Microchip Technology

dsPIC33CK256MP506T-I/MR - 16-bit 100MHz DSC 256KB Flash | Microchip

MPN: DSPIC33CK256MP506T-I/MR ✓ Active
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64-QFN (9x9 mm), exposed pad Package 100 MHz Speed 256 KB (256K x 8) Memory
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Price updated: 2026-09-22
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DSPIC33CK256MP506T-I/MR Overview

The Microchip Technology DSPIC33CK256MP506T-I/MR is a 16-bit digital signal controller (DSC) with a 100 MHz dsPIC33CK core, 256 KB Flash memory and 24 KB RAM, housed in a 64-pin QFN (9x9 mm) surface-mount package with exposed thermal pad.

A digital signal controller combines the control-flow capabilities of a microcontroller with the mathematical throughput of a digital signal processor in a single chip. In the power-management hierarchy, the dsPIC33CK family sits above general-purpose MCUs and targets closed-loop control systems such as digital power conversion, motor control and advanced sensing, where fast deterministic interrupt response and hardware math acceleration are essential.

Key features include the 100 MHz dsPIC DSC core with DSP engine and single-cycle MAC, 256 KB (256K x 8) of Flash program memory, 24 KB of RAM, and CAN Flexible Data (CAN FD) connectivity for modern automotive and industrial networks. On-chip analog integration is a family hallmark: this device provides three operational amplifiers and three comparators, reducing external component count in current-sense and feedback signal chains. A Peripheral Trigger Generator (PTG) offloads deterministic sequenced trigger tasks from the CPU.

The dsPIC33CK architecture emphasizes high-resolution PWM and fast ADC peripherals, which are central to digital power topologies such as totem-pole PFC, LLC converters and multiphase buck regulators. The exposed-pad QFN-64 package provides low-inductance ground return and efficient heat spreading for switch-mode power stages running at elevated ambient temperatures, and the -I suffix denotes the industrial temperature grade.

Typical applications include digital power supplies (AC-DC and DC-DC), brushless DC and PMSM motor control drives, automotive and industrial CAN FD nodes, power-factor-correction stages, and high-performance sensing and control systems. The integrated op-amps allow on-chip current amplification directly ahead of the ADC, shortening the control loop latency.

Design consideration: with a 100 MHz core driving multiple high-resolution PWM channels, decouple all VDD/VDDCORE pins with low-ESR ceramics close to the package and connect the exposed pad to a solid ground plane; also verify that each PGECx/PGEDx pair is used consistently for ICSP programming.

This page synthesizes distributor inventory data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference for the DSPIC33CK256MP506T-I/MR.

Drop-in alternatives for DSPIC33CK256MP506T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33CK256MP506T-I/MR (same form factor and footprint) — differing in Package, Core, Operating Temperature, Core Speed, Program Memory (Flash).

Microchip Technology
Operating Temperature: -40C to +125C
Microchip Technology
Package: 64-QFN (9x9 mm)
Core: dsPIC33CK 16-bit DSC core
Operating Temperature: -40C to +85C (Industrial, I-grade)
Microchip Technology
Package: 64-QFN (MR) 9x9 mm, exposed pad
Core: dsPIC33CK 16-bit DSC core
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 64-QFN (9x9 mm), MR
Core: dsPIC33CK, 16-bit DSC
Operating Temperature: -40C to +125C (I grade)
Microchip Technology
Package: 64-QFN (9x9 mm)
Core: dsPIC33CK 16-bit DSC core
Program Memory (Flash): 256 KBytes with ECC, dual-partition Live Update
Microchip Technology
Package: 64-QFN (9x9 mm), MR suffix
Core: 16-bit dsPIC DSC
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 64-QFN (9x9 mm)
Operating Temperature: -40C to +85C (I grade)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33CK256MP506-I/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-QFN (9x9)
16-bit dsPIC DSC · 100 MHz (100 MIPS) · 256 KB · 24 KB · 3.0 V to 3.6 V · 64-QFN (9x9 mm), MR suffix · 12-bit

