DSPIC33EP256GP504-I/TL - 16-bit DSC 70 MIPS 256KB Flash | Microchip
MPN: DSPIC33EP256GP504-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.65 | $56.50 |
| 100 | $5.05 | $505.00 |
| 500 | $4.62 | $2,310.00 |
| 1,000 | $4.25 | $4,250.00 |
DSPIC33EP256GP504-I/TL Overview
A Digital Signal Controller combines the computational throughput of a Digital Signal Processor (DSP) with the peripheral integration and ease of use of a microcontroller (MCU). Within the power management and control hierarchy, the dsPIC33EP general-purpose (GP) family sits above basic 8-bit MCUs and beside DSP-oriented parts, targeting embedded control systems that need math acceleration for control loops, filtering, and power conversion algorithms.
Key features include the 16-bit dsPIC33E CPU core rated up to 70 MIPS, on-chip op amps and advanced analog peripherals, high-speed PWM modules for digital power and motor control, a CAN module for industrial networking, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise timing, and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing.
Architecturally, the dsPIC33EP core pairs a 16-bit datapath with DSP-style multiply-accumulate (MAC) instructions and dual operand fetch, providing deterministic execution for PID and filter kernels. Flash-based program memory supports in-circuit self-programming, and the device programs through ICSP using any PGECx/PGEDx pin pair, which must be used as a matched pair.
Typical applications include digital power supplies (LLC, PFC), brushless DC and PMSM motor drives, industrial sensing and instrumentation, and CAN-connected embedded nodes. The -40C to +85C industrial temperature rating and QFN footprint suit compact, thermally demanding boards.
When designing with this device, budget the 3.3V supply rail for core plus I/O current and place decoupling close to each VDD/VSS pair; the exposed pad must be soldered to a ground pour for thermal and signal integrity.
This page synthesizes distributor availability, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GP504-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GP504-I/TL (same form factor and footprint) — differing in Package, Operating Temperature, Core, Flash Program Memory, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GP504-E/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP504-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GP504-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.98 / Unit
View Datasheet →DSPIC33EP64GP504-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC504-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GP504-H/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GP504-I/TL Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 70 MIPS (max) |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| Supply Voltage | 3.3 V |
| Package | 44-VTLA (6x6 mm) QFN, exposed pad |
| Pin Count | 44 |
| Operating Temperature | -40C to +85C (I grade) |
| Peripheral - Op Amps | Yes (on-chip op amps) |
| Peripheral - High-Speed PWM | Yes |
| Peripheral - CAN | Yes (enhanced CAN) |
| Peripheral - CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral - PTG | Yes (Peripheral Trigger Generator) |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
| Mounting Type | Surface Mount |
| Datasheet Length | 510 pages |
| Lifecycle Status | In Production |
DSPIC33EP256GP504-I/TL 44-vtla (6x6 mm) qfn, exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256GP504-I/TL (44-vtla (6x6 mm) qfn, exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GP504-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GP504-I/TL is suitable for 6 applications: Digital Power Supplies (PFC / LLC), Brushless DC / PMSM Motor Drives, Industrial Sensing and Instrumentation, CAN-Connected Embedded Nodes, Capacitive Touch Human Interface, Portable and Battery-Powered Equipment.
Digital Power Supplies (PFC / LLC)
The DSPIC33EP256GP504-I/TL fits digital power conversion because its high-speed PWM modules provide the resolution and dead-time control needed for PFC and LLC topologies, while the 70 MIPS dsPIC33E core closes voltage and current loops fast enough for kHz-range switching frequencies. On-chip op amps amplify current-shunt signals without external amplifiers, reducing BOM count, and the 12-class ADC paired with the PTG can trigger conversions autonomously to sample inductor current at the optimal point of each PWM cycle. In a typical 3.3V design the controller sits between the feedback dividers and the gate drivers, executing PID or nonlinear control in firmware. Compared with fixed-function controllers, firmware-based control allows soft-start profiles, mode hopping, and telemetry over CAN. Budget PWM resolution carefully: at higher switching frequencies, effective duty-cycle resolution drops, which can limit output-voltage accuracy.
