DSPIC33EP256GP502-H/MM - 256KB 60 MIPS DSC | Microchip
MPN: DSPIC33EP256GP502-H/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.68 | $5.68 |
| 10 | $5.12 | $51.20 |
| 100 | $4.55 | $455.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.72 | $3,720.00 |
DSPIC33EP256GP502-H/MM Overview
A digital signal controller combines the deterministic control flow of a microcontroller with the DSP engine (single-cycle MAC, divide, modulo addressing) of a digital signal processor. Within the power-management hierarchy, a DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33 family a common choice for closed-loop control systems such as digital power conversion and motor drives.
Key features include the dsPIC33E 16-bit core running at up to 60 MIPS on this speed/temperature grade, 256KB of self-programmable FLASH, 16-32KB of SRAM (distributor listings report 16KB and 32KB variants of the family; see validation note), and rich analog integration with on-chip op amps, a CTMU charge-time measurement unit and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing.
The architecture provides a flexible interrupt system, multiple PGECx/PGEDx In-Circuit Serial Programming (ICSP) debug channel pairs, and enhanced CAN communication, positioning the device for fieldbus-connected embedded nodes. Hi-speed PWM peripherals support switching power stages and actuator control, while the advanced analog block reduces external component count in sensor front ends.
Typical applications include automotive control modules, industrial automation and motor control, CAN-based communication nodes, digital power supplies, and precision sensor systems that exploit the on-chip op amps and CTMU for capacitive or time-domain measurements.
Design consideration: verify the exact SRAM figure for your speed and temperature ordering code against the family datasheet before locking the memory map, and use any matched PGECx/PGEDx pair for ICSP while keeping all VDD and VSS pins connected.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GP502-H/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GP502-H/MM (same form factor and footprint) — differing in Operating Temperature, Package, Qualification, SRAM, Lifecycle Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GP502-I/MM
✅ Drop-In✓ In Stock
$3.79 / Unit
View Datasheet →DSPIC33EP256GP502-E/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GP502-H/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP64GP502-H/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128MC202T-E/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.41 / Unit
View Datasheet →DSPIC33EP256GP502-H/MM Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33E DSC |
| Core Speed | 60 MIPS |
| Program Memory | 256KB (85.5K x 24) FLASH |
| SRAM | 32KB (some distributor listings state 16KB - verify against family datasheet) |
| Supply Voltage | 3.3 V (3.0 V to 3.6 V) |
| Connectivity | CAN, I2C, SPI, UART/USART, IrDA, LIN |
| Analog Peripherals | On-chip Op Amps, CTMU, ADC |
| Timing Peripherals | Hi-Speed PWM, Timers, RTCC |
| Special Peripherals | Peripheral Trigger Generator (PTG) |
| Operating Temperature | -40C to +150C (-H grade) |
| Qualification | AEC-Q100 (Automotive) |
| Package | 28-QFN-S (6x6 mm), exposed pad |
| Mounting Type | Surface Mount |
| Debug / Programming | ICSP via multiple PGECx/PGEDx pairs |
| Lifecycle Status | In Production (per Microchip product page) |
| Series | dsPIC 33EP (dsPIC33EP256GP502) |
DSPIC33EP256GP502-H/MM Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input / programming voltage |
| Pin 2 | AN0/RB0 — Analog input 0 / digital I/O PORTB bit 0 |
| Pin 3 | AN1/RB1 — Analog input 1 / digital I/O PORTB bit 1 |
| Pin 4 | AN2/RB2 — Analog input 2 / digital I/O PORTB bit 2 |
| Pin 5 | AN3/RB3 — Analog input 3 / digital I/O PORTB bit 3 |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Positive supply (3.0V-3.6V) |
| Pin 8 | AN4/RB4 — Analog input 4 / digital I/O PORTB bit 4 |
| Pin 9 | AN5/RB5 — Analog input 5 / digital I/O PORTB bit 5 |
| Pin 10 | VSS — Ground reference |
| Pin 11 | OSC1/RC12 — Oscillator crystal input / external clock input |
| Pin 12 | OSC2/RC15 — Oscillator crystal output / clock output |
| Pin 13 | PGED1/RB6 — ICSP data channel 1 / AN6 / digital I/O |
| Pin 14 | PGEC1/RB7 — ICSP clock channel 1 / AN7 / digital I/O |
| Pin 15 | AN8/RB8 — Analog input 8 / external interrupt INT0 / digital I/O |