✓ In Stock

$2.3 / Unit

View Datasheet →

DSPIC33CK256MP506-E/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-QFN (9x9)
dsPIC33CK 16-bit DSC core · 100 MHz (up to 100 MIPS) · 256 KBytes with ECC, dual-partition Live Update · 24 KBytes with MBIST · 3.0 V to 3.6 V · -40C to +150C · -40C to +125C · 250 ps (high-resolution PWM)

✓ In Stock

$4.05 / Unit

View Datasheet →

DSPIC33CK256MP506T-E/MR

✅ Drop-In ⚠️ Specs Unverified
📦 64-QFN (9x9)
tape-and-reel extended-temperature variant; identical die and pinout to this part

📋 Reference alternative (not in catalog)

DSPIC33CK128MP506-I/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-QFN (9x9)
dsPIC33CK 16-bit DSC core · 100 MHz (100 MIPS) · 128 KB (128K x 8) with ECC and live update · 16 KB · 3.0 V to 3.6 V · -40C to +85C (Industrial, I-grade) · 64-QFN (9x9 mm)

✓ In Stock

$4.35 / Unit

View Datasheet →

DSPIC33CK128MP506-E/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-QFN (9x9)
16-bit dsPIC DSC, Modified Harvard · DC to 100 MIPS (100 MHz core) · 128 KB (with ECC, dual-partition Live Update) · 16 KB · 3.0 V to 3.6 V · -40C to +125C · 2x CAN Flexible Data (CAN FD) · 3

✓ In Stock

$4.42 / Unit

View Datasheet →

DSPIC33CK256MP506T-I/MR Maximum Ratings & Electrical Characteristics

Core 16-bit dsPIC33CK DSC
Core Speed 100 MHz
Flash Memory 256 KB (256K x 8)
RAM 24 KB
Data Bus Width 16 bit
Package 64-QFN (9x9 mm), exposed pad
Number of Pins 64
On-chip Operational Amplifiers 3
On-chip Comparators 3
CAN Interface CAN FD (Flexible Data)
Peripheral Trigger Generator (PTG) Yes
High-Resolution PWM Yes (per family datasheet)
Mounting Type Surface Mount
Temperature Grade -I (Industrial, -40C to +85C)
RoHS Status Compliant

DSPIC33CK256MP506T-I/MR 64-qfn (9x9 mm), exposed pad Pin Configuration Guide

Pin configuration for DSPIC33CK256MP506T-I/MR (64-qfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

64-qfn (9x9 mm), exposed pad package pinout diagram for DSPIC33CK256MP506T-I/MR

No detailed pinout data available for DSPIC33CK256MP506T-I/MR.

Refer to the datasheet for full pin configuration.

Typical Applications

DSPIC33CK256MP506T-I/MR is suitable for 6 applications: Digital Power Supplies (AC-DC / DC-DC), BLDC / PMSM Motor Control Drives, Automotive and Industrial CAN FD Nodes, Power Factor Correction (PFC) Stages, Advanced Sensing and Control Systems, Embedded Control in Industrial Automation.

⚡

Digital Power Supplies (AC-DC / DC-DC)

The dsPIC33CK256MP506T-I/MR fits digital power conversion because its 100 MHz core closes current-mode control loops with ample cycle margin, and its high-resolution PWM delivers the sub-nanosecond duty-cycle granularity required by LLC, totem-pole PFC and multiphase buck topologies. The three integrated op-amps amplify shunt-resistor current signals directly ahead of the ADC, cutting external component count and loop latency in fast feedback paths. In a typical AC-DC design the DSC samples input/output voltages and inductor current each switching cycle, computes the control law in the DSP engine, and updates the PWM comparators deterministically. Unlike a fixed-frequency analog controller, firmware enables adaptive burst mode, frequency dithering for EMI, and full telemetry over the CAN FD or UART link. The exposed-pad 64-QFN (9x9 mm) package spreads heat from the digital section while remaining compatible with compact power-supply PCBs, and the -I industrial temperature grade covers typical PSU ambient environments.

