DSPIC33CK512MP606T-I/MR - 100MIPS 512KB Flash DSC | Microchip
MPN: DSPIC33CK512MP606T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.2 | $7.20 |
| 10 | $6.55 | $65.50 |
| 100 | $5.85 | $585.00 |
| 500 | $5.3 | $2,650.00 |
| 1,000 | $4.75 | $4,750.00 |
DSPIC33CK512MP606T-I/MR Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic real-time behavior of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs for math-intensive, closed-loop control tasks such as field-oriented motor control (FOC) and digital power conversion, where single-cycle multiply-accumulate (MAC) and fast interrupt latency are essential.
Key features include the 100 MHz dsPIC33C core with DSP engine and two-panel flash for seamless program execution across panel boundaries, 53 general-purpose I/O lines, dual 12-bit ADCs supporting simultaneous multi-channel sampling, multiple 16-bit high-resolution PWM generators with dead-time insertion, and CAN FD with flexible messaging for automotive and industrial networks. Integrated analog op-amps reduce external component count in current-sense paths.
Architecturally, the dsPIC33CK family pairs the 16-bit Modified Harvard core with 8-channel DMA, enabling ADC-to-PWM loops with minimal CPU intervention. The 'T' suffix denotes tape-and-reel delivery and the '/I' suffix indicates the industrial temperature range of -40C to +85C; the '/E' variant extends to +125C for harsh environments.
Typical applications include brushless DC and PMSM motor drives, digital SMPS and LLC converters, solar micro-inverters, and automotive/industrial CAN FD nodes requiring deterministic control loops.
Design consideration: the 3.0-3.6 V supply range requires a clean LDO or buck-derived rail; keep ADC reference separate from motor-driver supply returns to protect 12-bit conversion accuracy.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK512MP606T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK512MP606T-I/MR (same form factor and footprint) — differing in Package, Operating Temperature, CAN Interface, Core, Data SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK512MP605-I/M7
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.98 / Unit
View Datasheet →DSPIC33CK512MP606T-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK256MP506T-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.98 / Unit
View Datasheet →DSPIC33CK128MP506-E/MR
✅ Drop-In✓ In Stock
$4.42 / Unit
View Datasheet →DSPIC33CK32MP506-E/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33CK512MP606T-I/MR Maximum Ratings & Electrical Characteristics
| Core Size | 16-bit |
| Core Type | dsPIC33CK |
| Speed | 100 MIPS (100 MHz) |
| Program Memory Size | 512 KB (512K x 8) Flash |
| Program Memory Type | FLASH (Dual Panel) |
| RAM Size | 64 KB (64K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| Number of I/O | 53 |
| Package | 64-QFN (9x9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Connectivity | CAN FD, UART, SPI, I2C |
| Peripherals | Op-Amps, 12-bit ADCs, High-Resolution PWM, DMA |
| DMA Channels | 8 |
| Packaging | Tape & Reel (T) |
| RoHS Status | Compliant |
DSPIC33CK512MP606T-I/MR 64-qfn (9x9 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK512MP606T-I/MR (64-qfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK512MP606T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK512MP606T-I/MR is suitable for 6 applications: Field-Oriented Motor Control (FOC), Digital Switch-Mode Power Supplies, CAN FD Industrial Network Nodes, Solar Micro-Inverters and Power Optimizers, Battery Management and Charging Systems, LED Drivers and Smart Lighting.
Field-Oriented Motor Control (FOC)
The DSPIC33CK512MP606T-I/MR is purpose-built for sensorless and sensored FOC of BLDC and PMSM motors. Its 100 MIPS dsPIC33CK core executes single-cycle MAC operations, sustaining current-loop execution rates above 20 kHz with deterministic latency. The high-resolution PWM generators provide sub-nanosecond edge placement for dead-time optimization, while dual 12-bit ADCs sample phase currents and DC-bus voltage simultaneously. On-chip op-amps condition shunt-resistor current feedback without external amplifiers. In a typical topology, the ADC end-of-scan event triggers the PWM update through hardware, and the 8-channel DMA moves control-loop data without CPU overhead, minimizing jitter. The 512 KB flash leaves ample room for FOC algorithms, communication stacks, and field-upgradeable firmware panels.
Recommended
Digital Switch-Mode Power Supplies
For digital SMPS designs including LLC resonant converters, totem-pole PFC, and synchronous buck stages, the DSPIC33CK512MP606T-I/MR combines fast analog sampling with fine PWM control. The dual 12-bit ADCs digitize output voltage and inductor current in the same instant, enabling accurate peak-current-mode control, while high-resolution PWM steps allow precise frequency and phase management in resonant topologies. Microchip explicitly supports this use case with the dsPIC33CK512MP606 Digital Power Plug-In Module (PIM, User's Guide DS70005519), which plugs into Explorer boards for rapid prototyping of digital power stages. Because loop bandwidths exceed 100 kHz, the hardware-triggered ADC-to-PWM path and DMA keep software latency out of the critical control loop, achieving regulation performance comparable to dedicated digital power controllers.
