Microchip Technology

DSPIC33EP16GS506T-I/PT - 16-Bit 70MIPS DSC 16KB Flash | Microchip

MPN: DSPIC33EP16GS506T-I/PT ✓ Active
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3.0 V to 3.6 V (3.3 V nominal) Vdss 64-TQFP (10x10 mm) Package 16KB (16K x 8) Flash Memory
From $3.05 USD / Unit
MOQ: 1 |
Price updated: 2026-09-23
Volume Pricing
Qty Unit Price Extended
1 $4.62 $4.62
10 $4.18 $41.80
100 $3.74 $374.00
500 $3.38 $1,690.00
1,000 $3.05 $3,050.00
ℹ️ All prices are in USD

DSPIC33EP16GS506T-I/PT Overview

The Microchip Technology DSPIC33EP16GS506T-I/PT is a 16-bit digital signal controller (DSC) delivering up to 70 MIPS from 16KB (16K x 8) of Flash program memory and 2KB of RAM, housed in a 64-pin TQFP (10x10 mm) surface-mount package rated from -40C to +85C on a 3.0V to 3.6V supply.

A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, the DSC sits above a basic MCU and is purpose-built for closed-loop control: it executes the control law of a switch-mode power supply while dedicated hardware peripherals handle pulse-width modulation, analog sampling, and protection functions without CPU intervention.

The GS506 family is differentiated for digital power conversion. Its interconnected high-speed PWM module supports advanced topologies such as phase-shifted full bridge, LLC, and power-factor-correction stages. The on-chip analog front end integrates an ADC, programmable gain amplifiers (PGA), and comparators that can be cross-connected to the PWM outputs in hardware, enabling sub-microsecond fault response.

Beyond the power-conversion peripherals, the device provides 7 timers, 4 external interrupt sources, and 2 serial I/O ports, all managed through a multiple internal bus architecture in CMOS technology. Flash-based program memory allows field reprogramming and supports in-circuit serial programming (ICSP) via any PGECx/PGEDx pin pair used as a matched pair.

Typical applications include AC-DC and DC-DC switch-mode power supplies, solar inverters, battery chargers, digital lighting ballasts, and uninterruptible power supplies.

When designing with this device, verify all VDD and VSS pins are connected and decoupled, and pair ICSP clock and data pins correctly during programming.

This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for DSPIC33EP16GS506T-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33EP16GS506T-I/PT (same form factor and footprint) — differing in Operating Temperature, Package, Core Architecture, PWM, Analog Peripherals.

Microchip Technology
Package: 44-TQFP (10x10 mm)
Core Architecture: 16-bit dsPIC33EP modified Harvard, CMOS
PWM: Interconnected high-speed PWM (digital power optimized)
Microchip Technology
Operating Temperature: -40C to +85C (I grade)
Package: 64-TQFP (10x10 mm), 0.5 mm pitch
Core Architecture: 16-bit dsPIC33EP DSC
Microchip Technology
Operating Temperature: -40C to +125C (E grade)
Core Architecture: 16-bit dsPIC RISC with DSP
PWM: Interconnected high-speed PWM

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DSPIC33EP16GS506T-I/PT Maximum Ratings & Electrical Characteristics

Core Processor dsPIC33EP (16-bit)
Core Size 16-Bit
Maximum Performance 70 MIPS
Program Memory Size 16KB (16K x 8) Flash
RAM Size 2 KB
Supply Voltage 3.0 V to 3.6 V (3.3 V nominal)
Package 64-TQFP (10x10 mm)
Operating Temperature -40C to +85C
Mounting Type Surface Mount
Timers 7
External Interrupts 4
Serial I/O Ports 2
Peripherals Interconnected High-Speed PWM, ADC, PGA, Comparators
Application Focus Digital Power / SMPS
Functional Safety FuSa supported (dsPIC33EP GS family)
Packaging Tape & Reel (T suffix)
Program Memory Type FLASH (ICSP programmable)

DSPIC33EP16GS506T-I/PT 64-tqfp (10x10 mm) Pin Configuration Guide

Pin configuration for DSPIC33EP16GS506T-I/PT (64-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

64-tqfp (10x10 mm) package pinout diagram for DSPIC33EP16GS506T-I/PT

No detailed pinout data available for DSPIC33EP16GS506T-I/PT.