Recommended
Brushless DC / PMSM Motor Drives
The DSPIC33EP256GP504-I/TL is a strong fit for BLDC and PMSM drives: high-speed PWM outputs generate three-phase complementary signals with programmable dead time, the on-chip op amps condition low-side shunt currents, and the 70 MIPS DSP core with MAC instructions executes field-oriented control (FOC) loops deterministically. Distributor listings from Mouser specifically group this part under DSP DSCs with OpAmps and high-speed PWM for motor control workloads. In a typical 3.3V inverter design, the DSC reads hall or encoder feedback, runs the current loop in the tens-of-microseconds range, and implements speed and position outer loops in firmware. The CTMU can also support sensorless startup techniques. Compared with a separate MCU plus gate-driver-embedded control, a single DSC reduces latency between ADC sampling and PWM update, improving current-loop bandwidth and torque ripple performance.
Recommended
Industrial Sensing and Instrumentation
For industrial sensing nodes, the DSPIC33EP256GP504-I/TL combines analog signal-chain building blocks with DSP math on one chip. The on-chip op amps buffer sensor outputs, the CTMU provides precise charge-based timing for capacitive or resistance measurements, and the 70 MIPS core applies digital filtering (IIR/FIR) to raw readings before transmission. The -40C to +85C industrial temperature rating and the compact 6x6 mm QFN with exposed pad allow mounting directly on sensor carrier PCBs where space is constrained. Firmware can implement self-calibration routines stored in the 256KB Flash, trimming gain and offset drift across temperature. In a typical architecture, the DSC samples sensors, scales results, and reports over UART, SPI, or I2C to a gateway. The main trade-off versus a dedicated precision ADC front-end is analog performance headroom - verify noise and INL requirements against the datasheet ADC specifications.
Recommended
CAN-Connected Embedded Nodes
The DSPIC33EP256GP504-I/TL integrates an enhanced CAN module, making it suitable for industrial and vehicular network nodes where deterministic messaging is required. The enhanced CAN peripheral offloads message buffering and filtering from the CPU, so the 70 MIPS core remains free for application logic and control loops while the bus handles traffic. Combined with 256KB Flash, a node can store multiple communication profiles, bootloader images, and OTA-style update slots without external memory. The Peripheral Trigger Generator can chain ADC sampling to CAN transmit timing for synchronized data reporting. In a typical 3.3V node, the DSC connects to an external CAN transceiver at the physical layer. The industrial -40C to +85C rating covers most factory and heavy-equipment environments; for full automotive qualification, evaluate Microchip's automotive-grade family variants instead, since standard dsPIC33EP GP parts are not AEC-Q100 qualified.
Recommended
Capacitive Touch Human Interface
The DSPIC33EP256GP504-I/TL supports capacitive touch interfaces through its Charge Time Measurement Unit (CTMU), which measures charge time on touch pads with consistent, CPU-independent timing. The 70 MIPS core runs touch-decision algorithms, drift compensation, and multi-key scanning while simultaneously handling application tasks, and the on-chip op amps can assist with signal conditioning. Housed in a 44-pin QFN (6x6 mm), the device offers enough general-purpose I/O to drive LEDs or buzzer feedback directly, enabling a single-chip user interface: touch sensing, indication, and communication in one 3.3V controller. In a typical appliance or industrial HMI panel, pads are laid out on the PCB top layer behind an overlay, with the CTMU scanning each channel in sequence. Keep sensor traces short and guard adjacent ground to maximize sensitivity; heavy conformal coatings require recalibration of threshold levels in firmware.
