DSPIC33EP256GM306-E/MR - 16-bit 60 MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33EP256GM306-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.12 | $7.12 |
| 10 | $6.75 | $67.50 |
| 25 | $6.45 | $161.25 |
| 100 | $6.05 | $605.00 |
| 500 | $5.7 | $2,850.00 |
| 1,000 | $5.35 | $5,350.00 |
DSPIC33EP256GM306-E/MR Overview
A digital signal controller combines the computational power of a digital signal processor (DSP) with the peripheral integration and ease of use of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33E family sits in the broad category of embedded processors: 16-bit DSC -> microcontroller -> embedded processor -> semiconductor. Microchip's dsPIC33E family features the dsPIC DSC core with integrated DSP engine and enhanced on-chip peripherals, purpose-built for high-performance, precision digital motor control systems.
Key features of this device include the 12-channel motor control PWM (MCPWM) module, 8 input capture and 8 output capture/compare channels, 2 quadrature encoder interface (QEI) modules, and 4 on-chip operational amplifiers that offload analog signal conditioning for current-sense loops. Additional system integration comes from the CTMU (Charge Time Measurement Unit) for touch and timing measurements and the PTG (Pulse Train Generator) for sequenced pulse output without CPU intervention.
Technically, the -E suffix denotes the extended industrial temperature range of -40C to +125C, while the /MR suffix identifies the RoHS-compliant 64-VQFN (9x9 mm) surface-mount package. The 16-bit modified Harvard architecture executes most instructions in a single cycle, and the DSP engine provides multiply-accumulate (MAC) operations essential for field-oriented control (FOC) and other computationally intensive control algorithms. Flash program memory of 256KB (85.5K x 24 instruction words) accommodates complex firmware stacks and field upgrades.
Typical applications include brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) drives, power inverters and digital power supplies, industrial automation and robotics servo controllers, where the MCPWM, QEI, and on-chip op-amps directly map to motor-control signal-chain requirements.
A key design consideration: all VDD and VSS pins must be connected, and any pair of PGECx/PGEDx pins must be used together for ICSP programming - failing to connect a complete pair is a common cause of programming failure.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GM306-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM306-E/MR (same form factor and footprint) — differing in Package, Supply Voltage, Core, Operating Temperature, Quadrature Encoder Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM306-H/MR
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP256GM306T-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM306-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GM306-E/PT
✅ Drop-In✓ In Stock
$6.15 / Unit
View Datasheet →DSPIC33EP256GM306-E/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP 16-bit DSC |
| Maximum CPU Speed | 60 MIPS |
| Family Peak Performance | 70 MIPS (dsPIC33E family) |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| RAM Size | 16KB |
| Package | 64-VQFN (9x9 mm) |
| Operating Temperature Range | -40C to +125C (E grade) |
| Motor Control PWM Channels | 12 MCPWM |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interfaces | 2 QEI |
| On-chip Operational Amplifiers | 4 Op-Amps |
| Charge Time Measurement Unit | CTMU |
| Pulse Train Generator | PTG |
| Mounting Type | Surface Mount |
DSPIC33EP256GM306-E/MR 64-vqfn (9x9 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM306-E/MR (64-vqfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM306-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM306-E/MR is suitable for 6 applications: BLDC / PMSM Motor Control, Digital Power Supplies and Inverters, Industrial Automation and Robotics, Automotive and E-Mobility Subsystems, Home Appliances (HVAC, Washing Machines, Compressors), Test, Measurement and Sensing Instruments.
BLDC / PMSM Motor Control
The DSPIC33EP256GM306-E/MR maps directly to sensorless and sensored three-phase motor control: its 12 MCPWM channels generate complementary PWM pairs with dead-time for three-phase inverters, the 2 QEI modules decode incremental encoder feedback, and the 4 on-chip op-amps amplify low-level current-shunt signals ahead of the ADC for field-oriented control (FOC) loops. The 60 MIPS 16-bit DSP engine with single-cycle MAC executes FOC current loops well within PWM switching periods. Placing the controller at the heart of the inverter board eliminates external analog front-end amplifiers, reducing BOM cost. The -E grade tolerates -40C to +125C near heat-generating power stages.
Recommended
Digital Power Supplies and Inverters
For digitally controlled AC-DC and DC-DC converters, solar micro-inverters, and UPS systems, the DSPIC33EP256GM306-E/MR provides the MCPWM module with complementary outputs, dead-time insertion, and fault shutdown required by switch-mode power stages. The 60 MIPS core closes voltage and current loops at high control bandwidth, while the 8 input-capture channels time-stamp feedback events. The PTG generates trigger pulse trains autonomously, offloading the CPU for housekeeping tasks. The 256KB Flash accommodates protection state machines and communication stacks alongside the control loop, and the CTMU supports precision timing measurements for power-quality monitoring.
Recommended
Industrial Automation and Robotics
In factory automation, servo drives, and robotic joint controllers, the DSPIC33EP256GM306-E/MR coordinates multi-axis motion: 2 QEI modules accept dual encoder inputs, 12 MCPWM channels drive multiple motors, and 8/8 input capture/output compare channels handle timing-critical I/O. The 256KB Flash stores motion profiles, trajectory planners, and industrial communication firmware (UART/SPI/I2C as supported). The -40C to +125C rating suits enclosed control cabinets near heat sources. On-chip 4 op-amps condition analog position and current feedback without external amplifiers, and the CTMU enables capacitive touch or cable-diagnostic functions on the panel interface.
