DSPIC33EP256MU810T-I/PF - 60 MIPS DSC, 256KB Flash | Microchip
MPN: DSPIC33EP256MU810T-I/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.14 | $514.00 |
| 500 | $4.6 | $2,300.00 |
| 1,000 | $4.1 | $4,100.00 |
DSPIC33EP256MU810T-I/PF Overview
A digital signal controller combines the peripheral set and ease of use of a microcontroller with the computational throughput of a DSP. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33EP sits above a basic 8-bit MCU but below a full DSP-plus-MCU two-chip solution, providing a single-chip signal chain. The dsPIC33E family integrates a high-performance DSP engine with enhanced on-chip peripherals targeted at precision control applications.
Key features of this device include the 60 MIPS dsPIC33EP core, 256KB of self-programmable Flash, and on-chip peripherals highlighted by Microchip for the family: high-speed PWM modules, USB connectivity, and advanced analog converters with up to 32 channels supporting 10-bit or 12-bit resolution. Multiple DMA channels offload data movement, and general-purpose timers support complex sequencing without CPU intervention.
Architecturally, the dsPIC33EP core executes an enhanced 16-bit instruction set with DSP multiply-accumulate instructions, enabling single-cycle MAC operations for filtering and control loops. The wide 100-pin TQFP exposes 51 I/O ports worth of general-purpose connectivity, giving designers pin-count headroom for motor-control bridges, communication buses, and human-interface signals on a single controller.
Typical applications include precision motor control (BLDC, PMSM, stepper), digital power supplies and lighting, USB-connected industrial instruments, and embedded control systems requiring DSP-grade filtering. The high-speed PWM makes it particularly well matched to three-phase inverter stages.
Design consideration: the device operates from a 3.0V to 3.6V supply, so level-shift appropriately when interfacing with 5V logic, and follow Microchip decoupling guidance with low-ESR ceramics at each VDD/VSS pair.
This page synthesizes distributor pricing, drop-in alternatives across the dsPIC33EP family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP256MU810T-I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256MU810T-I/PF (same form factor and footprint) — differing in Package, Core, Operating Temperature, RAM, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesDSPIC33EP256MU810T-I/PF Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP, 16-bit |
| Max CPU Speed | 60 MIPS (60 MHz) |
| Program Memory Size | 256 KB (85.5K x 24) Flash |
| SRAM Size | 28 KB |
| Supply Voltage | 3.0 V to 3.6 V |
| Package | 100-TQFP (14 x 14 mm) |
| I/O Ports | 51 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Program Memory Type | Flash |
| USB | Yes (on-chip USB peripheral) |
| PWM | High-Speed PWM |
| ADC Channels | Up to 32 channels, 10-bit or 12-bit |
| DMA | Yes |
| Timers | Multiple general-purpose timers |
| Packaging | Tape & Reel (T suffix) |
| Qualification | AEC-Q100 qualified (E-grade variants) |
| RoHS Status | Compliant |
DSPIC33EP256MU810T-I/PF 100-tqfp (14 x 14 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256MU810T-I/PF (100-tqfp (14 x 14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MU810T-I/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MU810T-I/PF is suitable for 6 applications: Precision Motor Control (BLDC/PMSM), Digital Power Supplies and Lighting, USB-Connected Industrial Instruments, Embedded Audio and Signal Processing Nodes, Automotive and Harsh-Environment Control, Multi-Sensor Data Acquisition Systems.
Precision Motor Control (BLDC/PMSM)
The DSPIC33EP256MU810T-I/PF fits three-phase BLDC and PMSM control because its 60 MIPS core with single-cycle DSP multiply-accumulate executes field-oriented control loops fast enough for low-inductance motors, while the high-speed PWM peripheral generates complementary outputs with dead-time insertion for the inverter bridge. Up to 32 ADC channels at 10- or 12-bit resolution sample phase currents and bus voltage, and DMA transfers results to RAM without CPU intervention, keeping loop jitter low. In a typical design the PWM updates at 20 kHz or higher while the current loop runs at the same rate; the 28KB SRAM holds filter state and reference trajectories. The 51 I/O also cover encoder, Hall, and safety interlock signals on one 100-TQFP controller.
Recommended
Digital Power Supplies and Lighting
For digitally controlled AC/DC and DC/DC converters, this DSC provides the high-speed PWM resolution and fast ADC sampling needed for peak-current-mode or voltage-mode loops. The 60 MIPS core runs compensator calculations in single-cycle MAC operations, and the high-speed PWM supports frequency, duty, and phase-shift modulation with dead-time control suited to LLC, buck, and boost topologies. Digital lighting ballasts and LED drivers benefit from the same PWM engine plus USB connectivity for configuration and monitoring via a host. Operating from a 3.0-3.6V rail keeps the control side isolated from the power stage through standard optocouplers or digital isolators. The 100-pin TQFP exposes enough channels to control multiple independent power stages from one controller.
Recommended
USB-Connected Industrial Instruments
The on-chip USB peripheral makes this part a natural single-chip controller for bench instruments, data loggers, and programmable power modules that report to a PC. The 60 MIPS DSP engine filters and decimates incoming sensor data (with up to 32 ADC channels at 10/12-bit), while the USB endpoint handles bulk transfer of measurement records without stealing CPU cycles thanks to DMA. The 256KB Flash accommodates substantial application code, USB stacks, and calibration tables with room to spare, and the Flash is self-programmable for field firmware updates delivered over the USB link itself. The industrial -40C to +85C rating of the I grade suits factory-floor enclosures, and the 51 I/O drive front-panel indicators, relays, and auxiliary buses.
