DSPIC33EP512GP502-E/SP - 16-Bit DSC 60 MIPS 512KB Flash | Microchip
MPN: DSPIC33EP512GP502-E/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.28 | $5.28 |
| 10 | $4.9 | $49.00 |
| 100 | $4.55 | $455.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.95 | $3,950.00 |
DSPIC33EP512GP502-E/SP Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral set and ease of use of a microcontroller. In the product hierarchy, the dsPIC33EP512GP502 sits within the dsPIC33EP general-purpose DSC family, which belongs to Microchip's broader 16-bit MCU/DSP portfolio used in embedded control systems.
Key features include the 16-bit modified Harvard architecture core with DSP engine (single-cycle MAC, 40-bit accumulator), integrated operational amplifiers for current-sense signal chains, a CTMU (Charge Time Measurement Unit) for touch/timing measurement, CAN 2.0B communication, and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing. The E temperature suffix qualifies the part across the full -40C to +125C automotive range, and the part is listed by distributors as AEC-Q100 capable.
The dsPIC33E architecture provides 24-bit instruction width for high code density, hardware divide support, and an interrupt-rich PIC-style peripheral ecosystem. The 28-pin GP502 variant exposes remappable peripheral pins (PPS), enabling UART, SPI, I2C, and PWM routing to flexible I/O positions, which simplifies PCB layout reuse.
Typical applications include motor control (BLDC/ACIM with high-speed PWM), industrial automation, digital power conversion, automotive subsystems, and instrumentation requiring DSP math such as filtering and FFT.
Design consideration: this is a 3.0V to 3.6V device; level-shifting is required for 5V legacy peripherals, and the VCAP/VDDCORE pin requires the datasheet-specified low-ESR capacitor for stable core operation.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512GP502-E/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP502-E/SP (same form factor and footprint) — differing in Maximum CPU Speed, Mounting Type, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512GP502-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP502-I/SP
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GP502-I/SP
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP502-I/SP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.62 / Unit
View Datasheet →DSPIC33EP512GP502-E/SP Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 60 MIPS (70 MIPS family core) |
| Program Memory (Flash) | 512 KB (170K x 24) |
| RAM | 48 KB |
| Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (E grade) |
| Package | 28-SPDIP (0.300 in, 7.62 mm) |
| Mounting Type | Through-Hole |
| Peripherals | Op Amps, Comparators, High-Speed PWM, CTMU, PTG |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| ADC | 10-bit / 12-bit, 1.1 Msps |
| Instruction Width | 24-bit |
| Pin Remapping | Peripheral Pin Select (PPS) |
| Qualification | Automotive, AEC-Q100 capable |
| Packaging Type | Tube |
| RoHS Status | Compliant |
| Series | dsPIC33EP |
DSPIC33EP512GP502-E/SP 28-spdip (0.300 in, 7.62 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512GP502-E/SP (28-spdip (0.300 in, 7.62 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP502-E/SP.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP502-E/SP is suitable for 6 applications: BLDC / PMSM Motor Control, Digital Power Conversion, Automotive Body and Subsystem Control, Industrial Automation and Sensing, Portable Instrumentation and Data Loggers, Capacitive Touch and Human Interface.
BLDC / PMSM Motor Control
The DSPIC33EP512GP502-E/SP fits motor control because its dsPIC33E core executes field-oriented control loops at 60 MIPS with single-cycle MAC and 40-bit accumulators, while the high-speed PWM peripheral generates complementary outputs with hardware dead-time insertion. Integrated op amps amplify current-shunt signals on-chip, removing external amplifier stages and lowering BOM cost in the 28-pin through-hole design. The 12-bit ADC is synchronized to the PWM for deterministic current sampling at the center of each PWM period. Typical deployment places the controller between gate drivers and a current-sense network, controlling BLDC or PMSM motors in industrial pumps and fans; the 512 KB Flash leaves generous headroom for FOC plus CAN-based diagnostics and field-update firmware.
Recommended
Digital Power Conversion
Digital power supplies benefit from the DSPIC33EP512GP502-E/SP's combination of a 60 MIPS DSP engine and high-resolution PWM control: voltage- or current-mode loops execute in tens of microseconds with predictable cycle-by-cycle behavior. The integrated op amps buffer voltage/current feedback signals, and the CTMU supports precise timing measurement for sync-buck or LLC topologies. The 3.0V-3.6V supply and -40C to +125C E-grade rating suit power stages in industrial and telecom environments where ambient temperatures rise near heat-generating conversion stages. Firmware for PFC, LLC, or DC-DC control fits easily in 512 KB Flash, with the Peripheral Trigger Generator chaining ADC sampling to PWM updates autonomously, reducing interrupt jitter and improving transient-response consistency.
Recommended
Automotive Body and Subsystem Control
Distributor listings identify the DSPIC33EP512GP502-E/SP as an automotive AEC-Q100-capable part, and its -40C to +125C temperature range covers under-hood-adjacent and cabin-electronics environments. The on-chip CAN 2.0B module connects directly to vehicle networks for body-control nodes, sensor hubs, and actuator drivers, while the high-speed PWM drives lamps, valves, and small motors. The 512 KB Flash accommodates firmware with UDS-style diagnostics, and the CTMU can implement capacitive-touch user interfaces for interior controls. Because this /SP variant is through-hole, it is attractive in serviceable automotive retrofit and heavy-vehicle modules where rework and field replacement of controllers is required, unlike fine-pitch QFN or SSOP alternatives.