Recommended
Portable and Battery-Powered Equipment
The DSPIC33EP256GP504-I/TL suits portable instruments that need DSP capability in a compact footprint: the 6x6 mm QFN minimizes board area, and the 3.3V single-rail supply simplifies power-tree design from a battery or boost converter. The dsPIC33E core provides low-power modes that let firmware idle the 70 MIPS engine between sampling bursts, while the PTG can sequence ADC conversions autonomously so the CPU wakes only to process results - a common pattern in data-logger and handheld-test designs. With 256KB Flash and 32KB RAM on chip, applications can hold calibration tables, GUI assets, and communication stacks without external memory, reducing BOM height for handheld enclosures. Designers should profile sleep-mode entry/exit latency against sampling rate requirements, since frequent wake-ups erode the average-current advantage, and should place the exposed-pad ground connection solidly to control thermal and ground bounce in tight layouts.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GP504-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GP504-E/TL | DSPIC33EP128GP504-I/TL | DSPIC33EP64GP504-I/TL | DSPIC33EP256MC504-I/TL | DSPIC33EP256GP504-H/TL |
|---|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) QFN | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 60 MIPS (per distributor listing) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 128 KB | 64 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (I grade) | Extended grade (beyond +85C) | -40C to +85C | -40C to +85C | -40C to +85C | H grade (extended) |
| Peripheral Focus | GP: op amps, Hi-Speed PWM, CAN, CTMU, PTG | GP, same peripheral set | GP, same peripheral set | GP, same peripheral set | MC: motor-control oriented PWM | GP, same peripheral set |
| Lifecycle Status | In Production (active) | Active | Active | Active | Active | Active |
Key Differentiators
- On-chip op amps eliminate external signal-conditioning amplifiers (vs DSPIC33EP128GP504-I/TL)
- 70 MIPS headroom for tight control loops (vs DSPIC33EP256GP504-E/TL)
- General-purpose analog mix vs motor-specific peripheral set (vs DSPIC33EP256MC504-I/TL)
- Full peripheral feature set at standard temperature cost (vs DSPIC33EP256GP504-H/TL)
Design Notes
The 44-VTLA QFN has an exposed thermal pad on the underside that must be soldered to a grounded copper pour - it is not optional decoration; it carries both heat and the majority of ground return current. Use a 3x3 or 4x4 via array under the pad to tie it to internal ground planes. Decouple each VDD/VSS pair with 0.1uF ceramics placed within 2 mm of the pins, plus one bulk 10uF capacitor per supply domain. Per Microchip ICSP guidance, route one complete PGECx/PGEDx pair to a 5-pin programming header (MCLR, VDD, GND, PGECx, PGEDx); do not share these traces with high-current loads.
Two ordering-code mistakes cause most rework on this family. First, the TL (QFN) and PT (TQFP) suffixes are the same die in different packages - they are NOT footprint interchangeable, so a PCB designed for TQFP cannot accept this QFN part. Second, note the E grade is listed at 60 MIPS by distributors while the I grade runs 70 MIPS; if your control loop timing assumes 70 MIPS, re-verify cycle counts before substituting. Also confirm that analog peripherals (op amps, CTMU) are assigned pins that do not conflict with your PWM and CAN routing in the pin-mapping tool before layout freeze.
Estimated: with a 3.3V rail, core plus peripheral current for a mid-range dsPIC33EP running at 70 MIPS is typically in the tens of milliamps; add PWM gate-drive load if the DSC drives MOSFET drivers directly from I/O pins. Budget the regulator for peak worst-case (full-speed core + all peripherals + I/O source current) rather than typical, and add at least 20% margin. Place the bulk input capacitor near the DSC's VDD domain feeding the PWM outputs, since gate-charge bursts create fast di/dt transients that resistive supply traces convert into rail droop and ADC misreads.
When using the high-speed PWM for switching converters or motor drives, keep PWM output traces short and away from the ADC input nets and the ICSP/PGEDx programming lines; switching edges couple capacitively into high-impedance analog nodes and appear as conversion noise. If shunt sensing with the on-chip op amps, use Kelvin connections at the shunt resistor and a grounded guard ring around the amplifier inputs. For CAN, route the transceiver within 20 mm of the CAN TX/RX pins and stub the bus minimally to preserve signal integrity at standard bit rates.
Compliance Information
Compliance data was not present in the provided verified web data. Standard dsPIC33EP GP family parts are catalog (non-automotive) devices; verify current RoHS/REACH status on Microchip's product page environmental datasheet.
