DSPIC33EP32GS505-I/PT - 16-bit 70MIPS DSC 32KB | Microchip
MPN: DSPIC33EP32GS505-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.92 | $49.20 |
| 100 | $4.38 | $438.00 |
| 500 | $3.96 | $1,980.00 |
| 1,000 | $3.55 | $3,550.00 |
DSPIC33EP32GS505-I/PT Overview
A Digital Signal Controller combines the computational throughput of a digital signal processor with the control peripherals and ease of use of a microcontroller, occupying a middle tier of the semiconductor hierarchy: DSC -> 16-bit microcontroller -> microcontroller unit (MCU) -> embedded processor. The dsPIC33EP GS50x subfamily is purpose-built for digital switch-mode power supply (SMPS) and digital power-conversion applications.
Key differentiating features include a high-speed 12-bit ADC with multiple sample-and-hold circuits capable of several Msps throughput, on-chip analog comparators, programmable gain amplifiers (PGA), a 10-bit DAC, and the interconnected high-speed PWM module that supports complementary, independent and center-aligned PWM modes essential for multi-loop power converters. The core runs at 70 MIPS from an internal PLL, and the device is Functional Safety (FuSa) capable per Microchip's product designation.
Typical applications include interleaved power factor correction (PFC) - Microchip's official reference design demonstrates a 350W universal-input interleaved PFC converter - plus AC-DC converters, DC-DC converters, battery chargers, solar micro-inverters, LED drivers and telecom power supplies, where deterministic loop response and high-resolution PWM directly improve efficiency and transient behavior.
Design consideration: connect all VDD and VSS pairs and use a low-impedance decoupling network; any pair of PGECx/PGEDx pins must be used as a matched pair for ICSP programming and debugging, so route ICSPCLK/ICSPDAT consistently.
This page synthesizes verified distributor listings, drop-in same-footprint alternatives, and digital-power design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP32GS505-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GS505-I/PT (same form factor and footprint) — differing in Operating Temperature, Package, ADC, Functional Safety, Product Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GS505-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP64GS505-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GS505-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.45 / Unit
View Datasheet →DSPIC33EP16GS505-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.51 / Unit
View Datasheet →DSPIC33EP32GS505-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory | 32KB (32K x 8) FLASH |
| Package | 48-TQFP-EP (7x7 mm) |
| Operating Temperature | -40C to +85C (I grade) |
| Mounting Type | Surface Mount |
| ADC Resolution | 12-bit |
| ADC Type | High-speed, multiple S&H, Msps-class |
| PWM Module | Interconnected high-speed PWM (complementary, independent, center-aligned) |
| DAC | 10-bit on-chip |
| Comparators | On-chip analog comparators |
| Programmable Gain Amplifier | Yes (PGA) |
| Debug/Programming | ICSP via PGECx/PGEDx pairs (multiple pairs) |
| Functional Safety | FuSa-capable designation |
| Product Family | dsPIC33EPXXGS50X (SMPS & Digital Power Conversion) |
DSPIC33EP32GS505-I/PT 48-tqfp-ep (7x7 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP32GS505-I/PT (48-tqfp-ep (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GS505-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GS505-I/PT is suitable for 6 applications: Interleaved Power Factor Correction (PFC), AC-DC Switch-Mode Power Supplies, DC-DC Converters and Point-of-Load Supplies, Solar Micro-Inverters and Renewable Energy Converters, Battery Chargers and Battery Management, High-Power LED Drivers and Lighting Power.
Interleaved Power Factor Correction (PFC)
Microchip's official Interleaved PFC reference design targets the dsPIC33EP GS50x family directly, converting universal AC input to a single high-voltage DC output up to 350W. The DSPIC33EP32GS505-I/PT's interconnected high-speed PWM generates interleaved, phase-shifted drive for two converter legs, while the 12-bit high-speed ADC with multiple sample-and-hold circuits samples inductor current and output voltage synchronously to the PWM edges, minimizing switching-noise corruption. On-chip comparators with PGA provide fast cycle-by-cycle overcurrent protection without CPU intervention. At 70 MIPS, average-current-mode control loops execute with ample computational margin. The 48-TQFP-EP package exposes enough PWM and ADC channels for two-phase designs while keeping board area compact.
Recommended
AC-DC Switch-Mode Power Supplies
The dsPIC33EPXXGS50X family is explicitly designed by Microchip for multi-loop digital AC-DC converter control. The DSPIC33EP32GS505-I/PT handles flyback, forward and LLC topologies using its complementary and independent high-speed PWM modes with programmable dead-band and fault inputs. The 12-bit ADC samples the output voltage and primary current at Msps-class rates, and the on-chip 10-bit DAC plus comparators implement fast analog current limiting in hardware. Digital control enables adaptive burst mode, output-voltage scheduling and load-share logic that analog controllers cannot easily offer. With 32KB FLASH, full control firmware, protection state machines and housekeeping code fit comfortably, and the FuSa-capable designation aids power-supply safety assessments.
Recommended
DC-DC Converters and Point-of-Load Supplies
For telecom rectifiers, intermediate-bus converters and high-density point-of-load bricks, the DSPIC33EP32GS505-I/PT provides synchronous buck or boost control with center-aligned PWM that minimizes input ripple current. The high-speed ADC's multiple sample-and-hold inputs allow simultaneous sensing of input voltage, output voltage and inductor current, while hardware comparators deliver sub-microsecond overcurrent shutdown. The device executes voltage-mode, current-mode or digital adaptive control laws at 70 MIPS with deterministic latency, supporting fast transient response targets. Digital loop compensation in firmware permits tunable transient profiles and telemetry via UART or SPI without additional controllers, consolidating supervision and sequencing in a single 7x7 mm 48-pin device.