Recommended
Industrial Automation and Sensing
In factory automation, the DSPIC33EP512GP502-E/SP serves as a compact control node combining signal processing with flexible connectivity. Its UART, SPI, and I2C interfaces - freely positioned via Peripheral Pin Select - communicate with HMI panels, industrial sensors, and PLC I/O, while the CAN port links to higher-level plant networks. The 12-bit ADC plus integrated op amps digitize 4-20 mA, thermocouple, or bridge-sensor signals after minimal external conditioning, and the 60 MIPS DSP engine executes digital filtering and calibration math in real time. The extended -40C to +125C rating withstands enclosure-mounted environments near drives and power electronics, and the 512 KB Flash stores firmware plus look-up tables for sensor linearization.
Recommended
Portable Instrumentation and Data Loggers
Battery-powered instruments use the DSPIC33EP512GP502-E/SP for its DSP throughput at low power: the dsPIC33E core executes FFT-based spectral analysis or RMS computation on-board, enabling handheld vibration analyzers, power-quality meters, and acoustic testers. Sleep and Idle modes reduce average current draw between sampling bursts, and the 48 KB RAM buffers acquisition records before writing to external Flash. The through-hole 28-pin SPDIP package simplifies prototyping and low-volume production of laboratory and educational instruments, where sockets allow firmware-field upgrades. The CTMU provides precise time-interval measurement for ultrasonic flow and distance sensing, complementing the ADC's signal-chain role in measurement front ends.
Recommended
Capacitive Touch and Human Interface
The CTMU (Charge Time Measurement Unit) on the DSPIC33EP512GP502-E/SP measures charge time on electrode capacitances, enabling mTouch-style capacitive touch buttons and sliders without dedicated touch controllers. The 60 MIPS core runs debounce, drift-compensation, and gesture algorithms while simultaneously driving feedback via the high-speed PWM (haptics, backlight dimming) and reporting status over UART, SPI, or CAN. The -40C to +125C operating range permits use in outdoor kiosks, white-goods panels, and industrial operator interfaces exposed to wide ambient swings. With 512 KB Flash, a single chip can host touch sensing, menu logic, display drivers, and communication stacks, consolidating the bill of materials of panel controllers.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP502-E/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP502-I/SP | DSPIC33EP256GP502-I/SP | DSPIC33EP128GP502-I/SP | DSPIC33EP32GP502-I/SP |
|---|---|---|---|---|---|
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB | 512 KB | 256 KB | 128 KB | 32 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Key Peripherals | Op Amps, HS PWM, CAN, CTMU, PTG | Identical (same die) | Identical peripheral set | Identical peripheral set | Identical peripheral set |
| Relative Cost | Highest (max Flash, E grade) | Lower (same Flash, I grade) | Lower (half Flash) | Lower still | Lowest in family |
Key Differentiators
- Full extended temperature rating with maximum Flash (vs DSPIC33EP512GP502-I/SP)
- Twice the program memory of the mid-family part at the same pinout (vs DSPIC33EP256GP502-I/SP)
- Through-hole SPDIP packaging simplifies service and prototyping (vs DSPIC33EP512GP502-E/MM (QFN) and -E/SS variants)
Design Notes
The DSPIC33EP512GP502-E/SP requires 3.0V to 3.6V on VDD and derives its internal core voltage via the on-chip regulator - the VCAP/VDDCORE pin must carry the datasheet-specified low-ESR capacitor to ground, with short, thick traces. Decouple each VDD/AVDD pin with 0.1 uF ceramic capacitors placed within a few millimeters of the pins. If the analog supply is noisy (near switching converters), add an RC or ferrite filter from VDD to AVDD. Brown-out detection should be enabled in configuration fuses since 3.3V rails sagging below 3.0V cause unpredictable core behavior.
Although the /SP package is through-hole and forgiving to hand-solder, layout discipline still matters: route the OSC1/OSC2 crystal traces short and guard them with ground, and keep high-speed PWM outputs away from analog sense traces feeding AN0-AN5. Because Peripheral Pin Select (PPS) lets you place UART/SPI/I2C/PWM almost anywhere, assign digital-heavy functions to pins on the VDD-side of the package and reserve the ANx pins nearest AVDD for analog inputs to minimize ground-return loop area in mixed-signal sections.
Three recurring pitfalls: (1) forgetting to reserve the two boot blocks or configuration words when sizing firmware against the 512 KB Flash - verify the .map file before committing to the smaller DSPIC33EP256GP502 alternative; (2) mismatching temperature grade in second-source purchasing - the -I/SP is a common accidentally-ordered variant of the -E/SP and only covers -40C to +85C; (3) treating SPDIP socket contact resistance as negligible in high-vibration environments - use machined-pin sockets or solder the device directly for automotive builds.
Compliance Information
Hotenda and Mouser distributor listings describe this part as Automotive, AEC-Q100. RoHS/lead-free status from standard Microchip production practice; request official certificates from Microchip for REACH and conflict-minerals declarations.
