DSPIC33EP128GM306-E/PT - 16-bit DSC 60 MIPS 128KB | Microchip
MPN: DSPIC33EP128GM306-E/PT β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.2 | $7.20 |
| 10 | $6.8 | $68.00 |
| 100 | $6.7 | $670.00 |
| 500 | $6.45 | $3,225.00 |
| 1,000 | $6.15 | $6,150.00 |
DSPIC33EP128GM306-E/PT Overview
A digital signal controller combines the computational architecture of a microcontroller with the mathematical throughput of a DSP. Within the power-management hierarchy of embedded systems, a DSC such as this dsPIC33EP device sits at the heart of real-time control loops, executing control algorithms while managing peripherals, communications, and power sequencing. The Harvard architecture with separate program and data buses enables single-cycle MAC and DSP instructions.
Key features include the dsPIC33E 16-bit core with DSP engine, 13 timers, 4 DMA channels, dual CAN 2.0B modules, 8/8 input capture/output compare channels, 4 quadrature encoder interfaces, and on-chip operational amplifiers for current-sense front ends. These peripherals make the GM3 family particularly suited to closed-loop motor control without external analog signal conditioning.
Technically, the device operates from a nominal 3.3V supply (3.0V-3.6V range) with a maximum clock frequency of 60 MHz per distributor data, and supports ICSP programming/debugging through multiple PGECx/PGEDx pin pairs (which must be used as matched pairs). The -E/ temperature suffix qualifies the part for -40C to +125C ambient operation, and the family carries AEC-Q100 automotive qualification per distributor listings.
Typical applications include precision BLDC and PMSM motor control, digital power supplies and solar inverters, automotive body and powertrain subsystems, and industrial automation requiring deterministic control loops with CAN connectivity.
For design, connect all VDD and VSS pairs, select one matched PGECx/PGEDx pair for ICSP, and budget Flash carefully: 128KB suffices for FOC motor control with field weakening, but complex stacks may warrant the 256KB sibling DSPIC33EP256MC306.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128GM306-E/PT β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GM306-E/PT (same form factor and footprint) β differing in Operating Temperature, Package, Packaging, Core, RAM.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC33EP128GM304T-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.95 / Unit
View Datasheet βDSPIC33EP128GM706-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP256MC306-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP128MC306-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP128GP306-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP256GP306-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP128GM306-E/PT Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33EP DSC core |
| Max CPU Speed | 60 MIPS (60 MHz clock) |
| Flash Program Memory | 128KB (43K x 24) |
| RAM | 16KB |
| Supply Voltage | 3.0 V to 3.6 V (nominal 3.3 V) |
| Operating Temperature | -40C to +125C (E grade) |
| Package | 64-TQFP (10x10 mm), PT suffix |
| Timers | 13 timers |
| DMA Channels | 4 |
| CAN Modules | 2 x CAN 2.0B |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interfaces | 4 QEI |
| Op Amps (on-chip) | Yes |
| Qualification | Automotive, AEC-Q100 |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Programming / Debug | ICSP via PGECx/PGEDx pairs |
DSPIC33EP128GM306-E/PT 64-tqfp (10x10 mm), pt suffix Pin Configuration Guide
Pin configuration for DSPIC33EP128GM306-E/PT (64-tqfp (10x10 mm), pt suffix package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GM306-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GM306-E/PT is suitable for 6 applications: Precision BLDC/PMSM Motor Control, Automotive Body and Powertrain Nodes, Digital Power Supplies and Inverters, Industrial Automation and Robotics, Embedded Sensing and IoT Nodes, Test, Measurement and Instrumentation.
Precision BLDC/PMSM Motor Control
The DSPIC33EP128GM306-E/PT fits precision motor control because its 60 MIPS DSP core executes field-oriented control loops fast enough for high-speed commutation, while 4 quadrature encoder interfaces and 8 output-compare channels feed position and PWM stages directly. On-chip op amps amplify shunt current-sense signals without external amplifiers, reducing BOM count and offset error. The controller typically drives a three-phase inverter through a gate driver such as the MIC4104, reading phase currents at 10-20 kHz update rates. The dual CAN 2.0B modules connect the drive to industrial or automotive networks. The trade-off is that at large loads the 3.3V I/O must interface with higher-voltage drive stages through level-shifted gate drivers, adding one component stage.
Recommended
Automotive Body and Powertrain Nodes
This part suits automotive nodes because it carries AEC-Q100 qualification and the -E/ grade operates from -40C to +125C, covering under-hood and near-engine ambient conditions per Microchip and distributor data. Dual CAN 2.0B interfaces implement body-network and powertrain communication stacks, while 128KB Flash holds protocol handling plus application code with margin. In a pump, valve, or actuator module, the on-chip op amps condition position or current sensors and the 13 timers generate sequencing and pulse-width outputs. A companion LDO such as the MCP1703 regulates the 3.3V rail from the 12V battery bus. Designers should budget brown-out handling, since automotive rails experience crank and load-dump transients that require supervision circuitry.
Recommended
Digital Power Supplies and Inverters
Switching power stages benefit from the dsPIC33EP core's deterministic DSP throughput: 60 MIPS supports multi-kHz average-current-mode loops with single-cycle MAC operations, and 8 input captures synchronize to zero-crossing or sync-pulse events. Four DMA channels stream ADC results to RAM without CPU intervention, tightening loop latency. In a solar micro-inverter or server PSU, the controller generates phase-shifted or interleaved PWM via the output-compare modules while managing housekeeping telemetry over CAN. The 3.0-3.6V supply tolerates LDO-driven rails with adequate headroom. The trade-off versus dedicated digital-power ICs is firmware responsibility: protection features such as cycle-by-cycle current limiting must be implemented and validated in software.
