to-data bit-rate switch. In digital power and motor-control systems, CAN FD links the controller to gate drivers, battery management units, or industrial PLC backbones, supporting firmware update and telemetry with deterministic latency. The peripheral is detailed in the Microchip dsPIC33CK family datasheet.
Which programmer and IDE tools support DSPIC33CK32MP506-E/MR?
The DSPIC33CK32MP506-E/MR is supported by Microchip MPLAB X IDE and the XC16 compiler, and programs through the MPLAB ICD 4, MPLAB PICkit 4, or MPLAB Snap debuggers, which handle the ICSP interface of the dsPIC33CK family. Dual-partition Live Update firmware is managed through MPLAB Code Configurator and the family Flash programming specification. XAIPART recommends downloading the latest MPLAB X release for full 100 MHz device support. Source: Microchip development-tools ecosystem.

Engineering reference data for DSPIC33CK32MP506-E/MR — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC33CK32MP506-E/MR when your digital power, motor-control, or sensing node needs the full 64-pin peripheral expansion, integrated op amps and comparators, CAN FD, and reliable operation up to 150C near hot power stages. If your thermal analysis proves junction temperatures stay below 85C, the DSPIC33CK32MP506-I/MR is the same silicon at a lower cost and is a pin-to-pin drop-in. If firmware outgrows 32 KB Flash, move to the DSPIC33CK128MP506-E/MR (or 64MP506/256MP506 in the MR package) without changing the PCB. For cost-optimized, lower-pin-count designs, the DSPIC33CK32MP502-I/SS in SSOP is the leaner sibling. Avoid this family only if you need 32-bit floating-point DSP performance or >1 MB memory; then consider dsPIC33CH or 32-bit MCU alternatives.

Comparison with Alternatives

Parameter This Product DSPIC33CK32MP506-I/MR DSPIC33CK128MP506-E/MR DSPIC33CK32MP506T-E/MR DSPIC33CK64MP506-I/MR
Package 64-QFN (9x9 mm) MR 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Flash 32 KB (ECC) 32 KB (ECC) 128 KB (ECC) 32 KB (ECC) 64 KB (ECC)
Data SRAM 8 KB (MBIST) 8 KB (MBIST) 8 KB (MBIST) 8 KB (MBIST) 8 KB (MBIST)
CPU Speed 100 MHz (100 MIPS) 100 MHz 100 MHz 100 MHz 100 MHz
Operating Temperature -40C to +150C (E grade) -40C to +85C (I grade) -40C to +150C (E grade) -40C to +150C (E grade) -40C to +85C (I grade)
CAN FD Yes Yes Yes Yes Yes
Op Amps / Comparators 3 / 3 3 / 3 3 / 3 3 / 3 3 / 3

Key Differentiators

  • 150C extended temperature rating (vs DSPIC33CK32MP506-I/MR)
  • Integrated analog front end (vs Generic DSP or external-ADC solutions)
  • In-family Flash upgrade path in the same footprint (vs DSPIC33CK128MP506-E/MR)

Design Notes

The 64-QFN (9x9 mm) MR package uses a large exposed thermal pad that must be soldered to a ground array of thermal vias (typically 4x4 via grid) to achieve the datasheet thermal resistance and to carry the die's ground return. The -E/MR 150C rating depends on good pad soldering: a voided thermal pad can add tens of degrees C/W and void the extended-temperature margin. Follow the Microchip QFN land-pattern guidelines and inspect the pad with X-ray for high-reliability builds.

The dsPIC33CK core requires a 3.0V to 3.6V supply; provide a local 1uF plus 0.1uF decoupling pair at each VDD pin pair and an dedicated bulk capacitor near the package. The 42.5 mA maximum supply current (distributor-listed figure) does not include I/O and gate-drive loads, so size the regulator for peak switching activity. Use the on-chip LDO configuration options per the family datasheet and avoid long shared traces that couple HRPWM switching noise into the analog rails.

At 100 MHz, keep high-resolution PWM outputs on short, ground-guarded traces to gate drivers, and route current-sense feedback (routed through the internal op amps) on an analog island away from the PWM bank. Use the Peripheral Trigger Generator and ADC simultaneous sampling to minimize loop-latency jitter rather than software-triggered sampling, and enable the internal op amp bandwidth settings appropriate to your shunt values. Improperly shielded sense lines are the most common cause of noisy FOC current measurements in dsPIC33CK motor-control designs.

Do not substitute the -I/MR (85C) grade into sockets where the -E/MR (150C) was specified - ambient near power stages frequently exceeds 85C. Also remember the T (tape-and-reel) and non-T variants differ only in packaging, but reorder codes must match the assembler's feeder setup. Finally, 32 KB Flash fills quickly once CAN FD stacks and compensation libraries are linked; reserve headroom or choose the DSPIC33CK128MP506-E/MR same-footprint upgrade early in the project.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance inferred from Microchip standard product page and DigiKey listing; REACH and halogen-free status not stated in the provided web data - verify on Microchip's official environmental page.

Data verified on: 2026-09-23 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology DSPIC33CK32MP506-E/MR dsPIC33CK family DSPIC33CK128MP506-E/MR DSPIC33CK32MP502-I/SS DSPIC33CH64MP506T-I/PT digital signal controller DSC 16-bit MCU digital signal processor CAN FD high-resolution PWM ECC Flash MBIST 64-QFN (9x9 mm) QFN package family surface mount -40C to +150C extended temperature field-oriented control digital power conversion RoHS Functional Safety (FuSa) MPLAB X IDE XC16 compiler Modified Harvard architecture
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