| Pin 16 | AN9/RB9 — Analog input 9 / input capture / digital I/O |
| Pin 17 | AN10/RB10 — Analog input 10 / digital I/O PORTB bit 10 |
| Pin 18 | AN11/RB11 — Analog input 11 / digital I/O PORTB bit 11 |
| Pin 19 | AN12/RB12 — Analog input 12 / digital I/O PORTB bit 12 |
| Pin 20 | AN13/RB13 — Analog input 13 / digital I/O PORTB bit 13 |
| Pin 21 | AN14/RB14 — Analog input 14 / digital I/O PORTB bit 14 |
| Pin 22 | AN15/RB15 — Analog input 15 / digital I/O PORTB bit 15 |
| Pin 23 | VDD — Positive supply (3.0V-3.6V) |
| Pin 24 | VSS — Ground reference |
| Pin 25 | AVDD — Analog positive supply (connect to VDD) |
| Pin 26 | AVSS — Analog ground reference |
| Pin 27 | RP18/RF2 — Remappable peripheral pin (SDA1) / digital I/O |
| Pin 28 | RP19/RF3 — Remappable peripheral pin (SCL1) / digital I/O |
Typical Applications
DSPIC33EP256GP502-H/MM is suitable for 6 applications: Automotive Control Modules, Industrial Automation and Motor Control, CANbus Communication Nodes, Digital Power Conversion, Precision Sensor Systems, Portable and Battery-Powered Instruments.
Automotive Control Modules
The DSPIC33EP256GP502-H/MM fits automotive electronic control units because it combines AEC-Q100 qualification with the -40C to +150C -H temperature grade, covering under-hood and transmission-adjacent thermal environments where commercial-grade MCUs fail. The 60 MIPS 16-bit core executes closed-loop control algorithms with deterministic latency, while the integrated CAN peripheral provides direct in-vehicle network connectivity without an external CAN controller. The 256KB FLASH accommodates diagnostic layers and OTA-resilient bootloader structures typical of automotive firmware. Placed in a 28-QFN-S (6x6 mm) package with exposed pad soldered to a ground pour, the device dissipates minimal power at 3.3V, simplifying thermal design; the principal consideration is supply transient immunity per automotive load-dump requirements.
Recommended
Industrial Automation and Motor Control
In industrial automation, the DSPIC33EP256GP502-H/MM serves as a compact control node driving actuators, valves and small motors. The dsPIC33E core's DSP engine (single-cycle MAC) executes field-oriented control and PID loops at 60 MIPS, while Hi-Speed PWM peripherals generate the switching waveforms for power stages. The -40C to +150C rating tolerates hot cabinet environments, and the Peripheral Trigger Generator (PTG) sequences ADC sampling and PWM updates autonomously, offloading the CPU. Using the 28-QFN-S MM footprint keeps the controller close to gate drivers, shortening analog traces; designers should place the ADC input filters away from PWM switching noise and use the multiple PGECx/PGEDx pairs for field firmware updates via a production test header.
Recommended
CANbus Communication Nodes
The DSPIC33EP256GP502-H/MM is well suited as an intelligent CAN node in building automation, agricultural equipment and industrial fieldbus networks, because Enhanced CAN is integrated on-chip and supported by Microchip's application libraries, eliminating external CAN silicon. With 256KB FLASH, the node can host protocol stacks, diagnostics and logging buffers in the on-chip SRAM while maintaining 60 MIPS of headroom for application logic. The -H temperature grade allows mounting near heat sources on the network edge. Typical topology: CAN TX/RX through a transceiver such as the MCP2562 with a 120-ohm termination at the bus ends; the MCU handles filtering and message prioritization in hardware, and the PTG can trigger periodic transmission frames without CPU intervention, lowering worst-case interrupt latency.
Recommended
Digital Power Conversion
Digital power supplies, LED drivers and battery chargers benefit from the DSPIC33EP256GP502-H/MM's combination of Hi-Speed PWM outputs, fast ADC sampling and a DSP core for control-law computation. The PTG enables autonomous PWM-ADC-PWM loops, achieving consistent control periods that reduce output ripple and improve transient response compared with pure software timing. The -40C to +150C rating allows placement near hot converter stages, though keeping the controller physically separated from the magnetics remains best practice. The 28-QFN-S (6x6 mm) exposed-pad package provides a low-inductance ground reference important for clean ADC readings; connect the pad directly to a solid ground plane and decouple all VDD/AVDD pins with 100nF ceramics placed within 2mm of the pins.