Refer to the datasheet for full pin configuration.

Typical Applications

DSPIC33EP16GS506T-I/PT is suitable for 6 applications: AC-DC Switch-Mode Power Supplies, Power Factor Correction (PFC) Stages, Solar Inverters and Micro-Inverters, Battery Chargers and Battery Management, Digital Lighting and Electronic Ballasts, Uninterruptible Power Supplies (UPS).

⚡

AC-DC Switch-Mode Power Supplies

The DSPIC33EP16GS506T-I/PT is architected for AC-DC SMPS control: its interconnected high-speed PWM supports phase-shifted full-bridge, LLC, and flyback topologies, while the integrated comparators provide cycle-by-cycle overcurrent protection in hardware with sub-microsecond response - faster than any software interrupt path. The on-chip ADC with programmable gain amplifiers samples output voltage and current feedback without external signal-conditioning ICs. In a typical offline flyback or LLC power supply, the DSC executes voltage-mode or current-mode control loops at switching frequencies in the hundreds of kHz range while simultaneously managing soft-start, burst mode, and fault logging. Because 16KB of Flash is sufficient for single-loop control firmware, the part delivers digital-power flexibility (programmable regulation, adaptive dead-time, communication-based telemetry) at a cost point close to analog controllers.

⚡

Power Factor Correction (PFC) Stages

For boost-type PFC front ends, the DSPIC33EP16GS506T-I/PT provides the deterministic sampling and fast PWM update rates required to track the rectified line waveform. The ADC can be triggered synchronously with the PWM period by hardware, eliminating software jitter that degrades THD, and the PGA boosts small shunt-current signals to match the ADC input range. The 70 MIPS core executes average-current-mode control including input-voltage feedforward within each switching cycle. Hardware comparators handle inrush and overcurrent faults independently of the CPU, meeting safety expectations for offline conversion. The 3.0V to 3.6V supply and -40C to +85C industrial range suit sealed power-supply enclosures. 16KB Flash accommodates PFC plus housekeeping tasks such as brown-out detection and startup sequencing.

💡

Solar Inverters and Micro-Inverters

Grid-tied solar conversion requires coordinated DC-DC maximum-power-point tracking and DC-AC inversion with grid synchronization - a workload the DSPIC33EP16GS506T-I/PT handles with its interconnected PWM modules generating complementary outputs with programmable dead-time for the H-bridge, while the ADC samples grid voltage and current for PLL synchronization. The multiple internal bus architecture keeps control-loop execution deterministic at 70 MIPS. Hardware comparator inputs enable rapid anti-islanding and overcurrent shutdown required by grid codes. The 64-pin TQFP provides enough I/O for gate-drive signals, relay control, and auxiliary sensing without external port expanders. For firmware growth beyond 16KB, the pin-compatible DSPIC33EP64GS506 family allows the same PCB to be populated with a larger-Flash variant.

🔋

Battery Chargers and Battery Management

Multi-chemistry battery chargers benefit from the DSPIC33EP16GS506T-I/PT combination of precise analog acquisition and programmable charging profiles. The ADC with PGA reads battery current through low-value shunts, and the high-resolution interconnected PWM implements constant-current/constant-voltage phases with smooth transitions managed in firmware. Hardware comparators provide independent short-circuit and overtemperature protection thresholds. Because charging algorithms are pure software, the same 16KB-flash hardware supports Li-ion, lead-acid, and NiMH profiles, and field updates are possible through ICSP or self-programming. The 2KB RAM holds state machines and logging buffers for charge-history telemetry over the serial I/O ports. Industrial temperature rating of -40C to +85C covers outdoor charging infrastructure.

💡

Digital Lighting and Electronic Ballasts

Resonant lamp ballasts and high-current LED drivers use the DSPIC33EP16GS506T-I/PT to generate phase-shifted or frequency-modulated resonant half-bridge waveforms with hardware dead-time control, minimizing switching losses. The interconnected PWM-to-comparator links enable fast arc/lamp fault protection without CPU latency, and the ADC monitors lamp current and bus voltage every cycle for closed-loop brightness regulation. The 3.3V controller consumes modest quiescent power, easing standby-power compliance targets in always-connected luminaires. The 64-TQFP footprint supports DALI or serial interfaces on the two serial I/O ports for dimming communication. Flash program memory allows one hardware platform to serve multiple lamp wattages through firmware variants, simplifying manufacturing.

