DSPIC33EP128GP504T-I/ML - 70 MIPS 16-bit DSC 128KB Flash | Microchip
MPN: DSPIC33EP128GP504T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.54 | $55.40 |
| 100 | $4.88 | $488.00 |
| 500 | $4.35 | $2,175.00 |
| 1,000 | $3.92 | $3,920.00 |
DSPIC33EP128GP504T-I/ML Overview
A digital signal controller combines the computational architecture of a microcontroller with the DSP engine of a digital signal processor. In the product hierarchy, the dsPIC33EP sits within Microchip's 16-bit microcontroller portfolio, below the 32-bit PIC32 families, and integrates a DSP engine, high-speed ADC, and motor-control peripherals on a single chip for real-time embedded control applications.
Key features include the 70 MIPS dsPIC33E core with DSP instruction support, on-chip operational amplifiers, comparators, a Charge Time Measurement Unit (CTMU), and Peripheral Trigger Generators (PTG) that automate peripheral-to-peripheral data flow without CPU intervention. Communication coverage is broad: CAN 2.0B, I2C, SPI, UART/USART, plus IrDA and LIN support, making the part suitable for both industrial fieldbus and automotive-adjacent networks.
Technical depth comes from the enhanced peripherals: high-speed PWM modules with dead-time control serve motor control and power conversion, two on-chip op amps offload external analog circuitry, DMA channels move ADC results transparently, and IEEE 1149.2-compatible JTAG boundary scan supports production test. The device operates from a single 3.0 V to 3.6 V supply across an industrial temperature range of -40C to +85C and offers In-Circuit Serial Programming (ICSP) for field updates.
Typical applications include sensorless brushless DC and PMSM motor control, digital power supplies and PFC stages, industrial automation nodes with CAN connectivity, and general-purpose digital signal processing tasks such as audio filtering.
A key design consideration is supply decoupling: place low-ESR 0.1 uF ceramic capacitors at every VDD/VSS pair, including the exposed thermal pad, and keep the VCAP capacitor on its dedicated pin per the manufacturer datasheet to guarantee core regulator stability.
This page synthesizes distributor pricing, drop-in alternatives from the same dsPIC33EP128GP504 family, and practical design notes not found on the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP128GP504T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GP504T-I/ML (same form factor and footprint) — differing in Operating Temperature, Package, RAM, Packaging, Connectivity.
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DSPIC33EP128GP504-I/ML
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP128GP504-E/ML
✅ Drop-In✓ In Stock
$3.28 / Unit
View Datasheet →DSPIC33EP128GP504T-E/TL
✅ Drop-In✓ In Stock
$4.05 / Unit
View Datasheet →DSPIC33EP128GM304T-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.62 / Unit
View Datasheet →DSPIC33EP128MC504
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GP504T-I/ML Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33E DSC |
| Max Core Speed | 70 MIPS |
| CPU Clock Frequency | 60 MHz |
| Flash Program Memory | 128 KB (43K x 24) |
| RAM | 16 KB (8K x 16) |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial, I) |
| Package | 44-QFN (8x8 mm) with Exposed Pad |
| I/O Count | 35 |
| Connectivity | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LIN |
| Analog Peripherals | On-chip Op Amps, Comparators, CTMU, 10/12-bit ADC |
| PWM | High-speed PWM with dead-time control |
| DMA | Yes |
| Debug / Test | JTAG (IEEE 1149.2 compatible), ICSP, In-Circuit Debug |
| Peripherals | PTG, WDT, POR, BOR, LVD |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP128GP504T-I/ML 44-qfn (8x8 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP128GP504T-I/ML (44-qfn (8x8 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GP504T-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GP504T-I/ML is suitable for 6 applications: Brushless DC / PMSM Motor Control, Digital Power Supplies and PFC, Industrial CAN Network Nodes, Capacitive Touch and Measurement Interfaces, Sensor Signal Conditioning and Data Acquisition, Audio and DSP Signal Processing.