Recommended
CAN FD Industrial Network Nodes
Industrial automation and automotive-adjacent systems increasingly mandate CAN FD for higher payload and bandwidth. The DSPIC33CK512MP606T-I/MR integrates a CAN FD controller natively, supporting the flexible-data-rate frame format without an external controller chip. The 64 KB RAM buffers multiple RX/TX FIFOs and full message objects, while the 100 MIPS core filters, processes, and reacts to network commands with predictable timing - important for synchronized multi-axis motion and distributed drive systems. Combined with its motor-control PWM resources, a single MP606 can serve as both a fieldbus endpoint and a local motion controller, eliminating a second MCU. The industrial -40C to +85C grade of the /I suffix suits factory-floor cabinets, and the 64-QFN keeps node PCB area compact.
Recommended
Solar Micro-Inverters and Power Optimizers
Solar micro-inverter designs require simultaneous MPPT control, grid-synchronized current shaping, and safety compliance - a workload the DSPIC33CK512MP606T-I/MR handles within one device. Its dual 12-bit ADCs sample panel voltage/current and grid voltage/current concurrently, the high-resolution PWM drives interleaved boost and DC-AC stages, and the DSP core executes MPPT algorithms plus notch-filtered grid synchronization each switching cycle. The 512 KB dual-panel flash is a decisive advantage: one panel runs the certified grid-tie firmware while the other receives OTA updates, reducing field-service risk. Hardware comparators provide cycle-by-cycle overcurrent protection independent of software. The 3.0-3.6 V core supply simplifies auxiliary power design from the DC-link rail via a small buck regulator.
Recommended
Battery Management and Charging Systems
In lithium-ion battery chargers and BMS slave boards, the DSPIC33CK512MP606T-I/MR provides the charging profile control, cell-monitoring interface, and protective response required for safe operation. The 12-bit ADC measures cell voltages and pack current with adequate resolution for coulomb counting and impedance tracking, while PWM outputs drive synchronous buck charging stages with precise current regulation. On-chip op-amps amplify shunt-based current sense signals, and hardware comparators implement fast overcurrent/overvoltage trips that operate even if firmware faults. The 100 MIPS core runs state-of-charge estimation and CAN FD or UART communication to a pack master simultaneously. The dual-panel flash supports field firmware updates for evolving charging standards, an important lifecycle consideration for fleet and e-mobility products.
Recommended
LED Drivers and Smart Lighting
High-power LED luminaires benefit from the DSPIC33CK512MP606T-I/MR's digital dimming precision and protection features. High-resolution PWM with hardware dead-time controls buck or boost LED drivers at hundreds of kilohertz with smooth 0-100% dimming and flicker-free operation at all brightness levels, while the 12-bit ADC closes the current loop for constant-current regulation independent of LED forward-voltage drift. DALI or DMX protocols run over UART, and CAN FD suits networked architectural lighting on large sites. The 512 KB flash holds color-mixing curves, thermal-derating tables, and communication stacks with room for future feature upgrades. On-chip comparators provide instant short-circuit protection for the output stage, and the -40C to +85C industrial grade suits outdoor luminaires.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK512MP606T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK512MP605-I/M7 | DSPIC33CK512MP606T-E/MR | DSPIC33CK256MP506T-I/MR | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Core Speed | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
Key Differentiators
- Maximum flash in the 64-pin dsPIC33CK family (vs DSPIC33CK256MP506T-I/MR)
- Extended-temperature drop-in sibling available (vs DSPIC33CK512MP606T-E/MR)
- Full peripheral set versus reduced-interface sibling (vs DSPIC33CK512MP605-I/M7)
Design Notes
The DSPIC33CK512MP606T-I/MR requires a 3.0-3.6 V core supply. In motor-drive systems where the power stage runs from 24-48 V, derive the controller rail from a dedicated buck (e.g., a small synchronous buck followed by an LDO for ripple rejection) rather than sharing the gate-driver supply. Sequencing matters: hold the dsPIC in reset (MCLR low) until VDD is stable, using an external supervisor or the internal POR with a slow VDD ramp capacitor. Estimated: with typical running current of tens of mA at 3.3 V, controller dissipation is negligible; thermal budget is dominated by the power stage, not the MCU.
For the 64-QFN (9x9) package, dedicate a solid ground plane on layer 2 and stitch the exposed thermal pad with a 4x4 or larger via array to ground for both thermal relief and low-inductance analog reference. Keep the VDD/VDDCORE decoupling network (100 nF ceramic per supply pin plus 4.7-10 uF bulk) within 2 mm of the pins. Route ADC inputs as short shielded traces away from PWM lines and gate-drive loops; since dual ADCs sample phase currents synchronously, crosstalk from PWM edges directly degrades 12-bit current-loop accuracy in FOC applications.
The 'T' suffix means tape-and-reel - confirm your assembly line supports the reel and orientation, or order cut-tape (non-T) for prototypes. Firmware must match the memory size: code compiled for the 512 KB MP606 will not fit or link on 128 KB/256 KB family alternatives, so qualify the flash margin before standardizing on a smaller variant. Also note the /I and /E suffixes are functionally identical silicon but rated at different temperatures; using /I at sustained >85C ambient violates the datasheet rating even though the board 'appears to work'.
Compliance Information
RoHS compliance consistent with Microchip current production and distributor listings. Formal REACH, halogen-free, and conflict-minerals declarations should be confirmed via Microchip's certificate of conformance for this family.
