DSPIC33EP128MU504T-I/MV - 16-bit DSC 128KB Flash | Microchip
MPN: DSPIC33EP128MU504T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.6 | $5.60 |
| 10 | $5.04 | $50.40 |
| 100 | $4.48 | $448.00 |
| 500 | $4.03 | $2,015.00 |
| 1,000 | $3.64 | $3,640.00 |
DSPIC33EP128MU504T-I/MV Overview
A digital signal controller combines the compute architecture of a microcontroller with the mathematical acceleration of a digital signal processor. In the embedded hierarchy it sits between general-purpose MCUs (such as PIC16) and dedicated DSPs: it executes real-time control loops and filtering algorithms with single-cycle MAC and divide instructions while retaining flash memory, interrupts, and rich on-chip peripherals typical of microcontrollers.
Key features of this part include the 16-bit dsPIC33E core clocked at up to 70 MIPS, 128 KB of self-programmable flash with ECC, USB 2.0 On-The-Go support for device/host/OTG roles, multiple UART, SPI and I2C modules, and 12-bit ADC channels enabling precise analog acquisition for closed-loop control.
The dsPIC33E core implements DSP-class instructions, a high-performance MAC unit, and a flexible interrupt controller, allowing deterministic execution of PI loops, transforms, and digital filters. Code is executed from flash with software-managed prefetch, and the peripheral ecosystem includes output-compare, input-capture, and QEI modules suited to motion and power conversion.
Typical applications include USB-connected industrial instruments, digital power supplies, motor control drives, and portable measurement equipment where the USB OTG interface and DSP math coexist with real-time control.
For design, decouple the multiple VDD/VDDCORE rails per the manufacturer datasheet, and note that the -T suffix indicates tape-and-reel packaging; the MV package requires a matching QFN land pattern with grounded thermal via array.
This page synthesizes distributor sourcing data, same-family drop-in candidates, and design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128MU504T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128MU504T-I/MV (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Core Architecture, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128MC504-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128MC204T-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.65 / Unit
View Datasheet →DSPIC33EP128GP502-H/SO
✅ Drop-In✓ In Stock
$3.36 / Unit
View Datasheet →DSPIC33EP128MU504T-I/MV Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33E DSC |
| Core Speed | Up to 70 MIPS |
| Program Memory (Flash) | 128 KB |
| Data Type | IC DSC 16BIT 128KB FLASH |
| USB | USB 2.0 OTG (device/host/OTG) |
| Communication Interfaces | UART, SPI, I2C |
| ADC | 12-bit SAR, multiple channels |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 44-pin QFN/UQFN (MV) |
| Mounting Type | Surface Mount |
| Packaging Suffix | T = Tape and Reel |
| Supply Voltage VDDCORE | On-chip regulator (per datasheet) |
| Timers/Peripherals | Output Compare, Input Capture, QEI, PPS |
DSPIC33EP128MU504T-I/MV 44-pin qfn/uqfn (mv) Pin Configuration Guide
Pin configuration for DSPIC33EP128MU504T-I/MV (44-pin qfn/uqfn (mv) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128MU504T-I/MV.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128MU504T-I/MV is suitable for 6 applications: USB-Connected Industrial Instruments, Digital Power Supplies, Brushless DC Motor Control, Portable and Battery-Powered Measurement Devices, Audio and Signal Processing Nodes, Building Automation and IoT Sensor Nodes.
USB-Connected Industrial Instruments
The DSPIC33EP128MU504T-I/MV fits USB-connected measurement and control instruments because it combines a USB 2.0 OTG module with a 70 MIPS 16-bit DSP core and 12-bit ADC on one chip. In a typical instrument, the MCU runs the acquisition loop - sampling sensor channels through the ADC at tens of ksps - while the USB peripheral streams data to a PC as a virtual COM port (CDC class). The -40C to +85C industrial rating covers bench and field environments. Unlike a separate USB bridge chip plus MCU solution, the integrated OTG removes a BOM line, reduces firmware complexity, and eliminates inter-chip latency; the trade-off is that USB stack firmware must be written or licensed for the dsPIC33E.
Recommended
Digital Power Supplies
In digitally controlled power supplies, the 70 MIPS dsPIC33E core executes inner current-loop PI compensation at switching frequencies up to several hundred kHz, using the 12-bit ADC and output-compare/PWM resources. The DSP MAC instructions compute control-law arithmetic in single cycles, keeping loop latency low and deterministic - critical for loop stability margins. USB OTG allows the supply to report telemetry and accept setpoint updates from a host PC without additional hardware. Designers should budget CPU cycles carefully: at 300 kHz switching with double-update PWM, the control ISR must complete within microseconds, which the 70 MIPS core supports but leaves limited headroom for additional tasks.