Brushless DC / PMSM Motor Control
The DSPIC33EP128GP504T-I/ML fits sensorless and sensored motor control because its high-speed PWM outputs complementary drive signals with programmable dead time, while the ADC can be triggered synchronously with the PWM period to sample phase currents at the optimal instant. The 70 MIPS DSP core executes field-oriented control (FOC) loops at PWM frequencies of 20 kHz or more with ample cycle margin, and the on-chip op amps amplify low-level shunt currents, eliminating external amplifier stages. Designers should budget the DMA controller to move ADC results so the CPU core remains available for the control algorithm. The 3.0 V to 3.6 V supply suits gate-driver reference levels, and the industrial -40C to +85C range covers most motor-drive environments.
Recommended
Digital Power Supplies and PFC
In digitally controlled AC-DC and DC-DC converters, the DSPIC33EP128GP504T-I/ML provides the high-speed PWM resolution and fast control-loop execution required for voltage-mode and current-mode regulation. The 70 MIPS core closes current loops in the tens-of-microseconds region, while the 12-bit ADC samples output voltage and inductor current each switching cycle. The Peripheral Trigger Generator can chain ADC conversions directly to PWM updates, minimizing loop latency without CPU intervention. On-chip comparators support cycle-by-cycle overcurrent protection in hardware, an essential safeguard for power stages. The 35 I/O pins handle housekeeping functions such as fan control, fault signaling, and PMBus-style UART communication, consolidating digital power control in a single 44-QFN device.
Recommended
Industrial CAN Network Nodes
The integrated CAN 2.0B controller makes the DSPIC33EP128GP504T-I/ML a strong fit for industrial fieldbus nodes such as sensor aggregators, actuator controllers, and remote I/O. CAN supports robust multi-drop communication in electrically noisy factories, and DMA can service the CAN module buffers to sustain high message rates without CPU loading. The 128 KB Flash accommodates protocol stacks alongside application logic, and 16 KB RAM buffers message queues. Standard UART, SPI, and I2C interfaces connect local peripherals, while the CTMU supports capacitive touch or precision time measurement on operator panels. Combined with an external transceiver, one 44-QFN device forms a complete CAN node operating reliably from -40C to +85C.
Recommended
Capacitive Touch and Measurement Interfaces
The Charge Time Measurement Unit (CTMU) on the DSPIC33EP128GP504T-I/ML enables capacitive touch sensing and precision time-of-flight or current measurements without a dedicated touch controller. The CTMU pairs with the on-chip 10/12-bit ADC to charge and measure external capacitances, supporting keypad and slider implementations on the 35 I/O pins. Because the touch engine runs alongside the 70 MIPS core, the same chip can perform application logic, communication, and touch decoding concurrently - a common consolidation in appliance and industrial HMI designs. Firmware libraries from Microchip's touch portfolio accelerate development, and the 44-QFN 8x8 mm exposed-pad package provides the low-inductance grounding that touch-sensing accuracy benefits from.
Recommended
Sensor Signal Conditioning and Data Acquisition
With two on-chip operational amplifiers, comparators, and a 10/12-bit ADC, the DSPIC33EP128GP504T-I/ML can condition and digitize weak sensor signals - such as thermocouples, bridge transducers, or photodiode currents - directly on-chip. The op amps can be configured as programmable-gain amplifiers through firmware, reducing board area and BOM cost versus discrete amplifier stages. The DSP engine accelerates post-conversion filtering (FIR/IIR) at 70 MIPS, and DMA streams conversion results to RAM without CPU cycles. For multi-channel scanning systems, the Peripheral Trigger Generator sequences ADC sampling automatically. The 3.0 V to 3.6 V supply and -40C to +85C rating suit industrial sensing enclosures; the 128 KB Flash stores compensation tables and communication firmware in the same device.