Recommended
Industrial Automation and Robotics
For factory automation, the DSPIC33EP128GM306-E/PT provides 4 QEI modules for reading incremental encoders on multiple axes, 8 input captures for hall/tach feedback, and 8 output compares for coordinated PWM generation - enough for a compact multi-axis motion node on one chip. The 60 MIPS core runs trapezoidal or S-curve motion profiles in interrupt-level code while the main loop handles CAN and I/O. Its -40C to +125C rating tolerates cabinet and drive-attached temperature extremes. Memory-wise, 128KB Flash accommodates motion planning plus a Modbus/CAN stack; designs approaching the ceiling can migrate to the pin-compatible 256KB DSPIC33EP256MC306 without PCB changes. Industrial noise environments warrant careful ground separation between the PWM power stage and the controller analog ground.
Recommended
Embedded Sensing and IoT Nodes
The 16KB RAM and rich analog mix let this DSC act as a smart sensor hub: on-chip op amps buffer sensor outputs, timers generate precise excitation or sample triggers, and DMA moves ADC data with minimal CPU load. Dual CAN and multiple UART/SPI/I2C peripherals (through remappable pins) connect to gateways, while 60 MIPS headroom runs FFT-based vibration or power-quality analytics locally at the edge. The -40C to +125C range and AEC-Q100 qualification also suit outdoor and automotive-adjacent IoT deployments. Power-wise, the 3.0-3.6V nominal 3.3V supply pairs with a buck converter such as the MCP16301 for battery or 24V bus nodes. Firmware teams should profile DMA bandwidth early, since four channels are shared across all peripherals.
Recommended
Test, Measurement and Instrumentation
In bench instruments and data-acquisition units, the DSPIC33EP128GM306-E/PT contributes 60 MIPS of signal processing, 13 timers for timebase generation, and capture units with sub-microsecond event timing. The DSP engine computes windowed DFT or RMS math on sampled channels, and on-chip op amps serve as programmable front-end gain stages, removing one external amplifier per channel. 128KB Flash stores calibration tables, USB/CAN or UART protocols, and UI logic; the 64-TQFP exposes enough remappable I/O for relays, displays, and encoders. Instruments needing long calibration suites should consider the pin-compatible 256KB DSPIC33EP256GP306. Precision layouts should place the analog ground plane under the op-amp pins and route switching PWM traces away from ADC input nets.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GM306-E/PT β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128GM304T-I/PT | DSPIC33EP128GM706-I/PT | DSPIC33EP256MC306-I/PT | DSPIC33EP128GP306-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP - same | 64-TQFP - same | 64-TQFP - same | 64-TQFP - same |
| Core Speed | 60 MIPS | 60 MIPS | 70 MIPS (max family core) | 60 MIPS | 60 MIPS |
| Flash | 128KB (43K x 24) | 128KB | 128KB | 256KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 32KB (approx., MC306 family) | 16KB |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Automotive Qualification | Yes (E grade, AEC-Q100) | Industrial grade (-I suffix) | Industrial grade (-I suffix) | Industrial grade (-I suffix) | Industrial grade (-I suffix) |
| Key Differentiator | On-chip op amps + dual CAN, extended temp | Same GM analog set, industrial temp | Enhanced GM7 peripheral set | Doubled Flash, MC analog set | General-purpose analog set |
Key Differentiators
- Extended temperature range with automotive qualification (vs DSPIC33EP128GM304T-I/PT)
- On-chip op amps for current-sense front ends (vs DSPIC33EP128GP306-I/PT)
- Memory headroom versus 256KB siblings at lower cost (vs DSPIC33EP256MC306-I/PT)
Design Notes
The nominal supply is 3.3V with a 3.0V-3.6V allowed range. Decouple every VDD pin with 0.1uF ceramic capacitors placed within 2-3 mm of the pin, plus one bulk 4.7-10uF capacitor near the package. All VDD and VSS pins must be connected - leaving a pair floating is a common cause of ICSP failures and erratic reset behavior, per the family programming guidance. For noisy automotive rails, add an LC filter or ferrite bead before the LDO feeding the MCU.
Programming and debugging require a matched PGECx/PGEDx pair: if PGEC2 carries ICSPCLK, PGED2 must carry ICSPDAT, and swapping them across pairs prevents device detection. Bring one pair to a 5-pin header (MCLR, VDD, GND, PGECx, PGEDx) with a 10k pull-up on MCLR. Keep the ICSP traces under 15 cm and away from motor PWM nets to avoid programming faults in electrically noisy enclosures.
Estimated: at 60 MIPS with all peripherals active, core current is on the order of tens of mA, so junction dissipation stays well below 0.5W and the 10x10 TQFP needs no heatsink. However, in a -40C to +125C automotive application, total ambient budget leaves less margin - verify worst-case dissipation with the current-versus-frequency tables in the Microchip datasheet and keep junction temperature below the absolute maximum rating with at least 15C guardband.
Migrating firmware from dsPIC30F/33F to dsPIC33EP requires recompilation: the EP core has different clock, NVM, and peripheral register maps, and reused code must be revalidated. Flash budgeting matters - 128KB equals 43K x 24 instruction words, not 43K bytes; C code overhead consumes this faster than assembly-era estimates suggest. If the application adds a communication stack late in development, the pin-compatible 256KB DSPIC33EP256MC306 avoids a PCB respin.
Compliance Information
Distributor listings (Hotenda, DigiKey) describe the part as Automotive, AEC-Q100 qualified, 3.3V, 64-TQFP. RoHS/lead-free per standard Microchip production flow; REACH and halogen-free status not stated in provided data - confirm via Microchip product page.