🏭

BLDC / PMSM Motor Control Drives

Field-oriented control of brushless DC and permanent-magnet synchronous motors demands fast, deterministic math and precise PWM, and the dsPIC33CK256MP506T-I/MR delivers both: the 100 MHz dsPIC DSC core executes FOC current loops at high rates using its single-cycle MAC DSP engine, while high-resolution PWM phases drive the three-phase inverter with minimal dead-time distortion. The on-chip three op-amps condition low-side or inline shunt currents into the ADC without external amplifiers, and three comparators provide hardware overcurrent trip that shuts off PWM outputs in microseconds, independent of software. Firmware resident in the 256 KB Flash accommodates sensorless observers, field-weakening and communication stacks simultaneously. The 64-pin QFN exposes sufficient PWM, ADC and quadrature-encoder-interface pins for a complete drive, and the CAN FD module integrates the controller into industrial networked drives. The industrial -I temperature grade suits enclosed motor-drive environments from -40C to +85C ambient.

🚗

Automotive and Industrial CAN FD Nodes

The integrated CAN Flexible Data module makes the dsPIC33CK256MP506T-I/MR a strong candidate for networked sensing and control nodes that must move larger payloads or higher bit rates than classical CAN allows. CAN FD extends data frames to 64 bytes and supports a faster arbitration/data-phase bit-rate switch, and the DSC hardware module handles this without CPU bit-timing overhead. In an industrial automation node, the 100 MHz core runs local control tasks while CAN FD streams diagnostics, parameter sets and firmware-update frames over the network. The 256 KB Flash stores dual-bank firmware for field upgrades, and the 24 KB RAM buffers network traffic alongside control state. Paired with a CAN FD transceiver, the node achieves the robust differential signaling the CAN standard is known for. Note that the standard -I part is not automotive AEC-Q100 qualified; select a Q-variant of the family for in-vehicle applications and verify qualification status in the Microchip product selector.

🔌

Power Factor Correction (PFC) Stages

Average-current-mode power factor correction benefits directly from this DSC's architecture: the fast ADC samples rectified line voltage and inductor current near the switching frequency, the DSP engine computes the PFC control law, and high-resolution PWM updates the boost switch duty cycle with fine granularity that reduces input-current distortion at light load. The dsPIC33CK256MP506T-I/MR runs the PFC loop and housekeeping (inrush control, brown-out detection, surge counters) on one chip, with the PTG peripheral triggering ADC conversions on precisely sequenced PWM events - keeping sample timing jitter-free without CPU intervention. Firmware flexibility allows switching between boost, totem-pole and interleaved PFC variants on the same PCB. Because PFC stages operate hot, the exposed-pad 64-QFN layout should be tied to generous copper area; junction temperature must be kept within the -I grade limits by estimating dissipation from core frequency and peripheral activity per the family datasheet power equations.

🧩

Advanced Sensing and Control Systems

High-performance sensing nodes use the dsPIC33CK256MP506T-I/MR where raw MCU analog front ends fall short: three on-chip op-amps provide gain stages for bridge, shunt or photodiode signals, and the fast ADC digitizes them synchronously with PTG-triggered sampling that eliminates software timing jitter. The DSP engine then applies FIR/IIR filtering and FFT analysis in real time at 100 MHz. Typical deployments include impedance measurement, vibration monitoring and precision actuator control, where the 256 KB Flash holds calibration tables, compensation firmware and communication stacks simultaneously. Results and setpoints travel over CAN FD, UART or SPI to a supervisory controller, making the DSC a smart satellite in larger automation architectures. The 64-pin QFN provides enough GPIO to drive local relays, indicators and debug interfaces, while the industrial temperature rating and RoHS-compliant package suit factory-floor installations. Designers should place analog traces away from PWM routing to preserve the signal chain's noise performance.

🏭

Embedded Control in Industrial Automation

General industrial control panels and automation sub-systems adopt the dsPIC33CK256MP506T-I/MR when a project needs both real-time DSP-grade control and rich connectivity in one 64-QFN device. The 100 MHz core handles PID loops for process variables, the CAN FD module links to PLC networks, and the Peripheral Trigger Generator automates deterministic timing sequences that would otherwise consume CPU cycles. With 256 KB of Flash, one device can host application logic, a bootloader for field firmware updates over CAN, and diagnostic logging in RAM/Flash simultaneously - avoiding an external memory chip. The three op-amps and three comparators offload analog monitoring of sensors and fault conditions. The 64-pin count supports multiple encoder inputs, HMI touch lines and safety-interlock IO typical of machinery sub-systems. For new panel designs, the pin-compatible dsPIC33CK128MP506 offers a cost-reduced variant when the firmware image is smaller, enabling a two-tier product line on a single PCB layout.