Recommended
Embedded Audio and Signal Processing Nodes
The dsPIC33EP DSP engine with single-cycle MAC and hardware barrel shifter supports real-time audio filtering, spectral analysis, and acoustic sensing. While not an audio codec itself, the controller pairs with external codec ICs over standard serial interfaces, using the 60 MIPS core for IIR/FIR processing and the DMA to stream sample buffers without CPU overhead. The 28KB SRAM holds multiple filter delay lines at typical 8-48 kHz sample rates. Industrial sound-level monitors, active noise panels, and sensor-conditioning nodes benefit from combining this processing with the USB peripheral for host communication and Flash self-programming for field-updatable coefficient sets. The 100-pin package leaves I/O headroom for analog front-end control and indicator functions.
Recommended
Automotive and Harsh-Environment Control
Although the I-grade target part is rated -40C to +85C, designs headed for automotive qualification should use the pin-to-pin DSPIC33EP256MU810T-E/PF, which is AEC-Q100 qualified with extended temperature capability in the identical 100-TQFP footprint. The high-speed PWM plus multi-channel ADC architecture suits electronic throttle, pump, fan, and actuator control, and the DSP core handles sensor fusion and ripple-count position estimation. The 256KB Flash supports substantial diagnostic and fault-logging code, while the 51 I/O interface LIN-class transceivers and discrete switches. Because the E and I parts share the die and package, one PCB layout serves both industrial prototypes and automotive production, eliminating board respins during program migration.
Recommended
Multi-Sensor Data Acquisition Systems
With up to 32 ADC channels selectable between 10-bit and 12-bit resolution, this DSC consolidates many analog sensor inputs - thermistors, pressure bridges, current shunts - into one controller. The 60 MIPS core applies calibration math and digital filtering per channel, DMA moves conversion results into the 28KB SRAM ring buffers, and the USB peripheral streams processed records to a host. The 256KB Flash stores per-unit calibration tables, and self-programming enables field recalibration. The 51 I/O drive sensor excitation switches, multiplexer select lines, and status indicators. For systems needing more memory or different peripheral mixes within the same pin budget, the DSPIC33EP256GM710T-I/PF shares the 100-pin TQFP footprint, though pin functions require datasheet verification before migration.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MU810T-I/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MU810T-E/PF | DSPIC33EP256MU810T-E/PT | DSPIC33EP256MU810-I/PF | DSPIC33EP256GM710T-I/PF |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same footprint, pin functions differ |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Performance | 60 MIPS (16-bit dsPIC33EP core) | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 256 KB (85.5K x 24) | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 28 KB | 28 KB | 28 KB | 28 KB | 28 KB |
| Temperature Grade | -40C to +85C (I) | Extended (E), AEC-Q100 | Extended (E), AEC-Q100 | -40C to +85C (I) | -40C to +85C (I) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| USB Peripheral | Yes (MU series) | Yes | Yes | Yes | GM-series peripheral mix - verify per datasheet |
| Automotive Qualification | No (industrial I grade) | AEC-Q100 qualified | AEC-Q100 qualified | No | No |
Key Differentiators
- USB plus high-speed PWM on one die (vs DSPIC33EP256MC504T-I/TL)
- Pin-count headroom for multi-channel systems (vs DSPIC33EP256MU806T-I/PT)
- Cost-efficient industrial grade for non-automotive builds (vs DSPIC33EP256MU810T-E/PF)
Design Notes
The DSPIC33EP256MU810T-I/PF requires a 3.0V to 3.6V supply. Decouple every VDD pin pair with 100 nF low-ESR ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF capacitance near the die center. On a 100-pin TQFP, all VDD/VSS pairs must be connected - floating a pair raises ground bounce and can corrupt ADC readings during PWM switching events. If the design steps down from 5V, use a low-noise LDO rather than a buck converter directly to preserve analog converter accuracy.
The 100-TQFP (14x14 mm) with 0.5 mm pitch requires solder-mask-defined pads per Microchip layout guidance and a minimum 4-layer board for controlled fanout in motor-control designs. Keep the high-speed PWM traces to the gate drivers short and symmetric per phase, and route analog sense lines away from PWM switching edges to protect the up-to-32-channel ADC input integrity. Place the ICSP programming header near the device and reserve the programming pins to remain accessible in production for in-circuit programming and field updates.
A frequent substitution mistake is treating DSPIC33EP256GM710T-I/PF as an automatic replacement: although it shares the 100-pin TQFP footprint and 256KB Flash, the GM-series peripheral set and pin function mapping differ from the MU series, so a board designed for USB plus high-speed PWM on the MU810 may not function. Always re-verify the pinout table and configuration bit settings when migrating between MU and GM variants, and re-run the configuration-bit comparison before committing a production build.
Compliance Information
RoHS compliance per Microchip catalog listing practices for current dsPIC33EP production parts. The target I-grade part is not AEC-Q100 qualified; the E-grade variants are qualified per Microchip USA listings.