🔌

Uninterruptible Power Supplies (UPS)

In line-interactive and double-conversion UPS designs, the DSPIC33EP16GS506T-I/PT simultaneously controls the AC-DC rectifier, DC-AC inverter, and transfer switch logic. Its four external interrupt lines and fast comparator inputs implement line-failure detection and bypass transfer with hardware-level response. The interconnected high-speed PWM generates the inverter SPWM waveform while the ADC samples output voltage for THD-corrective control, all within the 70 MIPS execution budget. Seven timers coordinate battery-test scheduling, fan control, and watchdog supervision. The industrial -40C to +85C rating and FuSa-supported GS family positioning assist reliability-driven UPS programs. When the control firmware expands with communication protocols, the pin-compatible 64KB Flash GS506 variant drops onto the identical PCB.

What is the DSPIC33EP16GS506T-I/PT and what are its key specifications?
The DSPIC33EP16GS506T-I/PT is a 16-bit digital signal controller from Microchip Technology for digital power applications. Key specifications: 70 MIPS performance, 16KB (16K x 8) Flash program memory, 2KB RAM, 3.0V to 3.6V supply, -40C to +85C operation, and a 64-pin TQFP (10x10 mm) package. Per Microchip product data, it integrates interconnected high-speed PWM, ADC, PGA, and comparators for SMPS and power-conversion designs.
Where can I download the DSPIC33EP16GS506T-I/PT datasheet PDF?
The datasheet PDF is available on the official Microchip Technology product page at microchip.com/en-us/product/DSPIC33EP16GS506, and mirrored by distributors such as Mouser and GlobalSpec. The document covers the 16-bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators. XAIPART also links to the official datasheet from this page; the PDF file size is approximately 3723KB per distributor listings.
What is the price of DSPIC33EP16GS506T-I/PT?
As of 2026-09-24, the DSPIC33EP16GS506T-I/PT is priced at approximately $4.62 for 1 unit, $4.18 at 10 pieces, $3.74 at 100 pieces, $3.38 at 500 pieces, and $3.05 at 1000 pieces on XAIPART. Actual distributor pricing varies with stock position; Octopart listed 8120 pcs in stock updated on Sep 02, 2025. Request a quote for volume pricing above 1000 units.
Is DSPIC33EP16GS506T-I/PT in stock and what is the lead time?
Yes, the DSPIC33EP16GS506T-I/PT has been available through distribution; Octopart reported 8120 units in stock updated on Sep 02, 2025, and multiple brokers (Hotenda, DRex Electronics, Avaq) list it as in stock for immediate shipment. Note that factory lead time for new Microchip orders is approximately 16 weeks per Ventron data, so buying from existing distributor stock is recommended for urgent requirements.
What is the difference between DSPIC33EP16GS506T-I/PT and DSPIC33EP16GS506-I/PT?
The only difference is the packaging format: the T suffix denotes Tape & Reel packaging for automated pick-and-place assembly, while the non-T part ships in tube/tray packaging for lower-volume assembly. Both parts are the same die, same 16KB Flash, 70 MIPS, 3.3V, -40C to +85C device in the same 64-TQFP (10x10 mm) footprint, so they are fully interchangeable on the same PCB.
Can DSPIC33EP16GS506T-E/PT replace DSPIC33EP16GS506T-I/PT?
Yes, the DSPIC33EP16GS506T-E/PT is a drop-in replacement. The E suffix denotes the extended temperature grade (-40C to +125C) versus the industrial I grade (-40C to +85C). Same 64-TQFP package, same pinout, same 16KB Flash and 70 MIPS core, so it fits the identical PCB footprint. The reverse substitution is not safe if your application exceeds +85C ambient.
What is the best drop-in replacement for DSPIC33EP16GS506T-I/PT?
The best drop-in replacements are same-family Microchip parts in the same 64-TQFP package: DSPIC33EP16GS506-I/PT (identical die, tube packaging) and DSPIC33EP16GS506T-E/PT (extended temperature -40C to +125C). For more Flash in the same footprint, the DSPIC33EP64GS506 family shares the GS506 pinout with 64KB of Flash, allowing firmware growth without PCB rework. Always verify pinout against the manufacturer datasheet before final substitution.