Recommended Products Summary

MCP2562FD CAN FD transceiver for telemetry Used in: Digital Power Supplies (AC-DC / DC-DC), BLDC / PMSM Motor Control Drives, Automotive and Industrial CAN FD Nodes, Embedded Control in Industrial Automation MCP1501 Precision voltage reference for ADC Used in: Digital Power Supplies (AC-DC / DC-DC), Power Factor Correction (PFC) Stages MCP9808 I2C temperature sensor for drive monitoring Used in: BLDC / PMSM Motor Control Drives, Advanced Sensing and Control Systems MCP79410 RTCC for event timestamping Used in: Automotive and Industrial CAN FD Nodes MCP3201 Auxiliary ADC channel Used in: Power Factor Correction (PFC) Stages, Advanced Sensing and Control Systems MCP23017 I2C GPIO expander Used in: Embedded Control in Industrial Automation
What is the dsPIC33CK256MP506T-I/MR and what are its key specifications?
The dsPIC33CK256MP506T-I/MR is a Microchip 16-bit digital signal controller with a 100 MHz dsPIC33CK core, 256 KB Flash, 24 KB RAM, three op-amps, three comparators, CAN FD and PTG, packaged in a 64-pin QFN (9x9 mm). According to the Microchip product page, the dsPIC33CK family targets digital power, motor control, advanced sensing and control applications.
How much Flash and RAM does the dsPIC33CK256MP506T-I/MR have?
The dsPIC33CK256MP506T-I/MR has 256 KB (256K x 8) of Flash program memory and 24 KB of RAM. Per Mouser and DigiKey listings, this is the largest memory option in the 64-pin MP506 sub-family, allowing storage of complex control firmware including field-oriented motor control algorithms and CAN FD protocol stacks.
What is the difference between dsPIC33CK256MP506T-I/MR and dsPIC33CK128MP506?
The main difference is Flash memory: the dsPIC33CK256MP506 has 256 KB while the dsPIC33CK128MP506 has 128 KB, exactly half. Both share the same 100 MHz core, 64-pin QFN package, three op-amps, three comparators and CAN FD, making the 128 KB version a pin-compatible downgrade when firmware fits. Choose the 256 KB part for larger code bases or future headroom.
dsPIC33CK256MP506 vs dsPIC33EP256MC506 - which is better for digital power?
The dsPIC33CK256MP506 is better for digital power. The older dsPIC33EP256MC506 runs a 70 MIPS core, while the dsPIC33CK256MP506 runs 100 MHz with an improved DSP engine, higher-resolution PWM and faster ADCs. According to Microchip, the dsPIC33CK family is specifically positioned for digital power and advanced control; the EP family is a legacy choice for cost-sensitive existing designs.
What is the best drop-in replacement for dsPIC33CK256MP506T-I/MR?
The best drop-in replacements are same-family 64-pin QFN variants: dsPIC33CK256MP506-I/MR (standard reel packaging, identical die and pinout), dsPIC33CK256MP506-E/MR (extended temperature range, pin-to-pin compatible), and dsPIC33CK128MP506-I/MR (same package and peripherals, half the Flash). All mount on the same 64-QFN footprint. No cross-brand pin-compatible equivalent exists, as the dsPIC DSC core architecture is proprietary to Microchip.
Is there a cross-brand equivalent for the dsPIC33CK256MP506T-I/MR?
No true cross-brand drop-in equivalent exists for the dsPIC33CK256MP506T-I/MR. The dsPIC DSC architecture, peripheral set (high-resolution PWM, PTG, integrated op-amps) and 64-QFN pinout are Microchip-proprietary. Closest functional competitors such as TI C2000 or Renesas RX MCUs use different packages and pinouts and require PCB redesign. Same-family Microchip variants are the only pin-to-pin options.
Can I use dsPIC33CK256MP506T-I/MR for motor control applications?
