DSPIC33EP256GM306-H/MR - 70 MIPS 16-bit DSC 256KB Flash | Microchip
MPN: DSPIC33EP256GM306-H/MR ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP256GM306-H/MR Overview
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math acceleration of a digital signal processor (DSP). Within the power-management hierarchy of embedded systems, a DSC sits above basic MCUs and below application processors, making it the de facto choice for closed-loop motor control, digital power conversion, and sensing applications that need deterministic interrupt latency plus hardware multiply-accumulate (MAC) instructions in a single chip.
Key features include the 70 MIPS dsPIC33E CPU core with DSP and enhanced on-chip peripherals, 256 KB of self-programmable Flash, AEC-Q100 automotive qualification, and a compact 64-VQFN footprint suited to space-constrained control boards. The GM3xx family integrates high-speed PWM modules, analog comparators, and general-purpose I/O banks that directly serve digital power and motor-drive topologies.
Architecturally, the dsPIC33E core uses a Harvard memory bus structure with a 24-bit instruction word, hardware DSP engine, and DMA, allowing deterministic execution of control loops at tens of kilohertz switching frequencies without software bottlenecks. The extended -H temperature grade supports under-hood and off-highway environments where standard industrial parts (up to +125C or +85C) cannot survive.
Typical applications include brushless DC (BLDC) and permanent-magnet synchronous motor (PMSM) control, automotive auxiliary motor and pump controllers, and industrial digital power supplies (PFC, LLC) that benefit from the high-speed PWM and 70 MIPS headroom.
Design consideration: at 70 MIPS the core runs from an internal PLL multiplied from the external crystal - budget clock tree design and 3.3 V decoupling on every VDD pin of the 64-VQFN; also verify thermal margins at +150C ambient since allowable junction rise is reduced.
This page synthesizes verified distributor data, temperature-grade drop-in options, and practical design notes beyond what the manufacturer product page provides.
Drop-in alternatives for DSPIC33EP256GM306-H/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM306-H/MR (same form factor and footprint) — differing in Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM306-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM306-E/MR
✅ Drop-In✓ In Stock
$5.35 / Unit
View Datasheet →DSPIC33EP256GM306-H/MR Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33E (16-bit DSC core) |
| Core Size | 16-bit |
| Speed (Max MIPS) | 70 MIPS |
| Program Memory Size | 256 KB (85.5K x 24) Flash |
| Supply Voltage | 3.3 V |
| Connectivity / Peripherals | High-speed PWM, motor control peripherals |
| Package | 64-VQFN (9x9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +150C (H grade) |
| Qualification | AEC-Q100 (Automotive) |
| Product Family | dsPIC 33EP |
| Applications Class | Automotive, Motor Control, Digital Power |
| Packaging | Tube |
| Architecture | Harvard, DSP-enhanced |
DSPIC33EP256GM306-H/MR 64-vqfn (9x9 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM306-H/MR (64-vqfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM306-H/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM306-H/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Auxiliary Modules, Digital Power Conversion, Industrial Automation Sensing Nodes, Medical Instrumentation Control, Robotics and Servo Drives.
BLDC/PMSM Motor Control
The DSPIC33EP256GM306-H/MR fits motor control because its 70 MIPS dsPIC33E core with hardware DSP multiply-accumulate executes field-oriented control (FOC) inner current loops at 10-20 kHz deterministically, while integrated high-speed PWM peripherals generate complementary center-aligned drive waveforms with dead-time control. In use, the DSC reads phase currents and rotor position, computes Clarke/Park transforms in the DSP engine, and updates PWM duty within one loop period. The 3.3 V supply and AEC-Q100 +150C rating make it suitable for automotive traction auxiliaries and industrial servo drives alike.
Recommended
Automotive Auxiliary Modules
This device suits automotive auxiliary electronics because it is AEC-Q100 qualified and the -H grade operates from -40C to +150C, surviving under-hood pump, fan, and actuator environments where industrial-grade parts fail. Per distributor listings, the 64-VQFN (9x9 mm) package provides a compact, thermally efficient footprint for control PCBs inside sealed housings. In deployment, the DSC runs the closed-loop control firmware and communicates over CAN-family peripherals, while the 256 KB Flash accommodates OTA-updatable control firmware with boot-loader reserve. Verify junction-temperature derating when mounting near heat sources above +125C ambient.