Recommended
Precision Sensor Systems
The on-chip operational amplifiers, CTMU (Charge Time Measurement Unit) and ADC make the DSPIC33EP256GP502-H/MM a strong fit for sensor front ends: bridge sensors, capacitive touch/proximity and time-domain measurements can be conditioned and digitized without external amplifier ICs. The 60 MIPS core applies filtering (IIR/FIR) and calibration math in real time on the 3.3V rail. The -H grade suits outdoor and engine-bay sensor packages. Design considerations: use the on-chip op amps in unity-gain buffering for high-impedance sources, exploit the CTMU for ratiometric capacitive measurement with matched external charge capacitors, and route analog signals on a quiet ground island beneath the AVDD/AVSS pins to preserve effective ADC resolution.
Recommended
Portable and Battery-Powered Instruments
Handheld measurement and diagnostic instruments use the DSPIC33EP256GP502-H/MM for its dense integration: CAN, I2C, SPI, UART/IrDA and LIN on one 16-bit 60 MIPS core reduce board area, and the 28-QFN-S (6x6 mm) package fits compact enclosures. The 256KB FLASH holds GUI logic, logging and communication stacks without external memory, supporting single-chip BOMs that extend battery life. Operating from a single 3.0V-3.6V lithium cell via an LDO is straightforward; sleep and idle modes reduce average current between measurements. The -40C to +150C range, while beyond handheld requirements, guarantees margin against enclosed solar or vehicular installations. For lowest power, clock the core at reduced MIPS during idle periods and use the UART/IrDA interface for periodic data offload.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GP502-H/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GP502-I/MM | DSPIC33EP256GP502-E/MM | DSPIC33EP128GP502-H/MM | DSPIC33EP128GP502-H/SO |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6, MM) | 28-QFN-S (6x6, MM) - same | 28-QFN-S (6x6, MM) - same | 28-QFN-S (6x6, MM) - same | SOIC-28 (different footprint) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH | 256KB | 256KB | 256KB | 128KB | 128KB |
| Operating Temperature | -40C to +150C | -40C to +85C | -40C to +125C | -40C to +150C | -40C to +150C |
| Connectivity | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
Key Differentiators
- Highest automotive temperature grade in the family (vs DSPIC33EP256GP502-I/MM)
- Double the program memory of the 128GP variant (vs DSPIC33EP128GP502-H/MM)
- Same-die temperature downgrades enable cost optimization (vs DSPIC33EP256GP502-E/MM)
- General-purpose analog integration vs motor-control variants (vs DSPIC33EP128MC202T-E/MM)
Design Notes
Connect the QFN exposed pad to a solid VSS pour with an array of thermal vias. Connect all VDD pins (7, 23) and AVDD (25) to the 3.3V rail, each decoupled with 100nF ceramic capacitors placed within 2mm of the pin, plus one 4.7uF-10uF bulk capacitor near the supply entry. Keep AVSS/AVSS Analog ground return separate from high-current PWM return paths to preserve ADC accuracy.
ICSP requires matched PGECx/PGEDx pairs: if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2. Mixing channels from different pairs is the most common bring-up failure. Reserve one pair for a programming header on production boards. Additionally, verify the SRAM figure for your exact ordering code against the family datasheet before finalizing the linker memory map.
Estimated: at 60 MIPS with typical I/O loading, core current is on the order of tens of milliamps at 3.3V (well under 0.2W dissipation), so the 28-QFN-S package rarely needs heatsinking. However, for -H grade operation above +125C ambient, verify the junction temperature using the datasheet theta-JA and your PCB copper area, and consider the -E or -I grades if the enclosure stays below +85C/+125C to reduce cost.
Route the oscillator (OSC1/OSC2) traces short and symmetric with ground guarding, keep CAN transceiver stubs under 5cm with proper split termination, and separate analog input routing (RB0-RB15 analog functions) from PWM and clock traces on the top layer. Use a ground plane on layer 2 beneath the controller to provide a low-inductance return for the remappable RP pin signals.
Compliance Information
Distributor listings (DigiKey, Hotenda) explicitly market the part as 'Automotive, AEC-Q100'. RoHS/REACH/lead-free status not stated in provided data - confirm on Microchip's product page.