Is there a cross-brand (non-Microchip) equivalent for DSPIC33EP16GS506T-I/PT?
No verified cross-brand pin-to-pin equivalent exists in current cross-reference data. The GS506 combines a 16-bit DSP core with Microchip-proprietary interconnected PWM/ADC/PGA/comparator analog peripherals, so competing DSCs from other vendors require firmware and typically PCB changes. For shortage situations, Microchip's own cross-reference tool recommends within-family alternates. Do not substitute a generic STM32 or TI C2000 part without a full redesign review.
How do I program and debug the DSPIC33EP16GS506T-I/PT?
The device supports In-Circuit Serial Programming (ICSP) via any matched pair of PGECx/PGEDx pins - for example, ICSPCLK on PGEC2 must be paired with ICSPDAT on PGED2. All VDD and VSS pins must be connected during programming. Standard Microchip tools (PICkit, ICD, REAL ICE) and NSDSP programmers support the device per Northern Software compatibility notes, with both programming and debugging provisions available.
What supply voltage does the DSPIC33EP16GS506T-I/PT require?
The DSPIC33EP16GS506T-I/PT operates from a single 3.0V to 3.6V supply with 3.3V nominal, per GlobalSpec parameter data. All VDD pins must be tied to the same rail and individually decoupled with 0.1uF ceramic capacitors placed close to each pin. For digital power supplies, deriving the 3.3V rail from a small linear regulator fed by the auxiliary winding keeps controller supply noise low during converter transients.
When should I choose DSPIC33EP16GS506T-I/PT over DSPIC33EP64GS506?
Choose the 16KB DSPIC33EP16GS506T-I/PT when your control law is compact - a single-loop Buck, Boost, or PFC stage with modest state machines fits comfortably in 16KB. Choose the DSPIC33EP64GS506 (same 64-TQFP footprint, pin-compatible) when you need multi-loop control, communication stacks, data logging, or headroom for field firmware updates. Both share the identical interconnected PWM/ADC/PGA peripheral set, so the choice is primarily program-memory size, not peripheral capability.
Is the DSPIC33EP16GS506T-I/PT suitable for digital SMPS and power factor correction?
Yes - it is purpose-built for this. Per Microchip product data, the dsPIC33EPXXGS50X family offers features supporting common multi-loop digital switch-mode power supplies and power conversion such as AC-to-DC conversion. The interconnected high-speed PWM, ADC with programmable gain amplifiers, and comparators allow hardware-level fault shutdown and cycle-by-cycle current limiting, which is exactly the architecture needed for PFC stages and LLC or phase-shifted full-bridge converters.
What is the operating temperature range of DSPIC33EP16GS506T-I/PT?
The I-grade DSPIC33EP16GS506T-I/PT operates from -40C to +85C (-40F to 185F) per GlobalSpec specification data. For environments above +85C ambient, such as automotive under-hood or high-density power supplies, select the E-grade variant DSPIC33EP16GS506T-E/PT, which is specified to +125C in the same 64-TQFP package and is pin-to-pin compatible.
Where can I find the DSPIC33EP16GS506T-I/PT pinout?
The complete 64-pin TQFP pinout is in the manufacturer datasheet on the Microchip DSPIC33EP16GS506 product page. Key pins include multiple VDD/VSS pairs that must all be connected, PGECx/PGEDx pairs for ICSP (any pair, but clock and data must come from the same numbered pair), PWM output pins, ADC input channels, and comparator inputs. Northern Software's support summary confirms the device has more than one PGECx/PGEDx pair usable for programming.
What is the lifecycle status of the DSPIC33EP16GS506T-I/PT?
The DSPIC33EP16GS506T-I/PT is an active product per GlobalSpec life cycle data, and Microchip lists the dsPIC33EP16GS506 family as a current offering with long-term availability typical of its digital-power DSC lines. No last-time-buy or discontinuation notice exists as of 2026-09-24. Factory lead time of approximately 16 weeks applies to direct orders, so design-ins can proceed with normal obsolescence risk.