Recommended
Digital Power Conversion
The DSPIC33EP256GM306-H/MR is a strong fit for digital power because the 70 MIPS core plus high-speed PWM supports PFC, LLC, and phase-shifted full-bridge topologies with cycle-by-cycle current-mode control at switching frequencies of 100 kHz and above. The DSP engine handles per-cycle compensation math while the PWM modules provide adaptive dead time and fault trip inputs. Unlike analog controllers, firmware control allows soft-start profiling, power-metering, and fault logging in the same die. Use the 3.3 V rail with careful analog grounding of comparator references to preserve control-loop noise margin.
Recommended
Industrial Automation Sensing Nodes
For industrial sensing and automation nodes, the DSPIC33EP256GM306-H/MR combines 70 MIPS of DSP throughput with 256 KB Flash, enough to run FFT-based vibration analysis or power-quality math locally while handling protocol stacks. The 64-pin VQFN offers sufficient GPIO for multiple sensor interfaces, and the 3.3 V supply matches standard industrial logic levels. Firmware executes a deterministic sampling loop via DMA into RAM, applies the DSP filters, and reports over the network. The extended -H temperature rating also covers hot factory-floor enclosures lacking forced-air cooling, improving long-term reliability versus +85C parts.
Recommended
Medical Instrumentation Control
The DSPIC33EP256GM306-H/MR serves benchtop and portable medical instrumentation where deterministic control plus DSP math is needed - pump dosing control, centrifuge speed regulation, and sensor-front-end sequencing. The 70 MIPS core runs PID and digital filtering concurrently at low interrupt latency, and the 256 KB Flash retains calibration tables and logging structures in firmware. Its 3.3 V operation simplifies integration with low-voltage analog front ends. While the automotive -H grade exceeds medical ambient requirements, the extended temperature margin supports autoclave-adjacent equipment and thermally enclosed analytical modules with consistent derating headroom.
Recommended
Robotics and Servo Drives
In robotics, the DSPIC33EP256GM306-H/MR acts as a per-joint servo controller: the 70 MIPS DSP core closes current and velocity loops, the PWM peripherals drive three-phase inverters, and encoder/communication peripherals handle position feedback. The 256 KB Flash holds trajectory interpolation and safety-limit firmware locally, enabling deterministic sub-millisecond torque updates independent of a host processor. The compact 64-VQFN (9x9 mm) package fits inside actuator housings where board area is scarce, and the -40C to +150C -H rating tolerates motor-heatsink conduction in high-torque, thermally saturated robotic joints.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM306-H/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM306-I/MR | DSPIC33EP256GM306-E/MR |
|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS |
| Flash Memory | 256 KB (85.5K x 24) | 256 KB (85.5K x 24) | 256 KB (85.5K x 24) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +150C | -40C to +85C | -40C to +125C |
| AEC-Q100 | Qualified (Automotive) | Not automotive grade | Qualified (Automotive, +125C) |
| Typical Use Case | Under-hood / extreme-ambient motor control | Standard industrial motor control | Automotive +125C modules |
Key Differentiators
- Highest temperature grade in the family (vs DSPIC33EP256GM306-I/MR)
- Extended versus standard automotive rating (vs DSPIC33EP256GM306-E/MR)
- Trade-off: availability and cost (vs DSPIC33EP256GM306-I/MR)
Design Notes
Estimated: because the -H grade is specified to +150C ambient, allowable junction rise over ambient is minimal; at a 70 MIPS active-core current the internal dissipation is small (tens of mW range), but board-level heat soak from adjacent power stages can dominate. Compute TJ = TA + P_device * theta_JA using the theta_JA value from the official dsPIC33EP256GM306 datasheet for the 64-VQFN on your stackup, and keep TJ below the datasheet maximum with margin. Thermal vias under the exposed pad are strongly recommended.
Place a 100 nF ceramic decoupling capacitor at every VDD/VDDCORE pin pair of the 64-VQFN, within 2 mm of the pin, plus one 4.7-10 uF bulk capacitor per supply domain. The dsPIC33E core uses an internal regulator - follow the datasheet-required external capacitor on VCAP exactly, or the core may brown out at 70 MIPS. Solder the exposed thermal/electrical pad to a grounded pour for both grounding and heat spreading.
Do not confuse the temperature suffixes when BOM-matching: -I (85C), -E (125C), -H (150C) are same-die but NOT interchangeable in high-ambient designs - substituting an -I part into an -H socket risks field failures above 85C. Also, some aggregator snippets list an incorrect '40-pin' package for this MPN; the verified package is 64-VQFN (9x9 mm). Always confirm pin count against the official Microchip datasheet before layout release.
Compliance Information
AEC-Q100 automotive qualification confirmed by distributor listings (GlobalSpec, FindIC). RoHS/REACH/lead-free status not stated in the provided data - confirm on the Microchip product page.