Recommended
Automotive and E-Mobility Subsystems
The -E temperature grade (-40C to +125C) of the DSPIC33EP256GM306-E/MR supports automotive-adjacent subsystems such as auxiliary pumps, cooling fans, seat motors, and small traction auxiliaries, where under-hood ambient temperatures approach the extended industrial limit. The 12 MCPWM channels with fault inputs implement safe three-phase and brushed motor drives; the 2 QEI modules read position feedback from pumps and dampers. The 16-bit DSP engine executes sensorless estimation algorithms at 60 MIPS. Designers targeting formal AEC-Q100 programs should confirm qualification status with Microchip, as this -E part is specified for extended industrial rather than automotive qualification.
Recommended
Home Appliances (HVAC, Washing Machines, Compressors)
Variable-speed appliances benefit from the DSPIC33EP256GM306-E/MR's integration: a single controller drives the compressor or wash motor through 12 MCPWM channels, reads rotor position sensorlessly or via QEI encoders, and manages user-interface timing with the PTG. The 4 on-chip op-amps condition compressor current feedback, and the 60 MIPS DSP engine sustains sensorless FOC at low speeds for quiet operation. The 256KB Flash stores multiple wash-cycle or HVAC control profiles plus firmware-update capability. The -E grade survives appliance-enclosure temperatures near heating elements, and the 64-VQFN (9x9 mm) package fits compact main-board layouts.
Recommended
Test, Measurement and Sensing Instruments
Bench and embedded instruments exploit the DSPIC33EP256GM306-E/MR's CTMU for precise charge-time and capacitance measurement, the 8 input-capture channels for period and pulse-width analysis, and the on-chip op-amps for signal conditioning ahead of the ADC. The 60 MIPS DSP engine applies FFT-based analysis and digital filtering in firmware, while 256KB Flash hosts multiple measurement modes and calibration tables. The PTG autonomously generates precisely sequenced stimulus pulse trains for sensor excitation without CPU overhead. The extended -40C to +125C range suits portable instruments used outdoors and in industrial field conditions, and the 64-VQFN package supports dense multi-layer PCB designs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM306-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM306-H/MR | DSPIC33EP256GM306T-E/MR | DSPIC33EP256GM306-I/MR | DSPIC33EP128GM306-E/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | TQFP-64 (different body) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256KB (85.5K x 24) | 256KB | 256KB | 256KB | 128KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (H grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
Key Differentiators
- Extended -40C to +125C operation at standard industrial pricing (vs DSPIC33EP256GM306-I/MR)
- Integrated analog signal chain on-chip (vs DSPIC33EP128GM306-E/PT)
- Doubled motor-control peripheral density versus mainstream 16-bit MCUs (vs DSPIC33EP128MC502-I/SS)
Design Notes
On the 64-VQFN (9x9 mm) package, connect ALL VDD and VSS pins to the 3.3V rail and ground - even if the datasheet power tree suggests some are shared, omitting a connection is a documented cause of ICSP programming failure on dsPIC33EP256GM306 devices. Place a 100 nF ceramic decoupling capacitor at each VDD/VSS pin pair, plus bulk capacitance near the package. The exposed pad on the QFN bottom should be soldered to a grounded thermal array of vias for heat spreading and mechanical anchoring.
Programming failures are the most common bring-up issue on this device. The dsPIC33EP256GM306 has multiple PGECx/PGEDx clock/data pairs, and ICSP requires pins from the SAME pair: if PGEC2 carries ICSPCLK, then PGED2 must carry ICSPDAT. Mixing pairs prevents programming. Route the chosen pair to a standard 5-pin ICSP header (MCLR, VDD, GND, PGECx, PGEDx) on every production PCB, and avoid loading the MCLR pin with large RC delays that slow VDD rise detection.
The -E grade is specified to +125C ambient, so budget junction temperature conservatively. Estimated: with the 64-VQFN exposed-pad package, using a reasonable theta_JA of roughly 30-40 C/W on a board with a solid ground plane (verify exact value in the Microchip datasheet package section), a 100 mA core/peripheral load at 3.3 V dissipates only about 0.33 W, yielding an estimated 10-13 C rise - comfortable headroom near motors or power stages. For higher I/O sourcing loads, recalculate dissipation and enlarge the copper pour under the exposed pad.
Keep MCPWM outputs to gate drivers short and matched when driving three-phase bridges; route QEI encoder inputs as a differential-tolerant pair away from PWM switching edges, and add series termination (22-33 ohm) on long encoder lines to suppress ringing. Star-ground the analog op-amp feedback network away from high-di/dt PWM return paths to preserve ADC accuracy in FOC current loops. The 4 on-chip op-amps share supply rails with the digital core, so heavy digital switching can couple into analog front ends without careful layout partitioning.
Compliance Information
RoHS compliance and lead-free finish indicated by the /MR package suffix per Microchip and distributor listings as of 2026-09-24. Formal REACH, halogen-free, and conflict-minerals declarations should be requested from Microchip.