Recommended
Brushless DC Motor Control
The MU504 suits sensorless BLDC and PMSM drives through its DSP core, high-speed ADC, QEI module for encoder feedback, and complementary PWM outputs. Field-oriented control (FOC) requires a Park/Clarke transform and PI loops executed every PWM cycle; the single-cycle MAC and divide support in the dsPIC33E core handle this math at 70 MIPS. The -40C to +85C rating fits industrial drives and e-mobility accessories. Placement between gate drivers and current-sense amplifiers is standard, with ADC triggered synchronously to PWM centers to sample current with minimal ripple noise. Peripheral pin select (PPS) lets engineers map PWM and capture functions to optimal package pins on the 44-pin MV footprint.
Recommended
Portable and Battery-Powered Measurement Devices
Handheld meters, loggers, and diagnostic tools benefit from this DSC's single-supply 3.0-3.6 V operation, integrated USB OTG for charging-port data transfer, and compact 44-pin QFN package of roughly 8x8 mm class. The 12-bit ADC digitizes sensor signals without an external converter, and the 128 KB flash stores application firmware plus data-logging tables. Software-managed low-power modes let the device idle between samples; designers should profile sleep currents in their own implementation since consumption depends heavily on enabled peripherals. The USB role flexibility (device to PC, host to a flash drive) enables field data export without a PC, a differentiator over USB-device-only MCUs.
Recommended
Audio and Signal Processing Nodes
With a 70 MIPS DSP core providing single-cycle multiply-accumulate, the MU504 can run FIR/IIR filters, FFT windows, and simple audio effects at moderate sample rates, while USB OTG provides a digital audio or data link to a host. The 12-bit ADC and available DAC-class outputs (via PPS-mapped peripherals or external codec over SPI/I2C) cover instrumentation-grade signal chains; for hi-fi audio, an external I2S codec is recommended since the dsPIC33E targets control-grade rather than audiophile-grade conversion. The industrial temperature range and QFN footprint support embedded audio-instrument products such as DSP-enabled sensor front ends, acoustic analyzers, and conference-system control nodes.
Recommended
Building Automation and IoT Sensor Nodes
The MU504 serves as a gateway or supervisory node in building automation: its I2C and SPI buses aggregate environmental sensors, the 16-bit core runs control logic and simple protocol stacks, and USB OTG provides local service and commissioning access from a laptop. Compared with a pure PIC16 solution, the DSP headroom supports on-node analytics - vibration signature checks, RMS load calculations - that reduce upstream traffic. Designers pairing it with a radio module (e.g., Wi-Fi or sub-GHz) over UART gain a cloud-connected node; the 128 KB flash accommodates both application and communication firmware. Industrial temperature rating suits rooftop and mechanical-room deployments where consumer-grade parts fail.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128MU504T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128MC504-I/MV | DSPIC33EP128MC204T-I/MV | DSPIC33EP128GP502-H/SO |
|---|---|---|---|---|
| Package | QFN-44 (MV) | QFN-44 (MV) - same | QFN-44 (MV) - same | SOIC-28 - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB |
| Core Speed | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS |
| USB Peripheral | USB 2.0 OTG | None (CAN 2.0B instead) | None (CAN) | None (GP series) |
| CAN Peripheral | None | CAN 2.0B | CAN | None |
Key Differentiators
- Integrated USB 2.0 OTG (vs DSPIC33EP128MC504-I/MV)
- 70 MIPS DSP core with single-cycle MAC (vs DSPIC33EP128GP502-H/SO)
- Industrial -40C to +85C grade in compact QFN (vs DSPIC33EP128MU502-E/SP)
Design Notes
The 44-pin MV QFN uses an exposed pad that must be soldered to a ground via array (typically 4x4 vias of 0.3 mm on a 0.8-1.0 mm pitch) to provide both thermal relief and a low-inductance return path. Follow the land pattern in the package outline drawing of the manufacturer datasheet; do not shrink the pad for solder-mask-defined layouts, as insufficient paste coverage on the exposed pad is a leading cause of intermittent ground faults and USB signal integrity failures.
Decouple each VDD pin with a 100 nF ceramic placed within 2 mm of the pin, and add 4.7-10 uF bulk capacitance near the supply entry. The on-chip core regulator (VDDCORE) requires its recommended external capacitor per the datasheet - omitting or undersizing it can cause brown-out resets under load transients. Estimated: a 70 MIPS core with USB active draws on the order of tens of mA; budget the 3.3 V rail accordingly.
Route the USB D+/D- pair as a 90-ohm differential pair, length-matched within 1 mm, kept at least 3x trace width away from PWM and switching nodes. Because the dsPIC33E's Peripheral Pin Select (PPS) allows many digital functions to map to multiple pins, finalize PPS assignments before routing so that PWM outputs, encoder inputs, and analog inputs land on physically optimal pins - late re-mapping often forces noisy crossovers.
Compliance Information
RoHS status in retrieved web data was unclear (one listing showed ambiguous status text). Verify compliance certificates via the Microchip product page or distributor CoC before regulatory filings.