Engineering reference data for DSPIC33EP16GS506T-I/PT — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC33EP16GS506T-I/PT when you need a cost-optimized, tape-and-reel 16-bit DSC for single-loop digital power conversion - Buck, Boost, PFC, flyback, or LLC control - where 16KB Flash and 2KB RAM are sufficient and ambient stays within -40C to +85C. Select DSPIC33EP16GS506T-E/PT instead if your enclosure exceeds +85C (extended grade to +125C, same footprint). Use DSPIC33EP16GS506-I/PT (tube packaging) for prototypes and low-volume builds. If firmware will grow - multi-loop control, communication stacks, field bootloaders - design in the pin-compatible DSPIC33EP64GS506 family, which shares the identical 64-TQFP peripheral set with 4x the Flash, letting one PCB layout serve both cost and feature tiers. No cross-brand pin-compatible equivalent exists; substituting competitor DSCs requires PCB and firmware redesign.

Comparison with Alternatives

Parameter This Product DSPIC33EP16GS506-I/PT DSPIC33EP16GS506T-E/PT DSPIC33EP64GS506-I/PT
Package 64-TQFP (10x10 mm) 64-TQFP (10x10 mm) - same 64-TQFP (10x10 mm) - same 64-TQFP (10x10 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory (Flash) 16 KB 16 KB 16 KB 64 KB
Performance 70 MIPS 70 MIPS 70 MIPS 70 MIPS
Operating Temperature -40C to +85C -40C to +85C -40C to +125C -40C to +85C
Packaging Format Tape & Reel Tube/Tray Tape & Reel Tube/Tray
Supply Voltage 3.0 V to 3.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V

Key Differentiators

  • Purpose-built digital-power peripheral interconnect (vs DSPIC33EP16GS506-I/PT)
  • Extended temperature option on same footprint (vs DSPIC33EP16GS506T-E/PT)
  • Cost-optimized 16KB Flash vs 64KB sibling (vs DSPIC33EP64GS506-I/PT)

Design Notes

Connect and decouple every VDD/VSS pair - per the Northern Software ICSP summary, all VSS and VDD pins must be connected for both operation and programming. Place a 0.1uF ceramic capacitor at each VDD pin within 2 mm of the pin, plus one bulk 4.7uF-10uF capacitor near the device. In digital-power layouts, keep the controller ground reference on a quiet analog island connected to the power ground at a single star point to prevent PWM switching currents from corrupting ADC readings.

ICSP pairing errors are the most common bring-up failure: the device has multiple PGECx/PGEDx pairs, and the programming clock and data MUST come from the same numbered pair (e.g., ICSPCLK on PGEC2 with ICSPDAT on PGED2). Mismatched pairs cause silent programming failures. Also note factory lead time is approximately 16 weeks for direct Microchip orders, so qualify a second distributor source or hold buffer stock for production ramps.

Estimated: at 70 MIPS with typical I/O loading, controller power dissipation is on the order of 150-250 mW (VDD 3.3V x tens of mA), which the 64-TQFP 10x10 mm package dissipates with a modest 2-oz copper pour; junction rise stays well below 20C even in +85C ambient. Thermal design effort should instead target the power stage (MOSFETs, magnetics), not the DSC. Verify with actual current measurement on your firmware's clock configuration.

Keep ADC input traces short and route them away from PWM gate-drive traces; the integrated PGA gains small shunt signals, so injected switching noise appears amplified at the converter. Use the hardware comparator interconnect rather than software polling for overcurrent protection - the hardware path reacts in sub-microsecond time and is immune to firmware stalls, which matters for MOSFET safe-operating-area compliance in the power stage.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not explicitly stated in provided web data; Microchip standard commercial parts are typically RoHS-compliant but this must be confirmed on the official product page before relying on it.

Data verified on: 2026-09-24 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology DSPIC33EP16GS506T-I/PT DSPIC33EP16GS506-I/PT DSPIC33EP16GS506T-E/PT DSPIC33EP64GS506-I/PT DSPIC33EP16GS504-I/PT dsPIC33EP digital signal controller DSC 16-bit microcontroller SMPS digital power conversion interconnected high-speed PWM PGA 64-TQFP QFP package family surface mount ICSP 70 MIPS -40C to +85C Tape & Reel RoHS
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