Yes, the dsPIC33CK256MP506T-I/MR is well suited to motor control. Its 100 MHz core executes field-oriented control (FOC) loops with margin, the three on-chip op-amps amplify shunt current signals ahead of the ADC, and three comparators support fast overcurrent trip. Microchip positions the dsPIC33CK family explicitly for precision motor control of BLDC and PMSM drives.
Is the dsPIC33CK256MP506T-I/MR suitable for CAN FD networks?
Yes, the dsPIC33CK256MP506T-I/MR integrates a CAN Flexible Data (CAN FD) module, supporting the higher data payloads and switching bit rates of CAN FD versus classical CAN. Combined with an external CAN FD transceiver such as the MCP2562FD, it fits automotive body, industrial automation and networking nodes. Always verify transceiver supply compatibility with the DSC IO voltage in your design.
What package does the dsPIC33CK256MP506T-I/MR come in?
The dsPIC33CK256MP506T-I/MR comes in a 64-pin QFN package measuring 9x9 mm with an exposed thermal pad. DigiKey lists it as 64-QFN (9x9). The exposed pad must be soldered to a ground plane for both thermal dissipation and the low-inductance ground return required by its fast switching peripherals in digital power designs.
Where can I download the dsPIC33CK256MP506T-I/MR datasheet PDF?
You can download the dsPIC33CK256MP506 family datasheet from the official Microchip product page at microchip.com/en-us/product/dsPIC33CK256MP506, or via LCSC which hosts a free PDF for this exact MPN. The family datasheet covers the 28/36/48/64/80-pin 16-bit DSCs with high-resolution PWM and CAN FD; use it together with the family reference manual for register-level detail.
What is the price of dsPIC33CK256MP506T-I/MR?
As of 2026-09-23, the dsPIC33CK256MP506T-I/MR typically sells in the range of roughly 5 to 8 USD at unit quantity from authorized distributors such as Mouser, DigiKey and Newark, with volume pricing dropping toward the 5 USD range at 1000-piece quantities. Prices fluctuate with inventory conditions; request a quote on this page for current XAIPART pricing and lead time.
Where to buy dsPIC33CK256MP506T-I/MR online?
You can buy the dsPIC33CK256MP506T-I/MR from authorized distributors including Mouser, DigiKey, Newark and LCSC, all of which list this exact Microchip MPN. XAIPART also supplies this part - request a quote for pricing and lead time. Purchasing from authorized channels ensures factory-new, traceable components with full Microchip warranty support.
Is dsPIC33CK256MP506T-I/MR in stock and what is the lead time?
Stock levels for the dsPIC33CK256MP506T-I/MR change frequently across Mouser, DigiKey and Newark; DigiKey listings historically show ships-today availability. For current XAIPART stock and lead time, submit a quote request - lead times typically range from in-stock/same-day ship to several weeks depending on volume. The T (tape-and-reel) suffix version is the standard high-volume ordering option.
How do I program the dsPIC33CK256MP506T-I/MR?
Program the dsPIC33CK256MP506T-I/MR via In-Circuit Serial Programming (ICSP) using a PGECx/PGEDx pin pair - the device has multiple pairs and any pair works, but ICSPCLK and ICSPDAT must come from the same numbered pair (e.g., PGEC2 with PGED2). Compatible tools include Microchip PICkit, ICD and Real ICE programmers; third-party NSDSP-1/2/3 programmers are also confirmed to support this device.
What thermal and layout considerations apply to the 64-QFN package?
Connect the exposed pad of the 64-QFN (9x9) to a solid ground plane with an array of vias; this is required for heat spreading and low-inductance grounding in switching applications. Decouple every VDD pin with 100 nF ceramics placed within a few millimeters, and keep high-resolution PWM traces short and away from analog op-amp inputs. This is standard practice per Microchip dsPIC33CK design guidance.