Recommended
Solar Micro-Inverters and Renewable Energy Converters
Solar micro-inverters combine an MPPT DC-DC stage with a grid-tied inverter stage, exactly the multi-loop digital-power workload the GS50x family targets. The DSPIC33EP32GS505-I/PT's high-speed PWM drives both boost and inverter legs with configurable phase relationships, while synchronized 12-bit ADC sampling captures panel voltage/current and grid waveforms for maximum-power-point tracking and grid synchronization. On-chip comparators implement rapid anti-islanding and overcurrent protection in hardware. Outdoor enclosures create high ambient temperatures, so the extended-grade DSPIC33EP32GS505-E/PT variant is often preferred here. The 32KB FLASH accommodates MPPT algorithms, grid-code compliance firmware and communication protocols within the compact 48-TQFP-EP footprint.
Recommended
Battery Chargers and Battery Management
Multi-chemistry battery chargers require CC/CV charging profiles, charge-termination detection and safety supervision - all supported by the DSPIC33EP32GS505-I/PT peripheral set. Its high-speed PWM with complementary outputs drives buck or flyback charging stages, the 12-bit ADC monitors cell voltage and charge current with sufficient resolution for accurate termination thresholds, and the on-chip comparators with PGA enforce hardware overcurrent limits. Digital control enables adaptive charge curves per battery chemistry and coulomb-style supervision in firmware. At 70 MIPS the device also runs communication stacks (UART/CAN via peripherals) for charger-to-host telemetry, consolidating charger control and monitoring into one 16-bit DSC in the 7x7 mm TQFP-EP package.
Recommended
High-Power LED Drivers and Lighting Power
Digitally controlled LED drivers benefit from the GS50x family's combination of high-resolution PWM dimming and fast current-mode regulation. The DSPIC33EP32GS505-I/PT controls boost, buck or flyback LED drivers with its interconnected high-speed PWM, achieving flicker-free deep dimming via precise duty-cycle control, while the 12-bit ADC closes the LED current loop at high sampling rates. On-chip comparators provide short-circuit protection between PWM cycles. Firmware-based control allows intelligent features - thermal foldback via temperature sensing input, occupancy-based dimming, and DALI/DMX communication stacks - that discrete LED controller ICs cannot match. The 32KB FLASH and 48-pin TQFP-EP footprint fit smart luminaire drivers where size and integration drive the BOM.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GS505-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GS505-E/PT | DSPIC33EP64GS505-I/PT | DSPIC33EP64GS505-E/PT | DSPIC33EP16GS505-I/PT |
|---|---|---|---|---|---|
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Program Memory | 32KB (32K x 8) | 32KB (32K x 8) | 64KB (64K x 8) | 64KB (64K x 8) | 16KB (16K x 8) |
| ADC | 12-bit high-speed, Msps-class | 12-bit high-speed, Msps-class | 12-bit high-speed, Msps-class | 12-bit high-speed, Msps-class | 12-bit high-speed, Msps-class |
| Operating Temperature | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +125C (extended) | -40C to +85C |
| Functional Safety (FuSa) | Yes (family designation) | Yes (family designation) | Yes (family designation) | Yes (family designation) | Yes (family designation) |
| High-Speed PWM / Analog Peripherals | Interconnected HS-PWM, comparators, PGA, 10-bit DAC | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set |
Key Differentiators
- Interconnected high-speed PWM purpose-built for digital power (vs DSPIC33EP256MC504-I/PT (MC family))
- Extended temperature option in identical footprint (vs DSPIC33EP32GS505-E/PT)
- FLASH scalability without redesign (vs DSPIC33EP64GS505-I/PT)
Design Notes
Per Microchip's programming documentation (northernsoftware.com compatibility summary), the dsPIC33EP32GS505 exposes multiple PGECx/PGEDx pin pairs for ICSP. Any pair may be used, but ICSPCLK and ICSPDAT must come from the SAME matched pair - mixing PGEC2 with PGED1 prevents programming. Route your programming header to one chosen pair and never fan out to mixed pins. Additionally, all VDD and VSS pins must be connected per the datasheet; a single floating supply pin will cause erratic brown-out behavior even if the device appears to boot.
In digital power layouts, keep the PWM outputs, ADC sense lines and comparator inputs physically separated on the 48-TQFP-EP footprint. Route high-current switching loops (MOSFET drain-source paths) away from the ADC sampling traces to prevent ground-bounce corruption of the Msps-class conversions; use a dedicated analog ground region tied to VSS at a single point. Synchronize ADC sampling to PWM off-times using the family's ADC-to-PWM trigger interconnect rather than free-running sampling - this is the documented pattern in Microchip's digital power reference designs including the 350W Interleaved PFC design.
Estimated: the 48-TQFP-EP (7x7 mm) exposed-pad package improves heat spreading versus a plain TQFP; solder the EP pad to a grounded copper pour of at least 25 mm x 25 mm with an array of thermal vias. For an industrial-grade -I/PT part running digital power firmware, core current draw is modest (tens of mA at 70 MIPS), so junction rise from the DSC itself is typically small; the thermal risk in SMPS designs comes from adjacent power stages, so verify board-level airflow and keep the controller outside the hottest MOSFET zone to preserve margin within the -40C to +85C industrial rating (choose the -E/PT grade when ambient exceeds 85C).
Compliance Information
Compliance statuses were not stated in the retrieved web data; consult the Microchip product page and environmental data sheets for certified RoHS/REACH declarations.