Recommended
Audio and DSP Signal Processing
The dsPIC33E DSP engine of the DSPIC33EP128GP504T-I/ML executes multiply-accumulate instructions in a single cycle, making it capable of real-time audio filtering, echo cancellation, and tone generation at 70 MIPS. The 12-bit ADC digitizes microphone or line-level inputs, and the PWM modules can reconstruct output waveforms through external reconstruction filters for cost-sensitive audio paths. On-chip comparators support audio limiting and protection functions in hardware. Typical uses include industrial intercoms, alarm sounders, and embedded speech prompt systems where a dedicated audio DSP is unnecessary. The 128 KB Flash holds codec tables and multiple filter coefficient sets, while UART links the audio subsystem to a host controller.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GP504T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128GP504-I/ML | DSPIC33EP128GP504-E/ML | DSPIC33EP128GP504T-E/TL | DSPIC33EP128GM304T-I/ML | DSPIC33EP128MC504 |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) Exposed Pad | 44-QFN (8x8) Exposed Pad - same | 44-QFN (8x8) Exposed Pad - same | 44-QFN (8x8) Exposed Pad - same | 44-QFN (8x8) Exposed Pad - same | 44-QFN (8x8) Exposed Pad - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128 KB (43K x 24) | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM | 16 KB (8K x 16) | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C | -40C to +85C |
| Primary Peripheral Focus | General Purpose (op amps, CTMU, PTG, CAN) | General Purpose - identical | General Purpose - identical | General Purpose - identical | General purpose, different peripheral mix | Motor Control (enhanced PWM) |
Key Differentiators
- General-purpose analog integration (op amps, comparators, CTMU) (vs DSPIC33EP128MC504)
- Full industrial temperature at lowest cost (vs DSPIC33EP128GP504-E/ML)
- Tape & Reel for automated assembly (vs DSPIC33EP128GP504-I/ML)
Design Notes
Supply the DSPIC33EP128GP504T-I/ML from a regulated 3.3 V rail held within the 3.0 V to 3.6 V window. Decouple every VDD/VSS pin pair with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the pad, plus one bulk 10 uF capacitor near the device. Connect the exposed pad to a solid ground plane with an array of vias - it serves as both thermal relief and the primary ground return for the 70 MIPS core. Do not omit the dedicated VCAP stabilization capacitor specified in the manufacturer datasheet; omitting it causes brown-out resets under load transients.
The 44-QFN (8x8 mm) exposed-pad package requires attention to land-pattern design and stencil geometry. Use a solder mask-defined pad for the exposed thermal pad with approximately 50-70% stencil aperture reduction to avoid excessive solder and device floating. Follow IPC-recommended QFN land patterns with thermal vias under the pad. Peripheral Pin Select (PPS) allows digital function remapping in firmware, so route with flexibility: keep UART/SPI/I2C candidates on adjacent accessible pins, and reserve analog-capable pins near board edges for sensor inputs.
When driving motor-control PWM or CAN at high speed, keep the high-current outputs away from the analog ADC inputs on the opposite side of the package. Route CAN_TX/CAN_RX as a tightly coupled pair to the transceiver, and place the crystal (or use the internal FRC oscillator with PLL for 70 MIPS operation) away from switching nodes. Ground the exposed pad on all layers via stitching vias to contain the switching return currents of the 60 MHz system clock.
Two common mistakes: first, forgetting that the -I temperature grade stops at +85C - designs in sealed enclosures near heat sources must use the -E (+125C) variant instead. Second, relying on CTMU/op-amp features that do not exist on same-footprint substitutes (GM/MC family); if a BOM substitution to DSPIC33EP128GM304T-I/ML or DSPIC33EP128MC504 is planned, audit firmware for GP-specific peripherals before releasing the PCB. Verify the VCAP capacitor value and type against the current datasheet revision.
Compliance Information
Compliance status was not stated in the provided web data. Microchip dsPIC33EP devices in current production are generally RoHS-compliant, but this must be confirmed on the official Microchip product page or datasheet before use - not assumed here.