Engineering reference data for DSPIC33CK256MP506T-I/MR — comparison, design guidance, and compliance information.

Selection Guide

Choose the dsPIC33CK256MP506T-I/MR when your design needs maximum Flash (256 KB) for FOC motor control, digital power or CAN FD firmware in a 64-QFN footprint, purchased in tape-and-reel volume. If you prototype in low volume, pick DSPIC33CK256MP506-I/MR (same die, tray packing). For ambient temperatures above 85C or hot enclosures, choose the -E extended-temperature variants. If your compiled firmware fits under 128 KB and you want cost reduction, the DSPIC33CK128MP506 variants are pin-compatible downgrades on the same PCB. There is no cross-brand drop-in: TI C2000 or Renesas alternatives require a board redesign. Avoid this part for automotive safety systems needing AEC-Q100 - select a qualified family variant or the dsPIC33CH dual-core series instead.

Comparison with Alternatives

Parameter This Product DSPIC33CK256MP506-I/MR DSPIC33CK256MP506-E/MR DSPIC33CK128MP506-I/MR DSPIC33CK128MP506-E/MR
Package 64-QFN (9x9 mm) 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core Speed 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
Flash Memory 256 KB 256 KB 256 KB 128 KB 128 KB
On-chip Op-Amps / Comparators 3 / 3 3 / 3 3 / 3 3 / 3 3 / 3
CAN FD Yes Yes Yes Yes Yes
Temperature Range -40C to +85C (-I) -40C to +85C -40C to +125C (E) -40C to +85C -40C to +125C (E)
Typical Use Case Digital power, motor control, CAN FD nodes (volume production, tape & reel) Same, tray packaging for prototyping/low volume Same plus high-ambient environments Cost-reduced when firmware fits 128 KB Cost-reduced high-temperature variant

Key Differentiators

  • Maximum family Flash for complex control firmware (vs DSPIC33CK128MP506-I/MR)
  • On-chip analog integration reduces BOM cost (vs External op-amp solution (e.g., discrete MCP6021 stages))
  • High-temperature availability (vs DSPIC33CK256MP506-I/MR)
  • Trade-off: not automotive qualified (vs dsPIC33CH dual-core family)

Design Notes

Solder the exposed pad of the 64-QFN (9x9) to a ground plane through an array of thermal vias. This pad is the primary ground return for the fast switching peripherals and the main heat path; a floating or under-viadded pad causes both thermal and signal-integrity problems in digital power layouts. Place a 100 nF ceramic capacitor at every VDD pin within 2-3 mm of the pin, plus bulk 10 uF capacitance near the package, per standard Microchip dsPIC33C decoupling guidance.

The device provides multiple PGECx/PGEDx programming pin pairs. Any pair may be used for ICSP, but ICSPCLK and ICSPDAT must come from the same numbered pair (e.g., PGEC2 with PGED2) - mixing pairs from different numbers is a common bring-up failure. Route your programming header to one pair and leave it dedicated. Also, all VSS and VDD pins must be connected; do not assume unused supply pins are optional.

Keep high-resolution PWM routing short and physically separated from the op-amp and ADC analog traces. The on-chip op-amps amplify millivolt-level shunt signals; PWM switching edges couple readily into adjacent routing on dense QFN layouts. Use a solid ground reference under analog traces, filter the op-amp inputs with small RC networks at the shunt, and trigger ADC sampling from the PTG/PWM events rather than software to guarantee loop-timing determinism.

Estimated: core and peripheral dissipation scale with operating frequency and PWM/ADC activity. For a 100 MHz digital power application, budget roughly 150-250 mW for the DSC itself (verify against the family datasheet power equations for your peripheral usage) and confirm the junction stays within the -I grade limits given your PCB copper area and ambient. Extended-temperature designs should move to the -E suffix variant rather than relying on PCB cooling alone.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance per Microchip standard product offering; verify specific compliance certificates on the Microchip product page. Not AEC-Q100 qualified in this standard -I variant.

Data verified on: 2026-09-23 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology DSPIC33CK256MP506T-I/MR dsPIC33CK family dsPIC DSC digital signal controller 16-bit microcontroller digital signal processor CAN FD CAN Flexible Data PTG (Peripheral Trigger Generator) 64-QFN (9x9 mm) QFN package family surface mount high-resolution PWM field-oriented control (FOC) digital power conversion motor control RoHS AEC-Q100 MCP2562FD DSPIP33EP256MC506 DSPIC33CK128MP506 quiescent current exposed thermal pad
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